JP2008035383A - 圧電デバイスおよび圧電デバイスの製造方法 - Google Patents
圧電デバイスおよび圧電デバイスの製造方法 Download PDFInfo
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- JP2008035383A JP2008035383A JP2006208581A JP2006208581A JP2008035383A JP 2008035383 A JP2008035383 A JP 2008035383A JP 2006208581 A JP2006208581 A JP 2006208581A JP 2006208581 A JP2006208581 A JP 2006208581A JP 2008035383 A JP2008035383 A JP 2008035383A
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- piezoelectric
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- piezoelectric vibrator
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 238000000034 method Methods 0.000 title claims abstract description 20
- 229920005989 resin Polymers 0.000 claims abstract description 67
- 239000011347 resin Substances 0.000 claims abstract description 67
- 238000007789 sealing Methods 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims description 34
- 238000000465 moulding Methods 0.000 claims description 16
- 230000004308 accommodation Effects 0.000 claims description 6
- 239000005341 toughened glass Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
- 239000004065 semiconductor Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 230000004048 modification Effects 0.000 description 7
- 238000012986 modification Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000003860 storage Methods 0.000 description 6
- 235000014676 Phragmites communis Nutrition 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000003566 sealing material Substances 0.000 description 5
- 230000001678 irradiating effect Effects 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- 229910001020 Au alloy Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 239000005345 chemically strengthened glass Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 229910017518 Cu Zn Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910017755 Cu-Sn Inorganic materials 0.000 description 1
- 229910017752 Cu-Zn Inorganic materials 0.000 description 1
- 229910002482 Cu–Ni Inorganic materials 0.000 description 1
- 229910017827 Cu—Fe Inorganic materials 0.000 description 1
- 229910017927 Cu—Sn Inorganic materials 0.000 description 1
- 229910017943 Cu—Zn Inorganic materials 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910000927 Ge alloy Inorganic materials 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000003763 resistance to breakage Effects 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000006058 strengthened glass Substances 0.000 description 1
- 238000005496 tempering Methods 0.000 description 1
- 229910002058 ternary alloy Inorganic materials 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Landscapes
- Oscillators With Electromechanical Resonators (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006208581A JP2008035383A (ja) | 2006-07-31 | 2006-07-31 | 圧電デバイスおよび圧電デバイスの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006208581A JP2008035383A (ja) | 2006-07-31 | 2006-07-31 | 圧電デバイスおよび圧電デバイスの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008035383A true JP2008035383A (ja) | 2008-02-14 |
| JP2008035383A5 JP2008035383A5 (enrdf_load_stackoverflow) | 2009-09-10 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006208581A Withdrawn JP2008035383A (ja) | 2006-07-31 | 2006-07-31 | 圧電デバイスおよび圧電デバイスの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2008035383A (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013232876A (ja) * | 2012-09-13 | 2013-11-14 | Lapis Semiconductor Co Ltd | 半導体装置及び計測機器 |
| JP2016208535A (ja) * | 2016-07-25 | 2016-12-08 | ラピスセミコンダクタ株式会社 | 半導体装置及び計測機器 |
| US9787250B2 (en) | 2012-04-27 | 2017-10-10 | Lapis Semiconductor Co., Ltd. | Semiconductor device and measurement device |
| CN110463037A (zh) * | 2017-06-22 | 2019-11-15 | 株式会社大真空 | 晶体振动片及晶体振动器件 |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02211705A (ja) * | 1989-02-10 | 1990-08-23 | Nippon Dempa Kogyo Co Ltd | 圧電発振器 |
| JPH07212159A (ja) * | 1994-01-11 | 1995-08-11 | Citizen Watch Co Ltd | パッケージの製造方法 |
| JP2004297554A (ja) * | 2003-03-27 | 2004-10-21 | Seiko Epson Corp | 圧電発振器及び圧電発振器を利用した携帯電話装置および圧電発振器を利用した電子機器 |
| JP2005033761A (ja) * | 2003-06-16 | 2005-02-03 | Seiko Epson Corp | 圧電発振器とその製造方法ならびに圧電発振器を利用した携帯電話装置および圧電発振器を利用した電子機器 |
| JP2005150786A (ja) * | 2003-11-11 | 2005-06-09 | Seiko Epson Corp | 複合圧電デバイスおよびその製造方法 |
| JP2005318524A (ja) * | 2004-04-01 | 2005-11-10 | Seiko Epson Corp | 圧電発振器とその製造方法 |
| JP2005341045A (ja) * | 2004-05-25 | 2005-12-08 | Seiko Epson Corp | 圧電発振器 |
| JP2005348121A (ja) * | 2004-06-03 | 2005-12-15 | Seiko Epson Corp | 圧電発振器および電子機器 |
| JP2006050529A (ja) * | 2004-02-17 | 2006-02-16 | Seiko Epson Corp | 圧電発振器、及びその製造方法 |
-
2006
- 2006-07-31 JP JP2006208581A patent/JP2008035383A/ja not_active Withdrawn
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02211705A (ja) * | 1989-02-10 | 1990-08-23 | Nippon Dempa Kogyo Co Ltd | 圧電発振器 |
| JPH07212159A (ja) * | 1994-01-11 | 1995-08-11 | Citizen Watch Co Ltd | パッケージの製造方法 |
| JP2004297554A (ja) * | 2003-03-27 | 2004-10-21 | Seiko Epson Corp | 圧電発振器及び圧電発振器を利用した携帯電話装置および圧電発振器を利用した電子機器 |
| JP2005033761A (ja) * | 2003-06-16 | 2005-02-03 | Seiko Epson Corp | 圧電発振器とその製造方法ならびに圧電発振器を利用した携帯電話装置および圧電発振器を利用した電子機器 |
| JP2005150786A (ja) * | 2003-11-11 | 2005-06-09 | Seiko Epson Corp | 複合圧電デバイスおよびその製造方法 |
| JP2006050529A (ja) * | 2004-02-17 | 2006-02-16 | Seiko Epson Corp | 圧電発振器、及びその製造方法 |
| JP2005318524A (ja) * | 2004-04-01 | 2005-11-10 | Seiko Epson Corp | 圧電発振器とその製造方法 |
| JP2005341045A (ja) * | 2004-05-25 | 2005-12-08 | Seiko Epson Corp | 圧電発振器 |
| JP2005348121A (ja) * | 2004-06-03 | 2005-12-15 | Seiko Epson Corp | 圧電発振器および電子機器 |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9787250B2 (en) | 2012-04-27 | 2017-10-10 | Lapis Semiconductor Co., Ltd. | Semiconductor device and measurement device |
| US10243515B2 (en) | 2012-04-27 | 2019-03-26 | Lapis Semiconductor Co., Ltd. | Semiconductor device and measurement device |
| US10622944B2 (en) | 2012-04-27 | 2020-04-14 | Lapis Semiconductor Co., Ltd. | Semiconductor device and measurement device |
| JP2013232876A (ja) * | 2012-09-13 | 2013-11-14 | Lapis Semiconductor Co Ltd | 半導体装置及び計測機器 |
| JP2016208535A (ja) * | 2016-07-25 | 2016-12-08 | ラピスセミコンダクタ株式会社 | 半導体装置及び計測機器 |
| CN110463037A (zh) * | 2017-06-22 | 2019-11-15 | 株式会社大真空 | 晶体振动片及晶体振动器件 |
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