JP2008034541A - Electronic component housing package, multi-piece production electronic component housing package, and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component housing package wherein the hermeticity of a recess can efficiently and favorably be verified, and to provide a highly reliable electronic apparatus. <P>SOLUTION: In the multi-piece production electronic component housing package; a lattice-like body 2 is arranged on at least one main surface of a mother substrate 1, and has a plurality of recesses 5 and a plurality of electronic component housing package regions 7 corresponding to the recesses 5. The package comprises metallized layers 3 for measurement embedded between the mother substrate 1 in each electronic component housing package region 7 and the lattice-like body 2, and a pair of measurement terminals 4 electrically connected to the metallized layers 3 for measurement and led out to the external surface of the mother substrate 1 or the external surface of the lattice-like body 2. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electronic component storage package for mounting electronic components, a multi-piece electronic component storage package, and an electronic device.

  Conventionally, an electronic component storage package for mounting an electronic component such as a semiconductor element or a crystal resonator is made of, for example, tungsten or molybdenum on the surface of an insulating base made of an electrically insulating material such as an aluminum oxide sintered body. It is configured by arranging a wiring conductor made of metal powder metallization.

  And in such an electronic component storage package, the recessed part for accommodating an electronic component is normally formed. And while accommodating an electronic component in a recessed part, each electrode of an electronic component is electrically connected to each corresponding wiring conductor via electrical connection means, such as solder and a bonding wire, and the electronic component is connected to metal or ceramics. An electronic device is formed by covering and sealing with a lid made of glass or the like, or potting resin.

  Such an electronic component storage package is formed by printing a metallized paste for a wiring conductor on a ceramic green sheet for an insulating substrate or a ceramic green sheet for a frame, and laminating them to form a recess. And then fired at a high temperature.

  By the way, during the manufacturing process of the electronic component storage package, foreign matter (debris from processing equipment, degreasing debris from the ceramic green sheet, environmental debris, etc.) between the ceramic green sheet for the insulating substrate and the ceramic green sheet for the frame body. Etc.) may enter. When the ceramic green sheet is fired in a state where foreign matter has entered, since the firing temperature is high, the foreign matter is melted, and as a result, a void is formed between the insulating base and the frame. There was a thing.

  In addition, when foreign substances made of a material that easily evaporates at the firing temperature enter, when the ceramic green sheet is fired at a high temperature, the foreign substances evaporate, and a gap is also formed between the insulating substrate and the frame. There was that to form.

  When such an air gap is formed between the insulating base and the frame so that the outer edge of the electronic component storage package and the concave portion communicate with each other, the electronic component is mounted in the concave portion, Even if the recess is sealed, its airtightness may be lowered.

  Therefore, in order to confirm the airtightness of the recess, a helium leak test or the like is performed on the electronic component storage package. Such a test is performed by mounting the electronic component on the electronic component storage package. Moreover, when the electronic component storage area is hermetically sealed, the electronic component mounted on the electronic component storage package whose airtightness is impaired is not preferable from the viewpoint of productivity.

  In addition, as a material of such a foreign substance that is easily melted or evaporated, when the insulating base and the frame are made of an aluminum oxide sintered body, the material of the aluminum oxide such as iron, copper, stainless steel, carbon, paper, organic matter, etc. A material that easily melts or evaporates at the firing temperature is conceivable. When the insulating base and the frame are made of glass ceramics, a material that melts and evaporates at the firing temperature of glass ceramics such as carbon, paper, and organic matter can be considered.

  Such electronic component storage packages have become extremely small with a size of several mm square or less in accordance with recent demands for thinner and smaller electronic devices. In order to make the thin and small electronic component storage package easy to handle, and to improve the efficiency of manufacturing the electronic component storage package and the electronic device using the same, the electronic component storage package A large number of electronic component storage package regions are manufactured in the form of a so-called multi-piece substrate in which a large-area mother board is arranged in the vertical and horizontal directions at the center.

  Such a multiple wiring board is prepared by preparing a ceramic green sheet for a mother board, printing a metallized paste for a wiring conductor on the ceramic green sheet at a predetermined position, and if necessary, a plurality of ceramic green sheets After being laminated, it is manufactured by firing at a high temperature.

Then, after electronic components are mounted in each electronic component storage package area of the multi-chip substrate, a large number of electronic devices can be manufactured simultaneously by dividing the mother board into electronic component storage package areas. Is done. As a method of dividing into individual electronic component storage package areas, a dividing groove is formed at the boundary of each electronic component storage package area of the wiring board, and bending is performed along the division grooves. Or a method of cutting each electronic component storage package area by a slicing method or the like.
JP 2006-185953 A

  However, in the case of a multi-chip substrate in which a plurality of electronic component storage packages are arranged on the mother substrate, the airtightness of the recesses is confirmed with respect to the individual electronic component storage packages in the state of the multi-collection substrate. Had the problem of not being able to. In other words, since the multi-chip board has a plurality of electronic component storage package areas arranged on the mother board, each electronic component storage package is in the state of the multi-chip board before being separated into individual electronic component storage packages. The side surface of the component storage package is not exposed to the outside, and it cannot be confirmed whether or not there is a gap that communicates from the recess to the side surface.

