CN114420867A - Display panel and preparation method thereof - Google Patents
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- CN114420867A CN114420867A CN202210027017.0A CN202210027017A CN114420867A CN 114420867 A CN114420867 A CN 114420867A CN 202210027017 A CN202210027017 A CN 202210027017A CN 114420867 A CN114420867 A CN 114420867A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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Abstract
The invention provides a display panel and a preparation method thereof. The encapsulation layer includes a first inorganic film layer having a first surface distal from the light emitting device layer and a second surface proximal to the light emitting device layer. The first stress buffer layer is located on the first surface or the second surface of the first inorganic film layer, so that the first stress buffer layer can reduce stress on the first inorganic film layer, namely release stress of the packaging layer, and further improve packaging effect and service life of the display panel.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display panel and a preparation method thereof.
Background
Organic Light Emitting Diode (OLED) has the characteristics of self-luminescence, high color gamut, high contrast, fast response speed, flexible display and the like, and has wide application in the fields of illumination, display, intelligent wearing, VR and the like.
For OLED, organic materials are easy to crack under the influence of water and oxygen, and an OLED device can be protected from the influence of water and oxygen by an OLED packaging process, so that good photoelectric property and device service life are ensured. Currently, the mainstream of the OLED encapsulation method is Thin Film Encapsulation (TFE), and the Thin film encapsulation generally includes an inorganic film layer.
When the flexible panel is bent, the stress of the inorganic film layer is large, the stress cannot be released, the regional stress is concentrated, and the packaging failure is easily caused.
Disclosure of Invention
The invention aims to provide a display panel and a preparation method thereof, and aims to reduce stress on an inorganic film layer or an encapsulation film layer and further improve the encapsulation effect of a flexible OLED panel.
In one aspect, the present invention provides a display panel comprising:
a substrate;
a light emitting device layer on the substrate;
an encapsulation layer covering the light emitting device layer, the encapsulation layer including a first inorganic film layer having a first surface distal from the light emitting device layer and a second surface proximal to the light emitting device layer;
the first stress buffer layer is positioned on the first surface or the second surface of the first inorganic film layer.
Further, the first stress buffer layer is inflatable resin.
Further, the inflatable resin comprises a resin matrix and gas micropores dispersed in the resin matrix, wherein the resin matrix is at least one of acrylic resin, epoxy resin, polycarbonate-based resin, polyvinyl alcohol-based resin and acid-alcohol polycondensation resin.
Further, the encapsulation layer further includes:
a second inorganic film layer between the first inorganic film layer and the light emitting device layer;
and the organic film layer is positioned between the second inorganic film layer and the first inorganic film layer.
Further, the second inorganic film layer has a third surface distal from the light emitting device layer and a fourth surface proximal to the light emitting device layer; the display panel further includes:
and the second stress buffer layer is positioned on the third surface or the fourth surface of the second inorganic film layer.
Further, the encapsulation layer further includes:
an organic film layer covering the first inorganic film layer;
and a second inorganic film layer covering the organic film layer.
Further, the substrate includes a thin film transistor array substrate.
Further, the light-emitting device layer comprises an organic light-emitting diode device layer, and the organic light-emitting diode device layer comprises an anode, a light-emitting function layer and a cathode which are sequentially arranged on the substrate.
In another aspect, the present invention provides a method for manufacturing a display panel, including:
forming a substrate;
forming a light emitting device layer on the substrate;
forming an encapsulation layer covering the light emitting device layer, the encapsulation layer comprising a first inorganic film layer having a first surface distal from the light emitting device layer and a second surface proximal to the light emitting device layer;
forming a first stress buffer layer on the first surface or the second surface of the first inorganic film layer.
Further, the first stress buffer layer is an inflatable resin, and the inflatable resin comprises a resin matrix and gas micropores dispersed in the resin matrix; the step of forming the first stress buffer layer includes:
stirring the resin matrix, and filling inert gas and surfactant while stirring;
or hollow nano microspheres are doped in the resin matrix;
or the resin matrix is doped with foaming agent, and the gas micropores are formed by chemical reaction.
