KR20190044015A - Display device and method of manufacturing of the same - Google Patents

Abstract

According to an embodiment of the present invention, a method of manufacturing a display device comprises the following steps: forming a plurality of thin film transistors, a plurality of LEDs, a plurality of gate wirings, and a plurality of data wirings on the upper surface of a first substrate; forming a plurality of gate link lines and a plurality of data link lines on the back surface of a second substrate; bonding the first substrate and the second substrate; scribing the first substrate and the second substrate in a cell unit; connecting the plurality of gate wirings and the plurality of gate link lines, and forming a plurality of side lines to connect the plurality of data wirings and the plurality of data link lines; and forming an insulating layer covering the plurality of side lines.

Description

TECHNICAL FIELD [0001] The present invention relates to a display device and a method of manufacturing the same,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0002] The present invention relates to a display device and a display device manufacturing method, and more particularly, to a display device using an LED (Light Emitting Diode) and a display device manufacturing method.

2. Description of the Related Art [0002] Liquid crystal display devices (LCDs) and organic light emitting display devices (OLEDs), which have been widely used up to now, have been increasingly used.

The liquid crystal display device and the organic light emitting display device are widely applied to screens of everyday electronic devices such as mobile phones and notebooks because they can provide a high resolution screen and are lightweight and thin. It is expanding.

However, the liquid crystal display device and the organic light emitting display device have a limitation in reducing the size of a bezel area visible to the user in an area where no image is displayed on the display device. For example, in the case of a liquid crystal display, there is a limitation in reducing the size of the bezel region because a sealant must be used to seal the liquid crystal and adhere the upper substrate and the lower substrate. In addition, in the case of the organic light emitting diode display, since the organic light emitting diode is made of an organic material and is very vulnerable to moisture or oxygen, an encapsulation for protecting the organic light emitting diode must be disposed. have. In particular, since it is impossible to realize a very large screen as a single panel, when a very large screen is implemented by arranging a plurality of liquid crystal display panels or a plurality of organic light emitting display panels in the form of a tile, There may be a problem that the area is viewed by the user.

As an alternative to this, a display device including an LED has been proposed. The LED is made of an inorganic material, not an organic material, and therefore has excellent reliability and a longer life than a liquid crystal display device or an organic light emitting display device. In addition, the LED is suitable for a very large-sized screen because it not only has a fast lighting speed but also low power consumption, high impact resistance and excellent stability and can display a high-brightness image.

Accordingly, an LED device is generally used as a display device for providing a very large screen capable of minimizing a bezel area.

The inventors of the present invention have found that the LED has a higher luminous efficiency than the organic light emitting device, and thus, in the case of a display device including an LED, the size of one pixel, that is, Lt; RTI ID = 0.0 > a < / RTI > very small size of the luminescent region required. The inventors of the present invention have found that when the display device is implemented using LEDs, the distance between the light emitting regions of the adjacent pixels is smaller than the distance between the light emitting regions of adjacent pixels in the organic light emitting display device having the same resolution It was very long. The inventors of the present invention have found that when a tiled display implemented by arranging a plurality of panels in the form of tiles is implemented, the interval between the outermost LEDs of one panel and the outermost LEDs of the other panel adjacent thereto is one It is possible to realize a zero-bezel realization in which the bezel region does not exist substantially.

However, as described above, in order to realize the interval between the outermost LEDs of one panel and the outermost LEDs of another panel adjacent to the outermost LEDs of one panel to be the same as the interval between the LEDs in one panel, Such as a gate driver, a data driver, and the like, which are positioned on the rear side of the panel, must be positioned on the back side of the panel. The inventors of the present invention have invented a display device of a new structure in which devices such as a thin film transistor, an LED and the like are disposed on a top surface of a panel, and driving parts such as a gate driving part and a data driving part are disposed on the back surface of the panel. The inventors of the present invention invented a manufacturing technique for forming side wirings on the side surfaces of the panel to connect the elements arranged on the upper surface of the panel and the driving parts arranged on the back surface of the panel.

However, in the case of the conventional techniques for forming side wirings, when printing is performed a plurality of times by using a pad, the process is long and the defect rate is high, so that the printing accuracy is low. Therefore, when printing is performed by using a pad at one time, the length of the side wiring is short, and it is difficult to connect the wiring on the top surface of the panel to the wiring on the back surface. In addition, when side wirings are manufactured by printing using a pad, the contact surface of the pad is damaged or deformed to deteriorate the printing quality. Therefore, the pad must be periodically replaced, but the pad is expensive, There is a need to newly change the set values of the manufacturing equipment.

Accordingly, the inventors of the present invention invented a new method of manufacturing a display device using a laser printing method, which can realize a zero-bezel and a side wiring with a simpler process. In addition, the inventors of the present invention have developed a display device and a display device manufacturing method which can minimize breakage and deformation of a pad even when a side wiring is printed using a pad, and can realize accurate connection between wirings by a side wiring even in a single printing process Invented.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a display device and a display device manufacturing method capable of forming a side wiring even in a simple and low-cost manufacturing process by using Laser Transfer Printing.

Another problem to be solved by the present invention is to provide a display device and a display device manufacturing method which can omit a side grinding process in manufacturing a display device including an LED by using a laser etching process.

Another problem to be solved by the present invention is to provide a display device and a display device manufacturing method in which a base layer compensating for scratches due to a grinding process is disposed between a substrate and side wirings to minimize migration incidence between side wirings .

The problems of the present invention are not limited to the above-mentioned problems, and other problems not mentioned can be clearly understood by those skilled in the art from the following description.

According to an aspect of the present invention, there is provided a method of manufacturing a display device including forming a plurality of thin film transistors, a plurality of LEDs, a plurality of gate lines, and a plurality of data lines on a top surface of a first substrate, Forming a plurality of gate link wirings and a plurality of data link wirings on the back surface of the second substrate, bonding the first substrate and the second substrate, scribing the first substrate and the second substrate in a cell unit Forming a plurality of side wirings for connecting a plurality of gate wirings and a plurality of gate link wirings and connecting a plurality of data wirings and a plurality of data link wirings and forming an insulating layer covering the plurality of side wirings .

The details of other embodiments are included in the detailed description and drawings.

The present invention can use laser transfer printing to form the side wirings, thereby simplifying the manufacturing process for forming the side wirings and reducing the manufacturing cost.

Further, the present invention can omit the side grinding step, which was used for more smoothly connecting the wiring on the upper surface of the panel and the wiring on the back surface, by using a laser etching process to form the side wiring.

Further, according to the present invention, it is possible to minimize the occurrence of migration between wirings by disposing a base layer between the side wirings and the substrate. can do.

The effects according to the present invention are not limited by the contents exemplified above, and more various effects are included in the specification.

1 is a flowchart illustrating a method of manufacturing a display device according to an embodiment of the present invention.
2A to 2J are schematic process diagrams illustrating a method of manufacturing a display device and a display device according to an embodiment of the present invention.
3 is a schematic rear view for explaining a display device and a method of manufacturing a display device according to another embodiment of the present invention.
4A to 4C are schematic flow diagrams illustrating a method of manufacturing a display device and a display device according to another embodiment of the present invention.
5A to 5D are schematic flow diagrams illustrating a method of manufacturing a display device and a display device according to another embodiment of the present invention.
6A to 6D are schematic cross-sectional views for explaining a display device and a display device manufacturing method according to another embodiment of the present invention.
7A and 7B are schematic cross-sectional views for explaining a display device and a display device manufacturing method according to a comparative example.
7C is a schematic cross-sectional view illustrating a method of manufacturing a display device according to another embodiment of the present invention.
8A and 8B are schematic cross-sectional views for explaining a display device and a method of manufacturing a display device according to still another embodiment of the present invention.
9A and 9B are schematic cross-sectional views for explaining a display device and a display device manufacturing method according to various embodiments of the present invention.
10A to 10C are schematic sectional views for explaining a display device and a display device manufacturing method according to a comparative example.
11A to 11D are schematic cross-sectional views for explaining a display device and a method of manufacturing the display device according to still another embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention and the manner of achieving them will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims.

The shapes, sizes, ratios, angles, numbers, and the like disclosed in the drawings for describing the embodiments of the present invention are illustrative, and thus the present invention is not limited thereto. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail. Where the terms "comprises", "having", "done", and the like are used in this specification, other portions may be added unless "only" is used. Unless the context clearly dictates otherwise, including the plural unless the context clearly dictates otherwise.

