CN105322104B - The method for packing of OLED display panel - Google Patents
The method for packing of OLED display panel Download PDFInfo
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- CN105322104B CN105322104B CN201510902267.4A CN201510902267A CN105322104B CN 105322104 B CN105322104 B CN 105322104B CN 201510902267 A CN201510902267 A CN 201510902267A CN 105322104 B CN105322104 B CN 105322104B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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Abstract
The invention discloses a kind of method for packing of OLED display panel, comprise the following steps：The first film layer, the first film layer covering lead are deposited in the binding region of substrate；The second film layer is deposited in the effective display area domain of substrate, second film layer covers OLED functional layers；Outer Obstruct membrane, the outer Obstruct membrane covering the first film layer and the second film layer are integrally pasted in the effective display area domain of substrate and the binding region of substrate；The boundary of binding region of effective display area domain and substrate along substrate cuts outer Obstruct membrane；The outer Obstruct membrane in the binding region of substrate is removed, the first film layer together departs from outer Obstruct membrane from the effective display area domain of substrate.The present invention pastes outer Obstruct membrane by the way of overall pad pasting, effectively improve the sticking efficiency of outer Obstruct membrane and paste precision, the damage caused in outer Obstruct membrane stripping process to the lead in binding region is avoided, life-span and the safety in utilization of OLED display panel is improved.
Description
Technical field
The present invention relates to display technology field, more particularly to a kind of method for packing of OLED display panel.
Background technology
The encapsulation of OLED (Organic Light-Emitting Diode, Organic Light Emitting Diode) display panel is mainly
OLED is isolated with external environment, to prevent water point, oxidizing gas, the intrusion of dust ray and external force from damaging, and then stably
The parameters of device, improve service life.
At present, using thin film encapsulation technology the encapsulation of flexible OLED display panel more, being usually in OLED display panel
The surface of effective display area domain deposits barrier layer to avoid contacts of the OLED with external environment.In order to realize preferably isolation effect
Really, one layer of outer Obstruct membrane is generally pasted again on the outer surface on barrier layer, to reach the purpose of dual resisteance.Traditional method be
Outer Obstruct membrane is integrally pasted in not cleaved OLED display panel, if OLED display panel is cut into further according to process requirements
Dry small screen body.The shortcoming of the way is：In addition to the effective display area domain of OLED display panel, binding region also can be by
Outer Obstruct membrane is covered, accordingly, it would be desirable to which the outer Obstruct membrane of binding region is peeled off, and is easily destroyed and is tied up in stripping process
Determine the lead in region.
For disadvantages mentioned above, conventional solution has two kinds：1) OLED display panel is cut into according to process requirements
Several small screen bodies, then paste outer Obstruct membrane, binding region are kept in taping process one by one on each small screen body
Exposure is outside；2) small range pastes outer Obstruct membrane in every a line (or each row) of OLED display panel, in taping process
Keep binding region exposure outside, OLED display panel is then cut into several small screen bodies again.
But, above two mode can reduce the sticking efficiency of outer Obstruct membrane, so that it is whole to cause OLED display panel
The decline of body production efficiency；Also, paste one by one or small range stickup can influence the stickup precision of outer Obstruct membrane, easily glue
The phenomenon distorted is pasted, the qualification rate of product is have impact on.
The content of the invention
The invention provides a kind of method for packing of OLED display panel, substantially increase outer Obstruct membrane sticking efficiency and
Paste precision.
To reach above-mentioned purpose, the present invention is adopted the following technical scheme that：
A kind of method for packing of OLED display panel, the OLED display panel includes substrate, is formed at the substrate
OLED functional layers in effective display area domain, and the lead being formed in the binding region of the substrate, the method for packing
Comprise the following steps：
The first film layer, the first film layer covering lead are deposited in the binding region of the substrate；
The second film layer is deposited in the effective display area domain of the substrate, second film layer covers the OLED work(
Ergosphere；
Outer Obstruct membrane is integrally pasted in the effective display area domain of the substrate and the binding region of the substrate, it is described outer
Obstruct membrane covers the first film layer and second film layer；
The boundary of binding region of effective display area domain and the substrate along the substrate cuts the outer Obstruct membrane；
The outer Obstruct membrane in the binding region of the substrate is removed, the first film layer is with the outer Obstruct membrane one
Depart from from the effective display area domain of the substrate.
In one of the embodiments, the first film layer is one or more layers structure.
In one of the embodiments, the first film layer is formed in the preparation process of the OLED display panel.