The invention has the beneficial effects that: a display panel and a method for manufacturing the same are provided, including a substrate, a light emitting device layer on the substrate, an encapsulation layer covering the light emitting device layer, and a first stress buffer layer. The encapsulation layer includes a first inorganic film layer having a first surface distal from the light emitting device layer and a second surface proximal to the light emitting device layer. The first stress buffer layer is located on the first surface or the second surface of the first inorganic film layer, so that the first stress buffer layer can reduce stress on the first inorganic film layer, namely release stress of the packaging layer, and further improve packaging effect and service life of the display panel.
Drawings
The technical solution and other advantages of the present invention will become apparent from the following detailed description of specific embodiments of the present invention, which is to be read in connection with the accompanying drawings.
Fig. 1 is a schematic structural diagram of a display panel according to a first embodiment of the present invention;
fig. 2 is a schematic structural diagram of a display panel according to a second embodiment of the present invention;
fig. 3 is a schematic structural diagram of a display panel according to a third embodiment of the invention;
fig. 4 is a schematic structural diagram of a display panel according to a fourth embodiment of the invention;
fig. 5 is a schematic structural diagram of a display panel according to a fifth embodiment of the present invention;
fig. 6 is a schematic structural diagram of a display panel according to a sixth embodiment of the invention;
fig. 7 is a schematic structural diagram of a display panel according to a seventh embodiment of the invention;
fig. 8 is a schematic flow chart of a manufacturing method of a display panel according to an embodiment of the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "first", "second" and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or uses of other materials.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a display panel according to a first embodiment of the present invention. The display panel 100 may be an Organic Light Diode (OLED) display panel.
The display panel 100 includes a substrate 10, a light emitting device layer 11 on the substrate 10, an encapsulation layer 12 covering the light emitting device layer 11, and a first stress buffer layer 13. The encapsulation layer 12 includes a first inorganic film layer 121, and the first inorganic film layer 121 has a first surface 1211 distant from the light emitting device layer 11 and a second surface 1212 close to the light emitting device layer 11. Since the first inorganic film layer 121 is bent, the first surface 1211 and the second surface 1212 are also bent, and the first surface 1211 is continuous, the second surface 1212 is continuous, and the first surface 1211 and the second surface 1212 are parallel. That is, the first surface 1211 includes a plane parallel to the substrate 10 and a plane perpendicular to the substrate 10, and the second surface 1212 includes a plane parallel to the substrate 10 and a plane perpendicular to the substrate 10. The first stress buffer layer 13 is located on the first surface 1211 or the second surface 1212 of the first inorganic film layer 121.
In the embodiment, the first stress buffer layer 13 is disposed on a portion of the first surface 1211 of the first inorganic film layer 121 to release the stress of the first inorganic film layer 121.
In one embodiment, the first stress buffer layer 13 may cover all of the first surface 1211.
The substrate 10 may include a Thin Film Transistor (TFT) array substrate, and may further include a flexible substrate (e.g., polyimide) under the TFT array substrate. The thin film transistor array substrate includes a plurality of thin film transistors, such as switching thin film transistors, photo thin film transistors, and the like. The thin film transistor may have a top gate structure or a bottom gate structure. The thin film transistor comprises a shading layer, a buffer layer, an active layer, a grid insulating layer, a grid electrode, a source electrode, a drain electrode and an interlayer dielectric layer. The buffer layer covers the shading layer, the active layer is located on the buffer layer, the grid insulating layer is located on the active layer, and the grid electrode is located on the grid insulating layer. The interlayer dielectric layer covers the active layer, the gate insulating layer and the gate electrode. The source electrode and the drain electrode are respectively positioned at two ends of the active layer.
