JP2008098308A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H01L2224/481—Disposition
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- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
- H01L2224/48139—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate with an intermediate bond, e.g. continuous wire daisy chain
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
- H01L2224/48147—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked with an intermediate bond, e.g. continuous wire daisy chain
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L2224/4846—Connecting portions with multiple bonds on the same bonding area
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
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- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
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- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
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Abstract
【解決手段】半導体装置(IGBTモジュール12)は、所定平面の上に配置されたIGBT素子24およびダイオード素子25と、両素子の各々の一面に接合される第1接合部、および第1接合部の長手方向に対して直角方向に延設した第1端子21を有する第1バスバー(入力バスバー)26と、両素子の各々の他面に接合される接続片部を有する第2接合部、および第2接合部の長手方向に対して直角方向であって第1端子とは反対側に延設した第2端子31とを有する第2バスバー(出力バスバー)31とを備える。
【選択図】図1
Description
12 IGBTモジュール
21 入力端子
22 出力端子
24 IGBT素子
25 ダイオード素子
26 入力バスバー
31 出力バスバー
12A,12B IGBTモジュール
121 高圧バスバー
122 出力バスバー
131 低圧バスバー
132 出力バスバー
401 高圧端子
403 低圧端子
405 出力端子
402,404 IGBT素子
409,410 ダイオード素子
Claims (10)
- 所定平面の上に配置された電力用半導体素子および整流用半導体素子と、
前記電力用半導体素子および前記整流用半導体素子の各々の一面に接合される第1接合部、および前記第1接合部の長手方向に対して直角方向に延設した第1端子を有する第1バスバーと、
前記電力用半導体素子および前記整流用半導体素子の各々の他面に接合される接続片部を有する第2接合部、および前記第2接合部の長手方向に対して直角方向であって前記第1端子とは反対側に延設した第2端子とを有する第2バスバーと、
を備えることを特徴とする半導体装置。 - 前記第2バスバーは、前記第2接合部の代わりに、複数のワイヤを用いて前記電力用半導体素子および前記整流用半導体素子と前記第2端子とを接続するようにしたことを特徴とする請求項1記載の半導体装置。
- 前記第1端子と前記第2端子は、それぞれ表面と裏面を有し、前記第1端子の表面と前記第2端子の裏面とが同一平面になるように設けられていることを特徴とする請求項1または2記載の半導体装置。
- 前記第1端子と前記第2端子は、それぞれ表面と裏面を有し、前記第1端子の表面と前記第2端子の裏面とが同一平面に沿って位置しかつ重複部分を有するように設けられていることを特徴とする請求項1または2記載の半導体装置。
- 前記第1バスバーと前記第2バスバーは、平面形状で、共通の長手方向の中心線に対して対称的な形状になるように配置されていることを特徴とする請求項1〜4のいずれか1項に記載の半導体装置。
- 前記整流用半導体素子に比べて前記電力用半導体素子に流れる電流の割合が多くなる半導体装置の駆動を行う場合、前記電力用半導体素子は前記第1バスバーで前記第1端子に対して遠い側に配置され、
前記整流用半導体素子に比べて前記電力用半導体素子に流れる電流の割合が少なくなる半導体装置の駆動を行う場合、前記電力用半導体装置は前記第1バスバーで前記第1端子に対して近い側に配置される、
ことを特徴とする請求項1〜5のいずれか1項に記載の半導体装置。 - 前記電力用半導体素子および前記整流用半導体素子と前記第1バスバーと前記第2バスバーとから成る第1アーム用回路部と、
前記電力用半導体素子および前記整流用半導体素子と前記第1バスバーと前記第2バスバーとから成る第2アーム用回路部とを備え、
前記第1アーム用回路部の前記2バスバーの前記第2端子と前記第2アーム用回路部の前記第1バスバーの前記第1端子は電気的に接続されて出力端子を形成し、前記第1アーム用回路部の前記第1バスバーの前記第1端子は高圧端子となり、前記第2アーム用回路部の前記第2バスバーの前記第2端子は低圧端子となることを特徴とする請求項1または2記載の半導体装置。 - 前記第1アーム用回路部の前記第2バスバーの前記第2端子と、前記第2アーム用回路部の前記第1バスバーの前記第1端子は、それぞれ表面と裏面を有し、
前記第1アーム用回路部の前記第2バスバーの前記第2端子の裏面と前記第2アーム用回路部の前記第1バスバーの前記第1端子の表面とが同一平面に沿って位置しかつ重複部分を有し、前記第2端子と前記第1端子が圧接されることで電気的に接続されることを特徴とする請求項7記載の半導体装置。 - 前記第1アーム用回路部における前記第1バスバーの前記第1端子から前記第2バスバーの前記第2端子までの電流経路の長さと、前記第2アーム用回路部における前記第1バスバーの前記第1端子から前記第2バスバーの前記第2端子までの電流経路の長さとを実質的に等しくしたことを特徴とする請求項7記載の半導体装置。
- 前記整流用半導体素子に比べて前記電力用半導体素子に流れる電流の割合が多くなる半導体装置の駆動を行う場合、前記第1アーム用回路部の前記電力用半導体素子は前記第1バスバーで前記第1端子に対して遠い側に配置され、前記第2アーム用回路部の前記電力用半導体素子は前記第2バスバーで前記第2端子に対して遠い側に配置され、
