CN107695533B - Laser cutting method - Google Patents
Laser cutting method Download PDFInfo
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- CN107695533B CN107695533B CN201710887572.XA CN201710887572A CN107695533B CN 107695533 B CN107695533 B CN 107695533B CN 201710887572 A CN201710887572 A CN 201710887572A CN 107695533 B CN107695533 B CN 107695533B
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- cutting
- heat
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- cut
- laser
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention provides a kind of laser cutting method, by before being cut by laser, heat-sink shell is covered on the cutting track of cutting board to be cut, when so that laser cutting the cutting board to be cut along the cutting track of the cutting board to be cut, the heat-sink shell can partially absorb the thermal energy of the laser, when to reduce cutting on the cutting board to be cut the temperature gradient of cutting position and surrounding non-cutting position size, reduce the generation of thermal stress, and then the generation for the defects of reducing crackle, obtain the preferable product of quality.
Description
Technical field
The present invention relates to a kind of display panel manufacturing technology field more particularly to a kind of laser cutting methods.
Background technique
In the manufacturing process of existing display panel, usually the motherboard of monolith is cut to obtain the display for being suitble to size
Panel.Wherein, laser cutting is common mode.But during laser cutting, since the energy density of laser is high,
So that generate biggish temperature gradient between cutting position and surrounding non-cutting position, cutting position and its neighbouring is caused
Thermal stress is easy to produce between position, so that the direction for pressing against the temperature gradient is easy to produce crackle.Particularly with
The irregular cutting region such as angle, perforation is easy to produce the concentration of irregular deformation and easy heat production stress, to be easier
The defects of cracking, and then influence the quality of display panel product.
Summary of the invention
The present invention provides a kind of laser cutting method, avoids the defects of there may be crackles during laser cutting,
Obtain the preferable product of quality.
The laser cutting method provided by the invention, comprising steps of
Heat-sink shell is covered on the cutting track of cutting board to be cut；
Laser irradiation cuts the cutting board to be cut to the heat-sink shell and along the cutting track；
The heat-sink shell on the cutting board to be cut after cutting is completed in removal.
Wherein, the cutting track includes regular track and irregular track, the suction covered on the rule track
Thermosphere is multilayer, and the heat-sink shell covered on the irregular track is at least one layer.
Wherein, layer of the number of plies of the heat-sink shell of the regular track less than the heat-sink shell of the irregular track
Number.
Wherein, the irregular track includes chamfering cutting track, perforation cuts track；The rule track includes straight line
Cutting track.
Wherein, it is covered on the cutting area of the cutting board to be cut by any method in coating, sputtering or vapor deposition
Cover the heat-sink shell.
Wherein, the heat-sink shell is UV photodissociation glue.
Wherein, described " laser irradiation to the heat-sink shell simultaneously cuts the cutting board to be cut along the cutting track " packet
Include: the heat-sink shell melts under the laser irradiation, and flows into the cutting that the laser cutting cutting board to be cut generates
In gap.
Wherein, it is swept off by wiping or wind except the heat-sink shell on the cutting board to be cut completed after cutting.
Wherein, the width for being covered in the heat-sink shell on the cutting track is greater than the spot diameter of the laser.
Wherein, the cutting board to be cut is oled panel or LCD panel.The laser cutting side provided by the invention
Method, by covering heat-sink shell on the cutting track of the cutting board to be cut before being cut by laser, so that laser is described in
When cutting track cuts the cutting board to be cut, the heat-sink shell can partially absorb the thermal energy of the laser, cut to reduce
When cutting on the cutting board to be cut the temperature gradient of cutting position and surrounding non-cutting position size, reduce thermal stress
Generation, and then reduce crackle the defects of generation, obtain the preferable product of quality.
Detailed description of the invention
More clearly to illustrate construction feature and effect of the invention, come with reference to the accompanying drawing with specific embodiment to its into
Row is described in detail.
Fig. 1 is the flow diagram of laser cutting method described in the embodiment of the present invention；
Fig. 2 is the structural schematic diagram before substrate cut to be cut described in the embodiment of the present invention；
Fig. 3 is the schematic cross-section before substrate cut to be cut described in the embodiment of the present invention；
Fig. 4 is the schematic cross-section during substrate cut to be cut described in the embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description.Wherein, the drawings are for illustrative purposes only and are merely schematic diagrams, should not be understood as the limitation to this patent.
