CN101867023A - Packaging method for organic light-emitting diode display - Google Patents
Packaging method for organic light-emitting diode display Download PDFInfo
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- CN101867023A CN101867023A CN201010116663A CN201010116663A CN101867023A CN 101867023 A CN101867023 A CN 101867023A CN 201010116663 A CN201010116663 A CN 201010116663A CN 201010116663 A CN201010116663 A CN 201010116663A CN 101867023 A CN101867023 A CN 101867023A
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Abstract
The invention discloses a packaging method for an organic light-emitting diode (OLED) display. A rear cover of the organic light-emitting diode display also comprises at least one ring of continuous bumps surrounding the light emitting region at the periphery of the light emitting region; and a water-absorbing protection layer covers the surface of each pixel display region of a substrate. The method comprises the following steps of: coating a packaging adhesive at the periphery of the light emitting region of the rear cover, wherein the packaging adhesive surrounds the light emitting region and completely covers the at least one ring of bumps surrounding the light emitting region; aligning and pressing the rear cover coated with the packaging adhesive and the substrate; and curing the packaging adhesive. By using the rear cover provided with bumps at the periphery of the light emitting region, the required adhesive strength between the rear cover and the substrate can be ensured, the distance between the rear cover and the substrate can be greatly reduced, and the capability of the OLED of preventing the penetration of vapor and oxygen can be enhanced; and the vapor penetrated into the OLED can be adsorbed by further covering a transparent water-absorbing protection layer on the pixel display region, so that the organic functional layer is protected.
Description
Technical field
The present invention relates to a kind of electronic apparatus technical field, particularly relate to a kind of method for packing of display of organic electroluminescence.
Background technology
Display of organic electroluminescence (OLED, Organic Light-Emitting Diode) is present emerging a kind of flat-panel monitor, since OLED have active illuminating, contrast height, can slimming, wide, the low-power consumption of response speed fast, no visual angle restriction, operating temperature range, shock resistance is strong and can the flexibility demonstration etc. plurality of advantages, be acknowledged as the main force of display of future generation.
The typical structure of existing OLED as shown in Figure 1, comprise: base plate glass 1, be deposited on the anode 2 on the base plate glass 1, cover the organic function layer 3 on the anode 2, be positioned at the negative electrode 4 on the organic function layer 3, the bonnet 6 corresponding with base plate glass 1 is attached to the drier 5 of bonnet 6 on negative electrode 4 one side luminous zones, and the packaging plastic 7 that is positioned at glass substrate 1 and bonnet 6 contact positions.
Lost efficacy easily because the luminous organic material in the organic function layer 3 is met steam oxygen,,, prolonged the useful life of OLED so that reduce of the damage of steam oxygen to organic function layer so must add bonnet 6 and drier 5 encapsulates.
Even but using bonnet and drier, the steam oxygen that still has considerable dosage penetrates in the OLED, damages organic function layer.Be still a difficult problem that needs to be resolved hurrily at present the useful life that how to prolong OLED.
Summary of the invention
The method for packing that the purpose of this invention is to provide a kind of OLED is to prolong the useful life of OLED.
The invention provides a kind of method for packing of display of organic electroluminescence, the bonnet of described display of organic electroluminescence is formed with the luminous zone corresponding with the pixel display area matrix on the substrate towards the one side of substrate, and described bonnet also comprises the continuous projection of at least one circle of surrounding described luminous zone in periphery, described luminous zone; Each pixel display area surface coverage at substrate has the suction protective layer; Then described method comprises:
At the peripheral coating in the luminous zone of bonnet packaging plastic; Also complete covering is protruding around at least one circle of described luminous zone around described luminous zone for described packaging plastic;
To scribble the bonnet of packaging plastic and substrate contraposition, pressing, and solidify described packaging plastic.
Preferably, if described bonnet can also comprise the groove between described luminous zone and described projection, then before described coating packaging plastic, also comprise: in described groove, load drier.
Concrete, described groove can be continuously or discrete distribution.
Preferably, the degree of depth of described groove is not more than half of bonnet thickness of glass.
Preferably, the height of described projection can be 5～100 μ m, and width is 5～200 μ m.
Preferably, the distance between described projection and the substrate can be 0.1～2 μ m.
Preferably, described coating packaging plastic, bonnet and substrate contraposition, pressing and cure package glue are all finished in inert atmosphere.