  The present invention has been devised in view of the above-mentioned problems of the prior art, and the object thereof is to store electronic components that can efficiently and satisfactorily confirm the airtightness of the recesses with respect to the package region for storing electronic components. It is to provide an electronic package and a package for storing electronic components. Another object is to provide an electronic device with excellent reliability.

  The electronic component storage package of the present invention is an electronic component storage package having an insulating base and a frame mounted on at least one main surface of the insulating base, and the electronic base is a space between the insulating base and the frame. And a pair of package measurement terminals that are electrically connected to the package measurement metallization layer and led to the outer surface of the insulating base or the outer surface of the frame body. It is characterized by providing.

  An electronic component storage package according to the present invention is an electronic component storage package having an insulating base and a frame made of a plurality of layers mounted on at least one main surface of the insulating base. An embedded package measurement metallization layer, and a pair of package measurement terminals electrically connected to the package measurement metallization layer and led to the outer surface of the insulating substrate or the frame. And

  Preferably, the package measuring metallization layer is embedded in each of the layers having different height positions of the frame.

  Preferably, a plurality of the package measurement metallization layers are formed, and a pair of package measurement terminals are electrically connected to each of the plurality of package measurement metallization layers.

  Preferably, the package measurement metallization layer is formed to circulate in the frame body in a plan view.

  Preferably, the metallization layer for package measurement that circulates forms a series circuit or a parallel circuit between a pair of package measurement terminals.

  The multi-component electronic component storage package of the present invention has a lattice-shaped body disposed on at least one main surface of the mother board, and includes a plurality of recesses and a plurality of electronic component storage package regions corresponding to the recesses. A plurality of electronic component storage packages having a measurement metallization layer embedded between the mother substrate and the grid-like body in each electronic component storage package region, and an electrical connection to the measurement metallization layer And a pair of measuring terminals led to the outer surface of the mother board or the outer surface of the lattice-like body.

  The multi-component electronic component storage package according to the present invention includes a plurality of layers of a lattice-shaped body disposed on at least one main surface of a mother board, a plurality of concave portions, and a plurality of electronic component storage portions corresponding to the concave portions. A plurality of electronic component storage packages each having a package region, the measurement metallization layer embedded between the plurality of layers of the plurality of layers of each electronic component storage package region, and the measurement metallization And a pair of measuring terminals led out to the outer surface of the mother substrate or the outer surface of the lattice-like body.

  Preferably, the measurement metallization layer is embedded in each of the layers having different height positions of the lattice-like body.

  Preferably, a plurality of the measurement metallization layers are formed in each of the electronic component storage package regions, and a pair of measurement terminals are electrically connected to each of the plurality of measurement metallization layers. It is characterized by.

  Preferably, each of the measurement metallization layers in each electronic component storage package region is formed so as to surround the concave portion of each electronic component storage package region in plan view. And

  Preferably, the measurement metallization layer forms a series circuit or a parallel circuit between a pair of measurement terminals.

  Preferably, the mother board includes an outer dummy area outside an arrangement area of the electronic component storage package area, and the measurement terminal is one main surface of the mother board in the outer dummy area. It is derived from the above.

  Preferably, the mother board includes an intermediate dummy area between adjacent electronic component storage package areas, and the measurement terminal is led out to one main surface of the mother board in the intermediate dummy area. It is characterized by.

  Preferably, the measurement metallization layers formed between layers having different height positions are electrically connected by a connection conductor.

  An electronic device according to the present invention includes the above-described electronic component storage package and an electronic component mounted on the electronic component storage package.

  Alternatively, an electronic device of the present invention includes a plurality of electronic component storage packages described above and a plurality of electronic components mounted in each of the electronic component storage package regions of the multi-component electronic component storage package. The individual electronic device is obtained by being divided for each electronic component storage package area.

  An electronic component storage package according to the present invention is an electronic component storage package having an insulating base and a frame mounted on at least one main surface of the insulating base, and is embedded between the insulating base and the frame. And a pair of package measurement terminals that are electrically connected to the package measurement metallization layer and led out to the outer surface of the insulating base or the outer surface of the frame. If foreign matter enters between the insulating substrate and the frame during the manufacturing process, the conductive paste is not reliably applied in the printing process of the conductive paste that becomes the metallization layer for package measurement, and the package measurement is performed during the firing process. As a result, the metallized layer is disconnected, and foreign matters are burned out, resulting in the formation of voids that reduce the airtightness of the recesses. In addition, if foreign matter is present on the laminated surface during the laminated crimping step, the foreign matter will sever the packaged metallization layer. And in a subsequent baking process, a foreign material will burn out and the space | gap part which reduces the airtightness of a recessed part will be formed.