Please participate in Fig. 1, the present invention provides a kind of laser cutting method, the laser cutting method comprising steps of
Step 110, please refer to figs. 2 and 3 together, and heat-sink shell 20 is covered on the cutting track of cutting board 10 to be cut.
In the present invention, the mode being cut by laser cuts the cutting board 10 to be cut.The cutting includes pair
It is cut in the cutting board 10 to be cut to obtain the substrate of suitable dimension, further includes being fallen to the cutting board 10 to be cut
Angle, perforation etc. are to obtain having preferable appearance or meet the substrate of certain use demand.Also, in order to
To required size or the substrate with required chamfering, perforation etc., the cutting board 10 to be cut have preset cutting track, swash
Light 11 is cut along the cutting track, and the base with required size or with required chamfering, perforation etc. can be obtained
Plate.Specifically, the movement rail of the default laser head for generating the laser 11 can be passed through by the fixation cutting board 10 to be cut
Mark cuts the laser 11 along the cutting track；Alternatively, the fixed laser head for generating the laser 11, passes through
The motion profile for presetting the cutting board to be cut 10 cuts the laser 11 along the cutting track；Alternatively, logical
It crosses the motion profile for presetting the cutting board to be cut 10 and generates the motion profile of the laser head of the laser 11, so that described swash
Light 11 carry out relative motion with the cutting board 10 to be cut, so that the laser 11 is cut along the cutting track
It cuts.
In the present invention, the cutting board 10 to be cut can be oled panel, AMOLED panel or LCD panel, Huo Zhewei
Oled substrate, AMOLED substrate perhaps array substrate, color membrane substrates etc. or other metal substrates cut, glass
Various types of substrates such as glass substrate, flexible base board.In the present embodiment, the cutting board 10 to be cut is oled panel flexible,
The cutting board to be cut is cut by 11 cutting method of laser, so that the substrate after the completion of cutting, which meets, uses need
It asks.
The heat-sink shell 20 is the material with more highly endothermic ability, described to be cut by the way that the heat-sink shell 20 to be covered on
On the cutting track of cutting board 10, the laser for cutting the cutting board 10 to be cut can be partially absorbed by the heat-sink shell 20
Thermal energy generates the size of temperature gradient on the cutting board 10 to be cut, reduces the variation of thermal stress, to subtract when reducing cutting
The generation of the defects of few crackle, obtains the preferable product of quality.Referring to Fig. 4, preferred, the heat-sink shell 20 can be described
Under the irradiation of laser 11 from Solid State Transformation be molten state, so as to the stream when the laser 11 cuts the cutting board 10 to be cut
Enter in the cutting gap of generation, so that the cutting of the laser 11 is from the surface of the cutting board 10 to be cut to described to be cut
During the inside of substrate 10 is cut, the heat-sink shell 20 can be always positioned at the cleavage of the cutting board to be cut 10
It sets, when so that the laser 11 being cut to the inside of the cutting board to be cut 10, can still reduce the panel to be cut 10
Inside can also crack, and then protect 10 surface of cutting board to be cut and inside quality, to be had
The substrate of better quality.In the present embodiment, the heat-sink shell 20 is UV photodissociation glue, and the cutting is covered in by way of coating
On track.The UV photodissociation glue has very strong heat absorption capacity, and can first absorb heat in laser action process and lose viscosity and be in
Molten state simultaneously has certain mobility.It is understood that the heat-sink shell 20 can also have strong heat absorption energy to be other
The material of power, also, the difference of the material according to the heat-sink shell 20, the heat-sink shell 20 are covered on the cutting track
Mode is different, for example, it is also possible to sputter or being vapor-deposited (including PVD, CVD etc.)；Alternatively, the heat-sink shell 20 is made as piece in advance
When shape laminated material, directly the heat-sink shell 20 can be fitted on the cutting board to be cut 10.