The light emitting device layer 11 includes an organic light emitting diode device layer, and the organic light emitting diode device layer includes an anode, a light emitting function layer, and a cathode sequentially disposed on the substrate 10. The light-emitting functional layer can sequentially comprise a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer and an electron injection layer from bottom to top.
The first inorganic film layer 121 may be SiO2Rigidity of SiN, SiON, metal oxide, etc. with large stressA material. The Encapsulation method of the Encapsulation layer 12 is Thin Film Encapsulation (TFE).
The first stress buffer layer 13 is an air-filled resin. The gas-filled resin includes a resin matrix and gas micropores dispersed in the resin matrix. A large number of gas micropores are dispersed in the resin matrix, have the capacity of absorbing impact load, can release stress and improve the tensile resistance and the impact resistance of the stress buffer layer. The gas micropores are closed micropores, are not easy to absorb moisture and isolate water vapor, and can ensure good water and oxygen barrier performance.
The resin matrix is at least one of acrylic resin, epoxy resin, polycarbonate-based resin, polyvinyl alcohol resin and acid-alcohol polycondensation resin. These resin substrates have high elasticity, high stretchability, and high pressure impact resistance.
Referring to fig. 2, fig. 2 is a schematic structural diagram of a display panel according to a second embodiment of the present invention.
The display panel 200 includes a substrate 20, a light emitting device layer 21 on the substrate 20, an encapsulation layer 23 covering the light emitting device layer 21, and a first stress buffer layer 22. The encapsulation layer 23 includes a first inorganic film layer 231, and the first inorganic film layer 231 has a first surface 2311 distant from the light emitting device layer 21 and a second surface 2312 close to the light emitting device layer 21.
In the embodiment, the first stress buffer layer 22 is located on the second surface 2312 of the first inorganic film 231 to release the stress of the first inorganic film 231. The first stress buffer layer 22 covers all of the second surface 2312 of the first inorganic film 231.
Referring to fig. 3, fig. 3 is a schematic structural diagram of a display panel according to a third embodiment of the present invention.
The display panel 300 includes a substrate 30, a light emitting device layer 31 on the substrate 30, an encapsulation layer 33 covering the light emitting device layer 31, and a first stress buffer layer 32. The encapsulation layer 33 includes a first inorganic film layer 331, and the first inorganic film layer 331 has a first surface 3311 distant from the light emitting device layer 31 and a second surface 3312 close to the light emitting device layer 31.
In the present embodiment, the first stress buffer layer 32 is disposed on the second surface 3312 of the first inorganic film 331 to release the stress of the first inorganic film 331. The first stress buffer layer 32 covers a portion of the second surface 3312 of the first inorganic film layer 331.
Referring to fig. 4, fig. 4 is a schematic structural diagram of a display panel according to a fourth embodiment of the disclosure.
The display panel 400 includes a substrate 40, a light emitting device layer 41 on the substrate 40, an encapsulation layer 42 covering the light emitting device layer 41, and a first stress buffer layer 43. The encapsulation layer 42 includes a first inorganic film layer 423, a second inorganic film layer 421 between the first inorganic film layer 423 and the light emitting device layer 41, and an organic film layer 422 between the second inorganic film layer 421 and the first inorganic film layer 423. That is, the second inorganic film layer 421 covers the light emitting device layer 41, the organic film layer 422 covers the second inorganic film layer 421, and the first inorganic film layer 423 covers the organic film layer 422. The first inorganic film layer 423 has a first surface 4231 distant from the light emitting device layer 41 and a second surface 4232 close to the light emitting device layer 41.
The organic film 422 is made of a flexible film with relatively low stress, such as acrylic resin, epoxy resin, polyolefin resin, and the like. The first inorganic film layer 423 and the second inorganic film layer 421 may be SiO2And rigid materials with high stress such as SiN, SiON, and metal oxide. Because the inorganic film layer and the organic film layer 422 have different stresses, when the flexible panel is bent, the stress of the packaging film layer cannot be released, and the regional stress is concentrated, so that film layer separation or film layer fracture is easy to occur between the inorganic film layer and the organic film layer 422, the packaging failure is caused, and the defects of darkening display, black spots and the like are caused.
