JP2008138061A - 絶縁性高分子材料組成物 - Google Patents
絶縁性高分子材料組成物 Download PDFInfo
- Publication number
- JP2008138061A JP2008138061A JP2006325143A JP2006325143A JP2008138061A JP 2008138061 A JP2008138061 A JP 2008138061A JP 2006325143 A JP2006325143 A JP 2006325143A JP 2006325143 A JP2006325143 A JP 2006325143A JP 2008138061 A JP2008138061 A JP 2008138061A
- Authority
- JP
- Japan
- Prior art keywords
- lignin
- polymer material
- linseed oil
- insulating polymer
- curing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4042—Imines; Imides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
【解決手段】エポキシ化亜麻仁油に硬化剤としてリグニンが混合された後に加熱処理されて硬化して得られた絶縁性高分子材料組成物である。前記リグニンとしては例えばリグニン原料を爆砕した後にアルコール抽出して得られたものが採用される。前記エポキシ亜麻仁油と前記リグニンは例えば前記エポキシ亜麻仁油のエポキシ当量:前記リグニンの水酸基当量=1:1の割合で配合される。前記組成物には硬化促進剤として例えば2−メチル−4−イミダゾールが前記エポキシ亜麻仁油100重量部に対して0.2〜2.0重量部添加される。このとき例えば加熱温度150〜170℃及び加熱時間10〜20時間の条件で硬化される。前記加熱温度は2つの異なる温度領域からなるように設定される場合がある。
【選択図】なし
Description
Claims (5)
- エポキシ化亜麻仁油に硬化剤としてリグニンが混合された後に加熱処理されて硬化して得られた絶縁性高分子材料組成物。
- 前記リグニンはリグニン原料を爆砕した後にアルコール抽出して得られたものであることを特徴とする請求項1記載の絶縁性高分子材料組成物。
- 前記エポキシ亜麻仁油のエポキシ当量:前記リグニンの水酸基当量=1:1の割合いで前記エポキシ亜麻仁油と前記リグニンとが配合されたこと
を特徴とする請求項1または2記載の絶縁性高分子材料組成物。 - 前記エポキシ亜麻仁油100重量部に対して硬化促進剤として2−メチル−4−イミダゾールが0.2〜2.0重量部添加され、加熱温度150〜170℃及び加熱時間10〜20時間の条件で硬化されたこと
を特徴とする請求項3記載の絶縁性高分子材料組成物。 - 前記加熱温度は2つの異なる温度領域からなること
を特徴とする請求項4記載の絶縁性高分子材料組成物。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006325143A JP5315606B2 (ja) | 2006-12-01 | 2006-12-01 | 絶縁性高分子材料組成物 |
US12/440,511 US20090281273A1 (en) | 2006-12-01 | 2007-11-08 | Insulating polymeric-material composition |
DE112007002864T DE112007002864T5 (de) | 2006-12-01 | 2007-11-08 | Isolierende Polymermaterialzusammensetzung |
PCT/JP2007/071697 WO2008065866A1 (fr) | 2006-12-01 | 2007-11-08 | Composition de matière polymère isolante |
TW096144060A TW200835715A (en) | 2006-12-01 | 2007-11-21 | Insulating polymer material composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006325143A JP5315606B2 (ja) | 2006-12-01 | 2006-12-01 | 絶縁性高分子材料組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008138061A true JP2008138061A (ja) | 2008-06-19 |
JP5315606B2 JP5315606B2 (ja) | 2013-10-16 |
Family
ID=39467662
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006325143A Active JP5315606B2 (ja) | 2006-12-01 | 2006-12-01 | 絶縁性高分子材料組成物 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20090281273A1 (ja) |
JP (1) | JP5315606B2 (ja) |
DE (1) | DE112007002864T5 (ja) |
TW (1) | TW200835715A (ja) |
WO (1) | WO2008065866A1 (ja) |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009046646A (ja) * | 2007-07-23 | 2009-03-05 | Panasonic Electric Works Co Ltd | 植物由来組成物とその硬化物 |
JP2010150298A (ja) * | 2008-12-23 | 2010-07-08 | Hitachi Ltd | バイオマス由来エポキシ化合物及びその製造方法 |
JP2010209231A (ja) * | 2009-03-11 | 2010-09-24 | Chubu Electric Power Co Inc | 絶縁性高分子材料組成物 |
