Summary of the invention
In view of this, the embodiment of the present invention is dedicated to providing a kind of flexible display panels and preparation method thereof, Flexible Displays
Device, to solve the problems, such as that encapsulating structure reliability is low in the prior art.
First aspect present invention provides a kind of flexible display panels, including thin-film packing structure, which is characterized in that film
Encapsulating structure includes: stacked enhancement layer, organic layer and inorganic layer, and at least one of organic layer and inorganic layer include graphical
Surface.
In one embodiment, inorganic layer includes patterned surface.
In one embodiment, patterned surface and organic layer contact.
In one embodiment, patterned surface and enhancement layer contact.
In one embodiment, patterned surface includes groove, and enhancement layer includes the first sub- enhancement layer, the first sub- enhancement layer
In groove.
In one embodiment, the thickness of the first sub- enhancement layer is equal to the depth of groove.
In one embodiment, enhancement layer further includes the second sub- enhancement layer, and the second sub- enhancement layer is located at the first sub- enhancement layer
On patterned surface, and the second sub- enhancement layer has planarization surface.
In one embodiment, enhancement layer is nanometer silicon coating.
In one embodiment, enhancement layer includes the first enhancement layer and the second enhancement layer, and inorganic layer includes the first inorganic layer
With the second inorganic layer, the first inorganic layer, the first enhancement layer, organic layer, the second enhancement layer and the second inorganic layer successively adjacent stacked,
First inorganic layer and organic layer respectively include patterned surface.
Second aspect of the present invention provides a kind of flexible display apparatus, including above-mentioned flexible display panels.
Flexible display panels provided according to the present invention and preparation method thereof, flexible display apparatus, on the one hand, by thin
Patterned surface is set in film encapsulating structure, improves the stress release ability of the film layer including the patterned surface, reduces
Thin-film packing structure generates the risk in crack in flexible display panels bending process, so that improve thin-film packing structure can
By property;On the other hand, by the way that enhancement layer is arranged, the mechanical property of film layer below is improved, encapsulating structure exclusion of water is improved
The ability of oxygen, to further improve the reliability of thin-film packing structure.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that the described embodiment is only a part of the embodiment of the present invention, instead of all the embodiments.Based on this
Embodiment in invention, every other reality obtained by those of ordinary skill in the art without making creative efforts
Example is applied, shall fall within the protection scope of the present invention.
The present invention provides a kind of flexible display panels, which includes thin-film packing structure, film envelope
Assembling structure includes stacked enhancement layer, organic layer and inorganic layer, wherein at least one of stacked organic layer and inorganic layer packet
Include patterned surface.
The patterned surface refer to concave-convex surface rise and fall surface, i.e., and planarization the opposed concept in surface.Here it folds
Enhancement layer, organic layer and the inorganic layer set refer to that three film layers form the structure being laminated above and below, and for three film layers
Lamination order is not construed as limiting.In addition, enhancement layer, organic layer and inorganic layer these three film layers can successively arranged adjacent, can also be with
It is non-conterminous, i.e., it further include other film layers between two neighboring film layer.Fig. 1 show the flexibility of first embodiment of the invention offer
The structural schematic diagram of display panel.As shown in Figure 1, the flexible display panels 100 include bottom plate 13, organic LED array
Substrate 12 and the thin-film packing structure 11 on organic LED array substrate 12.Wherein, thin-film packing structure 11
Including stacked organic layer and inorganic layer, at least one of the organic layer and inorganic layer include patterned surface A.Thin-film package
Structure 11 further includes the enhancement layer 110 between adjacent organic and inorganic layer.
At least one of organic layer and inorganic layer mentioned herein include patterned surface A, can be thin-film package knot
One or more organic layers in structure 11 include patterned surface;Alternatively, one or more of thin-film packing structure 11 is inorganic
Layer includes patterned surface;Alternatively, one or more organic layers in thin-film packing structure 11 include patterned surface, while thin
One or more inorganic layers in film encapsulating structure 11 also include patterned surface.