In one of the embodiments, the OLED functional layers include hole injection layer and light coupling layer, and described first is thin
Film layer is formed in the preparation process of the hole injection layer or the light coupling layer.
In one of the embodiments, the first film layer is deposited by the way of evaporation.
In one of the embodiments, the thickness of the first film layer is 1nm~300nm.
In one of the embodiments, the substrate is flexible substrate, and the flexible substrate is formed at the table of rigid substrates
Face, the method for packing is further comprising the steps of：
The flexible substrate is integrally peeled off from the surface of the rigid substrates, then peeled off according to process requirements by described
The OLED display panel obtained afterwards is cut.
In one of the embodiments, by the way of laser lift-off by the OLED display panel from the rigid substrates
Surface integrally peel off.
In one of the embodiments, it is overall in the effective display area domain of the substrate and the binding region of the substrate
It is further comprising the steps of before the outer Obstruct membrane of stickup：
One layer of UV glue-line is coated on the surface of the first film layer and second film layer, or in the outer barrier
One layer of UV glue-line is coated on the sticking veneer of film.
In one of the embodiments, second film layer is formed by organic material and inorganic material alternating deposit.
The invention has the advantages that：
The method for packing of the OLED display panel of the present invention, outer Obstruct membrane is pasted by the way of overall pad pasting, is reduced
The number of times of pad pasting, effectively improves the sticking efficiency of outer Obstruct membrane, and then improves the preparation efficiency of OLED display panel；Together
When, the mode of overall pad pasting greatly reduces outer Obstruct membrane and pastes the probability distorted, and improves and pastes the qualified of precision and product
Rate；In addition, the present invention deposited the first film layer to protect lead in the binding region of substrate, so as to avoid outer Obstruct membrane
The damage caused in stripping process to the lead in binding region, improves life-span and the safety in utilization of OLED display panel.
Brief description of the drawings
Fig. 1 for the present invention in OLED display panel method for packing flow chart；
Fig. 2 is the structural representation of OLED display panel embodiment in encapsulation process；
Fig. 3 is structural representation of the OLED display panel after encapsulation is finished shown in Fig. 2；
Fig. 4 is the structural representation of OLED display panel another embodiment in encapsulation process；
Fig. 5 is structural representation of the OLED display panel after encapsulation is finished shown in Fig. 4.
Embodiment
The present invention is described in detail below in conjunction with embodiment.It should be noted that in the case where not conflicting, the application
In embodiment and the feature in embodiment can be mutually combined.
The invention provides a kind of method for packing of OLED display panel, it is mainly used in not cleaved large-area OLEDs and shows
Show the encapsulation of panel.Referring to Fig. 2 to Fig. 5, OLED display panel includes substrate 100, is formed at the effective display area domain of substrate 100
OLED functional layers 200 in 110, and the lead (not shown) being formed in the binding region 120 of substrate 100；Wherein, OLED
Functional layer 200 include be formed at the surface of substrate 100 thin film transistor (TFT), be formed at film crystal pipe surface anode electrode layer,
The organic material layer that is formed at anode electrode layer surface, the negative electrode layer for being formed at organic material layer and it is formed at negative electrode
The light coupling layer (Coupling Layer, CPL) of electrode layer surface.Specifically, as shown in figure 1, the method for packing bag of the present invention
Include following steps：
S100：The first film layer 400 is deposited in the binding region 120 of substrate 100, the covering of the first film layer 400 is tied up
Determine the lead in region 120.
The first film layer 400 act as the lead that protection is located in binding region 120, prevents from lead and subsequently encapsulating
The outer Obstruct membrane 500 pasted in journey is directly contacted.Wherein, the first film layer 400 can be a Rotating fields, or multilayer (including
Two layers) structure, preferably a Rotating fields, when the first film layer 400 be a Rotating fields when, it is possible to decrease the first film layer 400 lack
Probability is fallen into, the deposition quality of the first film layer 400 is improved.
It is preferred that the first film layer 400 is deposited by the way of evaporation.The film layer pair deposited using evaporation mode
Adhesiveness is weaker, is easily attached in subsequent process without damaging lead.In addition, the first film layer 400 can also be adopted
Deposited with other plated film modes.
Specifically, the thickness of the first film layer is 1nm~300nm.If the thickness of the first film layer 400 is excessive, unfavorable
In follow-up removal, if the thickness of the first film layer 400 is too small, it is unfavorable for the protection to lead in binding region 120, as
It is preferred that, the thickness of the first film layer 400 is 50nm~200nm, under the thickness, can either ensure the smooth of the first film layer 400
Remove, can play preferably protective effect to the lead in binding region 120 again.
