JP2008103709A - 白色発光ダイオード - Google Patents

白色発光ダイオード Download PDF

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Publication number
JP2008103709A
JP2008103709A JP2007255479A JP2007255479A JP2008103709A JP 2008103709 A JP2008103709 A JP 2008103709A JP 2007255479 A JP2007255479 A JP 2007255479A JP 2007255479 A JP2007255479 A JP 2007255479A JP 2008103709 A JP2008103709 A JP 2008103709A
Authority
JP
Japan
Prior art keywords
light emitting
phosphor
white light
emitting diode
green
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007255479A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008103709A5 (enExample
Inventor
Jong Rak Sohn
ジョンラク ソン
Chul Soo Yoon
チョルス ユン
Chang Hoon Kwak
チャンフン カク
Il Woo Park
イルウ パク
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
Original Assignee
Samsung Electro Mechanics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Publication of JP2008103709A publication Critical patent/JP2008103709A/ja
Publication of JP2008103709A5 publication Critical patent/JP2008103709A5/ja
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/0883—Arsenides; Nitrides; Phosphides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7783—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals one of which being europium
    • C09K11/7784—Chalcogenides
    • C09K11/7786—Chalcogenides with alkaline earth metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7783—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals one of which being europium
    • C09K11/77922—Silicates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7783—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals one of which being europium
    • C09K11/77928—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)
JP2007255479A 2006-10-17 2007-09-28 白色発光ダイオード Pending JP2008103709A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060100719A KR100862695B1 (ko) 2006-10-17 2006-10-17 백색 발광 다이오드

Publications (2)

Publication Number Publication Date
JP2008103709A true JP2008103709A (ja) 2008-05-01
JP2008103709A5 JP2008103709A5 (enExample) 2008-06-19

Family

ID=39302484

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007255479A Pending JP2008103709A (ja) 2006-10-17 2007-09-28 白色発光ダイオード

Country Status (3)

Country Link
US (2) US7999456B2 (enExample)
JP (1) JP2008103709A (enExample)
KR (1) KR100862695B1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013033903A (ja) * 2011-07-29 2013-02-14 Lg Innotek Co Ltd 発光素子パッケージ及びこれを利用した照明システム

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008021662A1 (de) * 2008-04-30 2009-11-05 Ledon Lighting Jennersdorf Gmbh LED mit Mehrband-Leuchtstoffsystem
KR101028304B1 (ko) * 2009-10-15 2011-04-11 엘지이노텍 주식회사 발광 장치
JP5678629B2 (ja) * 2010-02-09 2015-03-04 ソニー株式会社 発光装置の製造方法
JP5398657B2 (ja) * 2010-07-06 2014-01-29 株式会社東芝 発光デバイス
EP2665796A1 (en) * 2011-01-21 2013-11-27 Osram Sylvania Inc. Luminescent converter and led light source containing same
KR20120134375A (ko) * 2011-06-02 2012-12-12 삼성전자주식회사 발광소자 패키지 및 그 제조방법
CN102231418A (zh) * 2011-06-27 2011-11-02 中外合资江苏稳润光电有限公司 高显色指数白光led的制作方法
JP2013062320A (ja) * 2011-09-12 2013-04-04 Olympus Corp 発光装置
US9699422B2 (en) * 2011-10-04 2017-07-04 Prysm, Inc. Composite and other phosphor materials for emitting visible light and applications in generation of visible light including light-emitting screens
US8698407B1 (en) 2011-11-14 2014-04-15 Technical Consumer Products, Inc. Highly integrated non-inductive LED driver
CN103199180B (zh) * 2012-01-09 2016-03-30 诠兴开发科技股份有限公司 用于植物成长的发光二极管
US20130187180A1 (en) * 2012-01-24 2013-07-25 Hsing Chen Light emitting diode for plant growth
JP2014224182A (ja) * 2013-05-15 2014-12-04 株式会社東芝 蛍光体、発光装置、および蛍光体の製造方法
TWI469396B (zh) 2014-07-01 2015-01-11 Unity Opto Technology Co Ltd Applied to the backlight of the LED light-emitting structure
KR101770029B1 (ko) * 2015-09-04 2017-08-21 영남대학교 산학협력단 형광 단백질을 이용한 led 소자용 바이오 조성물, 그 제조 방법 및 이를 이용한 백색 led 소자
CN113903847B (zh) * 2020-07-06 2024-08-09 纬联电子科技(中山)有限公司 发光二极管封装结构及其制作方法与显示装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002531956A (ja) * 1998-11-30 2002-09-24 ゼネラル・エレクトリック・カンパニイ 蛍光体組成物を有する発光デバイス
KR20030060697A (ko) * 2002-01-11 2003-07-16 한국화학연구원 장파장 자외선용 녹색 형광체 및 그의 제조 방법
WO2005055328A1 (ja) * 2003-12-05 2005-06-16 Mitsubishi Denki Kabushiki Kaisha 発光装置及びこれを用いた照明器具
JP2005302988A (ja) * 2004-04-12 2005-10-27 Mitsubishi Electric Corp 発光装置
JP2006049799A (ja) * 2004-04-27 2006-02-16 Matsushita Electric Ind Co Ltd 発光装置
WO2006077740A1 (ja) * 2004-12-28 2006-07-27 Nichia Corporation 窒化物蛍光体及びその製造方法並びに窒化物蛍光体を用いた発光装置
WO2006098450A1 (ja) * 2005-03-18 2006-09-21 Mitsubishi Chemical Corporation 発光装置、白色発光装置、照明装置及び画像表示装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004127988A (ja) * 2002-09-30 2004-04-22 Toyoda Gosei Co Ltd 白色発光装置
US20050264173A1 (en) * 2004-05-28 2005-12-01 Harvatek Corporation White light emitting diode light source and method for manufacturing the same
US20070052342A1 (en) * 2005-09-01 2007-03-08 Sharp Kabushiki Kaisha Light-emitting device
US7804239B2 (en) * 2006-10-17 2010-09-28 Samsung Led Co., Ltd. White light emitting diode

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002531956A (ja) * 1998-11-30 2002-09-24 ゼネラル・エレクトリック・カンパニイ 蛍光体組成物を有する発光デバイス
KR20030060697A (ko) * 2002-01-11 2003-07-16 한국화학연구원 장파장 자외선용 녹색 형광체 및 그의 제조 방법
WO2005055328A1 (ja) * 2003-12-05 2005-06-16 Mitsubishi Denki Kabushiki Kaisha 発光装置及びこれを用いた照明器具
JP2005302988A (ja) * 2004-04-12 2005-10-27 Mitsubishi Electric Corp 発光装置
JP2006049799A (ja) * 2004-04-27 2006-02-16 Matsushita Electric Ind Co Ltd 発光装置
WO2006077740A1 (ja) * 2004-12-28 2006-07-27 Nichia Corporation 窒化物蛍光体及びその製造方法並びに窒化物蛍光体を用いた発光装置
WO2006098450A1 (ja) * 2005-03-18 2006-09-21 Mitsubishi Chemical Corporation 発光装置、白色発光装置、照明装置及び画像表示装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013033903A (ja) * 2011-07-29 2013-02-14 Lg Innotek Co Ltd 発光素子パッケージ及びこれを利用した照明システム

Also Published As

Publication number Publication date
US8378568B2 (en) 2013-02-19
US20080088226A1 (en) 2008-04-17
US20110266584A1 (en) 2011-11-03
US7999456B2 (en) 2011-08-16
KR20080034580A (ko) 2008-04-22
KR100862695B1 (ko) 2008-10-10

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