CN1200464C - Method for packaging electroluminescence element - Google Patents
Method for packaging electroluminescence element Download PDFInfo
- Publication number
- CN1200464C CN1200464C CNB01124254XA CN01124254A CN1200464C CN 1200464 C CN1200464 C CN 1200464C CN B01124254X A CNB01124254X A CN B01124254XA CN 01124254 A CN01124254 A CN 01124254A CN 1200464 C CN1200464 C CN 1200464C
- Authority
- CN
- China
- Prior art keywords
- vacuum chamber
- plate
- electroluminescent cell
- glass substrate
- packaging part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The present invention relates to a method for packaging electroluminescence elements. The present invention provides a glass basal plate with electroluminescence elements and a corresponding glass cover plate in water and oxygen control environment, and the cover plate is coated with frame glue in frame positions corresponding to the electroluminescence elements on the basal plate. The peripheries of the electroluminescence elements are not provided with a reserved opening on one side of a circuit, and secondly, the cover plate and the basal plate are pressed and combined, and the frame glue is solidified. The electroluminescence elements are cut to be separated to form individual packaging members which are put into a vacuum chamber for pumping air then. When pressure in the vacuum chamber achieve a set value, the packaging members are socked in a glue groove at the bottom of the vacuum chamber to make the opening of each packaging member in contact with packaging materials. Then, the pressure in the vacuum chamber is raised, and the packaging materials are filled in a cavity due to the internal and external pressure difference of the packaging members, and then the packaging materials in the cavity are solidified to complete the packaging of the electroluminescence elements.
Description
Technical field
The invention relates to a kind of electroluminescence (Electro-Luminescent, the EL) method for packing of element, and particularly relevant for a kind of organic electroluminescent (Organic Electro-Luminescent, OEL) method for packing of element.
Background technology
The research and development of organic electroluminescent start from generation nineteen sixty, and organic electroluminescent device is to adopt organic compound as the luminescent layer material, and it is clipped between metal electrode and the following transparent anode.According to the kind of organic material can be divided into the micromolecule light-emitting diode (Organic Light-Emitting Diode, OLED) and polymer LED (Polymer Light-Emitting Diode, PLED).At the initial stage in the 1980's, Kodak utilizes three-(8-hydroxyl quinoline) aluminium (Tri-(8-Hydroxyquinoline) Aluminum, Alq
3) as organic luminous layer, and between luminescent layer and anode, insert hole injection layer (Hole Injecting Layer), to improve joint efficiency again, established the practicality of organic illuminating element.Nineteen ninety, univ cambridge uk utilized poly-contraposition phenyl ethene (Poly (p-Phenylene Vinylene), PPV) macromolecule conjugated polymer (Conjugated Polymer) is made the macromolecule Organic Light Emitting Diode, because poly-contraposition phenyl ethene (PPV) material has similar semi-conductive characteristic and polymer LED (PLED) technology is simple, therefore caused the Organic Light Emitting Diode research boom of second ripple.Organic electroluminescent has characteristics such as self-luminous, wide viewing angle (reaching 160 degree), high answer speed, low driving voltage, full color, but practicability at present, can be applicable to the color plane display element, for example small-sized display floater, outdoor display board, computer and video screen etc.
The technical development of organic electroluminescent LED, by employed organic material, can probably divide into micromolecule and polymer LED two big classes, the operating efficiency of its element and life-span, except depending on organic material characteristic, technological parameter and process environments control, good encapsulation is the important key of holding element performance especially.With regard to technological standpoint, all reached business-like level on synthetic at material at present, the technique research and development; Yet, therefore make organic electroluminescent LED only can reach the scale of experiment or test manufacture, so can't produce in a large number owing to there is no quick and effective encapsulation technology at present.
Organic membrane material in the organic electroluminescent device is all very sensitive for aqueous vapor and oxygen, is because aqueous vapor and oxygen can cause the organic membrane material to worsen, and then influences the useful life of organic electroluminescent device.In order effectively to get rid of of the influence of factors such as aqueous vapor, oxygen to organic electroluminescent device, prolong the useful life of element, therefore must encapsulate organic electroluminescent device.
