JP2008181502A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2008181502A5 JP2008181502A5 JP2007334250A JP2007334250A JP2008181502A5 JP 2008181502 A5 JP2008181502 A5 JP 2008181502A5 JP 2007334250 A JP2007334250 A JP 2007334250A JP 2007334250 A JP2007334250 A JP 2007334250A JP 2008181502 A5 JP2008181502 A5 JP 2008181502A5
- Authority
- JP
- Japan
- Prior art keywords
- conductive film
- dielectric
- chip
- capacitor
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 claims 4
- 239000004065 semiconductor Substances 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007334250A JP5111094B2 (ja) | 2006-12-27 | 2007-12-26 | 半導体装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006351402 | 2006-12-27 | ||
| JP2006351402 | 2006-12-27 | ||
| JP2007334250A JP5111094B2 (ja) | 2006-12-27 | 2007-12-26 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008181502A JP2008181502A (ja) | 2008-08-07 |
| JP2008181502A5 true JP2008181502A5 (enExample) | 2011-01-20 |
| JP5111094B2 JP5111094B2 (ja) | 2012-12-26 |
Family
ID=39725322
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007334250A Expired - Fee Related JP5111094B2 (ja) | 2006-12-27 | 2007-12-26 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5111094B2 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1962408B1 (en) * | 2006-11-16 | 2015-05-27 | Semiconductor Energy Laboratory Co., Ltd. | Radio field intensity measurement device, and radio field intensity detector and game console using the same |
| WO2010035627A1 (en) * | 2008-09-25 | 2010-04-01 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP4340717B1 (ja) * | 2008-12-08 | 2009-10-07 | 義幸 梶野 | アンテナ装置及びアンテナ装置付きの家具 |
| JP2020005170A (ja) * | 2018-06-29 | 2020-01-09 | 共同印刷株式会社 | 無線装置及び通信方法 |
| JP7565929B2 (ja) * | 2019-01-17 | 2024-10-11 | フライセンス リミテッド | 電子タグ |
| GB202010923D0 (en) | 2020-07-15 | 2020-08-26 | Frisense Ltd | Electronic tag |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08138018A (ja) * | 1994-11-10 | 1996-05-31 | Rikagaku Kenkyusho | データ・キャリア・システム |
| US6107920A (en) * | 1998-06-09 | 2000-08-22 | Motorola, Inc. | Radio frequency identification tag having an article integrated antenna |
| JP2000057287A (ja) * | 1998-08-10 | 2000-02-25 | Sony Corp | 非接触式データキャリア |
| FI112550B (fi) * | 2001-05-31 | 2003-12-15 | Rafsec Oy | Älytarra ja älytarraraina |
| JP2003309490A (ja) * | 2002-04-12 | 2003-10-31 | Yuji Nishi | Rfid装置 |
| JP4236974B2 (ja) * | 2003-03-28 | 2009-03-11 | トッパン・フォームズ株式会社 | 非接触型情報記録媒体 |
| JP2007150868A (ja) * | 2005-11-29 | 2007-06-14 | Renesas Technology Corp | 電子装置およびその製造方法 |
-
2007
- 2007-12-26 JP JP2007334250A patent/JP5111094B2/ja not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2009278078A5 (enExample) | ||
| JP2007072453A5 (enExample) | ||
| JP2011175250A5 (ja) | 半導体装置 | |
| JP2008181502A5 (enExample) | ||
| JP2010003295A5 (enExample) | ||
| JP2008217778A5 (enExample) | ||
| EP2410563A3 (en) | Stacked interconnect heat sink | |
| WO2014131830A3 (de) | Chipkarte mit integrierten aktiven komponenten | |
| JP2015167227A5 (ja) | 電子機器 | |
| WO2011085260A3 (en) | Electronic devices and components for high efficiency power circuits | |
| JP2008197090A5 (enExample) | ||
| JP2012178215A5 (enExample) | ||
| JP2008084307A5 (enExample) | ||
| WO2013085071A3 (en) | Printed circuit board | |
| JP2008218989A5 (enExample) | ||
| JP2011205443A5 (enExample) | ||
| ATE439650T1 (de) | Schliessung mit rfid-einrichtung | |
| JP2012256852A5 (ja) | 半導体装置 | |
| JP2012256314A5 (enExample) | ||
| JP2008182214A5 (enExample) | ||
| CN106463489A (zh) | Tsv连接的背侧去耦 | |
| FI20095844A7 (fi) | Elektroniikkalaite | |
| KR102523641B1 (ko) | 입력 샘플링 커패시터를 포함하는 비교 회로 및 그것을 포함하는 이미지 센서 | |
| JP2008181495A5 (enExample) | ||
| RU2010102782A (ru) | Электрический модуль памяти с радиаторами |