In interpreting the constituent elements, it is construed to include the error range even if there is no separate description.

In the case of a description of the positional relationship, for example, if the positional relationship between two parts is described as 'on', 'on top', 'under', and 'next to' Or " direct " is not used, one or more other portions may be located between the two portions.

It will be understood that when an element or layer is referred to as being on another element or layer, it encompasses the case where it is directly on or intervening another element or intervening another element or element.

Although the first, second, etc. are used to describe various components, these components are not limited by these terms. These terms are used only to distinguish one component from another. Therefore, the first component mentioned below may be the second component within the technical spirit of the present invention.

Like reference numerals refer to like elements throughout the specification.

The sizes and thicknesses of the individual components shown in the figures are shown for convenience of explanation and the present invention is not necessarily limited to the size and thickness of the components shown.

It is to be understood that each of the features of the various embodiments of the present invention may be combined or combined with each other partially or entirely and technically various interlocking and driving is possible as will be appreciated by those skilled in the art, It may be possible to cooperate with each other in association.

Various embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

1 is a flowchart illustrating a method of manufacturing a display device according to an embodiment of the present invention. 2A to 2J are schematic process diagrams illustrating a method of manufacturing a display device and a display device according to an embodiment of the present invention. 2A is a schematic top view of the first substrate 111 prior to the bonding process. 2B is a schematic rear view of the second substrate 112 prior to the bonding process. 2C is a schematic cross-sectional view of the first substrate 111 and the second substrate 112 bonded. 2D is a schematic top view of the first substrate 111 with the scribing process completed. FIG. 2E is a schematic cross-sectional view of the state where the scribing process is completed. 2F and 2G are schematic cross-sectional views for explaining the laser printing process. Figure 2h is a schematic side view of the laser printing process completed. 2I is a schematic top view of the first substrate 111 with the laser printing process completed. FIG. 2J is a schematic cross-sectional view for explaining a process of forming the insulating layer 160. FIG.

First, a plurality of thin film transistors 120, a plurality of LEDs 130, a plurality of gate lines GL, and a plurality of data lines DL are formed on an upper surface of a first substrate (S100).

Referring to FIG. 2A, the first substrate 111 is a substrate for supporting components disposed on a display device, and may be an insulating substrate. For example, the first substrate 111 may be made of glass, resin, or the like. In addition, the first substrate 111 may include a polymer or plastic. In some embodiments, the first substrate 111 may be made of plastic material with flexibility.

The first substrate 111 may define a display area AA and a non-display area NA surrounding the display area AA. The display area AA is an area where an image is actually displayed in the display device and the LED 130 to be described later and the thin film transistor 120 for driving the LED 130 and the like may be disposed in the display area AA. The non-display area NA can be defined as an area where no image is displayed, and an area surrounding the display area AA. The non-display area NA may be provided with various wires such as the LED 130 and the gate line GL and the data line DL connected to the thin film transistor 120 arranged in the display area AA. In this specification, the first substrate 111 is described as being defined as the display area AA and the non-display area NA. However, the present invention is not limited to this, and it may be defined that there is no non-display area NA. That is, when the tiled display is implemented using the display device manufactured by the display device manufacturing method according to the embodiment of the present invention, the outermost LED 130 of one panel and the other The spacing between the outer LEDs 130 can be equal to the spacing between the LEDs 130 in one panel, thereby realizing a zero-bezel implementation in which there is substantially no bezel area. Therefore, the first substrate 111 is defined as having only the display area AA, and the non-display area NA may be described as being not defined in the first substrate 111. [

In the display area AA of the first substrate 111, a plurality of pixels PX are defined. Each of the plurality of pixels PX is an individual unit for emitting light and the plurality of pixels PX may include a red pixel PX, a green pixel PX and a blue pixel PX, no. In each of the plurality of pixels PX, a thin film transistor 120 and an LED 130 are formed. A more detailed description of the thin film transistor 120 and the LED 130 will be described later with reference to Fig. 2C.

A scribing line SL may be defined on the first substrate 111. The scribing line SL is a virtual cutting line used for cutting the display device in a cell unit after the bonding process of the first substrate 111 and the second substrate 112. That is, a scribing line SL can be defined for a scribing process in which a plurality of display devices are formed at the same time or one display device is formed on a ledge substrate, and then the display device is cut in units of cells .

Next, a plurality of gate link lines GLL and a plurality of data link lines (DLL) are formed on the back surface of the second substrate 112 (S110).

Referring to FIG. 2B, the second substrate 112 is a substrate for supporting components disposed under the display device, and may be an insulating substrate. For example, the second substrate 112 may be made of glass, resin, or the like. Also, the second substrate 112 may include a polymer or plastic. The second substrate 112 may be formed of the same material as the first substrate 111. In some embodiments, the second substrate 112 may be made of plastic material with flexibility.

A plurality of gate link lines GLL and a plurality of data link lines (DLLs) are formed on the back surface of the second substrate 112. The plurality of gate link lines GLL are wirings for connecting the plurality of gate lines GL formed on the upper surface of the first substrate 111 to the gate driver and the plurality of data link lines DLL are formed on the first substrate 111 And a data driver for connecting the plurality of data lines DL formed on the upper surface of the data driver. The plurality of gate link lines GLL and the plurality of data link lines DLL may extend from the end of the second substrate 112 toward the center of the second substrate 112. [

Although not shown in FIG. 2B, a gate driver is disposed on the back surface of the second substrate 112 so as to be electrically connected to a plurality of gate link lines GLL, and data A driving unit can be disposed. At this time, the gate driver and the data driver may be formed directly on the back surface of the second substrate 112, on the back surface of the second substrate 112 by a COF (Chip on Film) method, , But it is not limited thereto.

Subsequently, the first substrate 111 and the second substrate 112 are bonded (S120).

Referring to FIG. 2C, the first substrate 111 and the second substrate 112 are bonded through the bonding layer 118. The bonding layer 118 may be made of a material capable of curing the first substrate 111 and the second substrate 112 through various curing methods. The bonding layer 118 may be disposed in the entire area between the first substrate 111 and the second substrate 112, or may be disposed in only a part of the area.

Referring to FIG. 2C, the thin film transistor 120 is formed on the first substrate 111 in detail. Specifically, the gate electrode 121 is disposed on the first substrate 111, and the active layer 122 is disposed on the gate electrode 121. A gate insulating layer 113 for insulating the gate electrode 121 and the active layer 122 is disposed between the gate electrode 121 and the active layer 122. A source electrode 123 and a drain electrode 124 are disposed on the active layer 122 and a passivation layer 114 is provided on the source electrode 123 and the drain electrode 124 for protecting the TFT 120 . However, the passivation layer 114 may be omitted depending on the embodiment.

Referring to FIG. 2C, a gate line GL is formed on the same layer as the gate electrode 121. The gate line GL may be made of the same material as the gate electrode 121. [ The gate wiring GL is disposed in the display area AA and the non-display area NA and is formed beyond the scribing line SL. Although the gate line GL is shown in Fig. 2C, the data line DL may be formed in the same way as the gate line GL.

Referring to FIG. 2C, a common wiring CL is disposed on the gate insulating layer 113. [ The common line CL is a line for applying a common voltage to the LED 130 and may be disposed apart from the gate line GL or the data line DL. Further, the common line CL may extend in the same direction as the gate line GL or the data line DL. The common line CL may be made of the same material as the source electrode 123 and the drain electrode 124 as shown in FIG. 2C, but may be made of the same material as the gate electrode 121 without being limited thereto.

A reflective layer 143 is disposed on the passivation layer 114 in the display area AA. The reflective layer 143 is a layer for reflecting the light emitted from the LED 130 toward the first substrate 111 toward the upper portion of the display device and outputting the reflected light to the outside of the display device. The reflective layer 143 may be formed of a metal material having a high reflectivity.

An adhesive layer 115 is disposed on the reflective layer 143. The adhesive layer 115 may be an adhesive layer 115 for bonding the LED 130 on the reflective layer 143 and may isolate the LED 130 from the reflective layer 143 made of a metal material. The adhesive layer 115 may be formed of a thermosetting material or a photocurable material, but is not limited thereto.

The LED 130 is disposed on the adhesive layer 115. The LED 130 includes an n-type layer 131, an active layer 132, a p-type layer 133, an n-electrode 135 and a p- Hereinafter, LED 130 having a lateral structure is used as LED 130, but the structure of LED 130 is not limited thereto.

