JP2011009488A5 - - Google Patents
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- Publication number
- JP2011009488A5 JP2011009488A5 JP2009151832A JP2009151832A JP2011009488A5 JP 2011009488 A5 JP2011009488 A5 JP 2011009488A5 JP 2009151832 A JP2009151832 A JP 2009151832A JP 2009151832 A JP2009151832 A JP 2009151832A JP 2011009488 A5 JP2011009488 A5 JP 2011009488A5
- Authority
- JP
- Japan
- Prior art keywords
- pad
- columnar member
- conductive paste
- wiring board
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009151832A JP5443849B2 (ja) | 2009-06-26 | 2009-06-26 | 半導体装置及びその製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009151832A JP5443849B2 (ja) | 2009-06-26 | 2009-06-26 | 半導体装置及びその製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2011009488A JP2011009488A (ja) | 2011-01-13 |
JP2011009488A5 true JP2011009488A5 (de) | 2012-07-26 |
JP5443849B2 JP5443849B2 (ja) | 2014-03-19 |
Family
ID=43565800
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009151832A Active JP5443849B2 (ja) | 2009-06-26 | 2009-06-26 | 半導体装置及びその製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5443849B2 (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013219170A (ja) * | 2012-04-09 | 2013-10-24 | Yokogawa Electric Corp | 基板装置 |
KR101930689B1 (ko) * | 2012-05-25 | 2018-12-19 | 삼성전자주식회사 | 반도체 장치 |
JP6342794B2 (ja) * | 2014-12-25 | 2018-06-13 | 新光電気工業株式会社 | 配線基板及び配線基板の製造方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6263486A (ja) * | 1985-09-13 | 1987-03-20 | 富士通株式会社 | 混成集積回路の重層構造 |
JP2527562Y2 (ja) * | 1990-09-03 | 1997-03-05 | 富士通テン株式会社 | 基板接続構造 |
JPH0832216A (ja) * | 1994-07-15 | 1996-02-02 | Matsushita Electric Ind Co Ltd | 半田付け方法 |
JPH08195556A (ja) * | 1995-01-13 | 1996-07-30 | Fujitsu Ten Ltd | 回路基板間の接続方法 |
JPH08316629A (ja) * | 1995-05-16 | 1996-11-29 | Nec Shizuoka Ltd | 半田柱によるマルチ・チップ・モジュール基板の 半田付処理方法 |
JP2001267714A (ja) * | 2000-03-16 | 2001-09-28 | Sony Corp | 電子回路装置 |
JP3801902B2 (ja) * | 2001-10-30 | 2006-07-26 | シャープ株式会社 | 積層型半導体装置 |
KR101037229B1 (ko) * | 2006-04-27 | 2011-05-25 | 스미토모 베이클리트 컴퍼니 리미티드 | 반도체 장치 및 반도체 장치의 제조 방법 |
JP5125349B2 (ja) * | 2007-09-21 | 2013-01-23 | カシオ計算機株式会社 | 半導体装置の実装構造および実装方法 |
JP2009073735A (ja) * | 2008-10-31 | 2009-04-09 | Alps Electric Co Ltd | ホルダ付光学素子の製造方法 |
-
2009
- 2009-06-26 JP JP2009151832A patent/JP5443849B2/ja active Active
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