JP2008181502A5 - - Google Patents

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Publication number
JP2008181502A5
JP2008181502A5 JP2007334250A JP2007334250A JP2008181502A5 JP 2008181502 A5 JP2008181502 A5 JP 2008181502A5 JP 2007334250 A JP2007334250 A JP 2007334250A JP 2007334250 A JP2007334250 A JP 2007334250A JP 2008181502 A5 JP2008181502 A5 JP 2008181502A5
Authority
JP
Japan
Prior art keywords
conductive film
dielectric
chip
capacitor
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007334250A
Other languages
Japanese (ja)
Other versions
JP5111094B2 (en
JP2008181502A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2007334250A priority Critical patent/JP5111094B2/en
Priority claimed from JP2007334250A external-priority patent/JP5111094B2/en
Publication of JP2008181502A publication Critical patent/JP2008181502A/en
Publication of JP2008181502A5 publication Critical patent/JP2008181502A5/ja
Application granted granted Critical
Publication of JP5111094B2 publication Critical patent/JP5111094B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Claims (5)

Cチップと、
前記ICチップの第1の入出力端子と電気的に接続された第1の導電膜
前記ICチップの第2の入出力端子と電気的に接続された第2の導電膜と
前記第1の導電膜と第1の誘電体を介して第1の容量を形成する第3の導電膜と、
前記第2の導電膜と第2の誘電体を介して第2の容量を形成する第4の導電膜と、を有し
前記第3の導電膜と前記第4の導電膜とはアンテナとして機能し、
前記ICチップは、前記第1の容量または前記第2の容量を介して外部とデータの送受信を行うことを特徴とする半導体装置。
IC chip,
A first conductive film which is the first output terminal electrically connected to said IC chip,
A second conductive film electrically connected to a second input / output terminal of the IC chip ;
A third conductive film forming a first capacitor via the first conductive film and a first dielectric;
A second conductive film and a fourth conductive film that forms a second capacitor through a second dielectric ,
The third conductive film and the fourth conductive film function as an antenna,
The semiconductor device, wherein the IC chip transmits / receives data to / from the outside through the first capacitor or the second capacitor .
請求項1において、In claim 1,
前記第1の誘電体と前記第2の誘電体とは、同一の絶縁膜であることを特徴とする半導体装置。The semiconductor device, wherein the first dielectric and the second dielectric are the same insulating film.
請求項1において、In claim 1,
前記第1の誘電体と前記第2の誘電体とは、前記第3の導電膜及び前記第4の導電膜が設けられた同一の基板であることを特徴とする半導体装置。The semiconductor device, wherein the first dielectric and the second dielectric are the same substrate provided with the third conductive film and the fourth conductive film.
請求項1乃至請求項3のいずれか一項において、In any one of Claims 1 thru | or 3,
前記第3の導電膜と前記第4の導電膜は、同一の導電膜でなることを特徴とする半導体装置。The third conductive film and the fourth conductive film are made of the same conductive film.
請求項1乃至請求項のいずれか一項において、
前記ICチップは、外部から無線で電力の充電が可能なバッテリーを有することを特徴とする半導体装置。
In any one of Claims 1 thru | or 4 ,
The IC chip includes a battery capable of charging power wirelessly from outside.
JP2007334250A 2006-12-27 2007-12-26 Semiconductor device Expired - Fee Related JP5111094B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007334250A JP5111094B2 (en) 2006-12-27 2007-12-26 Semiconductor device

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006351402 2006-12-27
JP2006351402 2006-12-27
JP2007334250A JP5111094B2 (en) 2006-12-27 2007-12-26 Semiconductor device

Publications (3)

Publication Number Publication Date
JP2008181502A JP2008181502A (en) 2008-08-07
JP2008181502A5 true JP2008181502A5 (en) 2011-01-20
JP5111094B2 JP5111094B2 (en) 2012-12-26

Family

ID=39725322

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007334250A Expired - Fee Related JP5111094B2 (en) 2006-12-27 2007-12-26 Semiconductor device

Country Status (1)

Country Link
JP (1) JP5111094B2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8044813B1 (en) * 2006-11-16 2011-10-25 Semiconductor Energy Laboratory Co., Ltd. Radio field intensity measurement device, and radio field intensity detector and game console using the same
WO2010035627A1 (en) * 2008-09-25 2010-04-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP4340717B1 (en) * 2008-12-08 2009-10-07 義幸 梶野 ANTENNA DEVICE AND FURNITURE WITH ANTENNA DEVICE
JP2020005170A (en) * 2018-06-29 2020-01-09 共同印刷株式会社 Wireless device and communication method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08138018A (en) * 1994-11-10 1996-05-31 Rikagaku Kenkyusho Data carrier system
US6107920A (en) * 1998-06-09 2000-08-22 Motorola, Inc. Radio frequency identification tag having an article integrated antenna
JP2000057287A (en) * 1998-08-10 2000-02-25 Sony Corp Noncontact type data carrier
FI112550B (en) * 2001-05-31 2003-12-15 Rafsec Oy Smart label and smart label path
JP2003309490A (en) * 2002-04-12 2003-10-31 Yuji Nishi Rfid device
JP4236974B2 (en) * 2003-03-28 2009-03-11 トッパン・フォームズ株式会社 Non-contact information recording medium
JP2007150868A (en) * 2005-11-29 2007-06-14 Renesas Technology Corp Electronic equipment and method of manufacturing the same

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