  When such a gap is formed, the metallization layer for package measurement between the insulating base and the frame is also disconnected at the same time. Therefore, the metallization layer for package measurement is connected via a pair of package measurement terminals. By examining the presence or absence of disconnection, it is possible to confirm the presence or absence of voids due to the inclusion of foreign matter, and to confirm the airtightness of the recesses in each electronic component storage package area.

  In addition, the confirmation of the electrical continuity between the pair of package measurement terminals should be performed in the same inspection process as the process of confirming the electrical continuity of various wiring conductors formed in the electronic component storage package. Therefore, the airtight state of the recess can be efficiently confirmed with respect to the electronic component storage package.

  The electronic component storage package of the present invention is an electronic component storage package having an insulating base and a frame made of a plurality of layers mounted on at least one main surface of the insulating base, and is embedded between layers of the frame. A package measurement metallization layer, and a pair of package measurement terminals that are electrically connected to the package measurement metallization layer and led to the outer surface of the insulating base or the frame. Also in this case, as described above, by checking the electrical continuity between the pair of package measurement terminals and checking for the presence or absence of disconnection of the package measurement metallization layer, foreign matter can be mixed between the layers of the multi-layer frame. It is possible to confirm the airtightness of the concave portion of the electronic component storage package by confirming the presence or absence of the void portion.

  Similarly, the confirmation of the electrical continuity between the pair of package measuring terminals is performed in the same inspection process as the process of confirming the electrical continuity of various wiring conductors formed in the electronic component storage package. Can be done.

  Preferably, since the package measurement metallization layer is embedded in each of the layers having different height positions of the frame, the package measurement metallization layer is formed between the layers via a pair of package measurement terminals. By examining the respective electrical continuity states of the metallized layers, it becomes possible to efficiently check the airtightness between the layers having different height positions with respect to each electronic component storage package region.

  Preferably, a plurality of the package measurement metallization layers are formed, and a pair of package measurement terminals are electrically connected to each of the plurality of package measurement metallization layers. The electrical conduction state can be confirmed for each of the metallized layers.

  Preferably, since the metallization layer for package measurement is formed so as to circulate in the frame body in a plan view, the electrical connection state between the pair of package measurement terminals is confirmed by checking the electrical connection state. It is possible to better confirm the airtightness in the peripheral region of the recess with respect to the package for use.

  Preferably, since the metallization layer for circulating package measurement forms a series circuit or a parallel circuit between the pair of package measurement terminals, the electrical conduction state between the pair of package measurement terminals is This can be confirmed by a series circuit and a parallel circuit of the package measuring metallization layer surrounding the recess, and the airtightness in the peripheral region of the recess can be better confirmed with respect to the electronic component storage package. That is, when the package measurement metallization layer is a series circuit, it can be confirmed by the presence or absence of electrical continuity between the pair of package measurement terminals, and when the package measurement metallization layer is a parallel circuit, This can be confirmed by a difference in resistance value between the package measuring terminals (a resistance value when there is a disconnection and a resistance value when there is no disconnection).

  The multi-component electronic component storage package according to the present invention is electrically connected to the measurement metallization layer embedded between the mother board and the grid in each electronic component storage package region and the measurement metallization layer. And a pair of measuring terminals led to the outer surface of the mother board or the outer surface of the lattice-like body.

  If foreign matter enters between the mother substrate and the lattice during the manufacturing process, the conductive paste is not reliably applied in the printing process of the conductive paste that becomes the metallization layer for measurement. As the metallized layer breaks, foreign matters are burned out and voids that reduce the airtightness of the recesses are formed. In addition, if foreign matter is present on the laminated surface during the laminated crimping step, the foreign matter will sever the measurement metallized layer. And in a subsequent baking process, a foreign material will burn out and the space | gap part which reduces the airtightness of a recessed part will be formed.

  When such a gap is formed, the measurement metallization layer between the mother substrate and the lattice is also disconnected at the same time, so the measurement metallization layer is disconnected via a pair of measurement terminals. By checking the presence / absence, it is possible to confirm the presence / absence of a void due to the mixing of foreign matter, and to confirm the airtightness of the recesses in the respective electronic component storage package regions.

  As a result, it is possible to confirm the airtightness of the recesses for each electronic component storage package area in the form of a plurality of electronic component storage packages. The airtightness of the recess can be confirmed efficiently and satisfactorily.