Preferably, the pressure of the inert atmosphere in described pressing and the cure package glue process can be 0.1～20Torr.
Concrete, the material of described suction protective layer can be the organic chelate of aluminium, iron and/or zinc.
Concrete, described organic chelate is Alq3, Znq2.
Preferably, the thickness of described suction protective layer is 10～500nm.
The method for packing of OLED of the present invention, by using the peripheral bonnet that forms projection in the luminous zone, can guarantee bonding strength required between bonnet and the substrate, and significantly reduce distance between bonnet and the substrate, strengthen the ability that OLED stops that steam oxygen infiltrates, by further on pixel display area, covering the transparent water-absorbing protective layer, can adsorb the steam that has penetrated OLED inside, the protection organic function layer, and the suction manufacturing method of protective layer that increases is simple, can not cause bigger influence, effectively prolong the useful life of OLED production cycle and cost; Owing to do not need at bonnet luminous zone attaching drier, therefore do not need on bonnet luminous zone etching to be used to attach the depressed area of drier, can strengthen the mechanical strength of bonnet on the one hand, simplify manufacturing process, on the other hand, when encapsulation OLED, can save the process that attaches drier, package speed is faster.
Description of drawings
Fig. 1 is the typical section schematic diagram of existing OLED;
Fig. 2 is the schematic cross-section of OLED of the present invention;
Fig. 3 is the elevational schematic view of back cover glass of the present invention before cutting;
Fig. 4 is the enlarged diagram at I place among Fig. 3;
Fig. 5 is the enlarged diagram at K place among Fig. 2;
Fig. 6 is the schematic cross-section of an embodiment of bonnet of the present invention;
Fig. 7 is the schematic cross-section of another embodiment of bonnet of the present invention;
Fig. 8 is to use the schematic cross-section of the OLED of bonnet among Fig. 7;
Fig. 9 is the schematic flow sheet of OLED method for packing of the present invention.
Embodiment
For above-mentioned purpose of the present invention, feature and advantage can be become apparent more, the embodiment of the invention is described in further detail below in conjunction with the drawings and specific embodiments.
The inventor is through discovering: the steam oxygen that penetrates in the OLED mainly is to infiltrate by packaging plastic, and and bonnet and substrate between distance dependent: distance is big more, and the speed that steam oxygen infiltrates is just fast more, and the life-span of OLED is just short more.But consider the bond strength of bonnet and substrate, the thickness of packaging plastic can not be thin excessively.The present invention is exactly the method for packing that a kind of OLED will be provided; can be under the prerequisite of the bond strength that guarantees bonnet and substrate; significantly reduce the distance of bonnet and substrate; stop the infiltration of steam oxygen; and the pixel display area on the further protective substrate of use suction protective layer, the useful life of prolongation OLED.
Embodiment one
Present embodiment is introduced the structure of OLED of the present invention earlier.
Fig. 2 is the schematic cross-section of OLED of the present invention.The invention provides a kind of OLED, as shown in Figure 2, described OLED comprises: substrate 10, bonnet 20, packaging plastic 30.
Be formed with pixel display area matrix on the substrate 10; Each pixel display area in the described pixel display area matrix comprises transparent anode 101, organic function layer 102 and the negative electrode 103 that is deposited on successively on the substrate 10.In each pixel display area surface coverage suction protective layer 40 is arranged; If what select for use when preparation substrate 10 is special-purpose electro-conductive glass, the anode that the ITO of pre-deposition on the then described electro-conductive glass (Indium Tin Oxide, tin indium oxide) coating can be used as OLED uses.
Please be simultaneously referring to Fig. 3, Fig. 4, wherein, Fig. 3 is the elevational schematic view of bonnet of the present invention, Fig. 4 is the enlarged diagram at I place among Fig. 3, also can regard the schematic diagram of a bonnet as.
The height of projection 202 can be 5～100 μ m on the bonnet 20, and width can be 5～200 μ m.
When bonnet 20 during with substrate 10 involutions, because packaging plastic 30 can be embedded into the sunk area between the projection 202, make that packaging plastic has certain thickness between bonnet 20 and the substrate 10, guaranteed the intensity that both are bonding.Projection 202 can reach 0.1～2 μ m with distance between the substrate 10, and projection 202 is continuous one whole circle encirclement luminous zones 201, therefore, can significantly strengthen the blocking capability to steam oxygen, prolongs the useful life of OLED thus.