前記整流用半導体素子に比べて前記電力用半導体素子に流れる電流の割合が少なくなる半導体装置の駆動を行う場合、前記第1アーム用回路部の前記電力用半導体装置は前記第1バスバーで前記第1端子に対して近い側に配置され、前記第2アーム用回路部の前記電力用半導体素子は前記第2バスバーで前記第2端子に対して近い側に配置されている、
ことを特徴とする請求項7記載の半導体装置。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006276906A JP4977430B2 (ja) | 2006-10-10 | 2006-10-10 | 半導体装置 |
CN2010101775292A CN101819965B (zh) | 2006-06-09 | 2007-05-17 | 半导体装置 |
EP20070743997 EP2028692A4 (en) | 2006-06-09 | 2007-05-17 | SEMICONDUCTOR COMPONENT |
CN200780021119.5A CN101467252B (zh) | 2006-06-09 | 2007-05-17 | 半导体装置 |
EP10158345.8A EP2202792B1 (en) | 2006-06-09 | 2007-05-17 | Semiconductor device |
PCT/JP2007/060563 WO2007142038A1 (ja) | 2006-06-09 | 2007-05-17 | 半導体装置 |
EP20100158346 EP2202793A3 (en) | 2006-06-09 | 2007-05-17 | Semiconductor device |
US12/303,865 US8129836B2 (en) | 2006-06-09 | 2007-05-17 | Semiconductor device |
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JP2006276906A JP4977430B2 (ja) | 2006-10-10 | 2006-10-10 | 半導体装置 |
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JP2008098308A true JP2008098308A (ja) | 2008-04-24 |
JP4977430B2 JP4977430B2 (ja) | 2012-07-18 |
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JP2006276906A Expired - Fee Related JP4977430B2 (ja) | 2006-06-09 | 2006-10-10 | 半導体装置 |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013093532A (ja) * | 2011-10-27 | 2013-05-16 | Toyota Motor Corp | 半導体装置 |
JP2015006116A (ja) * | 2013-06-24 | 2015-01-08 | 株式会社デンソー | 車両用回転電機 |
JP2016182025A (ja) * | 2015-03-24 | 2016-10-13 | 株式会社東芝 | 半導体装置、インバータ回路、駆動装置、車両、及び、昇降機 |
US9941255B2 (en) | 2014-02-11 | 2018-04-10 | Mitsubishi Electric Corporation | Power semiconductor module |
US10128625B2 (en) | 2014-11-18 | 2018-11-13 | General Electric Company | Bus bar and power electronic device with current shaping terminal connector and method of making a terminal connector |
JP7278441B1 (ja) | 2022-02-15 | 2023-05-19 | 三菱電機株式会社 | 半導体モジュールおよび電力変換器 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005236108A (ja) * | 2004-02-20 | 2005-09-02 | Toyota Motor Corp | 半導体装置 |
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- 2006-10-10 JP JP2006276906A patent/JP4977430B2/ja not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2005236108A (ja) * | 2004-02-20 | 2005-09-02 | Toyota Motor Corp | 半導体装置 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013093532A (ja) * | 2011-10-27 | 2013-05-16 | Toyota Motor Corp | 半導体装置 |
JP2015006116A (ja) * | 2013-06-24 | 2015-01-08 | 株式会社デンソー | 車両用回転電機 |
US9941255B2 (en) | 2014-02-11 | 2018-04-10 | Mitsubishi Electric Corporation | Power semiconductor module |
US10128625B2 (en) | 2014-11-18 | 2018-11-13 | General Electric Company | Bus bar and power electronic device with current shaping terminal connector and method of making a terminal connector |
JP2016182025A (ja) * | 2015-03-24 | 2016-10-13 | 株式会社東芝 | 半導体装置、インバータ回路、駆動装置、車両、及び、昇降機 |
JP7278441B1 (ja) | 2022-02-15 | 2023-05-19 | 三菱電機株式会社 | 半導体モジュールおよび電力変換器 |
JP2023118160A (ja) * | 2022-02-15 | 2023-08-25 | 三菱電機株式会社 | 半導体モジュールおよび電力変換器 |
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