Also, the cutting track includes regular track and irregular track, and the heat-sink shell 20 includes the first heat-sink shell
21 and second heat-sink shell 22.The heat-sink shell 20 covered on the rule track is the first heat-sink shell 21, described non-
The heat-sink shell 20 covered on regular track is the second heat-sink shell 22.It is described to be cut after the completion of cutting in the present embodiment
Substrate 10 is used as mobile phone display panel, and the cutting track of the cutting board 10 to be cut includes the straight of 10 3 side of cutting board to be cut
Wire cutting track, to meet the size requirement of the mobile phone display panel, further include to the chamfering of the cutting board 10 to be cut and
Earpiece area, the aperture setting for imaging Head Section, to meet the use demand of the mobile phone display panel, assembly demand and appearance effect
The demands such as fruit.
Specifically, the rule track includes the camber line cutting rail of straight cuts track or the biggish nearly straight line of curvature
Mark.When the cutting track is regular track, when cutting the cutting board 10 to be cut along the cutting track, the cutting track
The deformation of each position is smaller, so that stress concentration is smaller, therefore, when the cutting track is regular track, generates defect
It is less.Therefore, in the position that the cutting track is regular track, can allow the thickness of the heat-sink shell 20 compared with
Thin, i.e., the thickness of described first heat-sink shell 21 can be relatively thin, the defect for guaranteeing the cutting position of the cutting board 10 to be cut compared with
In the case where few, the thickness of the heat-sink shell 20 is thinned as far as possible, to economize on resources, reduces production cost.In the present embodiment, institute
It states straight cuts track and belongs to regular track, cover first heat-sink shell 21 thereon.
The irregular track includes that chamfering cutting track, perforation cuts track or various zigzags, waveform etc. are each
The cutting track of kind changes shape.When the cutting track is irregular track, the cutting when cutting board 10 to be cut is cut
The deformation of track each position is larger, so that stress is easier to concentrate, is easy to produce defect.Therefore, in the cutting track
For the position of irregular track, the thickness when thickness cutting track of the heat-sink shell 20 is regular track need compared with
Thickness reduces the generation of the defect to guarantee to reduce the deformation of the cutting track each position.It is described in the present embodiment
The thickness of second heat-sink shell 22 is greater than the thickness of first heat-sink shell 21, thus guaranteeing to reduce at the cutting track
While defect generates, the use of the heat-absorbing material of the heat-sink shell 20 less as far as possible economizes on resources, and reduces production cost.And
And the difference of the thickness according to the cutting board 10 to be cut, the thickness of the heat-sink shell 20 is not also identical, to realize that reduction swashs
While the defect that light cutting position generates, the use of the heat-absorbing material of the heat-sink shell 20 is reduced, is economized on resources, reduces production
Cost.When the thinner thickness of the cutting board to be cut 10, the thickness of the heat-sink shell 20 can be relatively thin；The cutting board to be cut 10
Thickness it is thicker when, the thickness of the heat-sink shell 20 is thicker.In the present embodiment, the heat-sink shell 20 is one by way of coating
The coating of one layer of layer is formed on the cutting board to be cut 10, controls the heat-sink shell by controlling the number of plies of the coating
20 thickness.The heat-sink shell 20 covered on the rule track is multilayer, the suction covered on the irregular track
Thermosphere is at least one layer.In the present embodiment, the number of plies of the heat-sink shell 20 of the rule track is less than the irregular track
The heat-sink shell 20 the number of plies so that the thickness of first heat-sink shell 21 be less than second heat-sink shell 22 thickness.This
In embodiment, the cutting track in the chamfering and earpiece area, the aperture for imaging Head Section belongs to the irregular track, covers thereon
Second heat-sink shell 22.
The laser 11 can generate hot spot when being irradiated on the cutting board to be cut 10, the region irradiated by the laser 11
The cutting board 10 to be cut can due to temperature raising and be vaporized, to complete cutting to the cutting board 10 to be cut
It cuts.In the present invention, the width for being covered in the heat-sink shell 20 on the cutting track is greater than the spot diameter of the laser 11,
So that the position that the hot spot of the laser 11 irradiates is covered by the heat-sink shell 20, so that the hot spot of the laser 11 is each
The heat of position is partially absorbed by the heat-sink shell 20, the cutting position for avoiding the hot spot from irradiating and surrounding non-cutting position
Big temperature gradient is generated between setting, and then reduces the stress collection between the cutting position and surrounding non-cutting position
In, reduce the generation of defect on the cutting board 10 to be cut.Wherein, the width direction of the heat-sink shell 20 is perpendicular to the heat absorption
The extending direction of layer 20, and it is parallel to 10 plane of cutting board to be cut.