Please refer to Figure 1A to Figure 1B, is the method for packing of known a kind of organic electroluminescent LED, the generalized section of its manufacture craft.Shown in Figure 1A, the glass substrate 100 that contains organic electroluminescent diode 102 at first is provided, again with point gum machine with ultraviolet optical cement (being UV glue) 104 coat on the glass substrate 100, the bezel locations of organic electroluminescent LED 102.Refer again to Figure 1B, use glass cover-plate 106 to cover organic electroluminescent LED 102, and by ultraviolet optical cement 104 and glass substrate 100 pressings, again with ultraviolet light (UV) irradiation packaging part, ultraviolet optical cement 104 is solidified, finish the encapsulation of organic electroluminescent LED 102.
Secondly, please refer to Fig. 2 A to Fig. 2 B, is the method for packing of known another kind of organic electroluminescent LED, the generalized section of its manufacture craft.Shown in Fig. 2 A, at first stamping forming crown cap 206 is placed on the tool (not being shown among the figure), with point gum machine ultraviolet optical cement 204 is coated the edge of crown cap 206, and moisture absorption layer (Moisture Absorption Sheet) 208 is disposed in the crown cap 206.And the location of crown cap 206 in the tool, corresponding to the position of desiring potted element on the glass substrate.Refer again to Fig. 2 B, the glass substrate 200 that will contain organic electroluminescent diode 202 covers crown cap 206 tops, and by the edge pressing of ultraviolet optical cement 204 with crown cap 206, again with the UV-irradiation packaging part, ultraviolet optical cement 204 is solidified, finish the encapsulation of organic electroluminescent LED 202.
Aforementioned these two kinds of packaged types are applied to a large amount of production and there is no difficulty.But, only there is no method and effectively intercept extraneous aqueous vapor and oxygen with the locational ultraviolet optical cement of element frame, therefore can't reduce aqueous vapor, oxygen etc. to light-emitting component quality, Effect on Performance.And, the ultraviolet optical cement that the desire utilization is positioned at the element frame completely cuts off extraneous aqueous vapor and oxygen, and reach good packaging effect, must make and be malleation (promptly greater than atmospheric pressure) in the element, for example charge into high-purity nitrogen at element internal, but this is for technology and be not easy to realize, and can increase processing step, reduces production efficiency, and causes that product percent of pass is bad, cost of manufacture rises.
Referring again to Fig. 3 A to Fig. 3 B, be the method for packing of known another organic electroluminescent LED, the generalized section of its manufacture craft.As shown in Figure 3A, the glass substrate 300 that contains organic electroluminescent diode 302 at first is provided, and the epoxy resin (Epoxy Resin) 304 that will be generally called AB glue with point gum machine is coated the whole surface of each organic electroluminescent LED 302 on the glass substrate 300 again.Refer again to Fig. 3 B, use glass cover-plate 306 to cover organic electroluminescent LED 302, and, make epoxy resin 304 air-sets again, finish the encapsulation of organic electroluminescent LED 302 by epoxy resin 304 and glass substrate 300 pressings.
Yet above-mentioned this packaged type, to whole epoxy resin coating of organic electroluminescent LED, though better packaging effect is arranged, whole epoxy resin coating, the difficult control of its uniformity of gluing, and its difficulty is arranged on producing in batches.In addition, when glass substrate and glass cover-plate or crown cap pressing, be easy to generate the glue phenomenon of overflowing at whole gluing of element, cause light-emitting component to be covered by glue with the circuit that outside other element is connected, cause encapsulation back light-emitting component normally to use, cause production efficiency reduction, not good, the cost of manufacture rising of product percent of pass.And when the cover glass cover plate, between epoxy resin and glass cover-plate, produce bubble easily, still can cause bad influence to light-emitting component.
Summary of the invention
Therefore the invention provides a kind of method for packing of electroluminescent cell, can effectively intercept extraneous aqueous vapor and oxygen, prevent that it from causing negative effects such as light-emitting component deterioration and performance reduction.Moreover, this kind method can be carried out fast and effectively encapsulation light-emitting component, enhance productivity and product percent of pass, and reduction cost of manufacture, make it reach mass-produced scale, and can prevent between cover plate and substrate to take place to overflow and produce bubble etc. between glue and cover plate and encapsulating material light-emitting component is produced harmful effect.And this kind method for packing can be applicable to the encapsulation such as organic electroluminescent devices such as Organic Light Emitting Diodes, is a kind of encapsulation technology that can produce organic electroluminescent LED in a large number.
