CN109461831B - Organic light-emitting display panel and preparation method thereof - Google Patents
Organic light-emitting display panel and preparation method thereof Download PDFInfo
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- CN109461831B CN109461831B CN201811013556.9A CN201811013556A CN109461831B CN 109461831 B CN109461831 B CN 109461831B CN 201811013556 A CN201811013556 A CN 201811013556A CN 109461831 B CN109461831 B CN 109461831B
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- H10K50/00—Organic light-emitting devices
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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Abstract
The application discloses organic light emitting display panel and preparation method thereof, the organic light emitting display panel includes: the organic light emitting diode comprises a flexible substrate, an organic light emitting layer, an encapsulation layer and a stress buffer layer; the organic light emitting layer is arranged on the surface of the flexible substrate, the packaging layer covers the surface of the organic light emitting layer, which is far away from the flexible substrate, and the side face of the organic light emitting layer, and the stress buffer layer is arranged on the surface of the packaging layer, which is far away from the organic light emitting layer; wherein, the stress buffer layer is at least partially made of elastic material. Through the mode, the problem that membrane layer separation or membrane layer fracture easily occurs between the inorganic layer and the organic layer caused by bending can be solved.
Description
Technical Field
The present disclosure relates to the field of display technologies, and in particular, to an organic light emitting display panel and a method for manufacturing the same.
Background
An Active matrix Organic Light-Emitting Diode (AMOLED) device is based on electroluminescence of an Organic material, and an OLED pixel is controlled by using a Thin Film Transistor (TFT) array, each pixel operates independently, can continuously drive and emit Light, and is a mainstream in the display field due to low power consumption, high brightness, and high resolution.
The existing flexible OLED device adopts a 3-layer film packaging technology, the stress of an inorganic layer is different from that of an organic layer, the stress cannot be released when the device is bent, and the regional stress is concentrated. Therefore, in the bending process, film separation or film breakage is easy to occur between the inorganic layer and the organic layer in the film packaging layer, so that packaging failure is caused, water and oxygen in the air are invaded, and the flexible OLED device fails.
Disclosure of Invention
The technical problem mainly solved by the application is to provide an organic light-emitting display panel and a preparation method thereof, which can solve the problem that film separation or film breakage easily occurs between an inorganic layer and an organic layer due to bending.
In order to solve the technical problem, the application adopts a technical scheme that: provided is an organic light emitting display panel including: the organic light emitting diode comprises a flexible substrate, an organic light emitting layer, an encapsulation layer and a stress buffer layer; the organic light emitting layer is arranged on the surface of the flexible substrate, the packaging layer covers the surface of the organic light emitting layer, which is far away from the flexible substrate, and the side face of the organic light emitting layer, and the stress buffer layer is arranged on the surface of the packaging layer, which is far away from the organic light emitting layer; wherein, the stress buffer layer is at least partially made of elastic material.
In order to solve the above technical problem, another technical solution adopted by the present application is: provided is a method of manufacturing an organic light emitting display panel, including: providing a flexible substrate; forming an organic light emitting layer on a surface of a flexible substrate; forming an encapsulation layer on the surface of the organic light-emitting layer far away from the flexible substrate and the side surface of the organic light-emitting layer; and forming a stress buffer layer on the surface of the packaging layer far away from the organic light-emitting layer by adopting at least part of elastic material.
The beneficial effect of this application is: different from the situation of the prior art, in the embodiment of the application, a stress buffer layer is further formed on the surface of the encapsulation layer of the organic light-emitting display panel, and at least part of the stress buffer layer is made of an elastic material, so that the stress buffer layer covering the surface of the encapsulation layer can disperse bending stress in the bending process of the organic light-emitting display panel, and the stress borne by the encapsulation layer is reduced; furthermore, the stress buffer layer can also reduce the stress of the inorganic layer in the packaging layer, so that the deformation difference between the inorganic layer and the organic layer is reduced, the separation of the inorganic layer and the organic layer in the film packaging is further prevented, and the packaging effect and the service life of the flexible organic light-emitting display panel are improved.