Step 120, referring to Fig. 4, laser irradiation to the heat-sink shell 20 and along the cutting track cut it is described to be cut
Cutting board 10.
The laser 11 cuts the cutting board 10 to be cut along the cutting track, at this point, the laser 11 first irradiates
In on the heat-sink shell 20 being covered on the cutting track.The heat-sink shell 20 absorbs the partial heat energy of the laser 11 and then melts
Melt Cheng Liuti, and flow to the laser 11 and cut in the cutting gap that the cutting board to be cut 10 generates.The i.e. described heat-sink shell 20
Heat-absorbing material be always positioned at the cutting position of the cutting board to be cut 10, absorb the part heat for being irradiated in the laser of the position
Can, reduce the temperature gradient generated due to laser irradiation, to reduce the surface of the cutting position of the cutting board to be cut 10
And the unevenness of internal thermal stress, and then the surface of the cutting position of the reduction cutting board 10 to be cut and inside are issuable
The defects of crackle.
Step 130, removal complete the heat-sink shell 20 on the cutting board 10 to be cut after cutting.
After the completion of the cutting board to be cut 10 is cut, the heat-sink shell on the cutting board 10 to be cut after cutting is completed in removal
20.To guarantee the cleaning of substrate, to carry out next step operation.In the present embodiment, the heat-sink shell 20 absorbs the laser
11 thermal energy melting is liquid, therefore, can be swept simply by wiping or by swing flap machine progress wind by the heat-sink shell
20 removals, and can the heat-sink shell 20 of removal be recycled and be recycled, to economize on resources, reduction is produced into
This.It is understood that the removing method is can be according to the heat absorption when the heat-sink shell 20 is other heat-absorbing materials
The difference of layer 20, and select other operations such as to clean or remove.
11 cutting method of the laser provided by the invention, by before being cut by laser, in the cutting board to be cut
Cutting track on cover the heat-sink shell 20 so that laser along the cutting track cut the cutting board 10 to be cut when, institute
The thermal energy of the laser 11 can be partially absorbed by stating heat-sink shell 20, thus in the cutting with cutting substrate 10 when reducing cutting
The size of the temperature gradient of position and surrounding non-cutting position reduces the generation of thermal stress, and then the defects of reduction crackle
Generation, obtain the preferable product of quality.
The above is the preferred embodiment of the present invention, it is noted that for those skilled in the art
For, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also considered as
Protection scope of the present invention.
Claims (10)
1. a kind of laser cutting method, which is characterized in that comprising steps of
Heat-sink shell is covered on the cutting track of cutting board to be cut, the heat-sink shell is molten from Solid State Transformation under the irradiation of laser
Melt state；
Laser irradiation cuts the cutting board to be cut to the heat-sink shell and along the cutting track；
The heat-sink shell on the cutting board to be cut after cutting is completed in removal.
2. laser cutting method as described in claim 1, which is characterized in that the cutting track includes regular track and non-rule
Then track, the heat-sink shell that covers is multilayer, the heat-sink shell covered on the irregular track on the rule track
For at least one layer.
3. laser cutting method as claimed in claim 2, which is characterized in that the heat-sink shell covered on the rule track
The number of plies less than the heat-sink shell covered on the irregular track the number of plies.
4. laser cutting method as claimed in claim 3, which is characterized in that the irregular track includes chamfering cutting rail
Mark, perforation cuts track；The rule track includes straight cuts track.
5. laser cutting method as described in claim 1, which is characterized in that by fitting, coating, sputtering or vapor deposition
Any method covers the heat-sink shell on the cutting track of the cutting board to be cut.
6. laser cutting method as described in any one in claim 1-5, which is characterized in that the heat-sink shell is UV photodissociation glue.
7. laser cutting method as claimed in claim 6, which is characterized in that " laser irradiation to the heat-sink shell and the edge
The cutting track cuts the cutting board to be cut " include: that the heat-sink shell melts under the laser irradiation, and described in flowing into
It is cut by laser in the cutting gap that the cutting board to be cut generates.
8. laser cutting method as described in claim 1, which is characterized in that after being swept off by wiping or wind except cutting is completed
The cutting board to be cut on heat-sink shell.
