JP2009182274A5 - - Google Patents

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Publication number
JP2009182274A5
JP2009182274A5 JP2008022013A JP2008022013A JP2009182274A5 JP 2009182274 A5 JP2009182274 A5 JP 2009182274A5 JP 2008022013 A JP2008022013 A JP 2008022013A JP 2008022013 A JP2008022013 A JP 2008022013A JP 2009182274 A5 JP2009182274 A5 JP 2009182274A5
Authority
JP
Japan
Prior art keywords
insulating resin
resin layer
protruding electrode
wiring layer
metal plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008022013A
Other languages
English (en)
Japanese (ja)
Other versions
JP5028291B2 (ja
JP2009182274A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008022013A priority Critical patent/JP5028291B2/ja
Priority claimed from JP2008022013A external-priority patent/JP5028291B2/ja
Priority to CN2009101346932A priority patent/CN101540299B/zh
Priority to US12/364,084 priority patent/US8309864B2/en
Publication of JP2009182274A publication Critical patent/JP2009182274A/ja
Publication of JP2009182274A5 publication Critical patent/JP2009182274A5/ja
Application granted granted Critical
Publication of JP5028291B2 publication Critical patent/JP5028291B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2008022013A 2008-01-31 2008-01-31 素子搭載用基板、素子搭載用基板の製造方法、半導体モジュールおよび半導体モジュールの製造方法 Active JP5028291B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008022013A JP5028291B2 (ja) 2008-01-31 2008-01-31 素子搭載用基板、素子搭載用基板の製造方法、半導体モジュールおよび半導体モジュールの製造方法
CN2009101346932A CN101540299B (zh) 2008-01-31 2009-02-01 元件搭载用基板、半导体组件及其制造方法及便携式设备
US12/364,084 US8309864B2 (en) 2008-01-31 2009-02-02 Device mounting board and manufacturing method therefor, and semiconductor module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008022013A JP5028291B2 (ja) 2008-01-31 2008-01-31 素子搭載用基板、素子搭載用基板の製造方法、半導体モジュールおよび半導体モジュールの製造方法

Publications (3)

Publication Number Publication Date
JP2009182274A JP2009182274A (ja) 2009-08-13
JP2009182274A5 true JP2009182274A5 (de) 2011-03-10
JP5028291B2 JP5028291B2 (ja) 2012-09-19

Family

ID=41035973

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008022013A Active JP5028291B2 (ja) 2008-01-31 2008-01-31 素子搭載用基板、素子搭載用基板の製造方法、半導体モジュールおよび半導体モジュールの製造方法

Country Status (2)

Country Link
JP (1) JP5028291B2 (de)
CN (1) CN101540299B (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101669534B1 (ko) * 2009-12-07 2016-10-26 해성디에스 주식회사 범프를 구비한 회로기판 및 그 제조 방법
JP5830702B2 (ja) * 2010-04-28 2015-12-09 パナソニックＩｐマネジメント株式会社 回路装置の製造方法
US9398389B2 (en) * 2013-05-13 2016-07-19 Knowles Electronics, Llc Apparatus for securing components in an electret condenser microphone (ECM)
JP7226472B2 (ja) * 2020-05-26 2023-02-21 株式会社村田製作所 部品相互接続要素を備えた電子部品

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5823943B2 (ja) * 1975-07-16 1983-05-18 松下電器産業株式会社 絶縁体の貫通電極形成方法
EP0805614B1 (de) * 1995-11-17 2005-04-13 Kabushiki Kaisha Toshiba Mehrschichtige leiterplatte, vorgefertigtes material für diese leiterplatte, verfahren zur herstellung einer mehrschichtigen leiterplatte, packung elektronischer bauelemente und verfahren zur herstellung vertikaler, elektrisch leitender verbindungen
JP2951882B2 (ja) * 1996-03-06 1999-09-20 松下電器産業株式会社 半導体装置の製造方法及びこれを用いて製造した半導体装置
JP3050807B2 (ja) * 1996-06-19 2000-06-12 イビデン株式会社 多層プリント配線板
JP3769587B2 (ja) * 2000-11-01 2006-04-26 株式会社ノース 配線回路用部材とその製造方法と多層配線回路基板と半導体集積回路装置
JP2004095913A (ja) * 2002-08-30 2004-03-25 Dainippon Printing Co Ltd プリント配線基板及びその製造方法
JP2006310530A (ja) * 2005-04-28 2006-11-09 Sanyo Electric Co Ltd 回路装置およびその製造方法
JP4568215B2 (ja) * 2005-11-30 2010-10-27 三洋電機株式会社 回路装置および回路装置の製造方法

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