Drawings
FIG. 1 is a schematic structural diagram of a first embodiment of an organic light emitting display panel according to the present application;
FIG. 2 is a schematic structural diagram of a second embodiment of an organic light emitting display panel according to the present application;
FIG. 3 is a schematic top view of an exemplary patterned stress buffer layer of FIG. 2;
FIG. 4 is a schematic top view of another example of the patterned stress buffer layer of FIG. 2;
FIG. 5 is a schematic top view of another embodiment of the patterned stress buffer layer of FIG. 2;
FIG. 6 is a schematic structural diagram of a third embodiment of an organic light emitting display panel according to the present application;
FIG. 7 is a schematic top view of the stress buffer layer of FIG. 6;
FIG. 8 is a schematic structural diagram of a fourth embodiment of an organic light-emitting display panel according to the present application;
FIG. 9 is a schematic flow chart of a first embodiment of a method for fabricating an organic light emitting display panel according to the present application;
FIG. 10 is a detailed flowchart of steps S13 and S14;
FIG. 11 is a schematic flow chart of a second embodiment of a method for fabricating an organic light emitting display panel according to the present application;
fig. 12 is a schematic flow chart of a third embodiment of a method for manufacturing an organic light emitting display panel according to the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
As shown in fig. 1, in a first embodiment of an organic light emitting display panel of the present application, an organic light emitting display panel 10 includes: flexible substrate 101, organic light emitting layer 102, encapsulation layer 103 and stress buffer layer 104.
The organic light emitting layer 102 is disposed on the surface of the flexible substrate 101, the encapsulation layer 103 covers the surface of the organic light emitting layer 102 away from the flexible substrate 101 and the side surface of the organic light emitting layer 102, and the stress buffer layer 104 is disposed on the surface of the encapsulation layer 103 away from the organic light emitting layer 102.
The flexible substrate 101 may be made of a material such as PI (Polyimide) that is resistant to high temperature, has high flexibility, and blocks water and oxygen. The organic light emitting layer 102 at least includes a Thin Film Transistor (TFT) layer for driving the OLED pixel to emit light and an OLED pixel layer.
Alternatively, as shown in fig. 1, the encapsulation layer 103 may include a 3-layer structure composed of a first inorganic layer 1031, a first organic layer 1032, and a second inorganic layer 1033, which are sequentially stacked along the direction away from the organic light emitting layer 102. Of course, in other embodiments, the encapsulation layer 103 may also include a multi-layer encapsulation structure formed by stacking an inorganic layer and an organic layer, which is not limited herein.
The first inorganic layer 1031 and the second inorganic layer 1033 may be made of inorganic materials such as silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, and the like, have good light transmittance, and have stable chemical properties, are not easily reacted with other substances, and can perform a good isolation effect. The first organic layer 1032 can be made of organic polymers such as acrylate, epoxy, parylene, hexamethyldisiloxane, fluorocarbon, or vinyl alcohol, and has good fluidity, mainly serves to planarize, and has better adhesion to inorganic materials. Of course, the first inorganic layer 1031, the second inorganic layer 1033, and the first organic layer 1032 may be made of other materials, for example, the first inorganic layer 1031 and the second inorganic layer 1033 may be made of titanium oxide, etc., and the first organic layer 1032 may be made of polyethylene, etc.
With continued reference to fig. 1, the stress buffer layer 104 is disposed on the surface of the second inorganic layer 1033 away from the first organic layer 1032.
Wherein, the stress buffer layer 104 is made of at least partially elastic material. The elastic material may include materials having the same or different elasticity, for example, including at least one of acryl, epoxy, and acrylic materials.
The stress buffering layer 104 may be a film made of the same elastic material, or may be one or more films made of different elastic materials, which is not limited herein.
In this embodiment, a stress buffer layer is formed on the surface of the encapsulation layer of the organic light emitting display panel, and at least a portion of the stress buffer layer is made of an elastic material, so that the stress buffer layer covering the surface of the encapsulation layer can disperse bending stress in the bending process of the organic light emitting display panel, thereby reducing stress applied to the encapsulation layer. Furthermore, as the stress of the inorganic layer in the packaging layer is reduced, the deformation difference between the inorganic layer and the organic layer is reduced, so that the separation of the inorganic layer and the organic layer in the film packaging can be prevented, and the packaging effect and the service life of the flexible organic light-emitting display panel are improved.
In other embodiments, to further improve the stress buffering effect, the stress buffering layer may be patterned to create more stress buffering spaces.
Specifically, as shown in fig. 2, in the second embodiment of the organic light emitting display panel of the present application, the organic light emitting display panel 20 includes: the organic light emitting diode comprises a flexible substrate 201, an organic light emitting layer 202, an encapsulation layer 203 and a stress buffer layer 204.