The lamination structure of the LED 130 will be described in more detail. The n-type layer 131 can be formed by implanting n-type impurity into gallium nitride (GaN) having excellent crystallinity. An active layer 132 is disposed on the n-type layer 131. The active layer 132 may be a light emitting layer that emits light from the LED 130, and may be made of a nitride semiconductor, for example, indium gallium nitride (InGaN). A p-type layer 133 is disposed on the active layer 132. The p-type layer 133 can be formed by implanting p-type impurity into gallium nitride (GaN). However, the constituent materials of the n-type layer 131, the active layer 132 and the p-type layer 133 are not limited thereto.

The LED 130 is formed by sequentially stacking the n-type layer 131, the active layer 132 and the p-type layer 133 and then etching the predetermined portion, (134). ≪ / RTI > At this time, a predetermined portion is a space for separating the n-electrode 135 and the p-electrode 134, and a predetermined portion may be etched so that a part of the n-type layer 131 is exposed. In other words, the surface of the LED 130 on which the n-electrode 135 and the p-electrode 134 are to be disposed may have different height levels than the planarized surface.

Thus, the n-electrode 135 can be disposed on the n-type layer 131 exposed in the etched region, that is, the etching process. The n-electrode 135 may be made of a conductive material, for example, a transparent conductive oxide. On the other hand, the p-electrode 134 may be disposed on the non-etched region, that is, on the p-type layer 133. The p-electrode 134 may be formed of a conductive material, for example, a transparent conductive oxide. The p-electrode 134 may be formed of the same material as the n-electrode 135.

As described above, in a state where the n-type layer 131, the active layer 132, the p-type layer 133, the n-electrode 135 and the p-electrode 134 are formed, the LED 130 may be disposed adjacent to the reflective layer 143 rather than the p-electrode 134.

Subsequently, the first planarization layer 116 is disposed to planarize the thin film transistor 120 in the display area AA. The first planarization layer 116 may be formed to planarize the upper portion in the region where the LED 130 is disposed and the region except the contact hole. Also, a second planarization layer 117 may be disposed on the first planarization layer 116. The second planarization layer 117 may be disposed on the thin film transistor 120 and the LED 130 in a region except for the contact hole. At this time, the second planarization layer 117 may be formed such that a part of the p-electrode 134 and the n-electrode 135 of the LED 130 are opened. In FIG. 2C, two planarization layers are used in the manufacture of a display device. However, this is to prevent an excessive increase in processing time and the like when forming a single planarization layer. Accordingly, the first planarization layer 116 and the second planarization layer 117 are not necessarily formed in plural, but may be formed of a single planarization layer.

The first electrode 141 is an electrode for connecting the thin film transistor 120 to the p electrode 134 of the LED 130. The first electrode 141 is electrically connected to the source electrode 123 of the thin film transistor 120 through the contact hole formed in the first planarization layer 116, the second planarization layer 117, the passivation layer 114, And contacts the p-electrode 134 of the LED 130 through the contact hole formed in the second planarization layer 117. The first electrode 141 may be defined as being in contact with the drain electrode 124 of the thin film transistor 120, depending on the type of the thin film transistor 120.

The second electrode 142 is an electrode for connecting the common line CL to the n-electrode 135 of the LED 130. The second electrode 142 is in contact with the common line CL through the contact holes formed in the first planarization layer 116, the second planarization layer 117, the passivation layer 114 and the adhesive layer 115, Electrode 135 of the LED 130 through the contact hole formed in the layer 117. [

Accordingly, when the display device is turned on, different voltage levels applied to the source electrode 123 and the common line CL of the thin film transistor 120 are applied to the first electrode 141 and the second electrode Electrode 134 and the n-electrode 135 through the light-emitting layer 142 and the LED 130, respectively. 2C, the thin film transistor 120 is electrically connected to the p-electrode 134 and the common wiring CL is electrically connected to the n-electrode 135. However, the present invention is not limited thereto. the common line CL may be electrically connected to the n-electrode 135 and the common line CL may be electrically connected to the p-

Referring to FIG. 2C, a gate link line GLL is formed on the rear surface of the second substrate 112. The gate wiring line GLL may be made of the same material as the gate electrode 121. [ The gate link line GLL is disposed in the display area AA and the non-display area NA and is formed beyond the scribing line SL. Although the gate link wiring GLL is shown in FIG. 2C, the data link wiring (DLL) may also be formed in the same manner as the gate wiring wiring GLL.

Subsequently, the first substrate 111 and the second substrate 112 are scribed in units of cells (S130).

Referring to FIGS. 2d and 2e, a first substrate 111 and a second substrate 112 are formed along a virtual scribing line SL defined in the first substrate 111 and the second substrate 112, The first substrate 111 and the second substrate 112 can be separated in a cell unit by scribing. That is, as shown in FIG. 2C, the laser is irradiated along the scribing line SL in a state where the first substrate 111 and the second substrate 112 are attached to each other, The first substrate 111 and the second substrate 112 may be separated in a cell unit by scribing the first substrate 111 and the second substrate 112. [ The gate line GL and the data line DL are formed on the upper surface of the first substrate 111 as the first substrate 111 and the second substrate 112 are scribed along the scribing line SL, And the gate link line GLL and the data link line DLL extend to the end of the back surface of the second substrate 112. [

A plurality of side wirings 150 are connected to a plurality of gate wirings GL and a plurality of gate link wirings GLL and a plurality of data wirings DL and a plurality of data link wirings (S140).

The plurality of side wirings 150 may be formed by a laser transfer printing method. Specifically, the plurality of side wirings 150 are formed by irradiating the laser L onto the base member 190 on which the metal transfer layer 191 is formed, thereby transferring the metal transfer layer 191 to the first substrate 111 and the second And transferred to the side surface of the substrate 112. [ Here, the metal transfer layer 191 may be made of a conductive material such as silver (Ag) or the like.

The plurality of side wirings 150 includes a first side wiring 151 for connecting the gate wiring GL formed on the upper surface of the first substrate 111 and the gate wiring wiring GLL formed on the rear surface of the second substrate 112, And a second side wiring 152 connecting the data line DL formed on the upper surface of the first substrate 111 and the data link wiring line DLL formed on the rear surface of the second substrate 112.

2F, the first substrate 111 and the second substrate 112 are separated from each other so that the side surfaces of the first substrate 111 and the second substrate 112, the upper surface of the first substrate 111, and the rear surface of the second substrate 112 are separated from each other. The base member 190 on which the layer 191 is formed can be disposed and the laser L can be irradiated from above the base member 190. [ The metal transfer layer 191 which has been disposed on the base member 190 is irradiated with laser light from the base member 190 to the first end of the base member 190, And transferred to the substrate 111 and the second substrate 112 side. Thus, as shown in Figs. 2G and 2H, the first side wirings 151 may be formed to connect the gate wirings GL and the gate link wirings GLL. 2F to 2H, a laser transfer printing process is performed on the side surfaces of the first substrate 111 and the second substrate 112, the upper surface of the first substrate 111, and the back surface of the second substrate 112 The laser transfer printing process may be performed only on the sides of the first substrate 111 and the second substrate 112 according to the embodiment. 2F to 2H, only the process of forming the first side wirings 151 is shown. However, the second side wirings 152 connecting the data wirings DL and the data link wirings (DLL) (151). 2I, the second side wirings 152 may be formed to connect the data wirings DL and the data link wirings (DLL). 2I, the width of the first side wiring 151 is greater than the width of the gate wiring GL and the width of the second side wiring 152 is larger than the width of the data wiring DL. no.

Next, an insulating layer 160 covering the plurality of side wirings 150 is formed (S150).

An insulating layer 160 including a black material is formed to cover the plurality of side wirings 150. Referring to FIG. 2J, the first side wiring 151 is covered on the upper surface of the first substrate 111, the side surfaces of the first substrate 111 and the second substrate 112, and the rear surface of the second substrate 112 An insulating layer 160 including a black material may be formed. In the case where the plurality of side wirings 150 are made of a metal material, the external light is reflected by the plurality of side wirings 150 or the light emitted from the LED 130 is reflected by the plurality of side wirings 150, Can occur. Accordingly, the insulating layer 160 made of a black material is disposed so as to cover the plurality of side wirings 150, so that the above-described problems can be solved. The insulating layer 160 may be composed of one insulating layer 160 covering all of the plurality of first side wirings 151 and another insulating layer 160 covering both of the plurality of second side wirings 152 . The insulating layer 160 is also formed on the side where the gate wiring GL and the data wiring DL are not formed, so that the reflection of external light or the like can be further suppressed.