According to above-mentioned and other purpose of the present invention, a kind of method for packing of electroluminescent cell is proposed, in water, the controlled environment of oxygen concentration, glass substrate and corresponding glass cover-plate with electroluminescent cell at first are provided, on the cover board the bezel locations corresponding to each light-emitting component on the substrate is coated with frame glue, and does not have the side reservation opening of circuit at the light-emitting component periphery; Then with cover plate and substrate pressing and make the frame adhesive curing; Again substrate is cut, each light-emitting component is separated, form other packaging part; Then packaging part is inserted in the vacuum chamber and bleed, when pressure reaches set point in the vacuum chamber, packaging part is immersed in the glue groove of vacuum chamber bottom, allow the opening of packaging part contact with encapsulating material; Again pressure in the vacuum chamber is raise, make encapsulating material fill cavity,, finish the encapsulation of light-emitting component again with the encapsulation material solidifies in the cavity because of the pressure difference inside and outside the packaging part.
Description of drawings
Figure 1A to Figure 1B is the generalized section of known a kind of organic electroluminescent LED packaging technology;
Fig. 2 A to Fig. 2 B is the generalized section of known another kind of organic electroluminescent LED packaging technology;
Fig. 3 A to Fig. 3 B is the generalized section of known another organic electroluminescent LED packaging technology;
Fig. 4 is according to the first embodiment of the present invention, a kind of flow chart of method for packing of electroluminescent cell;
Fig. 5 A to Fig. 5 H is according to the first embodiment of the present invention, a kind of packaging technology schematic diagram of electroluminescent cell;
Fig. 6 is the generalized section that contains the glass substrate of organic electroluminescent diode;
Fig. 7 is according to the second embodiment of the present invention, a kind of flow chart of method for packing of large-area electroluminescent element;
Fig. 8 A to Fig. 8 F is according to the second embodiment of the present invention, and a kind of large tracts of land electricity causes the packaging technology schematic diagram of sending out element.
Description of reference numerals:
100,200,300,500,500a, 600,800: glass substrate
102,202,302: organic electroluminescent LED
104,204: the ultraviolet optical cement
106,306,504,504a, 804: glass cover-plate
206: crown cap
208: moisture absorption layer
304: epoxy resin
400～414: the encapsulation step of electroluminescent cell
502,802: electroluminescent cell
506,806: bezel locations
508,808: frame glue
510,810: spacer
512,812: opening
514,814: circuit
516,816: packaging part
518,818: cavity
520,820: vacuum chamber
522,822: the glue groove
524,524a, 824,824a: encapsulating material
530,830: water oxygen controls environment
602: the indium oxide layer of tin
604: the organic membrane material
606: metal electrode layer
610: hole injection layer
612: hole transmission layer
614: luminescent layer
616: electron transfer layer
700～710: the encapsulation step of large-area electroluminescent element
Embodiment
Please refer to Fig. 4, is according to the first embodiment of the present invention, a kind of flow chart of method for packing of electroluminescent cell.Fig. 5 A to Fig. 5 H is according to the first embodiment of the present invention, a kind of schematic diagram of manufacture craft of method for packing of electroluminescent cell.And the step 400 among Fig. 4～414 are corresponding with Fig. 5 A to Fig. 5 H respectively.
Shown in the step 400 among Fig. 4, and please refer to Fig. 5 A, at first in aqueous vapor, the controlled environment of oxygen concentration 530 times, for example be at water, oxygen concentration is less than under 1,000,000/(1ppm) the environment, this kind controls environment and comprises glove box (Dry Box) etc., glass substrate 500 with electroluminescent cell 502 and the glass cover-plate 504 corresponding with glass substrate 500 are provided then, and the 506 coating frame glue 508 of the bezel locations on glass cover-plate 504, and, promptly be not coated with frame glue in opening 512 positions do not have the side reservation opening 512 of circuit corresponding to each electroluminescent cell 502.