The organic light emitting layer 202 is disposed on the surface of the flexible substrate 201, the encapsulation layer 203 covers the surface of the organic light emitting layer 202 away from the flexible substrate 201 and the side surface of the organic light emitting layer 202, and the stress buffer layer 204 is disposed on the surface of the encapsulation layer 203 away from the organic light emitting layer 202.
In this embodiment, the encapsulation layer 203 may include a 3-layer structure composed of a first inorganic layer 2031, a first organic layer 2032, and a second inorganic layer 2033, which are sequentially stacked along the direction away from the organic light emitting layer 202. Of course, in other embodiments, the encapsulation layer 203 may also include a multi-layer encapsulation structure formed by stacking an inorganic layer and an organic layer, which is not limited herein.
The stress buffer layer 204 is disposed on the surface of the second inorganic layer 2033 away from the first organic layer 2032. As shown in connection with fig. 3, the stress buffer layer 204 includes a patterned elastic material layer including a patterned region having a plurality of voids 2041.
As shown in fig. 3, adjacent voids 2041 in the patterned region are spaced apart from one another. The shape of each gap 2041 may be the same or different, for example, as shown in fig. 3, a square-shaped gap may be used, or as shown in fig. 4, a plurality of shapes such as square, diamond, or circle may be used.
In another application example, such as shown in fig. 5, at least some adjacent voids 2041 in the patterned region are in communication.
The voids 2041 may be uniformly distributed on the stress buffering layer 204, for example, as shown in fig. 3, the voids 2041 are distributed in a horizontal and vertical array, and because the voids 2041 exist in both the horizontal and vertical directions, when the organic light emitting display panel 20 is bent, stress buffering spaces exist in both the horizontal and vertical directions, so that the stress buffering effect is better. If a plurality of circular transverse and longitudinal arrangements are adopted, the stress buffering effect at any position in each direction can be realized. Of course, in other embodiments, voids 2041 may be non-uniformly distributed, such as in a single transverse or longitudinal distribution, and may also provide stress buffering or distribution in one direction.
Optionally, in other embodiments, elastic particles may be filled in the voids of the patterned region of the stress buffer layer to further improve the stress buffering effect.
Specifically, as shown in fig. 6, in the third embodiment of the organic light emitting display panel of the present application, the organic light emitting display panel 30 includes: flexible substrate 301, organic light emitting layer 302, encapsulation layer 303 and stress buffer layer 304.
The organic light emitting layer 302 is disposed on the surface of the flexible substrate 301, the encapsulation layer 303 covers the surface of the organic light emitting layer 302 away from the flexible substrate 301 and the side surface of the organic light emitting layer 302, and the stress buffer layer 304 is disposed on the surface of the encapsulation layer 303 away from the organic light emitting layer 302.
In this embodiment, the encapsulation layer 303 may include a 3-layer structure including a first inorganic layer 3031, a first organic layer 3032, and a second inorganic layer 3033, which are sequentially stacked along a direction away from the organic light emitting layer 302. Of course, in other embodiments, the encapsulation layer 303 may also include a multi-layer encapsulation structure formed by stacking an inorganic layer and an organic layer, which is not limited herein.
The stress buffer layer 304 is disposed on a surface of the second inorganic layer 3033 away from the first organic layer 3032. As shown in fig. 7, the stress buffer layer 304 includes a patterned elastic material layer including a patterned region having a plurality of voids 3041, and the stress buffer layer 304 further includes elastic particles 3042 filled in the voids 3041.
The elastic particles 3042 may be the same kind of elastic particles having the same elasticity, or two or more kinds of elastic particles having different elasticity, and the shape and size of the elastic particles may be the same or different. In this embodiment, the elastic particles 3042 may be at least one of silicon dioxide elastic beads, silicon nitride beads, indium tin oxide beads, and nano carbon beads, and may also be particles made of other elastic materials and have other shapes, which is not limited herein.
Specifically, in one application example, in the patterned stress buffer layer 304, the voids 3041 are uniformly distributed in a square shape, the elastic particles 3042 are silica elastic beads, and each of the voids 3041 is filled with silica elastic beads. When the organic light emitting display panel 30 is bent, the stress buffer layer 304 deforms, so that not only can the patterned elastic material layer disperse stress, but also part of the stress can be dispersed into the elastic particles 3042 due to the elastic particles 3042 filled in the gaps 3041, so that the stress can be further buffered, the stress of the second inorganic layer 3033 in the encapsulation layer 303 can be reduced, the second inorganic layer 3033 can be prevented from being broken, the first organic layer 3032 and the second inorganic layer 3033 can be prevented from being separated, and the encapsulation effect and the service life of the organic light emitting display panel can be improved.