In the present invention, the first film layer 400 can be deposited in the preparation process of OLED display panel, also can be in OLED
Display panel preparation is deposited after finishing.
In the preparation process of OLED functional layers 200, the binding region 120 of substrate 100 is typically covered using mask plate,
Then thin film transistor (TFT), anode electrode layer, organic material layer, negative electrode are sequentially depositing in the effective display area domain 110 of substrate 100
Electrode layer and light coupling layer.It is preferred that in effective display area domain 110 deposited organic material layer or during light coupling layer, can be simultaneously
The first film layer 400 is deposited in binding region 120, can specifically be realized in the following way：Sunk in effective display area domain 110
When product organic material layer or light coupling layer, it will be designed as at position corresponding with the binding region 120 of substrate 100 in mask plate
Engraved structure so that organic material layer or light coupling layer can be deposited on effective display area domain 110 and the binding of substrate 100 simultaneously
In region 120, and the organic material layer or light coupling layer being deposited in binding region 120 then can as the first film layer 400, from
And the first film layer 400 is formed in the preparation process of OLED display panel.Which need not increase extra step i.e.
The preparation of the first film layer 400 can be completed, encapsulation process is simplified, has saved process, improve production efficiency.
Organic material layer in OLED functional layers 200 generally comprises hole injection layer (HIL), hole transmission layer (Hole
Injection Layer, HTL), luminous material layer (Emitting Material Layer, EML), electron injecting layer
(Electron Injection Layer, EIL), electron transfer layer (Electron Transport Layer, ETL), wherein,
The first film layer 400 can be formed in HIL, HTL, EML, EIL and ETL in any one layer or several layers of deposition process, i.e., and first
Film layer 400 can be at least one layer in HIL, HTL, EML, EIL and the ETL being deposited in the binding region 120 of substrate 100.
Preferably, the first film layer 400 is formed in HIL or CPL deposition process, i.e., the first film layer 400 is heavy
HIL or CPL of the product in the binding region 120 of substrate 100.In OLED functional layers 200, HIL and CPL thickness are moderate, protection
Effect is good, can effectively prevent the damage of lead.
It is that the first film layer 400 is deposited in the preparation of OLED display panel with upper type, when the first film layer 400 exists
When OLED display panel preparation is deposited after completing, deposition process can be completed in the following way：Covered using mask plate
OLED functional layers 200 in effective display area domain 110, then deposit the in binding region 120 using modes such as evaporations
One film layer 400.
S200：The second film layer 300 is deposited in the effective display area domain 110 of substrate 100, the second film layer 300 is covered
OLED functional layers 200.
Wherein, the second film layer 300 is mainly used in completely cutting off the contact of OLED functional layers 200 and the external world, effectively prevent moisture,
The damage that the factors such as oxidizing gas, dust, ray and external force are caused to OLED functional layers 200, and then improve OLED display surfaces
The luminescent properties and service life of plate.
Second film layer 300 can be formed by organic material deposition, can also be formed by inorganic material deposition.It is preferred that second
Film layer 300 is formed by organic material and inorganic material alternating deposit.Wherein, inorganic material is aluminum oxide, silicon nitride or dioxy
SiClx, it possesses preferable translucency, while having relatively stable chemical property, is difficult to react with other materials, can
Play preferably buffer action；Organic layer material is acrylate, epoxy resin, Parylene, HMDO, fluorine
Carbon compound or vinyl alcohol, organic material good fluidity are main to play planarization.
As a kind of embodiment, the thickness of the second film layer 300 is 3 μm~20 μm.
It should be noted that when being deposited after the first film layer 400 prepares completion in OLED, step S100 and step
Rapid S200 order is adjustable, you can the second film layer 300 is deposited in effective display area domain 110 with elder generation, then in binding region 120
Middle deposition the first film layer 400.
S300：Outer obstruct integrally is pasted in the effective display area domain 110 of substrate 100 and the binding region 120 of substrate 100
Film 500, the covering the first film layer 400 of outer Obstruct membrane 500 of stickup and the second film layer 300.