In some embodiments, the plurality of side wirings 150 may be configured to include a black material. When the plurality of side wirings 150 are made of a metal material, the external light is reflected by the plurality of side wirings 150, or the light emitted from the LED 130 is reflected by the plurality of side wirings 150, Can occur. Accordingly, the plurality of side wirings 150 may be formed of a black material, and in this case, the insulating layer 160 including a black material may be selectively formed.

In the method of manufacturing a display device according to an embodiment of the present invention, a plurality of side wirings 150 are formed using laser transfer printing. Therefore, even when the edges of the first substrate 111 and the second substrate 112 are angled, a plurality of side wirings 150 can be easily formed, and the gate wirings GL, The data line GLL and the data line DL and the data link line DL can be normally connected. Therefore, in the method of manufacturing a display device according to an embodiment of the present invention, the first substrate 111 is connected to the gate line GL, the gate link line GLL, the data line DL, and the data link line (DLL) And the step of grinding the edge of the second substrate 112 may be omitted. In addition, when the grinding process is performed, the side surfaces of the first substrate 111 and the second substrate 112 have a round shape or a polygonal shape. Therefore, when the grinding process is not performed, (NA) can be increased. Accordingly, in the method of manufacturing a display device according to an embodiment of the present invention, the size of the non-display area NA can be reduced. Since the process of forming the plurality of side wirings 150 is performed in a noncontact manner with respect to the first and second substrates 111 and 112, The defective factors such as the pad failure that may occur in the case where the defects are generated can be removed,

In the method of manufacturing a display device according to an embodiment of the present invention, an insulating layer 160 made of a black material is disposed so as to cover a plurality of side wirings 150, so that external light is reflected by a plurality of side wirings 150 The problem that the light emitted from the LED 130 is reflected by the plurality of side wirings 150 and is visible to the user can be solved. Thus, when a large-sized screen is implemented by arranging the display devices manufactured according to the method of manufacturing a display device according to an embodiment of the present invention in the form of a tile, it is possible to prevent light leakage phenomenon between neighboring display devices .

In some embodiments, a display device may be manufactured using only one substrate, instead of using two substrates of the first substrate 111 and the second substrate 112 for display device manufacture. That is, the data line DL and the gate line GL may be disposed on the upper surface of one substrate, and the data link line (DLL) and the data line DL may be disposed on the back surface of the same substrate.

3 is a schematic rear view for explaining a display device and a method of manufacturing a display device according to another embodiment of the present invention. The embodiment shown in Fig. 3 differs from the embodiment described with reference to Figs. 1 and 2 only in the gate link wiring GLL, the data link wiring (DLL) and the plurality of side wirings 350, Elements are substantially the same, so duplicate descriptions are omitted.

Referring to FIG. 3, the gate link line GLL disposed near the edge of the second substrate 112 among the plurality of gate link lines GLL includes a first portion extending in the same direction as the gate line GL, And a second portion directly connected to the first portion and extending in a different direction than the first portion. Also, a data link wiring (DLL) disposed near the edge of the second substrate 112 among the plurality of data link wiring lines (DLL) has a first portion extending in the same direction as the data wiring DL, And a second portion connected and extending in a different direction than the first portion.

At least a part of the plurality of first side wirings 351 disposed in the vicinity of the edge of the second substrate 112 has a first portion extending in the same direction as the plurality of gate wirings GL, And at least a part of the plurality of second side wirings 352 disposed in the vicinity of the edge of the second substrate may include a plurality of data lines DL extending in the same direction as the plurality of data lines DL And a second portion directly connected to the first portion and extending in a different direction than the first portion.

The gate line GLL is formed on the back surface of the second substrate 112 in order to arrange various driving parts such as the gate driver and the data driver on the back surface of the second substrate 112 in order to realize the zero- And a data link wiring (DLL) must be disposed. Since the gate link line GLL and the data link line DLL extend in different directions, the gate link line GLL and the data link line DLL that cross each other at the corner of the second substrate 112 . Thus, the gate link line GLL and the data link line DLL each include a portion extending in a direction different from the gate line GL and the data line DL, GLL) and the data link wiring do not intersect with each other.

In the method of manufacturing a display device according to another embodiment of the present invention, a plurality of side wirings 350 are formed by using a pad, and a non-contact type laser transfer printing method is used. It is very easy to form the plurality of side wirings 350 having the first portion and the second portion as described above. That is, by changing the shape of the base member 190 used for forming the plurality of side wirings 350, or changing the irradiation position of the laser, a plurality of side wirings 350 can be formed more easily . Accordingly, in the method of manufacturing a display device according to another embodiment of the present invention, the use of the laser transfer printing method can prevent the generation of interference due to the crossing of the gate link line GLL and the data link line DLL.

4A to 4C are schematic flow diagrams illustrating a method of manufacturing a display device and a display device according to another embodiment of the present invention. The embodiment shown in Figs. 4A to 4C differs from the embodiment described with reference to Figs. 1 and 2 only in the manufacturing process of the side wirings 150 and the manufacturing process of the insulating layer 460, They are substantially the same, so redundant description is omitted.

Referring to FIG. 4A, a step S140 of forming a plurality of side wirings 150 and a step S150 of forming an insulating layer 460 covering the plurality of side wirings 150 may be performed simultaneously.

The plurality of side wirings 150 and the insulating layer 460 may be simultaneously formed by a laser transfer printing method. More specifically, the plurality of side wirings 150 are formed by irradiating the laser L onto the base member 490 on which the metal transfer layer 491 and the black transfer layer 492 are sequentially formed, thereby forming the metal transfer layer 491 and the black transfer layer 492, The black insulating layer 460 may be transferred to the first substrate 111 and the second substrate 112 at the same time. Specifically, the metal transfer layer 491 is formed so as to be spaced apart from the side surfaces of the first substrate 111 and the second substrate 112, the upper surface of the first substrate 111, and the rear surface of the second substrate 112, And the base member 490 on which the black transfer layer 492 is formed and the laser L can be irradiated from above the base member 490. [ The metal transfer layer 491 and the black transfer layer 492 which were disposed on the base member 490 are irradiated with laser light by moving the laser L from one end of the base member 490 to the other end, Can be simultaneously transferred from the member 490 to the first substrate 111 and the second substrate 112 side.

4B and 4C, since the plurality of side wirings 150 and the insulating layer 460 are simultaneously formed by a laser transfer printing process, the insulating layer 460 corresponds to each of the plurality of side wirings 150 And may include a plurality of insulating patterns. Specifically, a plurality of insulating patterns are formed on the first insulating pattern 461 and the data wiring DL, which correspond to the first side wiring 151 connecting the gate wiring GL and the gate link wiring GLL, And a second insulation pattern 462 corresponding to the second side wiring 152 connecting the DLLs.

At this time, since a plurality of insulating patterns corresponding to each of the plurality of side wirings 150 and the plurality of side wirings 150 are simultaneously formed by the same laser transfer printing process, each of the plurality of side wirings 150 and a plurality of Are formed to have the same shape. Specifically, since the first side wiring 151 and the first insulating pattern 461 corresponding to each other are formed by the same laser transfer printing process at the same time, they can be formed to have the same shape and have the same width W1. In addition, the second side wiring 152 and the second insulating pattern 462 corresponding to each other are formed by the same laser transfer printing process at the same time, so that they can be formed to have the same shape and have the same width W2.

As described above, when the plurality of side wirings 150 are made of a metal material, the external light is reflected by the plurality of side wirings 150, or the light emitted from the LEDs 130 is reflected by the plurality of side wirings 150 There may be a problem that the user is confronted. An insulating layer 460 made of a black material is formed so as to cover a plurality of side wirings 150 to prevent reflection generated in the plurality of side wirings 150 while protecting the plurality of side wirings 150 . However, when the insulating layer 460 is formed separately from the plurality of side wirings 150, a separate printing process, a coating process, a high-temperature drying process, and the like must be added to form the insulating layer 460. Accordingly, in the method of manufacturing a display device according to another embodiment of the present invention, the process of forming the plurality of side wirings 150 and the process of forming the insulating layer 460 can be performed simultaneously in one step, thereby simplifying the process And the manufacturing cost can be minimized.