Fig. 5 A comprises the vertical view of glass cover-plate 504 and glass substrate 500 and the generalized section of subregion, wherein each bezel locations 506 on the glass cover-plate 504 corresponds respectively to each electroluminescent cell 502 on the glass substrate 500, and containing spacer (Spacer) 510 in the frame glue 508, the material of frame glue 508 then comprises thermohardening type glue (for example AB glue), ultraviolet curing type glue (for example UV glue) etc.
Secondly, please be simultaneously with reference to the step 402 among Fig. 4 and Fig. 5 B (the subregional generalized section of cover plate and substrate pressing rear portion), in the environment 530 of control water, oxygen concentration, with scribbling the glass cover-plate 504 and glass substrate 500 pressings of frame glue 508, make electroluminescent cell 502 between frame glue 508, glass substrate 500 and glass cover-plate 504 with electroluminescent cell 502.Its center glue 508 is in order to junction of glass substrate 500 and glass cover-plate 504, and with light-emitting component 502 sealings, 510 of wherein contained spacers are to be used for controlling the spacing (Gap) that glass substrate 500 engages with glass cover-plate 504.And when coating frame glue 508, mix spacer 510 at frame glue 508, the distance that can make 504 of glass substrate 500 and glass cover-plates is a fixed value.
Then, please refer to step 404 and Fig. 5 C (the subregional generalized section in frame adhesive curing rear portion) of Fig. 4, control environment 530 times, after glass cover-plate 504 and glass substrate 500 pressings, frame glue 508 is solidified at water, oxygen.If the material of frame glue 508 is a ultraviolet curing type glue,, frame glue 508 is solidified then with UV-irradiation; If the material of frame glue 508 is a thermohardening type glue, then must cooperate ultraviolet curing type glue and irradiating ultraviolet light, earlier the relative position of glass substrate 500 and glass cover-plate 504 is located, making material again is frame glue 508 curing of thermohardening type glue, for example carries out heat roasting (Curing) and makes the thermohardening type adhesive curing or allow the air-set of thermohardening type glue.
Then, carry out the step 406 of Fig. 4 and with reference to Fig. 5 D (vertical view after cover plate and the substrate pressing), in water, the controlled environment 530 of oxygen concentration, with after the pressing and engage glass substrate 500 and the glass cover-plate 504 that has solidified with frame glue 508, distribution according to each electroluminescent cell 502 on the glass substrate 500 and corresponding bezel locations 506 thereof is cut, and the dotted line among Fig. 5 D is wherein a kind of cutting mode.
Carry out again among Fig. 4 step 408 and with reference to Fig. 5 E (vertical view of packaging part and profile), under aqueous vapor, the controlled environment of oxygen concentration, glass substrate 500 and glass cover-plate 504 are after cutting, pressing the distribution of the bezel locations 506 of each electroluminescent cell 502 and correspondence thereof separates it individually, for example use the sliver machine separately with each light-emitting component, and reserve the externally required circuit 514 of electrical connection of each electroluminescent cell 502, form separately independently packaging part 516.And comprise element glass substrate 500a, frame glue 508 and element glass cover-plate 504a in each packaging part 516, and by cavity 518 that it constituted with electroluminescent cell 502.
Please refer to step 410 and Fig. 5 F among Fig. 4, vacuum chamber 520 is provided, and dispose glue groove 522, encapsulating material 524 then is housed in the glue groove 522, and encapsulating material 524 comprises ultraviolet curing type glue or thermohardening type glue etc. in its bottom.In water, oxygen control environment, each packaging part 516 after the cutting is separately inserted in the vacuum chamber 520.When therefore vacuum chamber 520 being carried out vacuum suction, simultaneously the packaging part 516 that is positioned at vacuum chamber 520 and encapsulating material 524 etc. are carried out vacuum exhaust, this moment packaging part 516 opening 512 towards glue groove 522, but do not contact with encapsulating material 524 in the glue groove 522.
