JP2008080396A - はんだペースト組成物およびその用途 - Google Patents
はんだペースト組成物およびその用途 Download PDFInfo
- Publication number
- JP2008080396A JP2008080396A JP2007140331A JP2007140331A JP2008080396A JP 2008080396 A JP2008080396 A JP 2008080396A JP 2007140331 A JP2007140331 A JP 2007140331A JP 2007140331 A JP2007140331 A JP 2007140331A JP 2008080396 A JP2008080396 A JP 2008080396A
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- Prior art keywords
- solder
- powder
- paste composition
- metal
- solder paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000002131 composite material Substances 0.000 title abstract description 5
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- 239000002184 metal Substances 0.000 claims abstract description 92
- 239000000843 powder Substances 0.000 claims abstract description 91
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- 239000000463 material Substances 0.000 claims abstract description 25
- 238000000576 coating method Methods 0.000 claims abstract description 24
- 238000001556 precipitation Methods 0.000 claims abstract description 15
- 239000011248 coating agent Substances 0.000 claims abstract description 14
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- 229920005989 resin Polymers 0.000 claims description 43
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 25
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- 239000004332 silver Substances 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 150000003839 salts Chemical class 0.000 claims description 10
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- 238000005476 soldering Methods 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
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- LBLYYCQCTBFVLH-UHFFFAOYSA-N 2-Methylbenzenesulfonic acid Chemical compound CC1=CC=CC=C1S(O)(=O)=O LBLYYCQCTBFVLH-UHFFFAOYSA-N 0.000 description 2
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/105—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing inorganic lubricating or binding agents, e.g. metal salts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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- H01L2224/0554—External layer