Enhancement layer 110 refers to hydrophobic effect, can improve the mechanical property of film layer below, so that it is attached to improve interface
The film layer puted forth effort, such as nanometer silicon coating.
The present invention is not construed as limiting the specific stacked manner of organic layer in thin-film packing structure 11 and inorganic layer, such as can
To be the form successively coated from inside to outside as shown in Figure 1, or be also possible to include in the side wall of thin-film packing structure 11
The form of inorganic overlapped layers.
According to flexible display panels provided in this embodiment, on the one hand, graphical by being arranged in thin-film packing structure
Surface improves the stress release ability of the film layer including the patterned surface, reduces thin-film packing structure in Flexible Displays
The risk that crack is generated in panel bending process, to improve the reliability of thin-film packing structure;On the other hand, by phase
Enhancement layer is set between adjacent organic layer and inorganic layer, improves the adhesive force between adjacent organic and inorganic layer, improves envelope
Assembling structure completely cuts off the ability of water oxygen, to further improve the reliability of thin-film packing structure.
In one embodiment, inorganic layer includes patterned surface A.Since inorganic layer is compared with organic layer, inorganic layer
Flexibility is poor, is more also easy to produce crack in flexible display screen bending process.Therefore patterned surface A is arranged in inorganic layer table
Face, in organic surface, is more advantageous to the reliability for improving thin-film packing structure compared to by patterned surface A setting.
In one embodiment, the patterned surface A in inorganic layer and organic layer contact.Due to depositing for patterned surface A
For planarizing surface, the contact area between inorganic layer and organic layer adjacent thereto is being increased, to improve
Adhesive force between the inorganic layer and the organic layer, reduces encapsulating structure and generates crack in flexible display screen bending process
Risk, further improve the reliability of encapsulating structure.
For example, as shown in Figure 1, thin-film packing structure 11 include be arranged on organic LED array substrate 12,
Stacked the first inorganic layer 111, organic layer 112 and the second inorganic layer 113 from top to bottom.Wherein, the first inorganic layer 111 includes figure
The interface of shape surface A, organic layer 112 and the second inorganic layer 113 includes enhancement layer 110.
The preparation process of thin-film packing structure 11 may include: in organic light emission in flexible display panels as shown in Figure 1
The first inorganic layer 111 is deposited on diode array substrate 12;Figure is carried out to 111 surface of the first inorganic layer using mask plate
Change, forms patterned surface A;Using ink-jet printing technology (Inkjet Printing, IJP), schemed using same mask plate
Surface and mask plate flush of the organic layer 112 until organic layer 112 are prepared on shape surface A, remove mask plate continuation
Prepare organic layer 112;Enhancement layer 110 is coated on organic layer 112;Using chemical vapour deposition technique (Chemical
Vapor Deposition, CVD) technology, the second inorganic layer 113 is prepared on enhancement layer 110.
Fig. 2 show the structural schematic diagram of the flexible display screen of second embodiment of the invention offer.As shown in Fig. 2, this is soft
Property display screen 200 and flexible display screen 100 difference be only that the position of enhancement layer 210 is different, i.e., in the present embodiment, add
Strong layer 210 and patterned surface A contact.Specifically for example shown in Fig. 2, enhancement layer 210 is located on patterned surface A, and
And the thickness of enhancement layer 210 is equal everywhere.
Since the inorganic layer 211 including patterned surface A can be because of the patterned structures on surface, so that the figure of inorganic layer 211
Shape area thickness is reduced, to reduce the ability that inorganic layer 211 obstructs water oxygen.Therefore, by being set on patterned surface A
The problem of water oxygen obstructing capacity declines caused by setting enhancement layer 210 and can making up because of patterned surface A.
The preparation process of thin-film packing structure 21 may include: in organic light emission in flexible display panels as shown in Figure 2
The first inorganic layer 211 is deposited on diode array substrate 22;Figure is carried out to 211 surface of the first inorganic layer using mask plate
Change, forms patterned surface A;Enhancement layer 210 is coated on patterned surface A;Using ink-jet printing technology (Inkjet
Printing, IJP), organic layer 212 is prepared on enhancement layer 210 using same mask plate until the surface of organic layer 112
With mask plate flush, removes mask plate and continue to prepare organic layer 212;Using chemical vapour deposition technique (Chemical
Vapor Deposition, CVD) technology, the second inorganic layer 213 is prepared on organic layer 212.