Because the method for the present invention is mainly used in the encapsulation of not cleaved OLED display panel, thus, OLED display surfaces
Plate generally includes integrally to paste outer Obstruct membrane 500 in multiple effective display area domains 110 and multiple binding regions 120, the present invention
Refer to and outer Obstruct membrane 500 is pasted in all effective display area domains 110 and binding region 120, and the outer Obstruct membrane 500 pasted is
One entirety, and cover all film layers 300 of the first film layer 400 and second.
The second film layer 300 of auxiliary that act as of outer Obstruct membrane 500 plays buffer action, further prevents outer bound pair OLED
The damage that functional layer 200 is caused.
As a kind of embodiment, outer Obstruct membrane 500 includes substrate and the barrier layer being deposited in substrate, wherein, base
Bottom can be the plastic materials such as PET or PE, and barrier layer can be aluminum oxide film, silicon nitride film, silicon oxide film, or be organic
The alternating deposit film of material and inorganic material.In addition, outer Obstruct membrane can also include the glue-line being coated on barrier layer.When outer
When Obstruct membrane includes glue-line, the surface of the first film layer 400 and the second film layer 300 can be affixed directly to；When outer barrier
When film does not include glue-line, one layer of glue-line, Huo Zhe can be first coated on the sticking veneer of outer Obstruct membrane 500 before step S300
The surface of the first film layer 400 and the second film layer 300 coats one layer of glue-line, is then pasted again.It is preferred that outer Obstruct membrane
500 thickness is 25 μm~125 μm.
S400：Along substrate 100 effective display area domain 110 and substrate 100 binding region 120 boundary cut extrernal resistance
Barrier film 500.
The purpose of this step is by positioned at the outer Obstruct membrane 500 of effective display area domain 110 and positioned at the outer of binding region 120
Connection between Obstruct membrane 500 disconnects.It is preferred that can be cut external Obstruct membrane 500 by the way of laser cutting.Laser
Cutting speed is fast, and the otch formed is thinner, and joint-cutting is high with surface perpendicularity, and heat affected area width is smaller, material near joint-cutting
Performance be barely affected；And Precision of Laser Cutting is higher, it is therefore prevented that what the substrate 100 of the external lower section of Obstruct membrane 500 was caused
Cut by mistake.In addition, can also be cut using the external Obstruct membrane 500 of mould.
S500, removes the outer Obstruct membrane 500 in the binding region 120 of substrate 100, the first film layer 400 is with extrernal resistance
Barrier film 500 together departs from from the binding region 120 of substrate 100.
Due to outer Obstruct membrane 500 be by glue-line be pasted onto the first film layer 400 and second film layer 300 surface, because
This, when removing the outer Obstruct membrane 500 in binding region 120, the first film layer 400 is under the adherence force of glue-line with extrernal resistance
Barrier film 500 together departs from from OLED display panel, and now, the lead in binding region 120 exposes.
After step S500, it usually needs OLED display panel is cut into several small screens according to process requirements
Body.
The method for packing of the OLED display panel of the present invention, by the way of overall pad pasting, reduces the number of times of pad pasting, has
Effect improves the sticking efficiency of outer Obstruct membrane 500, and then improves the preparation efficiency of OLED display panel；Meanwhile, overall pad pasting
Mode greatly reduce outer Obstruct membrane 500 and paste the probability distorted, improve the qualification rate for pasting precision and product；In addition,
The present invention deposits the first film layer 400 as protective layer in binding region 120, effectively reduces outer Obstruct membrane 500 and removed
The damage caused in journey to the lead in binding region 120, improves life-span and the safety in utilization of OLED display panel.
With reference to Fig. 4 and Fig. 5, it is preferred that when outer Obstruct membrane 500 does not include glue-line, can be carried out such as before step S300
Lower operation：One layer of UV glue-line 600 is coated on the surface of the first film layer 400 and the second film layer 300, or in outer Obstruct membrane
One layer of UV glue-line 600 is coated on 500 sticking veneer.After coating is finished, the outer entirety of Obstruct membrane 500 is pasted into UV glue-lines 600
Surface, or be coated with the outer Obstruct membranes 500 of UV glue-lines 600 and overall paste the first film layer 400 and the second film layer 300
Surface；Then the UV glue-lines 600 positioned at 400 surface of the first film layer are solidified, and keeps the UV glue-lines 600 of remainder to be
Flow regime；The boundary cutting extrernal resistance of the binding region 120 of effective display area domain 110 and substrate 100 then along substrate 100
Barrier film 500；The outer Obstruct membrane 500 in the binding region 120 of substrate 100 is torn again, now, the first film layer 400 exists
Depart under the adhesion of UV glue-lines 600 in flow regime with outer Obstruct membrane 500 from the binding region 120 of substrate 100, reveal
Go out to be located at the lead in binding region 120.Wherein, UV glue is generally by the organic matter structure such as acrylate, epoxy resin and propenyl
Into preferably water oxygen iris action can be played after hardening, the damage that can effectively prevent water, oxygen etc. from being caused to OLED.
