JP2008062476A - 加工装置およびチャックテーブル - Google Patents
加工装置およびチャックテーブル Download PDFInfo
- Publication number
- JP2008062476A JP2008062476A JP2006241878A JP2006241878A JP2008062476A JP 2008062476 A JP2008062476 A JP 2008062476A JP 2006241878 A JP2006241878 A JP 2006241878A JP 2006241878 A JP2006241878 A JP 2006241878A JP 2008062476 A JP2008062476 A JP 2008062476A
- Authority
- JP
- Japan
- Prior art keywords
- chuck table
- wafer
- suction holding
- processing
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003754 machining Methods 0.000 title description 11
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims abstract description 38
- 239000000919 ceramic Substances 0.000 claims abstract description 19
- 238000005520 cutting process Methods 0.000 claims description 60
- 238000012545 processing Methods 0.000 claims description 58
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 229910001220 stainless steel Inorganic materials 0.000 claims description 10
- 239000010935 stainless steel Substances 0.000 claims description 10
- 235000012431 wafers Nutrition 0.000 abstract description 57
- 238000005336 cracking Methods 0.000 abstract 1
- 230000002542 deteriorative effect Effects 0.000 abstract 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000011148 porous material Substances 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- 229910001928 zirconium oxide Inorganic materials 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Images
Landscapes
- Jigs For Machine Tools (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006241878A JP2008062476A (ja) | 2006-09-06 | 2006-09-06 | 加工装置およびチャックテーブル |
CNA2007101491640A CN101140892A (zh) | 2006-09-06 | 2007-09-05 | 加工装置和吸盘工作台 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006241878A JP2008062476A (ja) | 2006-09-06 | 2006-09-06 | 加工装置およびチャックテーブル |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2008062476A true JP2008062476A (ja) | 2008-03-21 |
Family
ID=39192763
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006241878A Pending JP2008062476A (ja) | 2006-09-06 | 2006-09-06 | 加工装置およびチャックテーブル |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2008062476A (zh) |
CN (1) | CN101140892A (zh) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011014783A (ja) * | 2009-07-03 | 2011-01-20 | Disco Abrasive Syst Ltd | 切削装置のチャックテーブル |
JP2011023686A (ja) * | 2009-07-21 | 2011-02-03 | Disco Abrasive Syst Ltd | 切削装置 |
JP2012104609A (ja) * | 2010-11-09 | 2012-05-31 | Disco Abrasive Syst Ltd | 加工装置 |
CN103786270A (zh) * | 2012-10-31 | 2014-05-14 | 株式会社迪思科 | 加工装置 |
CN104821266A (zh) * | 2015-05-07 | 2015-08-05 | 合肥彩虹蓝光科技有限公司 | 显微镜载片台 |
DE102019210075A1 (de) | 2018-07-09 | 2020-01-09 | Disco Corporation | Poröser Einspanntisch |
KR20210103944A (ko) | 2020-02-14 | 2021-08-24 | 가부시기가이샤 디스코 | 절삭 장치 및 절삭 방법 |
JP7519790B2 (ja) | 2020-03-13 | 2024-07-22 | 株式会社ディスコ | 保持テーブル、加工装置、及び、スピンナー洗浄ユニット |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5431853B2 (ja) * | 2009-10-01 | 2014-03-05 | 株式会社ディスコ | 切削装置及び検出方法 |
CN102082206B (zh) * | 2010-12-15 | 2012-09-05 | 沈阳仪表科学研究院 | 太阳能电池芯片专用划切载台 |
WO2012092026A2 (en) * | 2010-12-29 | 2012-07-05 | Twin Creeks Technologies, Inc. | A method and apparatus for forming a thin lamina |
CN104227247A (zh) * | 2013-06-24 | 2014-12-24 | 江苏香江科技股份有限公司 | Led晶元片激光切割吸盘固定装置 |
CN104637854B (zh) * | 2013-11-13 | 2018-12-07 | 沈阳新松机器人自动化股份有限公司 | 一种用于吸附硅片的吸盘 |
JP6815138B2 (ja) * | 2016-09-06 | 2021-01-20 | 株式会社ディスコ | 吸引保持システム |
CN110098143B (zh) * | 2018-01-31 | 2021-06-04 | 上海微电子装备(集团)股份有限公司 | 一种芯片吸附装置及芯片键合系统 |
CN108580991B (zh) * | 2018-05-24 | 2019-12-06 | 徐成晓 | 一种镊子开槽装置 |
CN109346424A (zh) * | 2018-10-29 | 2019-02-15 | 浙江金瑞泓科技股份有限公司 | 一种硅片刷片机 |
CN110509205B (zh) * | 2019-08-21 | 2022-03-29 | 深圳中科飞测科技股份有限公司 | 一种吸板 |
CN112318741A (zh) * | 2020-10-29 | 2021-02-05 | 浙江鼎元建设有限公司 | 一种蒸压加气混凝土板材水平切割设备 |
CN112917033B (zh) * | 2021-02-23 | 2022-11-15 | 扬州向弘工业科技有限公司 | 一种激光切割晶圆加工中可自动旋转校位的设备 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000323440A (ja) * | 1999-05-10 | 2000-11-24 | Disco Abrasive Syst Ltd | チャックテーブル |
JP2004209633A (ja) * | 2002-12-18 | 2004-07-29 | Komatsu Electronic Metals Co Ltd | 加工用基板固定装置およびその製造方法 |
-
2006
- 2006-09-06 JP JP2006241878A patent/JP2008062476A/ja active Pending
-
2007
- 2007-09-05 CN CNA2007101491640A patent/CN101140892A/zh active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000323440A (ja) * | 1999-05-10 | 2000-11-24 | Disco Abrasive Syst Ltd | チャックテーブル |
JP2004209633A (ja) * | 2002-12-18 | 2004-07-29 | Komatsu Electronic Metals Co Ltd | 加工用基板固定装置およびその製造方法 |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011014783A (ja) * | 2009-07-03 | 2011-01-20 | Disco Abrasive Syst Ltd | 切削装置のチャックテーブル |
JP2011023686A (ja) * | 2009-07-21 | 2011-02-03 | Disco Abrasive Syst Ltd | 切削装置 |
JP2012104609A (ja) * | 2010-11-09 | 2012-05-31 | Disco Abrasive Syst Ltd | 加工装置 |
CN103786270A (zh) * | 2012-10-31 | 2014-05-14 | 株式会社迪思科 | 加工装置 |
CN104821266A (zh) * | 2015-05-07 | 2015-08-05 | 合肥彩虹蓝光科技有限公司 | 显微镜载片台 |
DE102019210075A1 (de) | 2018-07-09 | 2020-01-09 | Disco Corporation | Poröser Einspanntisch |
KR20200006013A (ko) | 2018-07-09 | 2020-01-17 | 가부시기가이샤 디스코 | 포러스 척 테이블, 포러스 척 테이블의 제조 방법, 및 가공 장치 |
US11315822B2 (en) | 2018-07-09 | 2022-04-26 | Disco Corporation | Porous chuck table |
KR20210103944A (ko) | 2020-02-14 | 2021-08-24 | 가부시기가이샤 디스코 | 절삭 장치 및 절삭 방법 |
JP7519790B2 (ja) | 2020-03-13 | 2024-07-22 | 株式会社ディスコ | 保持テーブル、加工装置、及び、スピンナー洗浄ユニット |
Also Published As
Publication number | Publication date |
---|---|
CN101140892A (zh) | 2008-03-12 |
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