5A to 5D are schematic flow diagrams illustrating a method of manufacturing a display device and a display device according to another embodiment of the present invention. 5A to 5D are different from the embodiments described with reference to FIGS. 1 and 2 only in the manufacturing process of the side wirings 550. Since the other components are substantially the same, the redundant description is omitted do.

First, referring to FIGS. 5A and 5B, a first side metal layer 571 connecting both of a plurality of gate wirings GL and a plurality of gate link wirings GLL to form a plurality of side wirings 550 And a second side metal layer 572 connecting both the plurality of data wirings DL and the plurality of data link wirings (DLL) is formed. That is, a method of printing or coating a metal material on one side of the first substrate 111 and the second substrate 112 on which the ends of the plurality of gate lines GL and the plurality of gate link lines GLL are disposed, The first side metal layer 571 connecting both of the plurality of gate lines GL and the plurality of gate link lines GLL may be formed. A method of printing or coating a metal material on one side of the first substrate 111 and the second substrate 112 on which the ends of the plurality of data lines DL and the plurality of data link lines DLL are disposed, A second side metal layer 572 connecting both the plurality of data lines DL and the plurality of data link lines DLLs may be formed. The first side metal layer 571 and the second side metal layer 572 may be made of the same material. 5A and 5B, the first side metal layer 571 and the second side metal layer 572 are formed on the side surfaces of the first substrate 111 and the second substrate 112 as well as the side surfaces of the first substrate 111 and the second substrate 112, The first side metal layer 571 may connect both the plurality of gate wirings GL and the plurality of gate wiring wirings GLL and may be formed on the rear surface of the second substrate 112, The first side metal layer 571 and the second side metal layer 572 are electrically connected to the first substrate 111 and the second side metal layer 572 if the second side metal layer 572 connects both the plurality of data lines DL and the plurality of data link wires And the side of the second substrate 112.

Next, referring to FIGS. 5C and 5D, the first side metal layer 571 and the second side metal layer 572 are laser-etched to form a plurality of side wirings 550. At this time, laser etching may be performed in a linear direction only on the sides of the first substrate 111 and the second substrate 112. That is, the laser is irradiated only from the side surfaces of the first substrate 111 and the second substrate 112 to form the first side metal layer 571 so that the groove H as shown in FIGS. 5C and 5D can be formed. The first side metal layer 571 is divided into a plurality of first side wirings 551 in such a manner that the first and second side metal layers 571 and 572 as well as the first and second substrates 111 and 112 are patterned. The second side metal layer 572 can be separated into a plurality of second side wirings 552. At this time, in order to separate the first side metal layer 571 into a plurality of first side wirings 551 and separate the second side metal layer 572 into a plurality of second side wirings 552, The depth of the groove H is set such that the width of the first side wiring 551 and the second side wiring 552 on the upper surface of the first substrate 111 and the width of the first side wiring 552 on the back surface of the second substrate 112 551 and the second side wirings 552, respectively.

In the method of manufacturing a display device according to another embodiment of the present invention, the laser irradiation means is moved to the multi-domain at the time of laser etching of the first side metal layer 571 and the second side metal layer 572, A plurality of first side wirings 551 and a plurality of second side wirings 552 may be formed by irradiating a laser only on the side surfaces of the first substrate 111 and the second substrate 112. [ Thus, in the method of manufacturing a display device according to another embodiment of the present invention, the process for forming the first side wirings 551 and the second side wirings 552 can be simplified.

In the method of manufacturing a display device according to another embodiment of the present invention, a first side metal layer 571 for printing or coating a metal material on one side of a first substrate 111 and a second substrate 112, A side metal layer 572 is formed, and a plurality of first side wirings 551 and a plurality of second side wirings 552 are formed by laser etching. Therefore, the alignment process required when directly printing a plurality of first side wirings 551 and a plurality of second side wirings 552 using a pad can be simplified.

In the method of manufacturing a display device according to still another embodiment of the present invention, after forming the first side metal layer 571 and the second side metal layer 572, a plurality of first side wirings 551 and / The gate line GL and the data line DL on the upper surface of the first substrate 111 and the gate line wiring GLL on the back surface of the second substrate 112 can be formed, ) And the data link wiring (DLL) can be omitted. That is, in the method of manufacturing a display device according to yet another embodiment of the present invention, the first side metal layer 571 and the second side metal layer 572, regardless of the shapes of the first substrate 111 and the second substrate 112, A plurality of first side wirings 551 and a plurality of second side wirings 552 are formed by etching the first substrate 111 and the second substrate 112 with a laser as well as the first substrate 111 and the second substrate 112, There is no abnormality in the printing quality for the first side wirings 551 and the second side wirings 552 even when the corners of the first side wirings 111 and the edges of the second substrate 112 are angled. Therefore, in the method of manufacturing a display device according to another embodiment of the present invention, the first substrate 111 and the second substrate 112 (see FIG. 1) are formed to prevent the first side wiring 551 and the second side wiring 552 from being broken, ) Can be omitted, so that the manufacturing process can be further simplified.

6A to 6D are schematic flow diagrams illustrating a method of manufacturing a display device and a display device according to another embodiment of the present invention. 6A to 6D are different from the embodiment described with reference to FIGS. 1 and 2 only in the manufacturing process of the side wirings 650, and the other components are substantially the same, do.

First, referring to FIGS. 6A and 6B, the first substrate 111 and the second substrate 112 are laser-etched before the plurality of side wirings 650 are formed. At this time, laser etching may be performed in a linear direction only on the sides of the first substrate 111 and the second substrate 112. The laser etching may be performed between the plurality of gate lines GL disposed on the upper surface of the first substrate 111 and between the plurality of data lines DL. That is, the laser is irradiated only from the side surfaces of the first substrate 111 and the second substrate 112 so that the grooves H as shown in FIGS. 6A and 6B can be formed, 2 substrate 112 is patterned.

6C and 6D, a metal material is printed or coated using a single pad on the sides of the first substrate 111 and the second substrate 112 to form a plurality of side wirings 650 . A metal material is formed on the side surfaces of the first substrate 111 and the second substrate 112 except for the region where the grooves H are formed and further the upper surface of the first substrate 111 and the lower surface of the second substrate 112, A metal material may be formed on the lower surface of the substrate. 6C and 6D, the first side wirings 651 and the data wirings DL and the data link wirings (DLLs) for connecting the gate wirings GL and the gate link wirings GLL are connected to each other The second side wirings 652 are formed.

In the method of manufacturing a display device according to another embodiment of the present invention, the laser irradiation means is moved to the multi-domain at the time of laser etching of the first substrate 111 and the second substrate 112, The first substrate 111 and the second substrate 112 may be formed by printing or coating a metal material using a single pad on the side surfaces of the first substrate 111 and the second substrate 112, A wiring 651 and a second side wiring 652 are formed. Therefore, the alignment process required when directly printing a plurality of first side wirings 651 and a plurality of second side wirings 652 using pads can be simplified. Since the plurality of side wirings 650 are formed after patterning the first substrate 111 and the second substrate 112, the gate wirings GL, the gate link wirings GLL, the data wirings DL, The migration phenomenon in which metal ions are transferred to the link wiring (DLL) and the side wiring 650 can be suppressed.

7A and 7B are schematic cross-sectional views for explaining a display device and a display device manufacturing method according to a comparative example. 7C is a schematic cross-sectional view illustrating a method of manufacturing a display device according to another embodiment of the present invention. The embodiment shown in FIG. 7C differs from the embodiment described with reference to FIGS. 1 and 2 only in the manufacturing process of the side wirings 150, and the other components are substantially the same, and thus redundant description will be omitted.

A process of printing the side wirings 150 using the pads 780 may be used to form the side wirings 150. [ 7A, a pad 780 is formed on the corner of the first substrate 111 and the second substrate 112 to electrically connect the metal layer to the edges of the first substrate 111 and the second substrate 112, May be used. At this time, the pad 780 may include a support body 781 and a pad body 782 fixed to the support body 781. 7A, a metal layer is printed on the edge of the second substrate 112 using a pad 780 in a state where the pad body 782 is covered with a metal layer, and the first substrate 111 and the second substrate The side wirings 150 may be formed by printing the metal layer on the edge of the first substrate 111 using the pads 780 after the two substrates 112 are turned upside down.