It is shown in Figure 5 trapezoidal that described protruding 202 cross section preferably is, and this structure is easier to packaging plastic 30 and is embedded into sunk area between the projection 202, guarantees bonding strength.The cross section pattern that the concentration of etching liquid that can be by control etching projection 202 and time are controlled projection 202.Described etching liquid is the acid solution that contains fluorine ion, and concentration is 10%～40%, and etch period is 1～20 minute.
The cross section of 201 peripheries, luminous zone also can be as shown in Figure 6, and is equal with projection 202 in the bonnet glass height of protruding 202 peripheries.Because packaging plastic 30 just can reach required bonding strength and height at protruding 202 places, therefore the bonnet glass structure of protruding 202 peripheries does not influence the effect that encapsulation back OLED stops steam oxygen.
In addition, because the ability that the OLED opposing steam oxygen that uses described bonnet encapsulation to form infiltrates improves greatly, can not attach drier in the luminous zone, therefore described bonnet also is fit to the OLED of top light emitting and lighting at two sides; Simultaneously, in the process of bonnet processing, can save on bonnet etching and be used to attach the depressed area (referring to Fig. 1, the about 0.2mm of the described depressed area degree of depth) of drier (can be the solid block that calcium oxide, barium monoxide or its composition etc. form), manufacturing process is simpler.Use the OLED life-span of described bonnet can reach 3～5 years, be significantly increased with respect to 100～200 days that have OLED now.
To requiring higher OLED useful life, can also between the luminous zone 201 of bonnet 20 and projection 202, form groove 203, described groove 203 is between described luminous zone 201 and a circle projection 202 adjacent with described luminous zone 201.The bonnet cross section that has formed groove 203 is filled with drier 204 (referring to Fig. 8) as shown in Figure 7 in the groove 203, be preferably liquid drier.Groove 203 can continuous distribution, promptly 201 forms a complete circle around the luminous zone, also can discrete distribution.
Consider the mechanical strength of bonnet 20, more excellent, the degree of depth of groove 203 is not more than half of bonnet thickness of glass.The degree of depth of groove 203 can be 0.1～0.4mm, and width can be 0.1～10mm, is advisable can use syringe needle filling liquid drier.
The bonnet 20 that has described groove 203, therefore the light-permeable because luminous zone 201 is not blocked, still goes for the OLED of top light emitting and lighting at two sides.
Described liquid drier can be at inert gas (as N
2) solidify back and substrate 10 encapsulation under the atmosphere.Can reach more than 10 years the useful life that use has projection and is filled with the OLED that the bonnet encapsulation of the groove of drier forms.
See also Fig. 2; suction protective layer 40 covers anode 101, organic function layer 102 and the negative electrode 103 of each pixel display area; suction protective layer 40 adopts the transparent water-absorbing material; for example; the material of suction protective layer 40 can be the organic chelate of aluminium, iron and/or zinc etc.; described organic chelate can be Alq3, Znq2 etc., and the substrate 10 that has covered suction protective layer 10 is equally applicable to the OLED device of top light emitting and lighting at two sides.
The thickness of suction protective layer 40 crosses that the thin suction protective effect that rises is just more limited, and thickness is blocked up can to extend manufacture cycle again, and therefore, the thickness of the protective layer 40 that absorbs water is preferably 10～500nm.
Suction protective layer 40 can adopt the mode of vacuum thermal evaporation to deposit in pixel display area.Can select thickness earlier for use is the special-purpose electro-conductive glass of organic electroluminescence device of 0.55mm, be manufactured with organic electroluminescence devices required auxiliary electrode Cr, transparency electrode ITO, insulating barrier PI and insulated column layer RIB with wet etching, after drying is good described electro-conductive glass put into the vacuum coating package system of organic electroluminescence device special use.Elder generation's using plasma is handled conductive glass surface; plate organic function layer 102 again, then plate negative electrode 103, then evaporation suction protective layer 40; vacuum degree during evaporation suction protective layer 40 more than the Torr, enters the package system of 99.999% above purity nitrogen gas at 10E (6) at last.
Embodiment two
Present embodiment is introduced the method for packing of above-mentioned OLED.The bonnet of described OLED is formed with the luminous zone corresponding with the pixel display area matrix on the substrate towards the one side of substrate, and described bonnet also comprises the continuous projection of at least one circle of surrounding described luminous zone in periphery, described luminous zone; Each pixel display area surface coverage at substrate has the suction protective layer.As shown in Figure 9, described method for packing comprises:
S10 is at the peripheral coating in the luminous zone of bonnet packaging plastic; Also complete covering is protruding around at least one circle of described luminous zone around described luminous zone for described packaging plastic.