JP2010254829A (ja) * | 2009-04-27 | 2010-11-11 | Chubu Electric Power Co Inc | 絶縁性高分子材料組成物 |
JP2010254820A (ja) * | 2009-04-24 | 2010-11-11 | Panasonic Electric Works Co Ltd | 植物由来組成物とその製造方法ならびに成形品 |
JP2011074337A (ja) * | 2009-10-02 | 2011-04-14 | Chubu Electric Power Co Inc | エポキシ樹脂複合材料、及びその製造方法 |
WO2011099544A1 (ja) * | 2010-02-10 | 2011-08-18 | 日立化成工業株式会社 | 樹脂組成物、成形体及び複合成形体 |
JP2011219725A (ja) * | 2010-02-10 | 2011-11-04 | Hitachi Chem Co Ltd | 木質系皮膜 |
JP2011225653A (ja) * | 2010-04-16 | 2011-11-10 | Chubu Electric Power Co Inc | 絶縁性高分子材料組成物及びその製造方法 |
JP2012092282A (ja) * | 2010-09-30 | 2012-05-17 | Hitachi Chemical Co Ltd | 樹脂組成物及び成形体 |
WO2013157424A1 (ja) * | 2012-04-18 | 2013-10-24 | 株式会社 日立製作所 | リグニン由来エポキシ樹脂組成物及びその用途 |
CN104295087A (zh) * | 2014-10-23 | 2015-01-21 | 广西林安木业有限公司 | 建筑模板制作方法 |
CN104295087B (zh) * | 2014-10-23 | 2017-01-04 | 广西林安木业有限公司 | 建筑模板制作方法 |
JP2021505778A (ja) * | 2017-12-11 | 2021-02-18 | サン−ゴバン イゾベール | 鉱物繊維及び結合剤を含む絶縁製品 |
JP7461345B2 (ja) | 2018-10-02 | 2024-04-03 | フェート・エンフェー (フラームス・インステリング・フーア・テクノロジシュ・オンダーゾエク・エンフェー) | エポキシ樹脂の製造方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201219526A (en) * | 2010-11-11 | 2012-05-16 | Ind Tech Res Inst | Adhesive composition |
DE102011016918B4 (de) * | 2011-04-13 | 2018-01-25 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Lösungsmittelfreie Epoxidharzmischung, Verfahren zu deren Herstellung sowie deren Verwendung |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09143305A (ja) * | 1995-09-18 | 1997-06-03 | Internatl Business Mach Corp <Ibm> | 架橋した生物材料およびその使用 |
JP2001514691A (ja) * | 1997-03-07 | 2001-09-11 | デーエルベー、アクチエンゲゼルシャフト | 平面構造物のコーティング層のための重合反応生成物含有材料 |
JP2002504602A (ja) * | 1998-02-27 | 2002-02-12 | バンティコ アクチエンゲゼルシャフト | エポキシ化天然油を含む硬化性組成物 |
JP2003277615A (ja) * | 2002-03-25 | 2003-10-02 | Toshiba Corp | 樹脂組成物 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3329652A (en) * | 1965-02-15 | 1967-07-04 | Shell Oil Co | Process for curing polyepoxides with anhydrides and activators therefor |
TW354451B (en) * | 1995-09-18 | 1999-03-11 | Ibm | Method of fabricating cross-linked biobased materials and structures fabricated therewith a method comprising the step of: forming the mixture of polymer and cross-linked agent |
TW344191B (en) * | 1995-09-18 | 1998-11-01 | Ibm | Cross-linked biobased materials and uses thereof |
US6121398A (en) * | 1997-10-27 | 2000-09-19 | University Of Delaware | High modulus polymers and composites from plant oils |
JP4369642B2 (ja) | 2001-03-29 | 2009-11-25 | 三井化学株式会社 | 電気ケーブル及び高電圧電源用モールド |
JP4961691B2 (ja) * | 2005-07-25 | 2012-06-27 | 株式会社明電舎 | 絶縁性高分子材料硬化物 |
JP4961692B2 (ja) * | 2005-07-25 | 2012-06-27 | 株式会社明電舎 | 碍子 |
JP4304251B2 (ja) * | 2005-09-09 | 2009-07-29 | 独立行政法人産業技術総合研究所 | エポキシ樹脂組成物の製造方法 |
-
2006
- 2006-12-01 JP JP2006325143A patent/JP5315606B2/ja active Active