In other embodiments, the material of the stress buffering layer may also be an elastic material filled with elastic particles to further improve the stress buffering effect.
Specifically, as shown in fig. 8, in the fourth embodiment of the organic light emitting display panel of the present application, the organic light emitting display panel 40 includes: flexible substrate 401, organic light emitting layer 402, encapsulation layer 403, and stress buffer layer 404.
The organic light emitting layer 402 is disposed on the surface of the flexible substrate 401, the encapsulation layer 403 covers the surface of the organic light emitting layer 402 away from the flexible substrate 401 and the side surface of the organic light emitting layer 402, and the stress buffer layer 404 is disposed on the surface of the encapsulation layer 403 away from the organic light emitting layer 402.
In this embodiment, the encapsulation layer 403 may have a 3-layer structure including a first inorganic layer 4031, a first organic layer 4032, and a second inorganic layer 4033 which are stacked in this order away from the organic light-emitting layer 402. Of course, in other embodiments, the encapsulation layer 403 may also include a multi-layer encapsulation structure formed by stacking an inorganic layer and an organic layer, which is not limited herein.
The stress buffer layer 404 is disposed on a surface of the second inorganic layer 4033 away from the first organic layer 4032. As shown in fig. 8, the stress buffering layer 404 includes an elastic material 4041 and elastic particles 4042 doped in the elastic material 4041.
The elastic material 4041 may be an elastic material with the same or different elasticity, such as at least one of acrylic material, epoxy material, and acrylic material.
The elastic particles 4042 may be the same kind of elastic particles having the same elasticity, or two or more kinds of elastic particles having different elasticity, and the shape and size of the elastic particles may be the same or different. In this embodiment, the elastic particles 4042 may be at least one of silicon dioxide elastic beads, silicon nitride beads, indium tin oxide beads, and nano carbon beads, or may be particles made of other elastic materials and having other shapes, which is not limited herein.
In other embodiments, the material of the stress buffering layer 404 may also be two or more elastic particles with different elasticity doped in the non-elastic material, or two or more elastic particles with the same elasticity but different size/shape doped in the non-elastic material, which is not limited herein.
In this embodiment, since the stress buffer layer is formed on the surface of the encapsulation layer of the organic light emitting display panel and is made of elastic material doped with elastic particles, the elastic stress buffer layer covering the surface of the encapsulation layer can disperse bending stress and reduce stress applied to the encapsulation layer in the bending process of the organic light emitting display panel. Furthermore, as the stress of the inorganic layer in the packaging layer is reduced, the deformation difference between the inorganic layer and the organic layer is reduced, so that the separation of the inorganic layer and the organic layer in the film packaging can be prevented, and the packaging effect and the service life of the flexible organic light-emitting display panel are improved.
As shown in fig. 9, the first embodiment of the method for manufacturing an organic light emitting display panel of the present application includes:
s11: a flexible substrate is provided.
The flexible substrate can be made of materials such as PI (Polyimide), which are high temperature resistant, strong in flexibility and capable of blocking water and oxygen.
S12: an organic light-emitting layer is formed on the surface of the flexible substrate.
The organic light-emitting layer at least comprises a Thin Film Transistor (TFT) layer for driving the OLED pixel to emit light and an OLED pixel layer. Specifically, a Thin Film Transistor (TFT) layer can be formed on the surface of the flexible substrate, and then the OLED pixel layer is prepared on the surface of the TFT layer.
S13: and forming an encapsulation layer on the surface of the organic light-emitting layer far away from the flexible substrate and the side surface of the organic light-emitting layer.
S14: and forming a stress buffer layer on the surface of the packaging layer far away from the organic light-emitting layer by adopting at least part of elastic material.
The elastic material can comprise elastic materials with the same or different elasticity, or elastic particles doped in the elastic materials or the non-elastic materials, or two or more elastic particles with different elasticity, or two or more elastic particles with the same elasticity but different sizes/shapes.
The elastic material can be at least one of acrylic material, epoxy material and acrylic material, and the elastic particles can be at least one of silicon dioxide elastic balls, silicon nitride balls, indium tin oxide balls and nano carbon balls.
Alternatively, as shown in fig. 10, when the encapsulation layer has a three-layer structure in which an inorganic layer, an organic layer, and an inorganic layer are stacked, the steps S13 and S14 specifically include:
s131: and depositing a first inorganic layer on the surface of the organic light-emitting layer far away from the flexible substrate and the side surface of the organic light-emitting layer.