Simultaneously with reference to the step 412 among Fig. 4 and Fig. 5 G, when the vacuum degree in the vacuum chamber 520 reaches the pressure that sets, for example less than 1 atmospheric pressure, with the height reduction of packaging part 516, its opening 512 is immersed in the glue groove 522, and contact to carry out encapsulating with encapsulating material 524 surfaces.Because the cause of capillarity, the encapsulating material 524 in the glue groove 522 can be inhaled in the cavity 518 of packaging part 516 from opening 512.Then, with dry gas (for example: high-purity nitrogen) allow pressure rise in the importing vacuum chamber 520, for example pressure is risen to atmospheric pressure state or be about 1 atmospheric pressure, make encapsulating material 524 continue to inject and be full of the interior cavity 518 of packaging part 516 because of the inside and outside pressure differences of packaging part 516, cover electroluminescent cell 502 wherein fully, therefore can not produce bubble among the component package material 524a in cavity 518, prevent the quality and the life-span of aeration light-emitting component.
Then, shown in the step 414 among Fig. 4, and, after filling up component package material 524a in the cavity 518 of packaging part 516, component package material 524a is solidified, finish the encapsulation of electroluminescent cell with reference to Fig. 5 H.If the material that component package material 524a uses is ultraviolet curing type glue, then make its curing with UV-irradiation; If the material that uses of component package material 524a is thermohardening type glue, then can carry out heat and bake and make its curing, perhaps make its air-set.
Electricity proposed by the invention causes the method for packing of sending out element, also can be applicable to the large tracts of land electricity and causes the encapsulation of sending out element.Please refer to Fig. 7, is according to the second embodiment of the present invention, a kind of flow chart of method for packing of large-area electroluminescent element.Fig. 8 A to Fig. 8 F is according to the second embodiment of the present invention, a kind of manufacture craft schematic diagram of method for packing of large-area electroluminescent element.Similar with first embodiment, the step 700 among Fig. 7～710 are corresponding with Fig. 8 A to Fig. 8 F respectively.
Shown in the step 700 among Fig. 7, and please refer to Fig. 8 A, identical with first embodiment, aqueous vapor, the controlled environment of oxygen concentration 830 times, glass substrate 800 and corresponding glass cover-plate 804 are provided, and have single large-area electroluminescent element 802 on the glass substrate 800, its periphery has the required circuit of external connection 814.Then on glass cover-plate 804, corresponding to the bezel locations 806 of electroluminescent cell 802, coating contains the frame glue 808 of spacer 810, and, promptly be not coated with frame glue in opening 812 positions do not have the side reservation opening 812 of circuit corresponding to electroluminescent cell 802.And electroluminescent cell 802 comprises organic electroluminescent device, organic electroluminescent LED for example shown in Figure 6 etc.
Secondly, please be simultaneously with reference to the step 702 among Fig. 7 and Fig. 8 B (generalized section after cover plate and the substrate pressing), in the environment 830 of control water, oxygen concentration, with glass cover-plate 804 and glass substrate 800 pressings, make electroluminescent cell 802 between frame glue 808, glass substrate 800 and glass cover-plate 804.Frame glue 808 is in order to junction of glass substrate 800 and glass cover-plate 804, and with light-emitting component 802 sealings, its contained spacer 810 is the spacings that are used for controlling glass substrate 800 and glass cover-plate 804, is a fixed value.
Then, please refer to step 704 and Fig. 8 C (generalized section after the frame adhesive curing) of Fig. 7, control environment 830 times, the frame glue 808 that is positioned at 800 of glass cover-plate 804 and glass substrates is solidified at water, oxygen.If frame glue is ultraviolet curing type glue, then make its curing with UV-irradiation; As frame glue is thermohardening type glue, then must cooperate ultraviolet curing type glue and irradiating ultraviolet light, and earlier with the relative position location of glass substrate and glass cover-plate, mode roasting with heat again or air-set makes the frame adhesive curing.There is single electricity to cause an element 802 because 804 of glass substrate 800 and glass cover-plates only seal, therefore do not need to cut and the sliver step, can finish independently packaging part 816.
Refer again to step 706 and Fig. 8 D among Fig. 7, similar with the step 410 of first embodiment, provide the bottom to have the vacuum chamber 820 of glue groove 822, encapsulating material 824 then is housed in the glue groove 822.In water, oxygen control environment, one or several packaging parts 816 are placed in the vacuum chamber 820, and make its opening 812, but do not contact with wherein encapsulating material 824 towards glue groove 822.