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- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
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- H01L2224/161—Disposition
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Abstract
【解決手段】 電極表面にはんだをプリコートするのに用いられるはんだペースト組成物であって、はんだ粉末およびフラックスを含むとともに、はんだ粉末を構成する金属種と電極表面を構成する金属種のいずれとも異なる金属種の金属粉を、はんだ粉末総量に対して0.1重量%以上20重量%以下の割合で含有しているか、または、加熱によりはんだを析出させる析出型はんだ材料およびフラックスを含むとともに、析出型はんだ材料中の金属成分を構成する金属種と電極表面を構成する金属種のいずれとも異なる金属種の金属粉を、析出型はんだ材料によって析出させようとするはんだの総量に対して0.1重量%以上20重量%以下の割合で含有している。
【選択図】なし
Description
(1)電極表面にはんだをプリコートするのに用いられるはんだペースト組成物であって、はんだ粉末およびフラックスを含むとともに、前記はんだ粉末を構成する金属種と前記電極表面を構成する金属種のいずれとも異なる金属種の金属粉を、前記はんだ粉末総量に対して0.1重量%以上20重量%以下の割合で含有している、ことを特徴とするはんだペースト組成物。
(2)前記はんだ粉末は、はんだ合金からなる、前記(1)記載のはんだペースト組成物。
(3)前記はんだ粉末は、金属錫からなる、前記(1)記載のはんだペースト組成物。
(4)電極表面にはんだをプリコートするのに用いられるはんだペースト組成物であって、
加熱によりはんだを析出させる析出型はんだ材料およびフラックスを含むとともに、前記析出型はんだ材料中の金属成分を構成する金属種と前記電極表面を構成する金属種のいずれとも異なる金属種の金属粉を、前記析出型はんだ材料中の金属成分の総量に対して0.1重量%以上20重量%以下の割合で含有している、ことを特徴とするはんだペースト組成物。
(5)前記析出型はんだ材料は、錫粉末と、鉛、銅および銀から選ばれる金属の塩とを含むものである、前記(4)記載のはんだペースト組成物。
(6)前記析出型はんだ材料は、錫粉末、および、銀イオンおよび銅イオンから選ばれる少なくとも1種と、アリールホスフィン類、アルキルホスフィン類およびアゾール類から選ばれる少なくも1種との錯体を含むものである、前記(4)記載のはんだペースト組成物。
(7)前記電極がCu電極であるとき、前記金属粉は、Ni、Pd、Pt、Au、CoおよびZnからなる群より選ばれる少なくとも1種である、前記(1)〜(6)のいずれかに記載のはんだペースト組成物。
(8)長手方向の一部に他よりも幅が広い幅広部を有する形状であるパッドが配された電子回路基板上にはんだペースト組成物を塗布した後、加熱することにより、前記パッドの幅広部に備え付けられた電極表面にはんだをプリコートする方法であって、前記はんだペースト組成物として前記(1)〜(7)のいずれかに記載のはんだペースト組成物を用いる、ことを特徴とするはんだプリコート方法。
(9)前記パッドは、長手方向の一端から幅広部までの長さと他端から幅広部までの長さとが異なる形状である、前記(8)記載のはんだプリコート方法。
(10)前記(1)〜(7)のいずれかに記載のはんだペースト組成物を用いてプリコートされたはんだによって、電子回路基板上に搭載された電子部品が熱圧着されている、ことを特徴とする実装基板。
(11)前記電子回路基板の主面には、開口部を有する絶縁膜と該開口部内に配された複数のパッドとが形成され、前記パッドが長手方向の一部に他よりも幅が広い幅広部を有する形状を呈しており、かつ前記幅広部に備え付けられた電極と前記電子部品の主面に設けられた電極とが前記はんだによってフリップチップ接続されてなる、前記(10)記載の実装基板。
(12)前記パッドは、長手方向の一端から幅広部までの長さと他端から幅広部までの長さとが異なる形状であるとともに、幅広部までの長さが長い方の端部が前記電子部品の端部よりもさらに基板外側に位置するように配されている、前記(11)記載の実装基板。
(13)前記電子回路基板と前記電子部品との間にアンダーフィル樹脂が充填されてなる、前記(11)または(12)記載の実装基板。