S132: and ink-jet printing the first organic layer on the surface of the first inorganic layer far away from the organic light-emitting layer.
S133: and depositing a second inorganic layer on the surface of the first organic layer far away from the first inorganic layer and the side surface of the first organic layer.
S141: and forming a stress buffer layer on the surface of the second inorganic layer far away from the first organic layer by adopting at least partial ink-jet printing of the elastic material.
The first inorganic Layer and the second inorganic Layer may be deposited by Chemical Vapor Deposition (CVD), Plasma Enhanced Chemical Vapor Deposition (PECVD), Atomic Layer Deposition (ALD), or the like. The first organic layer and the stress buffer layer may be printed using an Ink-jet Printing (IJP) process.
The structure of the organic light emitting display panel formed in this embodiment may refer to the structure provided in the first embodiment of the organic light emitting display panel of the present application, and details thereof are not repeated here.
In this embodiment, at least a portion of the elastic material is used to form a stress buffer layer on the surface of the encapsulation layer of the organic light emitting display panel, so that the elastic stress buffer layer covering the surface of the encapsulation layer can disperse the bending stress during the bending process of the organic light emitting display panel, thereby reducing the stress applied to the encapsulation layer. Furthermore, as the stress of the inorganic layer in the packaging layer is reduced, the deformation difference between the inorganic layer and the organic layer is reduced, so that the separation of the inorganic layer and the organic layer in the film packaging can be prevented, and the packaging effect and the service life of the flexible organic light-emitting display panel are improved.
As shown in fig. 11, a second embodiment of the method for manufacturing an organic light emitting display panel of the present application includes:
s21: a flexible substrate is provided.
S22: an organic light-emitting layer is formed on the surface of the flexible substrate.
S23: and forming an encapsulation layer on the surface of the organic light-emitting layer far away from the flexible substrate and the side surface of the organic light-emitting layer.
S24: and printing the elastic material layer on the surface of the packaging layer far away from the organic light-emitting layer by adopting an ink-jet printing process.
The elastic material may be an elastic material with the same or different elasticity, such as at least one of acrylic material, epoxy material and acrylic material.
S25: and etching the elastic material layer to form a patterned area.
The specific implementation of steps S21-S23 may refer to steps S11-S13, which are not repeated here.
Specifically, in an application example, after the elastic material layer is printed on the surface of the encapsulation layer away from the organic light emitting layer by using an inkjet printing process, a photolithography process may be used, and after processes of coating a photoresist, exposing, developing, and the like, a patterned region may be etched in the elastic material layer.
Optionally, the patterned region has a plurality of gaps, and after step S25, the method may further include:
s26: the voids in the patterned region are filled with elastomeric particles.
The elastic particles may be the same kind of elastic particles having the same elasticity, or two or more kinds of elastic particles having different elasticity, and the shape/size of the elastic particles may be the same or different. In this embodiment, the elastic particles may be at least one of silicon dioxide elastic beads, silicon nitride beads, indium tin oxide beads, and nano carbon beads.
The structure of the organic light emitting display panel formed in this embodiment may refer to the structure provided in the second or third embodiment of the organic light emitting display panel of this application, and details thereof are not repeated here.
As shown in fig. 12, a third embodiment of the method for manufacturing an organic light emitting display panel of the present application includes:
s31: a flexible substrate is provided.
S32: an organic light-emitting layer is formed on the surface of the flexible substrate.
S33: and forming an encapsulation layer on the surface of the organic light-emitting layer far away from the flexible substrate and the side surface of the organic light-emitting layer.
S34: an elastomeric material doped with elastomeric particles is provided.
The elastic material comprises elastic materials with the same or different elasticity and elastic particles doped in the elastic materials, or comprises two or more elastic particles with different elasticity, or comprises two or more elastic particles with the same elasticity but different sizes/shapes.
S35: and printing the elastic material on the surface of the packaging layer far away from the organic light-emitting layer by adopting an ink-jet printing process to form the stress buffer layer.
The specific implementation of steps S31-S33 may refer to steps S11-S13, which are not repeated here.
Specifically, in one application example, the elastic particles may be doped into the elastic or inelastic material, and the desired elastic material may be prepared. The doping ratio is determined by the specific elastic requirement, and is not specifically limited herein. And then, printing the prepared elastic material on the surface of the packaging layer far away from the organic light-emitting layer by adopting an ink-jet printing process to form a stress buffer layer.