Then, please refer to step 708 and Fig. 8 E among Fig. 7, when reaching setting pressure in the vacuum chamber 820, packaging part 816 is immersed glue grooves 822, opening 812 is contacted with encapsulating material 824 carry out encapsulating, encapsulating material 824 is inhaled in the cavity 818 because of capillarity.Again dry gas is imported in the vacuum chamber 820, make encapsulating material 824 be full of its cavity 818, and cover electroluminescent cell 802 fully because of packaging part 816 inside and outside pressure differences continue to inject.
Shown in the step 710 among Fig. 7, and, after filling up component package material 824a in the cavity 818, it is solidified, finish the encapsulation of electroluminescent cell with reference to Fig. 8 F.Similar with step 704, if component package material 824a is a ultraviolet curing type glue, then make its curing with UV-irradiation; As component package material 824a is thermohardening type glue, can carry out then that heat is roasting to make its curing, perhaps makes its air-set.
By the above embodiments as can be known, the method for packing of electroluminescent cell proposed by the invention, can be applicable to the electroluminescent cell of different area, and be under aqueous vapor and the controlled environment of oxygen concentration, to carry out, therefore can effectively intercept aqueous vapor and oxygen, prevent that it from influencing light-emitting component quality and performance.And in frame glue, mix spacer and control the glue amount, can increase uniformity of gluing, the spacing of glass cover-plate and glass substrate is fixed, and produce the glue that overflows when preventing glass substrate and glass cover-plate pressing, avoid light-emitting component to be covered by glue with the circuit that the outside is connected.
Secondly, the present invention produces pressure difference make the packaging part of light-emitting component with vacuum chamber and encapsulating material inside and outside, encapsulating material is imported in the cavity of packaging part covering luminous element fully, has good packaging effect, and can prevent to produce in the encapsulating material bubble, avoid its quality that influences light-emitting component and life-span, improve reliability of products.Moreover, in vacuum chamber, can insert the packaging part of a plurality of light-emitting components simultaneously, and these packaging parts are carried out encapsulating, therefore using the present invention can carry out fast and effectively encapsulation light-emitting component, enhance productivity and product percent of pass, and the reduction cost of manufacture, make can reach the batch process scale such as elements such as organic electroluminescent LEDs.
Though the present invention with the embodiment explanation as above; right its is not in order to qualification the present invention, any person skilled in the art, without departing from the spirit and scope of the present invention; when can being used for a variety of modifications and variations, so protection scope of the present invention is as the criterion with claims.
Claims (12)
1. the method for packing of an electroluminescent cell is characterized by: comprise the following steps: at least
In a water, oxygen control environment, a glass substrate and a glass cover-plate are provided, this glass cover-plate is corresponding with this glass substrate, and this glass substrate has a plurality of electroluminescent cells;
In this water, oxygen controled environment, a plurality of bezel locations were coated with a frame glue respectively on this glass cover-plate, and this bezel locations is corresponding one by one with this electroluminescent cell, and each of this frame glue has an opening respectively;
In this water, oxygen control environment, make this frame glue between this glass cover-plate and this glass substrate, with this glass cover-plate and this glass substrate pressing, and make this electroluminescent cell between this glass cover-plate and this glass substrate;
In this water, oxygen control environment, make this frame adhesive curing;
In this water, oxygen control environment,, this glass cover-plate and this glass substrate are cut according to the distribution of this electroluminescent cell;
In this water, oxygen control environment, cut this glass cover-plate and this glass substrate, with this electroluminescent cell each separately, form independently a plurality of separately packaging parts, and each of this packaging part comprises one of them of an element glass substrate, this electroluminescent cell, one of them and an element glass cover-plate of this frame glue, and constitutes a cavity by one of them of this element glass cover-plate, this element glass substrate and this frame glue;
One vacuum chamber is provided, dispose a glue groove in the bottom of this vacuum chamber, in this glue groove an encapsulating material is housed, and this packaging part is inserted in this vacuum chamber, this opening that makes this frame glue of each in this packaging part is towards this glue groove, and this packaging part does not contact with this encapsulating material;
This vacuum chamber is carried out vacuum suction, make this packaging part and this encapsulating material vacuum exhaust;
When this vacuum chamber reaches one when setting vacuum degree, this packaging part is immersed in this glue groove, this opening of this frame glue of each in this packaging part is contacted with this encapsulating material carry out encapsulating;
Make this vacuum chamber pressure rise to one and set pressure, this encapsulating material is injected by this opening of this frame glue of each in this packaging part respectively and be full of this cavity, form an element encapsulating material and cover this electroluminescent cell fully; And
Make each this component package material cured.
