CN106684262B - Organic light-emitting display device and its packaging method - Google Patents
Organic light-emitting display device and its packaging method Download PDFInfo
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- CN106684262B CN106684262B CN201710208629.9A CN201710208629A CN106684262B CN 106684262 B CN106684262 B CN 106684262B CN 201710208629 A CN201710208629 A CN 201710208629A CN 106684262 B CN106684262 B CN 106684262B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Electroluminescent Light Sources (AREA)
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Abstract
A kind of organic light-emitting display device of present invention offer and its packaging method; the device includes glass substrate; and flexible display substrates, thin-film encapsulation layer and the protection film layer of setting on the glass substrate; thin-film encapsulation layer includes the first coating and the second coating; the surface flush opposite with protection film layer of first coating and the second coating; wherein, the first coating covers the display area of the flexible display substrates；The pad pasting region of second coating cover glass substrate being located on the outside of flexible display substrates and the region of flexible display substrates being located on the outside of the first coating.Organic light-emitting display device provided by the invention and its packaging method, it can not only eliminate the harmful effect that the segment difference formed between flexible display substrates and glass substrate brings film coating process, but also fitting width can be reduced, so as to improve the utilization rate of flexible display substrates.
Description
Technical field
The present invention relates to display technology fields, and in particular, to a kind of organic light-emitting display device and its packaging method.
Background technology
Organic Light Emitting Diode (OLED) is prepared on a flexible substrate, realizes that Flexible Displays are following to show skill with this
One important directions of art development.But flexible substrates are weaker to the blocking capability of water, oxygen for substrate of glass.
Future extends the service life of flexible OLED devices, it is necessary to effectively be encapsulated to OLED device using packaging film.Also, it is sealing
It installs into later, protective film can be attached on packaging film, not influenced by particle with protection packaging film.
Fig. 1 is a kind of existing structure chart of organic light-emitting display device.As shown in Figure 1, organic light-emitting display device packet
Glass substrate 1 is included, and flexible display substrates 2, thin-film encapsulation layer 3 and the protection film layer 4 being arranged on the glass substrate 1.Its
In, protection film layer 4 is attached to by protective film glue material 5 in thin-film encapsulation layer 3, and the length of side of protection film layer 4 is more than flexible show
Show the length of side of substrate 2, that is, the edge of protection film layer 4 is stretched out relative to the edge of flexible display substrates 2, the stretching
Partial length is to be bonded width D, which needs to be more than certain numerical value, to ensure the stability of subsequent technique.
But due to being formed with segment difference between flexible display substrates 2 and glass substrate 1, which may result in
It is bad in its extension generation bubble etc. to state protection film layer 4, this not only brings harmful effect to film coating process, but also needs more
Big fitting width D just can guarantee that the stability of subsequent technique, the utilization rate so as to cause flexible display substrates 2 are relatively low.
Invention content
The present invention is directed at least solve one of the technical problems existing in the prior art, it is proposed that a kind of organic light emitting display
Device and its packaging method can not only eliminate the harmful effect brought to film coating process, but also it is wide to reduce fitting
Degree, so as to improve the utilization rate of flexible display substrates.
A kind of organic light-emitting display device, including glass substrate are provided to achieve the purpose of the present invention, and setting exists
Flexible display substrates, thin-film encapsulation layer on the glass substrate and protection film layer, the thin-film encapsulation layer include the first covering
Layer and the second coating, the surface flush opposite with the protection film layer of first coating and the second coating,
In,
First coating covers the display area of the flexible display substrates；
Second coating covers the pad pasting region of the glass substrate being located on the outside of the flexible display substrates, with
And the region of the flexible display substrates being located on the outside of first coating.
Preferably, the surface opposite with the protection film layer of second coating is provided with hollow-out parts.
Preferably, the hollow-out parts are multiple, and are spaced apart around the flexible display substrates.
Preferably, second coating includes second organic water blocking layer.
Preferably, first coating includes that the first inorganic water blocking layer, first organic water blocking layer and second inorganic block water
Layer.
Preferably, the material identical of first coating and described first organic water blocking layer.
Preferably, the flexible display substrates include flexible base board, and the film being arranged on the flexible base board is brilliant
Body pipe functional layer and Organic Light Emitting Diode.
As another technical solution, the present invention also provides a kind of packaging methods of organic light-emitting display device comprising：
Flexible display substrates are formed on the glass substrate；
Thin-film encapsulation layer is formed on the flexible display substrates；The thin-film encapsulation layer includes the first coating and second
The surface flush opposite with the protection film layer of coating, first coating and the second coating, wherein described
One coating covers the display area of the flexible display substrates；Second coating cover the glass substrate be located at institute
State the pad pasting region on the outside of flexible display substrates and the area of the flexible display substrates being located on the outside of first coating
Domain
Protection film layer is formed in the thin-film encapsulation layer.
Preferably, second coating is formed by the way of inkjet printing.
Preferably, first coating includes that the first inorganic water blocking layer, first organic water blocking layer and second inorganic block water
Layer；
Described first organic water blocking layer is formed by the way of inkjet printing.
The invention has the advantages that：
In the technical solution of organic light-emitting display device provided by the invention and its packaging method, thin-film encapsulation layer includes the
One coating and the second coating, the surface flush opposite with protection film layer of the two, wherein the covering of the first coating is flexible
The display area of display base plate, to protect the OLED device on flexible display substrates.Second coating cover glass substrate
The region being located on the outside of the first coating in pad pasting region and flexible display substrates on the outside of flexible display substrates, is used
With the part for supporting the edge of protection film layer to be stretched out relative to the edge of flexible display substrates, so as to eliminate
The harmful effect that the segment difference formed between flexible display substrates and glass substrate brings film coating process, but also patch can be reduced
Width is closed, so as to improve the utilization rate of flexible display substrates.
Description of the drawings
Fig. 1 is a kind of existing structure chart of organic light-emitting display device；
Fig. 2 is the structure chart of organic light-emitting display device provided in an embodiment of the present invention；
Fig. 3 is the vertical view of the thin-film encapsulation layer of organic light-emitting display device provided in an embodiment of the present invention；And
Fig. 4 is the vertical view of the thin-film encapsulation layer for the organic light-emitting display device that the preferred embodiment of the embodiment of the present invention provides
Figure.
Specific implementation mode
To make those skilled in the art more fully understand technical scheme of the present invention, come below in conjunction with the accompanying drawings to the present invention
The organic light-emitting display device and its packaging method of offer are described in detail.
Fig. 2 is the structure chart of organic light-emitting display device provided in an embodiment of the present invention.Fig. 3 provides for the embodiment of the present invention
Organic light-emitting display device thin-film encapsulation layer vertical view.Also referring to Fig. 2 and Fig. 3, organic light-emitting display device packet
Glass substrate 10 is included, and flexible display substrates, thin-film encapsulation layer 15 and the protection film layer 14 being arranged on the glass substrate 10.
Wherein, flexible display substrates include flexible base board 11, and the luminescent layer 12 being arranged on the flexible base board 11, the luminescent layer position
In the display area A of flexible base board 11, the OLED of thin film transistor (TFT) functional layer and Organic Light Emitting Diode etc. can specifically include
Device.In addition, protection film layer 14 is attached to by protective film glue material 13 in thin-film encapsulation layer 15.
Thin-film encapsulation layer 15 includes the first coating and the second coating 154, wherein the first coating covers Flexible Displays
The display area of substrate, that is, the luminescent layer 12 in cladding display area, to protect OLED device.Further, this first is covered
Cap rock includes the first inorganic water blocking layer 151, first organic water blocking layer 152 and the second inorganic water blocking layer 153.Since inorganic thin film has
There is higher steam isolating power, may be used as water blocking layer, it still, can be inevitably during generating inorganic thin film
The defects of generating such as pin hole, crackle, causes the obstructing capacity of inorganic water blocking layer to reduce.In addition, blocked up inorganic water blocking layer is also
Larger internal stress is will produce, to seriously affect package quality.For this purpose, organic by being arranged between two inorganic water blocking layers
Water blocking layer, it is possible to reduce the defect and internal stress of inorganic water blocking layer, so as to improve package quality.
The pad pasting region C of second coating, 154 cover glass substrate 10 being located on the outside of flexible display substrates, and it is flexible
The region B of display base plate being located on the outside of the first coating.Region B does not include binding (bonding) circuit region,
That is, the second coating 154 does not cover binding circuit region.Also, the first coating and the second coating 154 with protection
The opposite surface flush of film layer 14, to which the second coating 154 has filled and led up flexible display substrates and the first coating in glass
The segment difference that 10 edge of substrate is formed, so as to eliminate the harmful effect that the segment difference brings film coating process, but also can be with
Under the premise of ensureing the stability of subsequent technique, reduce fitting width (that is, length E of the extension of protection film layer 4), from
And the utilization rate of flexible display substrates can be improved.
Fig. 4 is the vertical view of the thin-film encapsulation layer for the organic light-emitting display device that the preferred embodiment of the embodiment of the present invention provides
Figure.Referring to Fig. 4, preferred, the surface opposite with protection film layer 14 of the second coating 154 is provided with hollow-out parts 154a.It borrows
Hollow-out parts 154a is helped, the contact area of the second coating 154 and protective film glue material 13 can be increased, covered so as to improve second
The bonding force of cap rock 154 and protective film glue material 13.Preferably, hollow-out parts 154a can be multiple, and between flexible base board 11
Every distribution, so as to improve the uniformity of bonding force.In practical applications, the shape of each hollow-out parts 154a can be square
Shape, circle or other arbitrary shapes.In addition, multiple hollow-out parts 154a can also use any other distribution mode, the present invention
This is not particularly limited.
Preferably, above-mentioned second coating 154 includes second organic water blocking layer.Since organic water blocking layer can be in guarantee
Stress will not it is excessive under the premise of design larger thickness, therefore, can be met using organic water blocking layer and fill and lead up Flexible Displays base
The needs for the hierarchic structure that plate and the first coating are formed in 10 edge of glass substrate, while being not in that internal stress is excessive
Problem.Further, the material identical of the first coating 154 and first organic water blocking layer 151, to simplify thin film encapsulation processes.
As another technical solution, the embodiment of the present invention also provides a kind of packaging method of organic light-emitting display device,
Also referring to Fig. 2 and Fig. 3 comprising：
Step 1: forming flexible display substrates on the glass substrate 10.
The flexible display substrates include flexible base board 11, and the luminescent layer 12 being arranged on the flexible base board 11, the hair
Photosphere is located at the display area A of flexible base board 11, can specifically include thin film transistor (TFT) functional layer and Organic Light Emitting Diode etc.
OLED device.
Step 2: forming thin-film encapsulation layer 15 on the flexible display substrates.
The thin-film encapsulation layer 15 include the first coating and the second coating 154, the two it is opposite with protection film layer 14
Surface flush, wherein the first coating covers the display area A of flexible display substrates；Second coating, 154 cover glass base
The pad pasting region C of plate 10 being located on the outside of flexible display substrates and being located on the outside of the first coating for flexible display substrates
Region B.
Preferably, the second coating 154 is formed by the way of inkjet printing.The mode of inkjet printing have without using
Masterplate (mask), the good leveling property of film layer, the advantage that the process time is short and film thickness is controllable.It is of course also possible to use silk-screen printing
Mode form the second coating 154.
Additionally, it is preferred that, above-mentioned first coating includes the first inorganic water blocking layer 151, first organic water blocking layer 152 and the
Two inorganic water blocking layers 153.Since inorganic thin film has higher steam isolating power, water blocking layer is may be used as, still, in life
The defects of such as pin hole, crackle can be inevitably generated during at inorganic thin film, leads to the barrier energy of inorganic water blocking layer
Power reduces.In addition, blocked up inorganic water blocking layer also will produce larger internal stress, to seriously affect package quality.For this purpose, logical
It crosses between two inorganic water blocking layers and organic water blocking layer is set, it is possible to reduce the defect and internal stress of inorganic water blocking layer, so as to
To improve package quality.
It is similar with the generation type of above-mentioned second coating 154, inkjet printing or silk-screen printing can also be used
Mode form above-mentioned first organic water blocking layer 152.Furthermore it is possible to be formed using the film plating process of PVD or CVD etc.
State the first inorganic water blocking layer 151 and the second inorganic water blocking layer 153.
Step 3: forming protection film layer 14 in thin-film encapsulation layer 15.
It is attached in thin-film encapsulation layer 15 especially by protective film glue material 13.
In conclusion the packaging method of organic light-emitting display device provided by the invention, can not only eliminate in flexibility
The harmful effect that the segment difference formed between display base plate and glass substrate brings film coating process, but also it is wide to reduce fitting
Degree, so as to improve the utilization rate of flexible display substrates.
It is understood that the principle that embodiment of above is intended to be merely illustrative of the present and the exemplary implementation that uses
Mode, however the present invention is not limited thereto.For those skilled in the art, in the essence for not departing from the present invention
In the case of refreshing and essence, various changes and modifications can be made therein, these variations and modifications are also considered as protection scope of the present invention.