例えば、スクリーン印刷等によるはんだペースト組成物の印刷において使用するスクリーンマスクには、電子回路基板上の個々の電極ごとに開口したものではなく、複数の電極を含む広い範囲に開口したものを使用する。具体的には、クワッドフラットパッケージ(QFP)の場合には、複数の電極を小ピッチで並列させたQFPの各辺ごとの形状に、又はそれらの辺を含むQFP全体の形状に開口したスクリーンマスクを使用し、小ピッチで配列された多数の電極を含む広い範囲に、個々の電極の位置や形状を無視してラフにはんだペースト組成物をベタ塗りすればよい。
例えば、Sn−Ag系はんだ合金粉末は、その組成中、Agの含有量が0.5〜5.0重量%であり、残部がSnであるのが好ましい。また、該Sn−Ag系はんだ合金粉末に必要に応じてSnおよびAg以外の成分(In、Bi、Cu等)を添加する場合には、その含有量は0.1〜15重量%であるのがよい。
前記金属錫粉末は、錫金属の含有量が100重量%である粉末である。該金属錫粉末を用いることにより、例えばはんだ合金粉末を用いた場合に比べ、電子部品の端子(Auスタッドバンプなど)と接合した際に接合部に形成される金属間化合物の種類が少なくなるので、接合部の機械特性などに優れ、より信頼性の高い接合を与えることができる、という利点が得られる。
第1の実施態様におけるはんだ粉末は、はんだ合金粉末または金属錫粉末のいずれであっても、その平均粒子径が0.5〜30μm、好ましくは1〜10μmであるのがよい。なお、本明細書において、平均粒子径は、粒度分布測定装置で測定して得られる値である。
前記ベース樹脂としては、例えば、ロジン、アクリル樹脂等が挙げられる。ベース樹脂は1種のみであってもよいし、2種以上を併用してもよい。例えばロジンとアクリル樹脂を混合して使用することもできる。ベース樹脂の含有量は、フラックス総量に対して0.5〜80重量%、好ましく20〜80重量%であるのがよい。
さらに、前記フラックスは、必要に応じて、活性剤を含有していてもよい。活性剤としては、例えば、エチルアミン、プロピルアミン、ジエチルアミン、トリエチルアミン、エチレンジアミン、アニリン等のハロゲン化水素酸塩、乳酸、クエン酸、ステアリン酸、アジピン酸、ジフェニル酢酸、安息香酸等の有機カルボン酸等が挙げられる。活性剤の含有量は、フラックス総量に対して0.1〜30重量%であるのがよい。
本発明のはんだペースト組成物において、はんだ粉末とフラックスとの重量比(はんだ粉末:フラックス)は、特に制限されないが、70:30〜20:80程度であるのがよい。
第2の実施態様は、前述した第1の実施態様における「はんだ粉末」を「析出型はんだ材料」に変えた態様である。すなわち、第2の実施態様は、加熱によりはんだを析出させる析出型はんだ材料およびフラックスを含むものであり、このような態様のはんだペースト組成物は、一般に、析出型はんだペースト組成物と称される。
前記有機カルボン酸塩における有機カルボン酸としては、炭素数1〜40のモノまたはジカルボン酸を使用することができる。具体的には、ギ酸、酢酸、プロピオン酸などの低級脂肪酸、カプロン酸、カプリル酸、ラウリン酸、ミリスチン酸、パルミチン酸、ステアリン酸、オレイン酸、リノール酸などの動植物油脂から得られる脂肪酸、2,2−ジメチルペンタン酸、2−エチルヘキサン酸、イソノナン酸、2,2−ジメチルオクタン酸、n−ウンデカン酸などの有機合成反応から得られる各種合成酸、ピマル酸、アビエチン酸、デヒドロアビエチン酸、ジヒドロアビエチン酸などの樹脂酸、石油から得られるナフテン酸などのモノカルボン酸とトール油脂肪酸または大豆脂肪酸から合成して得られるダイマー酸、ロジンを二量化させた重合ロジンなどのジカルボン酸などであり、これらを2種以上含むものでもよい。
なお、図6〜図8において、(a)は電子回路基板に設けられた複数のパッドを示す平面図であり、(b)はx−x断面における断面図である。
図9は、電子回路基板12に複数の電子部品(半導体チップ)を積層してなる半導体装置(実装基板)の概略断面図である。この半導体装置においては、本発明のはんだペースト組成物を用いて電子回路基板12にプリコートされたはんだによって、第一の電子部品として半導体チップ(マイコンチップ)10Aがバンプ16を介してフリップチップ接続により搭載されている。該半導体チップ10Aの上には、さらに、第二の電子部品としての半導体チップ(DDR2−SDRAM)10Bがワイヤー13Bを用いたワイヤーボンド接続により搭載され、さらにその上には第三の電子部品としての半導体チップ(SDRAM)10Cがワイヤー(13C)を用いたワイヤーボンド接続により搭載されている。そして、搭載した第一、第二および第三の電子部品の周囲がモールド樹脂18で覆われている。
前記実施形態における電子回路基板12には、まず、図10に示すように、その主面に、複数の開口部を有する絶縁膜(ソルダーレジスト)11が形成され、その開口部内に複数のパッド1A、1B、1Cが形成される。パッド1Aには、はんだペースト組成物をプリコートして第一の電子部品が接続され、パッド1Bには、ワイヤー13Bによって第二の電子部品が接続され、パッド1Cには、ワイヤー13Cによって第三の電子部品が接続される。