The height of described projection can be 5～100 μ m, and width is 5～200 μ m.The material of described suction protective layer can for example can be Alq3, Znq2 for the organic chelate of aluminium, iron and/or zinc etc., and the thickness of suction protective layer is preferably 10～500nm.
S20 will scribble the bonnet of packaging plastic and substrate contraposition, pressing, and solidifies described packaging plastic.
Because the bonnet that uses among the present invention has continuous projection in the periphery, luminous zone; after packaging plastic is to substrate and bonnet encapsulation; sunk area between the projection makes packaging plastic have the bonding strength that enough thickness guarantees substrate and bonnet; and the distance between projection and the substrate can reach 0.1～2 μ m; strengthen OLED and stopped the ability that steam oxygen infiltrates; and; by further on pixel display area, covering the transparent water-absorbing protective layer; can adsorb the steam that has penetrated OLED inside; the protection organic function layer; and the suction manufacturing method of protective layer that increases is simple; therefore can not cause bigger influence, effectively prolong the useful life of OLED, not need on bonnet luminous zone etching to be used to attach the depressed area of drier production cycle and cost; can strengthen the bonnet mechanical strength on the one hand; simplify manufacturing process, on the other hand, when encapsulation OLED; can save the process that attaches drier, package speed is faster.
To requiring higher OLED useful life, described bonnet can also comprise the groove between described luminous zone and described projection, described groove is between a described luminous zone and adjacent with a described luminous zone circle projection, then described method is before described coating packaging plastic, can also comprise step: load drier in described groove, described drier is preferably liquid drier.Described liquid drier can be at inert gas (as N
2) solidify under the atmosphere.
Described groove is continuously or discrete distribution, and the degree of depth of described groove is not more than the bonnet thickness of glass half, and the degree of depth of groove can be 0.1～0.4mm, and width can be 0.1～10mm, is advisable can use syringe needle filling liquid drier.
After the encapsulation, the distance between described projection and the substrate can reach 0.1～2 μ m, and the OLED that can make bonnet have described projection has the ability that stops that well steam oxygen infiltrates, and prolongs the useful life of OLED.
Above-mentioned coating packaging plastic, bonnet and substrate contraposition, pressing and cure package glue are all finished in inert atmosphere.The pressure of the inert atmosphere in described pressing and the cure package glue process is 0.1～20Torr.
Detailed operating process can be with reference to following content:
1) bonnet is carried out import in the glove box of high pure nitrogen environment behind the cleaning, drying, in the groove of bonnet, put liquid drier, and liquid drier is carried out hot curing.At the peripheral coating in each luminous zone of bonnet packaging plastic, also complete covering is around at least one circle projection of described luminous zone around each luminous zone to guarantee described packaging plastic then, and this packaging plastic does not need pad.
2) will have the substrate that the liquid drier of curing and point go up the bonnet of packaging plastic and deposit anode, organic function layer and negative electrode and be sent to simultaneously in the encapsulation cavity, the encapsulation cavity is the environment of high pure nitrogen, has very low steam oxygen content.Bonnet and substrate are carried out contraposition, afterwards the encapsulation cavity is vacuumized.When pressure drops to 0.1～20Torr scope, bonnet and substrate are carried out pressing, and packaging plastic is carried out UV curing and hot curing (70～80 ℃).Herein, employed pressure is different from the 500Torr of prior art when bonnet and substrate are carried out pressing, thus, can not make and leave over too much N in the OLED
2, avoid causing quick-fried the dashing of packaging plastic not reach minimum with projection and substrate distance, in bonnet and substrate pressing process, can further compress the atmosphere in the OLED, make that the pressure after the pressing can be a bit larger tham an atmospheric pressure, avoid in OLED, forming negative pressure.