The method for packing of the present invention is applied to encapsulation of the substrate 100 for the OLED display panel of rigid material, and substrate
100 be the encapsulation of the OLED display panel of flexible material.
For the OLED display panel that substrate 100 is flexible material, when being prepared, generally first prepared by flexible substrate
In on rigid substrates (such as glass substrate), OLED functional layers and lead are then prepared in flexible substrate, for this kind of situation
OLED display panel, also need to peel off flexible substrate from rigid substrates in encapsulation process.
It is preferred that as a kind of embodiment, when flexible substrate is peeled off from rigid substrates, being peeled off using overall
Mode, i.e., after flexible substrate is integrally peeled off from rigid substrates, the OLED that is obtained after stripping is shown further according to process requirements
Show that panel is cut.Which reduces cutting difficulty without being cut to rigid substrates, it is to avoid cutting rigid substrates
Pollution or scuffing of the produced fragment to OLED display panel；Also, the rigid substrates obtained after peeling off maintain structure
Integrality, can be reused, greatly save material cost.
In order to which the present invention is explained further, below by way of specific embodiment, the present invention will be described.Need explanation
It is that the substrate 100 of the OLED display panel in following examples is flexible substrate, and flexible substrate is formed at glass substrate
On.
Embodiment 1
(1) when hole injection layer is deposited in the effective display area domain 110 of substrate 100, while in the binding region of substrate 100
Hole injection layer is deposited in 120, the hole injection layer being deposited in binding region 120 is regard as the first film layer 400；
(2) by the way of organic material and inorganic material alternating deposit, in the OLED in effective display area domain 110
The surface of functional layer 200 deposits the second film layer 300；
(3) one layer of outer Obstruct membrane 500 is integrally pasted on the surface of the first film layer 400 and the second film layer 300；
(4) by the way of laser cutting, extrernal resistance is cut along the boundary of binding region 120 and effective display area domain 110
Barrier film 500；
(5) the outer Obstruct membrane 500 in binding region 120 is torn, the first film layer 400 is in the viscous of outer Obstruct membrane 500
It is attached under patch power；
(6) flexible substrate 100 of OLED display panel is integrally peeled off from glass substrate by the way of laser lift-off,
Then the OLED display panel obtained after stripping is cut into several small screen bodies according to process requirements.
Embodiment 2
(1) when light coupling layer is deposited in the effective display area domain 110 of substrate 100, while in the binding region of substrate 100
Light coupling layer is deposited in 120, and regard the light coupling layer being deposited in binding region 120 as the first film layer 400；
(2) by the way of organic material and inorganic material alternating deposit, in the OLED in effective display area domain 110
The surface of functional layer 200 deposits the second pellicle film 300；
(3) one layer of outer Obstruct membrane 500 is integrally pasted on the surface of the first film layer 400 and the second film layer 300；
(4) substrate 100 of OLED display panel is integrally peeled off from glass substrate by the way of laser lift-off, then
The OLED display panel obtained after stripping is cut into several smaller screen bodies according to process requirements；
(5) by the way of mould cutting, along the binding region 120 and effective display area domain 110 in each smaller screen body
Boundary cut outer Obstruct membrane 500；
(6) the outer Obstruct membrane 500 being located in each smaller screen body in binding region 120 is torn, the first film layer 400 is in extrernal resistance
It is attached under the adherence force of barrier film 500.
Embodiment 3
(1) after the completion of the preparation of OLED display panel, using mask plate by the effective coverage 110 of substrate 100
OLED functional layers 200 cover, in the binding region 120 of substrate 100 be deposited one layer of organic material, be used as the first film layer
400；
(2) by the way of organic material and inorganic material alternating deposit, in the OLED in effective display area domain 110
The surface of functional layer 200 deposits the second pellicle film 300；
(3) one layer of UV glue-line 600 is coated on the surface of the first film layer 400 and the second film layer 300, then in UV glue-lines
Integrally paste one layer of outer Obstruct membrane 500 without glue-line in 600 surface；
(4) the UV glue-lines 600 for being coated in the surface of the second film layer 300 are exposed solidification using mask plate, its remaining part
The UV glue-lines 600 divided keep flow regime；
(5) by the way of laser cutting, extrernal resistance is cut along the boundary of binding region 120 and effective display area domain 110
Barrier film 500；
(6) the outer Obstruct membrane 500 in binding region 120 is torn, the first film layer 400 is in uncured UV glue-lines
Together it is attached with outer Obstruct membrane 500 under 600 adherence force；
(7) substrate 100 of OLED display panel is integrally peeled off from glass substrate by the way of laser lift-off, then
The OLED display panel obtained after stripping is cut into several small screen bodies according to process requirements.