なお、上記実施形態は、第二の電子部品および第三の電子部品を搭載してなる多層実装基板であるが、本発明の実装基板はこれに限定されるものではなく、電子回路基板に1つの電子部品のみが搭載された形態であってもよいことは言うまでもない。
[実施例1〜10および比較例1〜7]
まず、WW級トールロジン70重量部、ベンジルカルビトール(溶剤;比重1.08)20重量部、水素添加ひまし油(チキソトロピー剤)10重量部を混合して120℃で加熱熔融させ、室温に冷却して粘性を有するフラックスを調製した。
はんだ粉末としてAg含有量が3.5重量%であるSn−Ag系はんだ合金粉末(Sn−3.5Ag)および金属錫粉末(Sn)のうち表1に示すものを60重量部と、異種金属粉として表1に示す金属種の金属粉を表1に示す量(比較例1および比較例7においては無添加)と、上記で調製したフラックス40重量部とをコンディショニングミキサー((株)シンキー製「あわとり練太郎」)を用いて混練し、銅電極用のはんだペースト組成物を得た。
図6に示すパッド1のように長手方向の一部に他よりも幅が広い幅広部を有し、かつ長手方向の一端から幅広部までの長さと他端から幅広部までの長さとが異なる形状であるパッド(図6中、W1:30μm、W2:20μm、L:300μm、L1:200μm、L2:50μm、L3:50μmであるパッド1)が60μmピッチで配されてなる電子回路基板を用い、各パッドの幅広部に備え付けられた銅電極とその周辺ソルダーレジスト上に、上記で得られた各はんだペースト組成物を厚さ100μmでベタ状に印刷し、最高温度260℃のリフロープロファイルを使用して加熱した。次いで、該基板を60℃のブチルカルビトール溶液を入れた超音波洗浄機に浸漬し、フラックス残渣を除去した。その後、電極上のはんだ高さを焦点深度計((株)キーエンス製)により20点測定し、その平均値を算出して「はんだの平均高さ」とし、その標準偏差を算出して「高さのバラツキ」とした。
<はんだの膨れおよびはんだの欠落>
上記<はんだの平均高さおよび高さバラツキ>において得られたプリコート状態のはんだの外観を顕微鏡にて観察し、「はんだの膨れ」の有無および「はんだの欠落」の有無を確認した。
これに対し、はんだ粉末としてはんだ合金を用いたはんだペースト組成物であって、異種金属粉を添加しなかった比較例1、はんだ粉末と同じ金属種である錫粉や銀粉を添加した比較例2と比較例5、電極と同じ金属種である銅粉を添加した比較例3、金属粉の添加量が少なすぎる比較例4の各はんだペースト組成物を用いて形成されたはんだは、いずれも、高さのバラツキが大きく、膨れおよび欠落が認められる結果となった。また、はんだ粉末として金属錫を用いたはんだペースト組成物においても、電極と同じ金属種である銅粉を添加した比較例6、金属粉を添加しなかった比較例7は、高さのバラツキが大きく、膨れおよび欠落が認められる結果となった。
まず、WW級トールロジン70重量部、ベンジルカルビトール(溶剤;比重1.08)25重量部、水素添加ひまし油(チキソトロピー剤)5重量部を混合して120℃で加熱熔融させ、室温に冷却して粘性を有するフラックスを調製した。
次に、銀化合物([Ag{P(C6H5)3}4]+ CH3SO3 - ; 当該銀化合物中の銀の含有率は8重量%)と、上記で調製したフラックスとを、1:1(重量比)の割合で3本ロールを用いて均一に混合して、銀化合物混合フラックスを調製した。その後、錫粉60重量部と、銀化合物混合フラックス40重量部と、異種金属粉としてパラジウムの金属粉を0.6重量部(錫粉に対して1重量%に相当)とを混ぜ合わせ、コンディショニングミキサー((株)シンキー製「あわとり練太郎」)を用いて混練し、銅電極用の析出型はんだペースト組成物を得た。
実施例11においてパラジウムの金属粉を無添加としたこと以外は、実施例11と同様にして、析出型のはんだペースト組成物を得た。
1a 幅広部
2 ソルダーレジスト(絶縁膜)
3 はんだ
3a 瘤状部
3b 膨れ部
4 欠落部
10 半導体チップ(電子部品)
11 絶縁膜
12 電子回路基板
13 ワイヤー
14 供給ノズル
15 電極
16 バンプ
17 アンダーフィル樹脂
18 モールド樹脂
Claims (13)
- 電極表面にはんだをプリコートするのに用いられるはんだペースト組成物であって、
はんだ粉末およびフラックスを含むとともに、前記はんだ粉末を構成する金属種と前記電極表面を構成する金属種のいずれとも異なる金属種の金属粉を、前記はんだ粉末総量に対して0.1重量%以上20重量%以下の割合で含有している、ことを特徴とするはんだペースト組成物。 - 前記はんだ粉末は、はんだ合金からなる、請求項1記載のはんだペースト組成物。
