JP2008044045A5 - - Google Patents

Download PDF

Info

Publication number
JP2008044045A5
JP2008044045A5 JP2006220558A JP2006220558A JP2008044045A5 JP 2008044045 A5 JP2008044045 A5 JP 2008044045A5 JP 2006220558 A JP2006220558 A JP 2006220558A JP 2006220558 A JP2006220558 A JP 2006220558A JP 2008044045 A5 JP2008044045 A5 JP 2008044045A5
Authority
JP
Japan
Prior art keywords
cured product
substrate
liquid
component
microchannel according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006220558A
Other languages
English (en)
Japanese (ja)
Other versions
JP5016870B2 (ja
JP2008044045A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006220558A priority Critical patent/JP5016870B2/ja
Priority claimed from JP2006220558A external-priority patent/JP5016870B2/ja
Publication of JP2008044045A publication Critical patent/JP2008044045A/ja
Publication of JP2008044045A5 publication Critical patent/JP2008044045A5/ja
Application granted granted Critical
Publication of JP5016870B2 publication Critical patent/JP5016870B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2006220558A 2006-08-11 2006-08-11 微小流路の製造方法 Expired - Fee Related JP5016870B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006220558A JP5016870B2 (ja) 2006-08-11 2006-08-11 微小流路の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006220558A JP5016870B2 (ja) 2006-08-11 2006-08-11 微小流路の製造方法

Publications (3)

Publication Number Publication Date
JP2008044045A JP2008044045A (ja) 2008-02-28
JP2008044045A5 true JP2008044045A5 (https=) 2009-08-20
JP5016870B2 JP5016870B2 (ja) 2012-09-05

Family

ID=39178265

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006220558A Expired - Fee Related JP5016870B2 (ja) 2006-08-11 2006-08-11 微小流路の製造方法

Country Status (1)

Country Link
JP (1) JP5016870B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5503239B2 (ja) * 2009-09-25 2014-05-28 株式会社朝日Ｆｒ研究所 シリンジ用ガスケットに摺動性被膜を形成する方法、摺動性被膜が形成されたシリンジ用ガスケット、及びプレフィルドシリンジ
JP6721454B2 (ja) * 2016-08-10 2020-07-15 シチズン時計株式会社 時計用部品

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4533256B2 (ja) * 2004-06-28 2010-09-01 キヤノン株式会社 微細構造体の製造方法および液体吐出ヘッドの製造方法
JP2006189292A (ja) * 2005-01-05 2006-07-20 Ulvac Japan Ltd マイクロ流路デバイス及びその製造方法

Similar Documents

Publication Publication Date Title
JP2009231752A5 (https=)
JP2007243181A (ja) インプリンティングによる基板の製造方法
JP2013138183A5 (https=)
WO2009035087A1 (ja) ケイ素含有微細パターン形成用組成物およびそれを用いた微細パターン形成方法
WO2008102582A1 (ja) 光学素子の製造方法及び光学素子
JP2016173541A5 (https=)
WO2008139857A1 (ja) 異方導電性接着剤フィルム及び異方導電性接着剤フィルムの製造方法
JP2009529244A5 (https=)
JP2014080489A5 (ja) 電子部品被覆用熱硬化性接着シートおよびその製造方法ならびにそれを用いた電子部材の製造方法
CN101610645A (zh) 软硬板的制作方法
TW200700208A (en) Method for fabricating soft mold
JP2009081357A5 (https=)
EP1915037A4 (en) RIGID PCB OF THE BENDING TYPE AND PROCESS FOR THEIR MANUFACTURE
CN105451443A (zh) 印刷电路板
CN106328559A (zh) 制造半导体封装模块的设备和方法
WO2008111309A1 (ja) 認識マークおよび回路基板の製造方法
JP2007150180A5 (https=)
WO2009073351A3 (en) Defoaming method, defoaming device and manufacturing method of transfer mold
EP1571465A3 (en) Method of and apparatus for producing micro lens and micro lens
JP2008044045A5 (https=)
JP4990945B2 (ja) 多層セラミックス基板製造方法
JP2014240137A5 (https=)
JP2016074417A5 (https=)
CN104816429A (zh) 金属表面与塑胶一体注塑并相互牢固粘结的生产工艺
JP4952915B2 (ja) インク層の転写方法および電子装置の製造方法