In this embodiment, a stress buffer layer is formed on the surface of the encapsulation layer of the organic light-emitting display panel, and the stress buffer layer is made of elastic material doped with elastic particles, so that the elastic stress buffer layer covering the surface of the encapsulation layer can disperse bending stress in the bending process of the organic light-emitting display panel, thereby reducing stress applied to the encapsulation layer. Furthermore, as the stress of the inorganic layer in the packaging layer is reduced, the deformation difference between the inorganic layer and the organic layer is reduced, so that the separation of the inorganic layer and the organic layer in the film packaging can be prevented, and the packaging effect and the service life of the flexible organic light-emitting display panel are improved.
The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.
Claims (8)
1. An organic light emitting display panel, comprising: the organic light emitting diode comprises a flexible substrate, an organic light emitting layer, an encapsulation layer and a stress buffer layer;
the organic light emitting layer is arranged on the surface of the flexible substrate, the packaging layer covers the surface of the organic light emitting layer, which is far away from the flexible substrate, and the side face of the organic light emitting layer, and the stress buffer layer is arranged on the surface of the packaging layer, which is far away from the organic light emitting layer;
the stress buffer layer is an elastic material layer which is provided with a plurality of patterned areas of gaps, and the stress buffer layer further comprises elastic particles filled in the gaps, wherein the elastic particles are not in contact with at least part of the side walls of the gaps; the elastic particles comprise at least one of silicon nitride beads, indium tin oxide beads and nano carbon beads.
2. The organic light-emitting display panel of claim 1, wherein the elastic material comprises at least one of an epoxy material and an acrylic material.
3. The organic light-emitting display panel according to claim 2, wherein adjacent ones of the voids are spaced apart from each other; or at least some adjacent ones of said voids.
4. The organic light-emitting display panel according to claim 1, wherein the elastic particles include two or more kinds of particles different in elasticity; alternatively, the elastic particles comprise two or more particles of the same elasticity but different size/shape.
5. The organic light-emitting display panel according to claim 1, wherein the encapsulation layer comprises a first inorganic layer, a first organic layer, and a second inorganic layer, which are stacked in this order along a direction away from the organic light-emitting layer;
the stress buffer layer is arranged on the surface of the second inorganic layer far away from the first organic layer.
6. A method for manufacturing an organic light emitting display panel includes:
providing a flexible substrate;
forming an organic light emitting layer on a surface of the flexible substrate;
forming an encapsulation layer on the surface of the organic light-emitting layer, which is far away from the flexible substrate, and the side surface of the organic light-emitting layer;
forming a stress buffer layer on the surface of the packaging layer far away from the organic light-emitting layer by adopting at least part of elastic material;
wherein, the forming of the stress buffer layer by adopting at least part of elastic materials on the surface of the encapsulation layer far away from the organic light-emitting layer comprises the following steps:
printing an elastic material layer on the surface of the packaging layer far away from the organic light-emitting layer by adopting an ink-jet printing process;
etching the elastic material layer to form a patterned area; the patterned region having a plurality of voids;
and filling elastic particles in the gap, wherein the elastic particles are not in contact with at least part of the side wall of the gap, and the elastic particles comprise at least one of silicon nitride beads, indium tin oxide beads and nano carbon beads.
7. The production method according to claim 6,
the elastic particles include two or more kinds of particles having different elasticity; alternatively, the elastic particles comprise two or more particles of the same elasticity but different size/shape.
8. The production method according to claim 6,
the forming of the encapsulation layer on the surface of the organic light emitting layer away from the flexible substrate and the side surface of the organic light emitting layer includes:
sequentially laminating a first inorganic layer, a first organic layer and a second inorganic layer on the surface of the organic light-emitting layer far away from the flexible substrate and the side surface of the organic light-emitting layer;
the step of forming the stress buffer layer by adopting at least part of elastic materials on the surface of the packaging layer far away from the organic light-emitting layer comprises the following steps:
and forming the stress buffer layer on the surface of the second inorganic layer far away from the first organic layer by adopting at least partial elastic material ink-jet printing.
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| CN112002825B (en) * | 2020-08-24 | 2022-09-06 | 昆山工研院新型平板显示技术中心有限公司 | Display panel |
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| CN114141970A (en) * | 2021-11-29 | 2022-03-04 | 深圳市华星光电半导体显示技术有限公司 | Display panel, display device and display panel preparation method |
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