In order to prevent the problem of film separation or film breakage between the TFE inorganic layer and the TFE organic layer when the flexible panel is bent, a stress buffer layer is additionally arranged on the TFE film layer. In the process of buckling, the stress buffer layer can disperse the buckling stress, reduce the stress that the TFE rete received, also can reduce the stress of the inorganic rete of TFE, and then reduce the deformation difference of inorganic rete and organic rete 422 to prevent the inorganic layer of TFE and organic layer separation fracture, improve the encapsulation effect and the life-span of flexible OLED panel.
Specifically, in the present embodiment, the first stress buffer layer 43 is located on the first surface 4231 of the first inorganic film 423 to release the stress of the first inorganic film 423. The first stress buffer layer 43 covers a portion of the first surface 4231 of the first inorganic film 423.
In one embodiment, the first stress buffer layer 43 may cover all of the first surface 4231 of the first inorganic film layer 423.
Referring to fig. 5, fig. 5 is a schematic structural diagram of a display panel according to a fifth embodiment of the present invention.
The display panel 500 includes a substrate 50, a light emitting device layer 51 on the substrate 50, an encapsulation layer 52 covering the light emitting device layer 51, and a first stress buffer layer 53. The encapsulation layer 52 includes a first inorganic film layer 521, an organic film layer 522 covering the first inorganic film layer 521, and a second inorganic film layer 523 covering the second inorganic film layer 421. The first inorganic film layer 521 has a first surface 5211 distant from the light emitting device layer 51 and a second surface 5212 close to the light emitting device layer 51.
In the embodiment, the first stress buffer layer 53 is located on the first surface 5211 of the first inorganic film 521 to release the stress of the first inorganic film 521. The organic film 522 covers the first stress buffer layer 53 and the first inorganic film 521, i.e., the first stress buffer layer 53 may also be disposed between the inorganic film and the organic film 522, and may absorb the stress of the TFE inorganic film.
In one embodiment, the first stress buffer layer 53 may cover all of the first surface 5211.
Referring to fig. 6, fig. 6 is a schematic structural diagram of a display panel according to a sixth embodiment of the present invention.
The display panel 600 includes a substrate 60, a light emitting device layer 61 on the substrate 60, an encapsulation layer 62 covering the light emitting device layer 61, and a first stress buffer layer 63. The encapsulation layer 62 includes a first inorganic film layer 621, an organic film layer 622 covering the first inorganic film layer 621, and a second inorganic film layer 623 covering the second inorganic film layer 523. The first inorganic film layer 621 has a first surface 6211 remote from the light emitting device layer 61 and a second surface 6212 close to the light emitting device layer 61.
In this embodiment, the first stress buffer layer 63 is located on the first surface 6211 of the first inorganic film 621 to release the stress of the first inorganic film 621. The organic film 622 covers the first stress buffer layer 63 and the first inorganic film 621.
In one embodiment, the first stress buffer layer 63 may cover all of the first surface 6211 of the first inorganic film layer 621.
The second inorganic film layer 623 has a third surface 6231 distal from the light emitting device layer 61 and a fourth surface 6232 proximal to the light emitting device layer 61. The display panel 600 further includes: a second stress buffer layer 64 located on the third surface 6231 or the fourth surface 6232 of the second inorganic film layer 623. The second stress buffer layer 64 is also an aerated resin that includes a resin matrix and gas micro-pores dispersed in the resin matrix.
In this embodiment, the second stress buffer layer 64 is located on the third surface 6231 of the second inorganic film layer 623 to release the stress of the second inorganic film layer 623. The first stress buffer layer 63 and the second stress buffer layer 64 can reduce the stress applied to the encapsulation layer 62, and also can reduce the stress of the inorganic film (including the first inorganic film 621 and the second inorganic film 623), thereby reducing the deformation difference between the inorganic film and the organic film 622, preventing the inorganic film and the organic film 622 from being separated and broken, and improving the encapsulation effect and the service life of the display panel 600.