7A, when the corners of the first substrate 111 and the second substrate 112 are angled, the pad body 782 contacts the first substrate 111 and the second substrate 112, It may be damaged by the edges, resulting in pad failure, and the metal layer may not be normally printed. In addition, when a pad failure occurs, the entire pad 780 or the pad body 782 must be replaced. Repeated replacement of the pad 780 increases the cost of replacing the pad. In addition, when the entire pad 780 or the pad body 782 is replaced, the set value for the pad printing process must be set again according to the condition of the replaced pad 780, thereby increasing the manufacturing process time . In addition, since the pad printing process twice and the drying process for the metal layer twice are required, there is a problem that the manufacturing process time is increased.

7B, a process of printing the side wirings 150 using the pads 780 in a state where the first substrate 111 and the second substrate 112 are arranged in a vertical direction may be used . In the case of using the pad printing process as shown in FIG. 7B, since the pad printing process and the drying process may be performed only once, there is an advantage that the manufacturing process time is shortened. However, there is a problem that the pad 780 is still damaged by the edges of the first substrate 111 and the second substrate 112. In addition, since the pad printing process is performed only once, the length of the side wiring 150 to be printed is shortened and the connection of the gate wiring GL and the gate link wiring GLL and the connection of the data wiring DL and the data link wiring DLL ) May not be correctly connected.

7C, a pad 780 may further include a pad film 783 surrounding the pad body 782. In the method of manufacturing a display device according to another embodiment of the present invention, as shown in FIG. That is, the pad 780 used in the method of manufacturing a display device according to another embodiment of the present invention includes a support member 781, a pad body 782 disposed on the support member 781, and a support member 781 And a pad film 783 that is fixed and arranged to surround the pad body 782. Here, the pad body 782 and the pad film 783 may be made of a flexible insulating material. For example, the pad body 782 and the pad film 783 may be made of the same material and made of silicon. Various required characteristics of the pad body 782 and the pad film 783 are softness, durability, workability and the like. Various rubbers can be used for the pad body 782 and the pad film 783. However, in the case of silicon, it is preferable that silicon is used as the pad body 782 and the pad film 783 used for pad printing, since the surface of the silicon is easily removed even when the ink adheres to the surface.

In the display device manufacturing method according to another embodiment of the present invention, the first substrate 111 and the second substrate 112 are scribed along the scribing line SL, and then the first substrate 111 And the edge of the second substrate 112 can be performed. As described above, when the corners of the first substrate 111 and the second substrate 112 are angled, the pad body 782 is damaged by the corners of the first substrate 111 and the second substrate 112 So that pad defects may occur, and the metal layer may not be normally printed. Accordingly, in the method of manufacturing a display device according to another embodiment of the present invention, the edge of the first substrate 111 and the edge of the second substrate 112 have a round shape as shown in FIG. 7C, A step of grinding so as to have a polygonal shape can be additionally performed.

Accordingly, in the method of manufacturing a display device according to another embodiment of the present invention, by performing the grinding process on the edges of the first substrate 111 and the second substrate 112, Damage to the corners of the substrate 111 and the second substrate 112 can be minimized. Accordingly, the life of the pad 780 can be prolonged to reduce the cost of replacing the pad, and the side wiring 150 is disconnected from the side and edges of the first substrate 111 and the second substrate 112 at the time of pad printing So that the printing quality of the side wiring 150 can be improved.

In the method of manufacturing a display device according to another embodiment of the present invention, since the pad film 783 disposed to surround the pad body 782 is further included in the pad 780, It is necessary to replace only the pad film 783 which is less expensive than the pad body 782 in the case where the pad body 783 is damaged. The cost incurred can be reduced. In the method of manufacturing a display device according to another embodiment of the present invention, only the pad film 783 may be replaced, not the pad body 782, so that the process of changing the set value due to the replacement of the pad body 782 may be omitted , The manufacturing process can be simplified.

8A and 8B are schematic cross-sectional views illustrating a method of manufacturing a display device and a display device according to another embodiment of the present invention. The embodiment shown in FIGS. 8A and 8B differs from the embodiment described with reference to FIG. 7C only in the shape of the pad 880, and the other elements are substantially the same, and thus redundant description will be omitted.

Referring to FIG. 8A, the pad 880 may include a pad body 882 including a hollow 884. That is, a void 884 may be formed in the inside of the pad body 882, so that an empty space may exist. At this time, the hollow 884 may be formed to extend in the longitudinal direction of the pad 880.

In the method of manufacturing a display device according to another embodiment of the present invention, since the hollow 884 is present inside the pad body 882, the pad 880 is formed on the first substrate 111 and the second substrate So as to surround the region of the plate. That is, as compared with the case where the hollow 884 is not present in the pad body 882, when the hollow 884 exists in the pad body 882, the first substrate 111 and the second substrate The area of the pad body 882 contacting the substrate 2 can be increased. Therefore, the side wiring 150 can be formed in more curved and planar regions as the hollow 884 exists in the pad body 882, and the gate wiring GL and the gate wiring GLL, (DL) and the data link wiring (DLL) can be connected more accurately.

8A and 8B, one hollow 884 is disposed on the pad body 882, but a plurality of hollows 884 may be disposed inside the pad body 882. [ When one hollow 884 is formed in the pad body 882, the supporting force of the pad body 882 itself may be reduced. In the method of manufacturing a display device according to another embodiment of the present invention, considering the ductility of the pad body 882, the length of the side wiring 150 to be printed, and the like, Can be set variously, and the position of the hollow 884 can also be set variously.

9A and 9B are schematic cross-sectional views for explaining a display device and a display device manufacturing method according to various embodiments of the present invention. 9A and 9B differs from the embodiment described with reference to FIGS. 8A and 8B only in the process using the pads 880 and 880, and the other components are substantially the same, .

First, referring to FIG. 9A, during printing using the pad 880, the pressure in the hollow 884 can be adjusted by sucking air into the hollow 884 of the pad 880. As described above, the shape of the pad body 882 may be deformed by the structure of the first substrate 111 and the second substrate 112 when the pad is printed, and the size of the hollow 884 may be reduced. However, if the pressure in the hollow 884 of the pad 880 is too small, the first substrate 111 and the second substrate 112 may not be wrapped by the pad body 882 or wrapped in the correct position . If the pressure in the hollow 884 of the pad 880 is excessively high, the side wirings 150 may not be formed long enough to the first substrate 111 and the second substrate 112, 882 may be damaged.

Accordingly, in the method of manufacturing a display device according to another embodiment of the present invention, air can be injected into the hollow 884 of the pad 880 to adjust the pressure in the hollow 884. Thus, the side wirings 150 can be printed at the correct positions of the first substrate 111 and the second substrate 112, and the pad 880 can be prevented from being damaged at the time of pad printing.

Next, referring to FIG. 9B, a pad 980 may further include a pad film 983 surrounding the pad body 882. FIG. In the method of manufacturing a display device according to another embodiment of the present invention, since the pad film 983 disposed to surround the pad body 882 is further included in the pad 980, Only the pad film 983 which is less expensive than the pad body 882 can be replaced when the pad body 983 is damaged so that the pad film 983 is replaced rather than the pad body 882 The cost incurred can be reduced. In the method of manufacturing a display device according to another embodiment of the present invention, only the pad film 983 is replaced, not the pad body 882, so that the process of changing the set value according to the replacement of the pad body 882 may be omitted , The manufacturing process can be simplified.

Hereinafter, a solution is suggested through embodiments that can suppress or minimize the migration phenomenon that may occur in the side wiring.

10A to 10C are schematic cross-sectional views for explaining a display device and a display device manufacturing method according to a comparative example.

Referring to FIG. 10A, after the first substrate 111 and the second substrate 112 are bonded to each other (S120), the first substrate 111 and the second substrate 112 are scribed in units of cells S130). The comparative example shown in FIG. 10A shows a process of performing grinding on the edges of the first substrate 111 and the second substrate 112. The first substrate 111, the second substrate 112, The gate wiring GL, and the gate link wiring GLL are substantially the same as those in Figs. 2C to 2E, and duplicate explanations are omitted.

The grinding process for the edges of the first substrate 111 and the second substrate 112 can be performed using the grinder GR. When the corners of the first substrate 111 and the second substrate 112 are angled, the pad body 782 is damaged by the edges of the first substrate 111 and the second substrate 112, And the metal layer may not be normally printed. Accordingly, in the method of manufacturing a display device according to another embodiment of the present invention, a process of grinding the edge of the first substrate 111 and the edge of the second substrate 112 so as to have a polygonal shape may be additionally performed. Is a cross-sectional view after performing the grinding process. The corners of the first substrate 111 and the second substrate 112 are grinded and angled. The end of the gate line GL on the first substrate 111 is also ground and the end of the gate line GL is broken due to the rotation intensity or impact of the grinder GR, 0.0 > of < / RTI > Alternatively, in consideration of the above-described breakage or grinding step error in the step of forming the gate line GL described with reference to FIG. 2A, the gate line GL can be formed by the length shown in FIG. 10B. The gate link wiring GLL on the back surface of the second substrate 112 is also ground, which can be further ground than the degree to which the second substrate 112 is ground. Alternatively, in the process of forming the gate link line GLL described in FIG. 2A, the gate line line GLL can be formed by the length of the gate link line GLL shown in FIG. 10B.

Fig. 10C is a view showing the grinding surface after the grinding process is completed. Fig. Scratches may be generated on the sides of the first substrate 111 and the second substrate 112 and on the grinding surfaces of the first substrate 111 and the second substrate 112. [ FIG. 10C is a view for explaining a problem that may occur through the grinding process. The shape and level of the scratch CR can be changed by the shape of the grinder GR, the rotation intensity, or the like. The scratch CR by the grinder GR can be formed only in a part of the area, and can be formed in cracks of micro units or the like. Since the scratches CR are developed in the direction toward the neighboring side wirings, the occurrence of migration between the side wirings can be promoted due to the scratches CR shown in Fig. 10C. In particular, in the case of a high-resolution display device, the interval between the side wirings is very narrow, and in the case of a display device such as a signage display, a current applied to the side wirings is very high. In such an environment, if the side wirings are formed on the first substrate 111 and the second substrate 112 including the scratches CR, the possibility of occurrence of migration between the side wirings can be further increased. Accordingly, the inventors of the present invention have invented a structure capable of minimizing the occurrence of migration of side wirings in high-resolution or signal display.

11A to 11D are schematic cross-sectional views for explaining a display device and a method of manufacturing the display device according to still another embodiment of the present invention.

11A is a cross-sectional view after the grinding process is performed on the corners of the first substrate 111 and the second substrate 112, and is substantially the same as the cross-sectional view shown in FIG. 10B, so duplicated description will be omitted. The scratch CR shown in FIG. 10C is formed on the side surfaces of the first substrate 111 and the second substrate 112 shown in FIG. 10B and the grinding surfaces of the first substrate 111 and the second substrate 112 Lt; / RTI >

11B is a cross-sectional view illustrating a structure capable of minimizing the occurrence of migration according to an embodiment of the present invention. Referring to FIG. 11B, a base layer 1190 is formed to cover the side surfaces of the first substrate 111 and the second substrate 112. More specifically, the ends of the gate wiring GL and the gate link wiring GLL, the upper surface of the first substrate 111 and the rear surface of the second substrate 112, the first substrate 111 and the second substrate 112 A ground layer 1190 is formed so as to cover both the grinding surface and the side surfaces of the first substrate 111 and the second substrate 112. [ As the material of the base layer 1190, various resins can be used. For example, Bioresin Biovest 578, Bluestar Silicones BP 9710, polyimide, and epoxy resin can be used. Also, the base layer 1190 can be coated by various methods such as pad printing, spraying, dispensing, inkjet, dipping, and dipping.

The base layer 1190 compensates for the sharp edges of the first substrate 111 and the second substrate 112. Referring to FIG. 11B, the edges of the first substrate 111 and the second substrate 112 may be sharp. Although a new grinding surface is formed at the edges of the first substrate 111 and the second substrate 112 by the grinding process, the edge of the grinding surface may still be sharp as the side wiring 1150 is printed. The base layer 1190 is coated so as to cover the sharp edges of the first substrate 111 and the second substrate 112 to suppress shorting of the side wirings 1150. [

In the method for manufacturing a display device and a display device according to still another embodiment of the present invention, the side wirings 1150 can be formed on the base layer 1190. [ At this time, the side wiring 1150 is formed so as to overlap with both the gate wiring GL and the gate wiring line GLL including the base layer 1190. The signal applied from the circuit portion on the back surface of the second substrate 112 is transmitted to the side wiring 1150 disposed on the base layer 1190 via the gate link wiring GLL and is transferred to the side wiring 1150 via the gate wiring GL Of the pixel PX.

The surface states of the first substrate 111 and the second substrate 112 can promote the occurrence of migration. The base layer 1190 compensates for scratches CR formed on the first substrate 111 and the second substrate 112. The upper surface of the base layer 1190 is not affected by the minute bending of the first substrate 111 and the second substrate 112 which are in contact with the lower surface of the base layer 1190 and is coated flatly, The occurrence can be suppressed to a minimum level.

Referring to FIG. 11C, a base pattern 1191 may be formed on the surface of the base layer 1190. The base pattern 1191 can be formed to have the same directionality as the direction in which the side wirings 1150 extend. Also, the base pattern 1191 may be in a straight line shape, but is not limited thereto. For example, a fine wrinkle shape as shown in FIG. 11C, and can be processed to have a directional parallel to the side wirings 1150. Therefore, the base pattern 1191 can block the migration path of the migration and minimize the short-circuit defect between the wirings due to the migration.

The base pattern 1191 shown in Figs. 11C and 11D has a shape extending from the end to the other end of the base layer 1190, but is not limited thereto. For example, the base pattern 1191 may be formed in the form of a plurality of wrinkles or the like on the same line. At this time, it is preferable that the directionality of the base pattern 1191 is formed so as to be parallel to the extending direction of the side wirings 1190 Do. The width of the base pattern 1191 formed on the base layer 1190 may be smaller than the line width of the side wirings 1150. A plurality of base patterns 1191 may be included between the adjacent side wirings 1150 , But is not limited thereto.

In the display device according to various embodiments of the present invention, the base pattern 1191 formed on the base layer 1190 may be in the form of a random mesh. In the case where the base pattern 1191 is a random net having no specific directionality, even if the migration proceeds from a part of the wirings, the migration path of the migration can be extended to suppress the short defect between wirings to a minimum level.

Referring to FIG. 11D, one gate line GL is shown as being connected to the plurality of side lines 1150, but the present invention is not limited thereto. For example, one gate line GL can be connected to one side line. At this time, a plurality of base patterns 1191 may be disposed between the plurality of side wirings 1150. Accordingly, the base pattern 1191 has a directionality opposite to the direction of the migration between the side wirings 1150, or is formed so as to extend the migration progress path, so that the possibility of migration can be minimized.

The base pattern 1191 can be formed in various ways. For example, the base pattern 1191 may be formed on the surface of the base layer 1190 by exposing the argon ion beam to the top of the base layer 1190. The orientation and shape of the base pattern 1191 can be determined by setting different exposure times in exposing the argon ion beam on the base layer 1190 shown in Fig. 11B. On the other hand, the base pattern 1191 may be formed on the base layer 1190 by a rubbing process or stamping process of a roller, but is not limited thereto.

In the display device and the display device manufacturing method according to various embodiments of the present invention, a pattern enhancement layer may be further formed on the base pattern 1191. [ The pattern enhancement layer may be formed by depositing a carbon layer, and the pattern enhancement layer may further increase the pattern depth of the base pattern 1191, thereby slowing the migration progress path. That is, the pattern reinforcing layer can more reliably form the wrinkles of the base pattern 1191 formed on the surface of the base layer 1190, thereby minimizing the migration phenomenon. The pattern enhancing layer may include a black material, and a process for adding an insulating characteristic may be further added.

An exemplary embodiment of the present invention can be described as follows.

A method of manufacturing a display device according to an embodiment of the present invention includes the steps of forming a plurality of thin film transistors, a plurality of LEDs, a plurality of gate wirings, and a plurality of data wirings on an upper surface of a first substrate, Forming a plurality of gate wiring lines and a plurality of data link wirings; bonding the first substrate and the second substrate; scribing the first substrate and the second substrate in a cell unit; Forming a plurality of side wirings for connecting the gate link wirings and connecting the plurality of data wirings and the plurality of data link wirings and forming an insulating layer covering the plurality of side wirings.

According to another aspect of the present invention, a method of manufacturing a display device may further include, after scribing, grinding an edge of the first substrate and an edge of the second substrate.

According to another aspect of the present invention, in the step of forming the plurality of side wirings, the metal transfer layer is transferred onto the side surfaces of the first substrate and the second substrate by irradiating a laser on the base member on which the metal transfer layer is formed, Thereby forming side wirings of the gate electrode.

According to another aspect of the present invention, the plurality of side wirings may include a black material.

According to another aspect of the present invention, the insulating layer may comprise a black material.

According to still another aspect of the present invention, the step of forming the plurality of side wirings and the step of forming the insulating layer can be performed simultaneously.

According to still another aspect of the present invention, the step of forming a plurality of side wirings and the step of forming an insulating layer include a step of forming a metal transfer layer and a black transfer layer by irradiating a laser beam onto a base member on which a metal transfer layer and a black transfer layer are sequentially formed, And transferring the black transfer layer to the side surfaces of the first substrate and the second substrate to form a plurality of side wirings and an insulating layer.

According to another aspect of the present invention, the insulating layer may include a plurality of insulating patterns corresponding to each of the plurality of side wirings.

According to another aspect of the present invention, each of the plurality of side wirings and the plurality of insulating patterns corresponding to each other may have the same shape.

According to another aspect of the present invention, at least a part of the plurality of side wirings is connected directly to the first portion and the first portion extending in the same direction as the plurality of gate wirings or the plurality of data wirings and in a direction different from the first portion And a second portion extending therefrom.

According to another aspect of the present invention, at least a part of the plurality of side wirings may be disposed adjacent to the edge on the lower surface of the second substrate.

According to still another aspect of the present invention, the step of forming the plurality of side wirings includes the steps of forming a first side metal layer connecting both the plurality of gate wirings and the plurality of gate link wirings, Forming a second side metal layer connecting both of the data link interconnects of the first side metal layer and the second side metal layer, and laser etching the first side metal layer and the second side metal layer to form a plurality of side wirings.

According to another aspect of the present invention, the step of laser etching is performed in a linear direction on the sides of the first substrate and the second substrate to pattern the first side metal layer, the second side metal layer, the first substrate, .

According to still another aspect of the present invention, the step of forming a plurality of side wirings includes the steps of: laser etching between a plurality of gate wirings and a plurality of data wirings among the side surfaces of the first substrate and the second substrate; And printing or coating a metal material using a single pad on the side of the second substrate to form a plurality of side wirings.

According to another aspect of the present invention, forming the plurality of side wirings may include printing a plurality of side wirings using a pad.

According to another aspect of the invention, the pad may comprise one or more hollows.

According to a further feature of the invention, the hollow can extend in the longitudinal direction of the pad.

According to another aspect of the present invention, forming the plurality of side wirings may include injecting air into the hollow to adjust the pressure in the hollow.

According to another aspect of the present invention, the pad may include a support member, a pad body disposed on the support member, and a pad film secured to the support member and arranged to surround the pad body.

According to another aspect of the present invention, the pad body and the pad film may be made of the same material.

According to another aspect of the present invention, the pad body and the pad film may be made of silicon.

Although the embodiments of the present invention have been described in detail with reference to the accompanying drawings, it is to be understood that the present invention is not limited to those embodiments and various changes and modifications may be made without departing from the scope of the present invention. . Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. Therefore, it should be understood that the above-described embodiments are illustrative in all aspects and not restrictive. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

111: first substrate
112: second substrate
113: gate insulating layer
114: Passivation layer
115: Adhesive layer
116: first planarization layer
117: second planarization layer
118: bonding layer
120: thin film transistor
121: gate electrode
122: active layer
123: source electrode
124: drain electrode
130: LED
131: n-type layer
132:
133: p-type layer
134: p electrode
135: n electrode
141: first electrode
142: second electrode
143: reflective layer
150, 350, 550: side wiring
151, 351, 551: first side wiring
152, 352, 552: second side wiring
160, 460: insulating layer
461: first insulation pattern
462: second insulation pattern
571: first side metal layer
572: second side metal layer
780, 880, 980: pad
781: Support member
782, 882: Pad body
783, 983: pad film
894: hollow
190, 490: base member
191, 491: metal transfer layer
492: Black transfer layer
1190:
1191: Base pattern
L: Laser
H: Home
SL: Scribing line
PX: Pixels
DL: Data wiring
DLL: Data link wiring
GL: gate wiring
GLL: Gate link wiring
CL: Common wiring
AA: display area
NA: non-display area

Claims (23)

Forming a plurality of thin film transistors, a plurality of LEDs, a plurality of gate wirings, and a plurality of data wirings on an upper surface of a first substrate;
Forming a plurality of gate link lines and a plurality of data link lines on the back surface of the second substrate;
Bonding the first substrate and the second substrate;
Scribing the first substrate and the second substrate in a cell unit;
Forming a plurality of side wirings for connecting the plurality of gate wirings and the plurality of gate link wirings and connecting the plurality of data wirings and the plurality of data link wirings; And
And forming an insulating layer covering the plurality of side wirings. The method according to claim 1,
Further comprising grinding an edge of the first substrate and an edge of the second substrate after the scribing step. The method according to claim 1,
Wherein forming the plurality of side wirings includes:
And transferring the metal transfer layer to the side surfaces of the first substrate and the second substrate by irradiating a laser on a base member on which the metal transfer layer is formed to form the plurality of side wirings . The method of claim 3,
Wherein the plurality of side wirings include a black material. The method of claim 3,
Wherein the insulating layer comprises a black material. The method according to claim 1,
Wherein the step of forming the plurality of side wirings and the step of forming the insulating layer are performed simultaneously. The method according to claim 6,
Wherein the step of forming the plurality of side wirings and the step of forming the insulating layer comprise the steps of irradiating a laser beam onto a base member on which a metal transfer layer and a black transfer layer are sequentially formed to form the metal transfer layer and the black transfer layer, The side wiring and the insulating layer are transferred to the side surfaces of the first substrate and the second substrate to form the plurality of side wirings and the insulating layer. 8. The method of claim 7,
Wherein the insulating layer includes a plurality of insulating patterns corresponding to each of the plurality of side wirings. 9. The method of claim 8,
Each of the plurality of side wirings corresponding to each other and each of the plurality of insulating patterns has the same shape. 8. The method according to any one of claims 3 to 7,
Wherein at least a part of the plurality of side wirings includes a first portion extending in the same direction as the plurality of gate wirings or the plurality of data wirings and a second portion directly connected to the first portion and extending in a direction different from the first portion And a second portion. 11. The method of claim 10,
And at least a part of the plurality of side wirings is disposed adjacent to an edge at a lower surface of the second substrate. The method according to claim 1,
Further comprising forming a base layer on side surfaces of the first substrate and the second substrate after the scribing step is completed,
Wherein the base layer is formed to overlap the scratches generated on the first substrate and the second substrate while the scraping step is performed. 13. The method of claim 12,
Wherein the step of forming the plurality of side wirings is performed after the step of forming the base layer is completed. 14. The method of claim 13,
Wherein forming the base layer includes forming a base pattern on at least a portion of the base layer. 15. The method of claim 14,
Wherein forming the base pattern includes forming the base pattern so that the base pattern has a direction parallel to the side wirings. 15. The method of claim 14,
Wherein the forming of the base pattern includes forming the base pattern so that the surface of the base layer has an irregular pattern. The method according to claim 1,
Wherein forming the plurality of side wirings includes printing the plurality of side wirings using a pad. Board;
A plurality of upper wirings disposed on an upper surface of the substrate;
A plurality of lower wirings disposed on a back surface of the substrate;
A base layer disposed on a side of the substrate;
And a plurality of side wirings arranged on the base layer,
Wherein the side wirings are electrically connected to the upper wirings and the lower wirings, 19. The method of claim 18,
Wherein the base layer is arranged to overlap at least a part of the plurality of upper wirings and at least a part of the plurality of lower wirings. 19. The method of claim 18,
Wherein the base layer includes a three-dimensional pattern. 21. The method of claim 20,
And the three-dimensional pattern extends in a direction parallel to the plurality of side wirings. 21. The method of claim 20,
Wherein the three-dimensional pattern has an irregular shape. 19. The method of claim 18,
And one of the plurality of upper wirings is electrically connected to the plurality of side wirings.

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