JP2008121097A5 - - Google Patents

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Publication number
JP2008121097A5
JP2008121097A5 JP2006309608A JP2006309608A JP2008121097A5 JP 2008121097 A5 JP2008121097 A5 JP 2008121097A5 JP 2006309608 A JP2006309608 A JP 2006309608A JP 2006309608 A JP2006309608 A JP 2006309608A JP 2008121097 A5 JP2008121097 A5 JP 2008121097A5
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JP
Japan
Prior art keywords
cathode portion
anode
insulating layer
anode plate
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006309608A
Other languages
English (en)
Japanese (ja)
Other versions
JP4820736B2 (ja
JP2008121097A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006309608A priority Critical patent/JP4820736B2/ja
Priority claimed from JP2006309608A external-priority patent/JP4820736B2/ja
Priority to TW096140697A priority patent/TW200825211A/zh
Priority to KR1020070112485A priority patent/KR20080044162A/ko
Priority to CN2007101872661A priority patent/CN101240443B/zh
Publication of JP2008121097A publication Critical patent/JP2008121097A/ja
Publication of JP2008121097A5 publication Critical patent/JP2008121097A5/ja
Application granted granted Critical
Publication of JP4820736B2 publication Critical patent/JP4820736B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2006309608A 2006-11-15 2006-11-15 電解めっき装置及び電解めっき方法並びにめっき治具 Active JP4820736B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006309608A JP4820736B2 (ja) 2006-11-15 2006-11-15 電解めっき装置及び電解めっき方法並びにめっき治具
TW096140697A TW200825211A (en) 2006-11-15 2007-10-30 Electroplating apparatus, electroplating method and plating jig
KR1020070112485A KR20080044162A (ko) 2006-11-15 2007-11-06 전해 도금 장치와 전해 도금 방법 및 도금 지그
CN2007101872661A CN101240443B (zh) 2006-11-15 2007-11-15 电镀装置、电镀方法以及电镀夹具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006309608A JP4820736B2 (ja) 2006-11-15 2006-11-15 電解めっき装置及び電解めっき方法並びにめっき治具

Publications (3)

Publication Number Publication Date
JP2008121097A JP2008121097A (ja) 2008-05-29
JP2008121097A5 true JP2008121097A5 (enrdf_load_stackoverflow) 2009-09-03
JP4820736B2 JP4820736B2 (ja) 2011-11-24

Family

ID=39506168

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006309608A Active JP4820736B2 (ja) 2006-11-15 2006-11-15 電解めっき装置及び電解めっき方法並びにめっき治具

Country Status (4)

Country Link
JP (1) JP4820736B2 (enrdf_load_stackoverflow)
KR (1) KR20080044162A (enrdf_load_stackoverflow)
CN (1) CN101240443B (enrdf_load_stackoverflow)
TW (1) TW200825211A (enrdf_load_stackoverflow)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4164435B2 (ja) * 2003-11-05 2008-10-15 新光電気工業株式会社 電子部品用めっき治具及び電解めっき装置
TWI385605B (zh) * 2009-12-30 2013-02-11 Univ Ishou Applicable to the fuzzy control teaching of the card plating device
CN102337577B (zh) * 2010-07-22 2014-03-12 富葵精密组件(深圳)有限公司 电镀装置
CN102080253B (zh) * 2010-12-23 2012-07-25 北大方正集团有限公司 电镀夹具及印制线路板电镀系统
CN102776551B (zh) * 2012-07-04 2015-11-25 中国电子科技集团公司第四十一研究所 一种硬质微带电路电镀夹具
JP6193005B2 (ja) * 2013-06-14 2017-09-06 Ｋｙｂ株式会社 保持装置及びそれを備えた高速めっき装置
CN103436946A (zh) * 2013-08-01 2013-12-11 黄海 一种自动化电镀系统
CN104711656B (zh) * 2015-03-23 2017-06-06 河南理工大学 一种用于电镀平面薄片件的挂具
TW201720969A (zh) * 2015-12-14 2017-06-16 台灣先進系統股份有限公司 可調控式不溶性陽極板及其應用於銅柱電鍍之方法
JP6709727B2 (ja) * 2016-12-14 2020-06-17 株式会社荏原製作所 電解めっき装置
CN107904632B (zh) * 2017-04-24 2020-05-12 张碧海 一种电镀设备
CN107287626A (zh) * 2017-08-11 2017-10-24 杭州帝洛森科技有限公司 一种防短路的阳极板及应用其的电解装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6890413B2 (en) * 2002-12-11 2005-05-10 International Business Machines Corporation Method and apparatus for controlling local current to achieve uniform plating thickness
JP4164435B2 (ja) * 2003-11-05 2008-10-15 新光電気工業株式会社 電子部品用めっき治具及び電解めっき装置
JP4164443B2 (ja) * 2003-11-26 2008-10-15 新光電気工業株式会社 電子部品用めっき治具及び電解めっき装置
JP2006193806A (ja) * 2005-01-17 2006-07-27 Matsushita Electric Ind Co Ltd めっき電極、めっき治具およびそれを用いた電子部品のめっき方法

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