Referring to fig. 7, fig. 7 is a schematic structural diagram of a display panel according to a seventh embodiment of the disclosure.
The display panel 700 includes a substrate 70, a light emitting device layer 71 on the substrate 70, an encapsulation layer 72 covering the light emitting device layer 71, and a first stress buffer layer 73. The encapsulation layer 72 includes a first inorganic film layer 721, an organic film layer 722 covering the first inorganic film layer 721, and a second inorganic film layer 723 covering the second inorganic film layer 623. The first inorganic film layer 721 has a first surface 7211 distant from the light emitting device layer 71 and a second surface 7212 close to the light emitting device layer 71. The second inorganic film layer 723 has a third surface 7231 distal to the light emitting device layer 71 and a fourth surface 7232 proximal to the light emitting device layer 71.
In the embodiment, the first stress buffer layer 73 is disposed on the second surface 7212 of the first inorganic film 721 to release or reduce the stress of the first inorganic film 721. The first inorganic film layer 721 covers the first stress buffer layer 73 and the light emitting device layer 71.
In one embodiment, the first stress buffer layer 73 may be located on all of the second surface 7212 of the first inorganic film layer 721.
The display panel 700 further includes: a second stress buffer layer 74 on the fourth surface 7232 of the second inorganic film layer 723. The second stress buffer layer 74 is also an aerated resin that includes a resin matrix and gas micro-pores dispersed in the resin matrix.
In the display panel provided by the embodiment of the invention, the stress buffer layer is formed on the first surface or the second surface of the first inorganic film layer and/or the third surface or the fourth surface of the second inorganic film layer. Therefore, in the bending process of the display panel, the stress buffer layer can disperse the bending stress, reduce the stress of the packaging layer or the inorganic film layer, improve the packaging effect and prolong the service life. When the packaging layer is laminated by the inorganic film layer and the organic film layer, the deformation difference of the inorganic film layer and the organic film layer can be reduced by reducing stress, so that the organic film layer and the inorganic film layer are prevented from being separated and broken, the packaging effect of the flexible display panel is improved, and the service life of the flexible display panel is prolonged.
Referring to fig. 8, fig. 8 is a schematic flow chart illustrating a method for manufacturing a display panel according to an embodiment of the invention. The method of manufacturing the display panel includes the following steps S1-S4. In this embodiment, a method for manufacturing the display panel 100 is described by taking the display panel 100 in fig. 1 as an example.
Step S1: a substrate 10 is formed.
Step S2: a light emitting device layer 11 is formed on the substrate 10.
Step S3: forming an encapsulation layer 12 covering the light emitting device layer 11, the encapsulation layer 12 including a first inorganic film layer 121, the first inorganic film layer 121 having a first surface 1211 distant from the light emitting device layer 11 and a second surface 1212 close to the light emitting device layer 11.
In one embodiment, the encapsulation layer 12 may further include a second inorganic film layer and an organic film layer.
The inorganic film layer in the encapsulation layer 12 may be formed by a Chemical Vapor Deposition (CVD), Physical Vapor Deposition (PVD), or Atomic Layer Deposition (ALD) process. The organic film layer in the encapsulation layer 12 can be fabricated by an inkjet printing process.
Step S4: forming a first stress buffer layer 13, wherein the first stress buffer layer 13 is located on the first surface 1211 or the second surface 1212 of the first inorganic film layer 121.
The first stress buffer layer 13 is an inflatable resin including a resin matrix and gas pores dispersed in the resin matrix. Not only the resin matrix can disperse and release stress, but also the gas micropores can further absorb the dispersed stress, better disperse bending stress and reduce the stress on the TFE film layer.