2. the method for packing of electroluminescent cell as claimed in claim 1 is characterized by: the water that this water, oxygen control environment, oxygen concentration less than 1,000,000/.
3. the method for packing of electroluminescent cell as claimed in claim 1 is characterized by: when being coated with this frame glue, be mixed with a plurality of spacers in this frame glue.
4. the method for packing of electroluminescent cell as claimed in claim 1 is characterized by: when carrying out encapsulating, this of this vacuum chamber set vacuum degree less than 1 atmospheric pressure.
5. the method for packing of electroluminescent cell as claimed in claim 1 is characterized by: the method that this vacuum chamber pressure is risen comprises dry gas is imported this vacuum chamber.
6. the method for packing of electroluminescent cell as claimed in claim 1, it is characterized by: this setting pressure is 1 atmospheric pressure.
7. the method for packing of an electroluminescent cell is characterized by: comprise the following steps: at least
In a water, oxygen control environment, a glass substrate and a glass cover-plate are provided, this glass cover-plate is corresponding with this glass substrate, and this glass substrate has an electroluminescent cell;
In this water, oxygen controled environment, the frame position on this glass cover-plate was coated with a frame glue, and this bezel locations is corresponding with this electroluminescent cell, and this frame glue has an opening;
In this water, oxygen control environment, make this frame glue between this glass cover-plate and this glass substrate, with this glass cover-plate and this glass substrate pressing, and make this electroluminescent cell between this glass cover-plate and this glass substrate;
In this water, oxygen control environment, make this frame adhesive curing, form a packaging part, and constitute a cavity by this glass cover-plate, this glass substrate and this frame glue;
One vacuum chamber is provided, dispose a glue groove in the bottom of this vacuum chamber, in this glue groove an encapsulating material is housed, and at least one this packaging part is inserted in this vacuum chamber, this opening that makes this frame glue in this packaging part is towards this glue groove, and this packaging part does not contact with this encapsulating material;
This vacuum chamber is carried out vacuum suction, make this packaging part and this encapsulating material vacuum exhaust;
When this vacuum chamber reaches one when setting vacuum degree, this packaging part is immersed in this glue groove, this opening of this frame glue in this packaging part is contacted with this encapsulating material carry out encapsulating;
Make this vacuum chamber pressure rise to one and set pressure, this encapsulating material is injected by this opening of this frame glue in this packaging part, and be full of this cavity of this packaging part, form an element encapsulating material and cover this electroluminescent cell in this cavity fully; And
Make this component package material cured.
8. the method for packing of electroluminescent cell as claimed in claim 7 is characterized by: the water that this water, oxygen control environment, oxygen concentration less than 1,000,000/.
9. the method for packing of electroluminescent cell as claimed in claim 7 is characterized by: when being coated with this frame glue, be mixed with a plurality of spacers in this frame glue.
10. the method for packing of electroluminescent cell as claimed in claim 7 is characterized by: when carrying out encapsulating, this of this vacuum chamber set vacuum degree less than 1 atmospheric pressure.
11. the method for packing of electroluminescent cell as claimed in claim 7 is characterized by: the method that this vacuum chamber pressure is risen comprises dry gas is imported this vacuum chamber.