9. laser cutting method as described in claim 1, which is characterized in that the heat absorption being covered on the cutting track
The width of layer is greater than the spot diameter of the laser.
10. laser cutting method as described in claim 1, which is characterized in that the cutting board to be cut be oled panel or
LCD panel.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710887572.XA CN107695533B (en) | 2017-09-26 | 2017-09-26 | Laser cutting method |
| PCT/CN2018/073501 WO2019061963A1 (en) | 2017-09-26 | 2018-01-19 | Cutting method employing laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710887572.XA CN107695533B (en) | 2017-09-26 | 2017-09-26 | Laser cutting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107695533A CN107695533A (en) | 2018-02-16 |
| CN107695533B true CN107695533B (en) | 2019-08-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710887572.XA Active CN107695533B (en) | 2017-09-26 | 2017-09-26 | Laser cutting method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN107695533B (en) |
| WO (1) | WO2019061963A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108598116A (en) * | 2018-04-24 | 2018-09-28 | 昆山国显光电有限公司 | Display panel, display device, display panel motherboard and preparation method thereof |
| WO2019214285A1 (en) * | 2018-05-11 | 2019-11-14 | 云谷（固安）科技有限公司 | Display panel motherboard, display panel, and display panel manufacturing method |
| CN108747043A (en) * | 2018-05-25 | 2018-11-06 | 广东水利电力职业技术学院（广东省水利电力技工学校） | A kind of plate with laser cutting machine and control method, computer |
| CN111628118B (en) * | 2020-06-30 | 2022-07-22 | 武汉天马微电子有限公司 | Method and device for cutting display mother board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3498895B2 (en) * | 1997-09-25 | 2004-02-23 | シャープ株式会社 | Substrate cutting method and display panel manufacturing method |
| TWI486259B (en) * | 2010-12-27 | 2015-06-01 | Au Optronics Corp | Flexible substrate structure and method of making the same |
| CN102310275A (en) * | 2011-06-27 | 2012-01-11 | 胡忠 | Numerical-control laser fracture-control cutting machine |
| CN102500896B (en) * | 2011-10-25 | 2015-01-07 | 碳元科技股份有限公司 | Method and system for thermal cutting of graphene layer |
| US9492990B2 (en) * | 2011-11-08 | 2016-11-15 | Picosys Incorporated | Room temperature glass-to-glass, glass-to-plastic and glass-to-ceramic/semiconductor bonding |
| JP2013107090A (en) * | 2011-11-17 | 2013-06-06 | Hitachi High-Technologies Corp | Brittle substrate processing apparatus |
| DE202012102188U1 (en) * | 2012-06-14 | 2013-09-26 | Polifilm Protection Gmbh | Particle-containing adhesive film for temporary protection of a workpiece surface, in particular in laser processing, and composite with such a film |
| WO2015113024A1 (en) * | 2014-01-27 | 2015-07-30 | Corning Incorporated | Edge chamfering methods |
| CN103700731B (en) * | 2014-01-06 | 2016-03-02 | 山东师范大学 | A kind of preparation method of transferable Te-Cd-Hg film |
| TWI566288B (en) * | 2014-07-14 | 2017-01-11 | 矽品精密工業股份有限公司 | Carrier for dicing and dicing method |
| KR20160126175A (en) * | 2015-04-22 | 2016-11-02 | 삼성디스플레이 주식회사 | Method of cutting a substrate and method of manufacturing a display apparatus |
| CN105322104B (en) * | 2015-12-08 | 2017-09-19 | 昆山工研院新型平板显示技术中心有限公司 | The method for packing of OLED display panel |
| CN106328680B (en) * | 2016-08-25 | 2019-03-15 | 昆山国显光电有限公司 | The thermally conductive jig of the package sealing with laser of organic light-emitting display device and package sealing with laser method |
| CN206456047U (en) * | 2017-01-13 | 2017-09-01 | 佛山市顺德区春祥包装材料有限公司 | A kind of laser cutting diaphragm |
-
2017
- 2017-09-26 CN CN201710887572.XA patent/CN107695533B/en active Active
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2018
- 2018-01-19 WO PCT/CN2018/073501 patent/WO2019061963A1/en active Application Filing
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| Publication number | Publication date |
|---|---|
| WO2019061963A1 (en) | 2019-04-04 |
| CN107695533A (en) | 2018-02-16 |
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