Claims (10)
1. a kind of organic light-emitting display device, including glass substrate, and the Flexible Displays base that is arranged on the glass substrate
Plate, thin-film encapsulation layer and protection film layer, which is characterized in that the thin-film encapsulation layer includes the first coating and the second coating,
The surface flush opposite with the protection film layer of first coating and the second coating, wherein
First coating covers the display area of the flexible display substrates；
Second coating covers the pad pasting region of the glass substrate being located on the outside of the flexible display substrates, Yi Jisuo
The region of flexible display substrates being located on the outside of first coating is stated, the flexible display substrates are covered positioned at described first
Region on the outside of cap rock does not include binding circuit region.
2. organic light-emitting display device according to claim 1, which is characterized in that second coating with it is described
The opposite surface of protection film layer is provided with hollow-out parts.
3. organic light-emitting display device according to claim 2, which is characterized in that the hollow-out parts are multiple, and are surrounded
The flexible display substrates are spaced apart.
4. according to the organic light-emitting display device described in claim 1-3 any one, which is characterized in that second coating
Including second organic water blocking layer.
5. according to the organic light-emitting display device described in claim 1-3 any one, which is characterized in that first coating
Including the first inorganic water blocking layer, first organic water blocking layer and the second inorganic water blocking layer.
6. organic light-emitting display device according to claim 5, which is characterized in that first coating and described first
The material identical of organic water blocking layer.
7. according to the organic light-emitting display device described in claim 1-3 any one, which is characterized in that the Flexible Displays base
Plate includes flexible base board, and the thin film transistor (TFT) functional layer and Organic Light Emitting Diode being arranged on the flexible base board.
8. a kind of packaging method of organic light-emitting display device, which is characterized in that including：
Flexible display substrates are formed on the glass substrate；
Thin-film encapsulation layer is formed on the flexible display substrates；
Protection film layer is formed in the thin-film encapsulation layer；
Wherein, the thin-film encapsulation layer includes the first coating and the second coating, first coating and the second coating
The surface flush opposite with the protection film layer, wherein first coating covers the aobvious of the flexible display substrates
Show region；Second coating covers the pad pasting region of the glass substrate being located on the outside of the flexible display substrates, with
And the region of the flexible display substrates being located on the outside of first coating；The flexible display substrates are located at described the
Region on the outside of one coating does not include binding circuit region.
9. the packaging method of organic light-emitting display device according to claim 8, which is characterized in that using inkjet printing
Mode forms second coating.
10. the packaging method of organic light-emitting display device according to claim 8, which is characterized in that first covering
Layer includes the first inorganic water blocking layer, first organic water blocking layer and the second inorganic water blocking layer；
Described first organic water blocking layer is formed by the way of inkjet printing.
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| CN201710208629.9A CN106684262B (en) | 2017-03-31 | 2017-03-31 | Organic light-emitting display device and its packaging method |
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| CN201710208629.9A CN106684262B (en) | 2017-03-31 | 2017-03-31 | Organic light-emitting display device and its packaging method |
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| CN106684262B true CN106684262B (en) | 2018-10-19 |
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| CN107195794B (en) | 2017-06-06 | 2019-07-30 | 京东方科技集团股份有限公司 | A kind of flexible display substrates and preparation method thereof, display panel, display device |
| CN109509402B (en) * | 2017-09-14 | 2022-03-18 | 广州国显科技有限公司 | Flexible display device |
| CN108962023B (en) * | 2017-11-30 | 2021-04-16 | Tcl科技集团股份有限公司 | Flexible display device and preparation method thereof |
| KR102612769B1 (en) * | 2018-11-09 | 2023-12-11 | 엘지디스플레이 주식회사 | Display apparatus and method for manufacturing the same |
| CN110729335B (en) * | 2019-10-28 | 2022-02-01 | 武汉华星光电半导体显示技术有限公司 | Display panel and preparation method thereof |
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| KR102001815B1 (en) * | 2011-11-29 | 2019-07-19 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Method of manufacturing sealed body and method of manufacturing light-emitting device |
| CN103325958A (en) * | 2013-06-19 | 2013-09-25 | 京东方科技集团股份有限公司 | Organic light-emitting device packaging cover plate, organic light-emitting device and displayer |
| CN104867960B (en) * | 2015-04-21 | 2019-06-04 | 京东方科技集团股份有限公司 | Display panel and its packaging method, display device |
| CN105226201A (en) * | 2015-09-02 | 2016-01-06 | 上海和辉光电有限公司 | A kind of flexible OLED display and manufacture method thereof |
| CN106068564B (en) * | 2015-10-29 | 2019-10-11 | 京东方科技集团股份有限公司 | Display device and preparation method thereof |
| CN105322104B (en) * | 2015-12-08 | 2017-09-19 | 昆山工研院新型平板显示技术中心有限公司 | The method for packing of OLED display panel |
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