12. the method for packing of electroluminescent cell as claimed in claim 7 is characterized by: this setting pressure is 1 atmospheric pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB01124254XA CN1200464C (en) | 2001-08-20 | 2001-08-20 | Method for packaging electroluminescence element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB01124254XA CN1200464C (en) | 2001-08-20 | 2001-08-20 | Method for packaging electroluminescence element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1405901A CN1405901A (en) | 2003-03-26 |
| CN1200464C true CN1200464C (en) | 2005-05-04 |
Family
ID=4665610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB01124254XA Expired - Fee Related CN1200464C (en) | 2001-08-20 | 2001-08-20 | Method for packaging electroluminescence element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1200464C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015196518A1 (en) * | 2014-06-23 | 2015-12-30 | 深圳市华星光电技术有限公司 | Packaging method and packaging structure for substrate |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005093494A (en) * | 2003-09-12 | 2005-04-07 | Sanyo Electric Co Ltd | Semiconductor device and its manufacturing method |
| CN100445195C (en) * | 2006-01-13 | 2008-12-24 | 中国科学院上海微系统与信息技术研究所 | Low temperature airtightness packaging method for wafer level micro machinery device and photoelectric device |
| CN101030611B (en) * | 2006-03-05 | 2010-05-12 | 浙江古越龙山电子科技发展有限公司 | Large-power light-emitting diodes gluing process |
| CN100407447C (en) * | 2006-03-28 | 2008-07-30 | 中国科学院上海技术物理研究所 | Epoxy-glue packing method for low-temperature infrared detector and special device |
| CN101931058B (en) * | 2010-07-06 | 2013-03-13 | 电子科技大学 | Packaging structure and packaging method of organic electroluminescent device |
| CN103022378B (en) * | 2012-12-17 | 2015-09-09 | 京东方科技集团股份有限公司 | A kind of OLED and method for packing, display unit |
| CN106992260A (en) * | 2017-03-10 | 2017-07-28 | 上海小糸车灯有限公司 | A kind of OLED car lights and its OLED screen mounting structure and installation method |
| CN106920893A (en) * | 2017-03-10 | 2017-07-04 | 上海小糸车灯有限公司 | The bonded structure and installation method of a kind of OLED car lights and its OLED screen body |
| CN114273169A (en) * | 2021-12-24 | 2022-04-05 | 连云港杰瑞电子有限公司 | Vacuum encapsulation method and tool for brick type power module |
-
2001
- 2001-08-20 CN CNB01124254XA patent/CN1200464C/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015196518A1 (en) * | 2014-06-23 | 2015-12-30 | 深圳市华星光电技术有限公司 | Packaging method and packaging structure for substrate |
| CN104022145B (en) * | 2014-06-23 | 2017-01-25 | 深圳市华星光电技术有限公司 | Substrate packaging method and packaging structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1405901A (en) | 2003-03-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6612888B1 (en) | Packaging method of electroluminescence devices | |
| CN1265333C (en) | Luminous diplay panel and its mfg. method | |
| CN1200465C (en) | Packaged structure of display element and its packaging method | |
| CN1681360A (en) | Panel display and manufacture thereof | |
| US20040075115A1 (en) | Encapsulation of "top-emitting" OLED panels | |
| CN105304676A (en) | Flexible organic light-emitting device packaging structure and flexible display device | |
| CN1697578A (en) | Organic electro luminescence device and fabrication method thereof | |
| CN1200464C (en) | Method for packaging electroluminescence element | |
| CN101030617A (en) | Light emitting device package and method of fabricating the same | |
| CN1487779A (en) | Organic electroluminescent display device and producing method thereof | |
| CN1901190A (en) | Side view led with improved arrangement of protection device | |
| CN1652643A (en) | Electro-optical apparatus, manufacturing method thereof, and electronic instrument | |
| EP3706183A1 (en) | Oled packaging method and oled packaging structure | |
| CN1454034A (en) | Organic electroluminescent display device | |
| CN1901221A (en) | Organic light emitting display | |
| CN1694585A (en) | Organic electro-luminescence device and fabrication method thereof | |
| CN101075609A (en) | Structure and method for packing LED chip | |
| CN1832223A (en) | Organic electroluminescence display and method for manufacturing the same | |
| CN1707778A (en) | Glass lid, and package provided with a such a lid, for the encapsulation of electronic components | |
| CN110048018B (en) | Display packaging structure and manufacturing method thereof | |
| CN1214695C (en) | Method for manufacturing electric field lighting display device | |
| CN1643989A (en) | Organic electroluminescence display panel | |
| CN1265472C (en) | Organic light emitting diode | |
| CN107565050A (en) | Organic light-emitting diode packaging structure, electronic installation and method for packing | |
| CN1822731A (en) | Packaging structure of two-side organic electroluminescence module and packaging method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |