JP2008056857A - 光半導体用熱硬化性組成物、光半導体素子用封止剤、光半導体素子用ダイボンド材、光半導体素子用アンダーフィル材及び光半導体装置 - Google Patents

光半導体用熱硬化性組成物、光半導体素子用封止剤、光半導体素子用ダイボンド材、光半導体素子用アンダーフィル材及び光半導体装置 Download PDF

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Publication number
JP2008056857A
JP2008056857A JP2006238028A JP2006238028A JP2008056857A JP 2008056857 A JP2008056857 A JP 2008056857A JP 2006238028 A JP2006238028 A JP 2006238028A JP 2006238028 A JP2006238028 A JP 2006238028A JP 2008056857 A JP2008056857 A JP 2008056857A
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Prior art keywords
optical semiconductor
group
epoxy
thermosetting composition
optical
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JP2006238028A
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Japanese (ja)
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JP2008056857A5 (https=
Inventor
Mitsuru Tanigawa
満 谷川
Takashi Watanabe
貴志 渡邉
Takashi Nishimura
貴史 西村
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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Priority to JP2006238028A priority Critical patent/JP2008056857A/ja
Publication of JP2008056857A publication Critical patent/JP2008056857A/ja
Publication of JP2008056857A5 publication Critical patent/JP2008056857A5/ja
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

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  • Sealing Material Composition (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Led Device Packages (AREA)
JP2006238028A 2006-09-01 2006-09-01 光半導体用熱硬化性組成物、光半導体素子用封止剤、光半導体素子用ダイボンド材、光半導体素子用アンダーフィル材及び光半導体装置 Withdrawn JP2008056857A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006238028A JP2008056857A (ja) 2006-09-01 2006-09-01 光半導体用熱硬化性組成物、光半導体素子用封止剤、光半導体素子用ダイボンド材、光半導体素子用アンダーフィル材及び光半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006238028A JP2008056857A (ja) 2006-09-01 2006-09-01 光半導体用熱硬化性組成物、光半導体素子用封止剤、光半導体素子用ダイボンド材、光半導体素子用アンダーフィル材及び光半導体装置

Publications (2)

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JP2008056857A true JP2008056857A (ja) 2008-03-13
JP2008056857A5 JP2008056857A5 (https=) 2009-08-20

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009242587A (ja) * 2008-03-31 2009-10-22 Namics Corp エポキシ樹脂組成物
JP2009290045A (ja) * 2008-05-30 2009-12-10 Namics Corp Ｌｅｄ用導電性ダイボンディング剤
JP2010111756A (ja) * 2008-11-05 2010-05-20 Yokohama Rubber Co Ltd:The 加熱硬化性光半導体封止用樹脂組成物およびこれを用いる光半導体封止体
JP2010153910A (ja) * 2010-03-19 2010-07-08 Yokohama Rubber Co Ltd:The 光半導体封止体
KR101207103B1 (ko) 2010-03-31 2012-12-03 코오롱인더스트리 주식회사 봉지재 조성물，이의 경화막 및 유기발광소자
US8994030B2 (en) 2012-04-27 2015-03-31 Kabushiki Kaisha Toshiba Semiconductor light emitting device
JP2015063656A (ja) * 2012-09-28 2015-04-09 三菱化学株式会社 熱硬化性樹脂組成物、その製造方法、樹脂硬化物の製造方法、および、エポキシ化合物の自己重合を発生させる方法
JP2015189825A (ja) * 2014-03-27 2015-11-02 三菱化学株式会社 熱硬化性樹脂組成物
JP2017509741A (ja) * 2014-02-06 2017-04-06 モーメンティブ・パフォーマンス・マテリアルズ・インク 湿気硬化性シリコーン組成物

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009242587A (ja) * 2008-03-31 2009-10-22 Namics Corp エポキシ樹脂組成物
JP2009290045A (ja) * 2008-05-30 2009-12-10 Namics Corp Ｌｅｄ用導電性ダイボンディング剤
JP2010111756A (ja) * 2008-11-05 2010-05-20 Yokohama Rubber Co Ltd:The 加熱硬化性光半導体封止用樹脂組成物およびこれを用いる光半導体封止体
JP2010153910A (ja) * 2010-03-19 2010-07-08 Yokohama Rubber Co Ltd:The 光半導体封止体
KR101207103B1 (ko) 2010-03-31 2012-12-03 코오롱인더스트리 주식회사 봉지재 조성물，이의 경화막 및 유기발광소자
US8994030B2 (en) 2012-04-27 2015-03-31 Kabushiki Kaisha Toshiba Semiconductor light emitting device
JP2015063656A (ja) * 2012-09-28 2015-04-09 三菱化学株式会社 熱硬化性樹脂組成物、その製造方法、樹脂硬化物の製造方法、および、エポキシ化合物の自己重合を発生させる方法
CN104662086A (zh) * 2012-09-28 2015-05-27 三菱化学株式会社 热固性树脂组合物、其制造方法、树脂固化物的制造方法以及使环氧化合物发生自聚合的方法
EP2902441A4 (en) * 2012-09-28 2015-09-30 Mitsubishi Chem Corp A HEAT-RESISTANT RESIN COMPOSITION, METHOD FOR THE PRODUCTION THEREOF, METHOD FOR THE PRODUCTION OF A CURED RESIN PRODUCT, AND DEVICE FOR DETERMINING THE SELF-POLYMERIZATION OF AN EPOXY COMPOUND
US9550877B2 (en) 2012-09-28 2017-01-24 Mitsubishi Chemical Corporation Thermosetting resin composition, method for producing same, method for producing cured resin product, and method for causing self-polymerization of epoxy compound
CN104662086B (zh) * 2012-09-28 2018-04-17 三菱化学株式会社 热固性树脂组合物、其制造方法、树脂固化物的制造方法以及使环氧化合物发生自聚合的方法
JP2017509741A (ja) * 2014-02-06 2017-04-06 モーメンティブ・パフォーマンス・マテリアルズ・インク 湿気硬化性シリコーン組成物
JP2015189825A (ja) * 2014-03-27 2015-11-02 三菱化学株式会社 熱硬化性樹脂組成物

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