Fig. 3 show the structural schematic diagram of the flexible display screen of third embodiment of the invention offer.As shown in figure 3, this is soft
The difference of property display screen 300 and flexible display screen 200 is that enhancement layer 310 is only located in the groove of patterned surface A.Specifically
For, as shown in figure 3, the patterned surface A of inorganic layer 311 includes groove, enhancement layer 310 is located in groove.
It is considered that inorganic layer 311 actually only can be in the reduction of the recess region of patterned surface A generation thickness, therefore
The problem of water oxygen obstructing capacity declines caused by only setting enhancement layer 310 can make up because of thickness reduction in groove, to save
Save the raw material of enhancement layer 310.
In this case, in one embodiment, as shown in figure 3, the thickness of the enhancement layer 310 in groove is equal to groove
Depth.In this way, a planarization surface can be formed, to facilitate the preparation of the organic layer 312 of 311 top of inorganic layer.
Flexible Displays face shown in the preparation process of thin-film packing structure 31 and Fig. 2 in flexible display panels as shown in Figure 3
The difference of the preparation process of thin-film packing structure 21 is only that in plate: as the formation patterned surface A on the first inorganic layer 311
Later, enhancement layer 310 is coated on patterned surface A using the same mask plate for being patterned until enhancement layer
The flush on 310 surface and the first inorganic layer 311;Then it is sequentially prepared on enhancement layer 310 and the first inorganic layer 311
Organic layer 312 and the second inorganic layer 313.
Fig. 4 show the structural schematic diagram of the flexible display screen of fourth embodiment of the invention offer.As shown in figure 4, this reality
Applying the enhancement layer 410 in example includes the first sub- enhancement layer 401 and the second sub- enhancement layer 402.Wherein the first sub- enhancement layer 401 is located at
In the groove of patterned surface A, and the thickness of the first sub- enhancement layer 401 is equal to the depth of groove, i.e., the first sub- enhancement layer 401
Just fill groove;Second sub- enhancement layer 402 is located on the surface of the first sub- enhancement layer 401 and the first inorganic layer 411, and
The thickness of second sub- enhancement layer 402 is equal everywhere.
In this case, the enhancement layer 310 in flexible display panels as shown in Figure 3 in thin-film packing structure, which is equivalent to, only wraps
The first sub- enhancement layer 401 of the enhancement layer of thin-film packing structure in flexible display panels shown in Fig. 4 is included, then flexibility shown in Fig. 4 is aobvious
Show the thin-film packing structure in panel preparation process and Fig. 3 shown in thin-film packing structure in flexible display panels preparation
The difference of journey is only that: after the first sub- enhancement layer 401 is completed in preparation, in the first sub- enhancement layer 401 and the first inorganic layer 411
On be coated with the second sub- enhancement layer 402.
Fig. 5 show the structural schematic diagram of the flexible display screen of fifth embodiment of the invention offer.As shown in figure 5, this is soft
Property display screen 500 in enhancement layer include the first enhancement layer 5101 and the second enhancement layer 5102, inorganic layer include the first inorganic layer
511 and second inorganic layer 513, the first inorganic layer 511, the first enhancement layer 5101, organic layer 512, the second enhancement layer 5102 and
Successively adjacent stacked, the first inorganic layer 511 include patterned surface A to two inorganic layers 513, and organic layer 512 includes patterned surface
B。
In one embodiment, the structure of patterned surface A and patterned surface B can be the same or different, and first
Enhancement layer 5101 and 5102 structure of the second enhancement layer can be the same or different.When patterned surface A's and patterned surface B
When structure difference, the first enhancement layer 5101 and 5102 structure of the second enhancement layer are inevitable different, as patterned surface A and graphical table
When the structure of face B is identical, the first enhancement layer 5101 and 5102 structure of the second enhancement layer can be different.
