JP2008147317A5 - - Google Patents
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- Publication number
- JP2008147317A5 JP2008147317A5 JP2006331245A JP2006331245A JP2008147317A5 JP 2008147317 A5 JP2008147317 A5 JP 2008147317A5 JP 2006331245 A JP2006331245 A JP 2006331245A JP 2006331245 A JP2006331245 A JP 2006331245A JP 2008147317 A5 JP2008147317 A5 JP 2008147317A5
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- electrode
- substrate
- protruding electrode
- alignment protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 31
- 230000002093 peripheral Effects 0.000 claims 7
- 230000000875 corresponding Effects 0.000 claims 6
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 229920001187 thermosetting polymer Polymers 0.000 claims 2
- 238000003825 pressing Methods 0.000 claims 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006331245A JP4889464B2 (ja) | 2006-12-08 | 2006-12-08 | 電子部品の実装方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006331245A JP4889464B2 (ja) | 2006-12-08 | 2006-12-08 | 電子部品の実装方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008147317A JP2008147317A (ja) | 2008-06-26 |
JP2008147317A5 true JP2008147317A5 (de) | 2009-11-05 |
JP4889464B2 JP4889464B2 (ja) | 2012-03-07 |
Family
ID=39607181
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006331245A Expired - Fee Related JP4889464B2 (ja) | 2006-12-08 | 2006-12-08 | 電子部品の実装方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4889464B2 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011165872A (ja) * | 2010-02-09 | 2011-08-25 | Renesas Electronics Corp | Bgaタイプ半導体装置の接続構造 |
JP5481249B2 (ja) | 2010-03-26 | 2014-04-23 | 富士通株式会社 | 半導体装置及びその製造方法 |
JP5927756B2 (ja) * | 2010-12-17 | 2016-06-01 | ソニー株式会社 | 半導体装置及び半導体装置の製造方法 |
WO2014182239A1 (en) * | 2013-05-07 | 2014-11-13 | Smartflex Technology Pte Ltd | Ultra-thin smart card modules with chip bumps disposed in susbtrate via holes and methods of fabricating the same |
EP2819162B1 (de) | 2013-06-24 | 2020-06-17 | IMEC vzw | Verfahren zur Herstellung von Kontaktbereichen auf einem Halbleitersubstrat |
JP2015149314A (ja) * | 2014-02-04 | 2015-08-20 | 富士通株式会社 | 半導体装置及びその製造方法 |
CN109309069A (zh) * | 2018-09-19 | 2019-02-05 | 深圳市心版图科技有限公司 | 焊球阵列封装芯片及其焊接方法 |
JP2021170582A (ja) | 2020-04-15 | 2021-10-28 | 株式会社村田製作所 | 増幅モジュール |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02170444A (ja) * | 1988-12-22 | 1990-07-02 | Matsushita Electric Works Ltd | 半導体素子の実装方法 |
JPH03218039A (ja) * | 1990-01-23 | 1991-09-25 | Sumitomo Electric Ind Ltd | 半導体素子の実装方法 |
JPH04199524A (ja) * | 1990-11-28 | 1992-07-20 | Mitsubishi Electric Corp | 半導体装置 |
JP2715793B2 (ja) * | 1992-03-19 | 1998-02-18 | 日本電気株式会社 | 半導体装置及びその製造方法 |
JPH10256308A (ja) * | 1997-03-06 | 1998-09-25 | Oki Electric Ind Co Ltd | 半導体チップ実装構造及びその実装方法 |
JPH11111772A (ja) * | 1997-10-07 | 1999-04-23 | Matsushita Electric Ind Co Ltd | キャリア基板の実装位置決め方法、キャリア基板および配線基板 |
JPH11163194A (ja) * | 1997-11-26 | 1999-06-18 | Oki Electric Ind Co Ltd | Vlsiパッケージ |
JP2002246512A (ja) * | 2001-02-16 | 2002-08-30 | Nec Corp | Bgaパッケージの構造及び実装基板の構造 |
JP2002373914A (ja) * | 2001-06-15 | 2002-12-26 | Ricoh Co Ltd | 電子部品接続構造体 |
JP2006324577A (ja) * | 2005-05-20 | 2006-11-30 | Matsushita Electric Ind Co Ltd | 半導体装置およびその製造方法 |
-
2006
- 2006-12-08 JP JP2006331245A patent/JP4889464B2/ja not_active Expired - Fee Related
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