Embodiment described above only expresses the several embodiments of the present invention, and it describes more specific and detailed, but simultaneously
Therefore the limitation to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that for one of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention
Protect scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of method for packing of OLED display panel, the OLED display panel includes substrate, is formed at having for the substrate
Imitate the OLED functional layers in viewing area, and the lead being formed in the binding region of the substrate, it is characterised in that described
Method for packing comprises the following steps：
The first film layer for protecting lead is deposited in the binding region of the substrate, the first film layer covering is described
Lead；
The second film layer is deposited in the effective display area domain of the substrate, second film layer covers the OLED functions
Layer；
Outer Obstruct membrane, the outer barrier are integrally pasted in the effective display area domain of the substrate and the binding region of the substrate
Film covers the first film layer and second film layer；
The boundary of binding region of effective display area domain and the substrate along the substrate cuts the outer Obstruct membrane；
Remove the outer Obstruct membrane in the binding region of the substrate, the first film layer with the outer Obstruct membrane together from
Depart from the binding region of the substrate.
2. the method for packing of OLED display panel according to claim 1, it is characterised in that the first film layer is one
Layer or sandwich construction.
3. the method for packing of OLED display panel according to claim 1, it is characterised in that the first film layer is in institute
State in the preparation process of OLED display panel and formed.
4. the method for packing of OLED display panel according to claim 3, it is characterised in that the OLED functional layers include
Hole injection layer and light coupling layer, the first film layer is in the preparation process of the hole injection layer or the light coupling layer
Formed.
5. the method for packing of OLED display panel according to claim 1, it is characterised in that the first film layer is used
The mode of evaporation is deposited.
6. the method for packing of OLED display panel according to claim 1, it is characterised in that the thickness of the first film layer
Spend for 1nm~300nm.
7. the method for packing of OLED display panel according to claim 1, it is characterised in that the substrate is flexible liner
Bottom, the flexible substrate is formed at the surface of rigid substrates, and the method for packing is further comprising the steps of：
The flexible substrate is integrally peeled off from the surface of the rigid substrates, then will be obtained according to process requirements after the stripping
To OLED display panel cut.
8. the method for packing of OLED display panel according to claim 7, it is characterised in that by the way of laser lift-off
The OLED display panel is integrally peeled off from the surface of the rigid substrates.
9. the method for packing of OLED display panel according to claim 1, it is characterised in that in the effectively aobvious of the substrate
Show before outer Obstruct membrane is integrally pasted in the binding region of region and the substrate, it is further comprising the steps of：
One layer of UV glue-line is coated on the surface of the first film layer and second film layer, or in the outer Obstruct membrane
One layer of UV glue-line is coated on sticking veneer.
10. the method for packing of OLED display panel according to claim 1, it is characterised in that second film layer by
Organic material and inorganic material alternating deposit are formed.
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| CN105845845B (en) * | 2016-04-14 | 2018-07-06 | 鄂尔多斯市源盛光电有限责任公司 | A kind of graphic method of adhesion type Obstruct membrane, display panel, display device |
| KR102671371B1 (en) | 2016-10-07 | 2024-06-04 | 삼성디스플레이 주식회사 | Flexible display apparatus and manufacturing method thereof |
| CN106654063B (en) * | 2016-12-28 | 2019-11-19 | 武汉华星光电技术有限公司 | The production method of flexible OLED display panel |
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Application publication date: 20160210 Assignee: Bazhou Yungu Electronic Technology Co., Ltd.|Yungu (Gu'an) Technology Co., Ltd Assignor: Kunshan Institute of technology new flat panel display technology center Co., Ltd.|Kunshan Guoxian photoelectric Co., Ltd Contract record no.: X2019990000153 Denomination of invention: Encapsulation method and encapsulation equipment for OLED display panel Granted publication date: 20170919 License type: Common License Record date: 20191030 |