For example, in the present embodiment, as shown in figure 5, patterned surface A is identical with the structure of patterned surface B, and the
One enhancement layer 5101 is identical with 5102 structure of the second enhancement layer.Specifically, 511 surface of the first inorganic layer includes array arrangement
Rectangular channel, i.e. patterned surface A;First enhancement layer 5101 include the first sub- enhancement layer 501 and the second sub- enhancement layer 502, first
Sub- enhancement layer 501 fills the rectangular channel on 511 surface of the first inorganic layer, and the second sub- enhancement layer 502 covers the first inorganic layer 511 and the
The surface of one sub- enhancement layer 501, and the thickness of the second sub- enhancement layer 502 is equal everywhere, to make the second sub- 502 shape of enhancement layer
At planarization surface, be conducive to top film layer, the i.e. preparation of organic layer 512.Patterned surface B is used and patterned surface A phase
Same structure, the second enhancement layer 5102 uses and the identical structure of the first enhancement layer 5101, and which is not described herein again.
It will be understood by those skilled in the art that the first enhancement layer 5101 and/or the second enhancement layer 5102 in Fig. 5 can be with
Using Fig. 2 or structure shown in Fig. 3, given here is exemplary, and is not construed as limiting and is used.
According to flexible display screen provided in this embodiment, by the way that patterned surface and reinforcement are arranged in thin-film packing structure
Layer, improves the reliability of thin-film packing structure.
Fig. 6 show the preparation method flow chart of the flexible display screen of one embodiment of the invention offer.As shown in fig. 6, should
The preparation method 600 of flexible display screen includes:
Step S601, prepares organic LED array substrate.
Specifically, including on substrate anode layer, hole injection layer, organic luminous layer, electron transfer layer are sequentially prepared
And metal cathode layer.
Step S602 prepares the first inorganic layer on organic LED array substrate.
It can be using physically or chemically gas phase deposition technology, in the anode layer or metal of organic LED array substrate
The first inorganic layer is prepared on cathode layer, the material of the inorganic layer is one of aluminium oxide, magnesia, silica, silicon nitride
Or it is a variety of.
Step S603 is patterned the surface of the first inorganic layer.
Using mask plate, processing is patterned to the first inorganic layer surface, specific figure here not limits.
Step S604 is coated with the first enhancement layer on the patterned surface of the first inorganic layer.
Step S605 prepares organic layer on the first enhancement layer.
Here organic layer can be any one of polyimide film, polyethylene film, polypropylene screen, polystyrene film.
Step S606 is patterned the surface of organic layer.
Step S607 is coated with the second enhancement layer on the patterned surface of organic layer.
Step S608 prepares the second inorganic layer on the second enhancement layer.
The detailed process of step S604- step S608 depends on the specific structure of the first enhancement layer and the second enhancement layer, example
Such as, when the first enhancement layer is using structure shown in Fig. 2, it is referred to the preparation process of enhancement layer shown in Fig. 2;When the first enhancement layer
Using the preparation process for when structure, being referred to enhancement layer shown in Fig. 3 shown in Fig. 3;When the first enhancement layer is using structure shown in Fig. 4
When, it is referred to the preparation process of enhancement layer shown in Fig. 4.Which is not described herein again.
The preparation method 600 of flexible display screen shown in fig. 6 can be used for preparing flexible display screen shown in fig. 5, Fig. 5 institute
Show that corresponding technical characteristic can add in preparation method shown in fig. 6 in flexible display screen, which is not described herein again.
The present invention also provides a kind of flexible display apparatus, the flexible display screen provided including any of the above-described embodiment.It should
Flexible display apparatus has the beneficial effect of respective flexible display screen.
It is clearer to should be appreciated that determiner " first " and " second " used in description of the embodiment of the present invention are only used for
It illustrates technical solution, can not be used to limit the scope of the invention.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Within mind and principle, made any modification, equivalent replacement etc. be should all be included in the protection scope of the present invention.