The method for packing of OLED of the present invention, by using the peripheral bonnet that forms projection in the luminous zone, can guarantee bonding strength required between bonnet and the substrate, and significantly reduce distance between bonnet and the substrate, strengthen the ability that OLED stops that steam oxygen infiltrates, by further on pixel display area, covering the transparent water-absorbing protective layer, can adsorb the steam that has penetrated OLED inside, the protection organic function layer, and the suction manufacturing method of protective layer that increases is simple, can not cause bigger influence, effectively prolong the useful life of OLED production cycle and cost; Owing to do not need at bonnet luminous zone attaching drier, therefore do not need on bonnet luminous zone etching to be used to attach the depressed area of drier, can strengthen the mechanical strength of bonnet on the one hand, simplify manufacturing process, on the other hand, when encapsulation OLED, can save the process that attaches drier, package speed is faster.
Need to prove, in this article, relational terms such as first and second grades only is used for an entity or operation are made a distinction with another entity or operation, and not necessarily requires or hint and have the relation of any this reality or in proper order between these entities or the operation.And, term " comprises ", " comprising " or its any other variant are intended to contain comprising of nonexcludability, thereby make and comprise that process, method, article or the equipment of a series of key elements not only comprise those key elements, but also comprise other key elements of clearly not listing, or also be included as this process, method, article or equipment intrinsic key element.Do not having under the situation of more restrictions, the key element that limits by statement " comprising ... ", and be not precluded within process, method, article or the equipment that comprises described key element and also have other identical element.
The above is preferred embodiment of the present invention only, is not to be used to limit protection scope of the present invention.All any modifications of being done within the spirit and principles in the present invention, be equal to replacement, improvement etc., all be included in protection scope of the present invention.
Claims (11)
1. the method for packing of a display of organic electroluminescence, it is characterized in that, the bonnet of described display of organic electroluminescence is formed with the luminous zone corresponding with the pixel display area matrix on the substrate towards the one side of substrate, and described bonnet also comprises the continuous projection of at least one circle of surrounding described luminous zone in periphery, described luminous zone; Each pixel display area surface coverage at substrate has the suction protective layer; Then described method comprises:
At the peripheral coating in the luminous zone of bonnet packaging plastic; Also complete covering is protruding around at least one circle of described luminous zone around described luminous zone for described packaging plastic;
To scribble the bonnet of packaging plastic and substrate contraposition, pressing, and solidify described packaging plastic.
2. method for packing as claimed in claim 1 is characterized in that, if described bonnet also comprises the groove between described luminous zone and described projection, then before described coating packaging plastic, also comprises: load drier in described groove.
3. method for packing as claimed in claim 2 is characterized in that, described groove is continuously or discrete distribution.
4. method for packing as claimed in claim 2 is characterized in that the degree of depth of described groove is not more than half of bonnet thickness of glass.
5. as each described method for packing of claim 1-4, it is characterized in that the height of described projection is 5～100 μ m, width is 5～200 μ m.
6. as each described method for packing of claim 1-4, it is characterized in that the distance between described projection and the substrate is 0.1～2 μ m.
7. as each described method for packing of claim 1-4, it is characterized in that, described coating packaging plastic, bonnet and substrate contraposition, pressing and cure package glue are all finished in inert atmosphere.
8. method for packing as claimed in claim 7 is characterized in that, the pressure of the inert atmosphere in described pressing and the cure package glue process is 0.1～20Torr.
9. as each described method for packing of claim 1-4, it is characterized in that the material of described suction protective layer is the organic chelate of aluminium, iron and/or zinc.
10. as each described method for packing of claim 1-4, it is characterized in that described organic chelate is Alq3, Znq2.
11. as each described method for packing of claim 1-4, the thickness of described suction protective layer is 10～500nm.
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| CN201010116663A CN101867023A (en) | 2010-02-26 | 2010-02-26 | Packaging method for organic light-emitting diode display |
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| CN201010116663A CN101867023A (en) | 2010-02-26 | 2010-02-26 | Packaging method for organic light-emitting diode display |
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| CN105261712A (en) * | 2015-08-31 | 2016-01-20 | 上海和辉光电有限公司 | Flexible OLED display panel |
| WO2016086538A1 (en) * | 2014-12-02 | 2016-06-09 | 深圳市华星光电技术有限公司 | Oled encapsulation structure and oled encapsulation method |
| CN106025092A (en) * | 2016-07-19 | 2016-10-12 | 京东方科技集团股份有限公司 | Organic electroluminescent device, preparation method thereof and displaying device |
| WO2016165238A1 (en) * | 2015-04-17 | 2016-10-20 | 京东方科技集团股份有限公司 | Oled substrate, manufacturing method therefor, and display device |
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Application publication date: 20101020 |