The method for forming the first stress buffer layer 13 can be made by ink-jet printing, coating, blade coating, spraying and other processes. For example, when the first stress buffer layer 13 is formed on the first surface 1211, the first stress buffer layer 13 may be directly formed on the first inorganic film layer 121 by any method. When the first stress buffer layer 13 is formed on the second surface 1212, the first stress buffer layer 13 may be formed on the surface of the light emitting device layer 11 by any one of the methods described above.
Among them, the method for preparing the inflation type resin may adopt a physical method or a chemical method. The physical method can keep the gas micropores (generated by stirring) stable by filling inert gases (such as nitrogen, argon, carbon dioxide and the like) and surfactants and the like when mechanically stirring the resin matrix or the resin prepolymer or the resin monomer at a high speed. Or the inflatable resin can be formed by doping and dispersing hollow nano microspheres in a resin matrix, a resin prepolymer or a resin monomer. The chemical method may dope a foaming agent (such as azo compounds, hydrazide compounds, nitroso compounds, amine compounds, etc.) in a resin matrix, and form gas pores by using a chemical reaction between components to form the inflatable resin.
According to the preparation method of the display panel, provided by the embodiment of the invention, the inflatable resin is prepared by a physical method or a chemical method, and the stress buffer layer is prepared by adopting the processes of ink-jet printing, coating, blade coating, spraying and the like, so that the stress of the packaging layer is reduced, the packaging effect of the display panel can be improved, and the service life of the display panel can be prolonged.
The above description of the embodiments is only for helping understanding the technical solution of the present invention and its core idea; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A display panel, comprising:
a substrate;
a light emitting device layer on the substrate;
an encapsulation layer covering the light emitting device layer, the encapsulation layer including a first inorganic film layer having a first surface distal from the light emitting device layer and a second surface proximal to the light emitting device layer;
the first stress buffer layer is positioned on the first surface or the second surface of the first inorganic film layer.
2. The display panel according to claim 1, wherein the first stress buffer layer is an air-filled resin.
3. The display panel according to claim 2, wherein the gas-filled resin comprises a resin matrix and gas fine pores dispersed in the resin matrix, and the resin matrix is at least one of an acrylic resin, an epoxy resin, a polycarbonate-based resin, a polyvinyl alcohol-based resin, and an acid alcohol polycondensation-based resin.
4. The display panel of claim 1, wherein the encapsulation layer further comprises:
a second inorganic film layer between the first inorganic film layer and the light emitting device layer;
and the organic film layer is positioned between the second inorganic film layer and the first inorganic film layer.
5. The display panel according to claim 4, wherein the second inorganic film layer has a third surface distant from the light-emitting device layer and a fourth surface close to the light-emitting device layer; the display panel further includes:
and the second stress buffer layer is positioned on the third surface or the fourth surface of the second inorganic film layer.
6. The display panel of claim 1, wherein the encapsulation layer further comprises:
an organic film layer covering the first inorganic film layer;
and a second inorganic film layer covering the organic film layer.
7. The display panel of claim 1, wherein the substrate comprises a thin film transistor array substrate.
8. The display panel according to claim 1, wherein the light emitting device layer comprises an organic light emitting diode device layer including an anode, a light emitting functional layer, and a cathode sequentially on the substrate.
9. A method for manufacturing a display panel, comprising:
forming a substrate;
forming a light emitting device layer on the substrate;
forming an encapsulation layer covering the light emitting device layer, the encapsulation layer comprising a first inorganic film layer having a first surface distal from the light emitting device layer and a second surface proximal to the light emitting device layer;
forming a first stress buffer layer on the first surface or the second surface of the first inorganic film layer.
10. The method for manufacturing a display panel according to claim 9, wherein the first stress buffer layer is an inflation type resin comprising a resin matrix and gas fine pores dispersed in the resin matrix; the step of forming the first stress buffer layer includes:
stirring the resin matrix, and filling inert gas and surfactant while stirring;
or hollow nano microspheres are doped in the resin matrix;
or the resin matrix is doped with foaming agent, and the gas micropores are formed by chemical reaction.
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