- 前記はんだ粉末は、金属錫からなる、請求項1記載のはんだペースト組成物。
- 電極表面にはんだをプリコートするのに用いられるはんだペースト組成物であって、
加熱によりはんだを析出させる析出型はんだ材料およびフラックスを含むとともに、前記析出型はんだ材料中の金属成分を構成する金属種と前記電極表面を構成する金属種のいずれとも異なる金属種の金属粉を、前記析出型はんだ材料中の金属成分の総量に対して0.1重量%以上20重量%以下の割合で含有している、ことを特徴とするはんだペースト組成物。 - 前記析出型はんだ材料は、錫粉末と、鉛、銅および銀から選ばれる金属の塩とを含むものである、請求項4記載のはんだペースト組成物。
- 前記析出型はんだ材料は、錫粉末、および、銀イオンおよび銅イオンから選ばれる少なくとも1種と、アリールホスフィン類、アルキルホスフィン類およびアゾール類から選ばれる少なくも1種との錯体を含むものである、請求項4記載のはんだペースト組成物。
- 前記電極がCu電極であるとき、前記金属粉は、Ni、Pd、Pt、Au、CoおよびZnからなる群より選ばれる少なくとも1種である、請求項1〜6のいずれかに記載のはんだペースト組成物。
- 長手方向の一部に他よりも幅が広い幅広部を有する形状であるパッドが配された電子回路基板上にはんだペースト組成物を塗布した後、加熱することにより、前記パッドの幅広部に備え付けられた電極表面にはんだをプリコートする方法であって、
前記はんだペースト組成物として請求項1〜7のいずれかに記載のはんだペースト組成物を用いる、ことを特徴とするはんだプリコート方法。 - 前記パッドは、長手方向の一端から幅広部までの長さと他端から幅広部までの長さとが異なる形状である、請求項8記載のはんだプリコート方法。
- 請求項1〜7のいずれかに記載のはんだペースト組成物を用いてプリコートされたはんだによって、電子回路基板上に搭載された電子部品が熱圧着されている、ことを特徴とする実装基板。
- 前記電子回路基板の主面には、開口部を有する絶縁膜と該開口部内に配された複数のパッドが形成されているとともに、各パッドは長手方向の一部に他よりも幅が広い幅広部を有する形状を呈しており、かつ前記幅広部に備え付けられた電極と前記電子部品の主面に設けられた電極とが前記はんだによってフリップチップ接続されてなる、請求項10記載の実装基板。
- 前記パッドは、長手方向の一端から幅広部までの長さと他端から幅広部までの長さとが異なる形状であるとともに、幅広部までの長さが長い方の端部が前記電子部品の端部よりもさらに基板外側に位置するように配されている、請求項11記載の実装基板。
- 前記電子回路基板と前記電子部品との間にアンダーフィル樹脂が充填されてなる、請求項11または12記載の実装基板。
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CNA2008100814451A CN101314199A (zh) | 2007-05-28 | 2008-02-22 | 钎焊膏组合物及其用途 |
KR1020080017256A KR20080104945A (ko) | 2007-05-28 | 2008-02-26 | 땜납 페이스트 조성물 및 그 용도 |
TW097106703A TWI430865B (zh) | 2007-05-28 | 2008-02-26 | 釬焊膏組合物及其用途 |
US12/038,404 US20080160331A1 (en) | 2006-08-28 | 2008-02-27 | Solder paste composition, solder precoating method and mounted substrate |
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- 2007-05-28 JP JP2007140331A patent/JP4385061B2/ja not_active Expired - Fee Related
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- 2008-02-22 CN CNA2008100814451A patent/CN101314199A/zh active Pending
- 2008-02-26 KR KR1020080017256A patent/KR20080104945A/ko active Search and Examination
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TWI430865B (zh) | 2014-03-21 |
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