-
2007
- 2007-11-08 DE DE112007002864T patent/DE112007002864T5/de not_active Withdrawn
- 2007-11-08 US US12/440,511 patent/US20090281273A1/en not_active Abandoned
- 2007-11-08 WO PCT/JP2007/071697 patent/WO2008065866A1/ja active Application Filing
- 2007-11-21 TW TW096144060A patent/TW200835715A/zh unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09143305A (ja) * | 1995-09-18 | 1997-06-03 | Internatl Business Mach Corp <Ibm> | 架橋した生物材料およびその使用 |
JP2001514691A (ja) * | 1997-03-07 | 2001-09-11 | デーエルベー、アクチエンゲゼルシャフト | 平面構造物のコーティング層のための重合反応生成物含有材料 |
JP2002504602A (ja) * | 1998-02-27 | 2002-02-12 | バンティコ アクチエンゲゼルシャフト | エポキシ化天然油を含む硬化性組成物 |
JP2003277615A (ja) * | 2002-03-25 | 2003-10-02 | Toshiba Corp | 樹脂組成物 |
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009046646A (ja) * | 2007-07-23 | 2009-03-05 | Panasonic Electric Works Co Ltd | 植物由来組成物とその硬化物 |
US8232365B2 (en) | 2008-12-23 | 2012-07-31 | Hitachi, Ltd. | Biomass-derived epoxy compound and manufacturing method thereof |
JP2010150298A (ja) * | 2008-12-23 | 2010-07-08 | Hitachi Ltd | バイオマス由来エポキシ化合物及びその製造方法 |
JP2010209231A (ja) * | 2009-03-11 | 2010-09-24 | Chubu Electric Power Co Inc | 絶縁性高分子材料組成物 |
JP2010254820A (ja) * | 2009-04-24 | 2010-11-11 | Panasonic Electric Works Co Ltd | 植物由来組成物とその製造方法ならびに成形品 |
JP2010254829A (ja) * | 2009-04-27 | 2010-11-11 | Chubu Electric Power Co Inc | 絶縁性高分子材料組成物 |
JP2011074337A (ja) * | 2009-10-02 | 2011-04-14 | Chubu Electric Power Co Inc | エポキシ樹脂複合材料、及びその製造方法 |
WO2011099544A1 (ja) * | 2010-02-10 | 2011-08-18 | 日立化成工業株式会社 | 樹脂組成物、成形体及び複合成形体 |
JP2011219725A (ja) * | 2010-02-10 | 2011-11-04 | Hitachi Chem Co Ltd | 木質系皮膜 |
JPWO2011099544A1 (ja) * | 2010-02-10 | 2013-06-13 | 日立化成株式会社 | 樹脂組成物、成形体及び複合成形体 |
JP2011225653A (ja) * | 2010-04-16 | 2011-11-10 | Chubu Electric Power Co Inc | 絶縁性高分子材料組成物及びその製造方法 |
JP2012092282A (ja) * | 2010-09-30 | 2012-05-17 | Hitachi Chemical Co Ltd | 樹脂組成物及び成形体 |
WO2013157424A1 (ja) * | 2012-04-18 | 2013-10-24 | 株式会社 日立製作所 | リグニン由来エポキシ樹脂組成物及びその用途 |
CN104295087A (zh) * | 2014-10-23 | 2015-01-21 | 广西林安木业有限公司 | 建筑模板制作方法 |
CN104295087B (zh) * | 2014-10-23 | 2017-01-04 | 广西林安木业有限公司 | 建筑模板制作方法 |
JP2021505778A (ja) * | 2017-12-11 | 2021-02-18 | サン−ゴバン イゾベール | 鉱物繊維及び結合剤を含む絶縁製品 |
JP7290642B2 (ja) | 2017-12-11 | 2023-06-13 | サン-ゴバン イゾベール | 鉱物繊維及び結合剤を含む絶縁製品 |
US11897999B2 (en) | 2017-12-11 | 2024-02-13 | Saint-Gobain Isover | Insulation product comprising mineral fibers and a binder |
JP7461345B2 (ja) | 2018-10-02 | 2024-04-03 | フェート・エンフェー (フラームス・インステリング・フーア・テクノロジシュ・オンダーゾエク・エンフェー) | エポキシ樹脂の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP5315606B2 (ja) | 2013-10-16 |
US20090281273A1 (en) | 2009-11-12 |
DE112007002864T5 (de) | 2009-12-03 |
TW200835715A (en) | 2008-09-01 |
WO2008065866A1 (fr) | 2008-06-05 |
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