  The multi-component electronic component storage package according to the present invention is electrically connected to a measurement metallization layer embedded in a plurality of layers of a lattice-like body in each electronic component storage package region and the measurement metallization layer. And a pair of measuring terminals led to the outer surface of the mother board or the outer surface of the lattice-like body. In this case as well, as described above, the presence or absence of voids due to the inclusion of foreign matter between the layers of the grid-like body composed of multiple layers is confirmed by examining the electrical continuity of the measurement metallization layer via a pair of measurement terminals. And the airtightness of the recessed part of each electronic component storage package area | region can be confirmed.

  Preferably, the measurement metallization layer is embedded in each of the layers having different height positions of the lattice-like body that may reduce the hermeticity of the recesses, so that the measurement metallization layer is interposed between the pair of measurement terminals. By checking the electrical continuity of each measurement metallization layer formed between the layers (presence / absence of disconnection), the respective airtightness between the layers having different height positions with respect to each electronic component storage package region can be obtained. It becomes possible to confirm efficiently.

  Preferably, a plurality of measurement metallization layers are formed in each electronic component storage package region, and a pair of measurement terminals are electrically connected to each of the plurality of measurement metallization layers. For each of the metallized layers for use, the electrical continuity state can be confirmed, and by confirming the presence or absence of a gap for each region where the measurement metallized layer is formed, a plurality of regions in each electronic component storage package region The airtightness of the recess can be confirmed better.

  Preferably, each of the measurement metallization layers of each electronic component storage package region is formed so as to surround the concave portion of each electronic component storage package region in plan view. By checking the electrical continuity state, it is possible to better check the airtightness in the entire region around the recess with respect to each electronic component storage package region.

  Preferably, since the measurement metallization layer forms a series circuit or a parallel circuit between the pair of measurement terminals, the electrical continuity between the pair of measurement terminals is measured around the recess. This can be confirmed by the series circuit and the parallel circuit of the metallization layer for the electronic component, and the airtightness in the peripheral region of the recess can be confirmed more favorably with respect to each electronic component storage package region. That is, when the measurement metallization layer is a series circuit, it can be confirmed by the presence or absence of electrical continuity between the pair of measurement terminals. When the measurement metallization layer is a parallel circuit, the pair of measurement terminals It can be confirmed by the difference in resistance value between them (resistance value when there is a disconnection and difference between resistance values when there is no disconnection).

  Preferably, the mother board includes an outer dummy area outside the arrangement area of the electronic component storage package area, and the measurement terminal is led out to one main surface of the mother board in the outer dummy area. Therefore, the measurement terminal is located in an area other than each electronic component storage package area, and it is not necessary to consider the area for forming the measurement terminal in the electronic component storage package area. The area can be reduced in size.

  Preferably, the mother board is provided with an intermediate dummy area between adjacent electronic component storage package areas, and the measurement terminals are led to one main surface of the mother board in the intermediate dummy area. In the same manner as described above, each electronic component storage package area can be reduced in size.

  Preferably, the measurement metallization layers formed between the layers having different height positions are electrically connected to each other by the connection conductor, so that the measurement metallization layers are connected via the measurement terminals led to the outer surface. By examining the electrical continuity state of the metallized layer, it is possible to simultaneously confirm the state of the regions between the different height positions of each electronic component storage package region. The airtightness can be confirmed efficiently and satisfactorily.

  Since the electronic device of the present invention includes the above-described electronic component storage package and the electronic component mounted on the electronic component storage package, the electronic device is a highly reliable electronic device.

  Alternatively, an electronic device according to the present invention includes a plurality of electronic component storage packages described above, and a plurality of electronic components mounted in the electronic component storage package area of the multi-component electronic component storage package. Since the electronic device is obtained by dividing each electronic component storage package region, a plurality of highly reliable electronic devices can be efficiently manufactured.

  DESCRIPTION OF EMBODIMENTS Embodiments of a multi-package electronic component storage package according to the present invention will be described below with reference to the accompanying drawings. FIG. 1A is a plan view showing an example of an embodiment of a package for storing multiple electronic components according to the present invention, and FIG. 1B is a cross-sectional view taken along the line AA ′ of FIG. FIG. 1C is a cross-sectional view taken along the line BB ′ of FIG. In FIG. 1, 1 is a mother substrate, 2 is a lattice-like body, 3 is a metallization layer for measurement, 4 is a measurement terminal, 5 is a recess, 6 is a package region for storing electronic components, and 7 is a wiring conductor.

  The package for storing multiple electronic components according to the present invention has a plurality of grid-like bodies 2 in which a plurality of penetrating portions are arranged on one main surface of the mother board 1 so that the recesses 5 are arranged. A plurality of electronic component storage packages in which electronic component storage package regions are arranged, and a measurement metallization layer 3 embedded between the mother substrate 1 and the grid 2, and a measurement metallization layer 3 And a pair of measuring terminals 4 led out to the outer surface of the mother board 1 or the outer surface of the lattice-like body 2.

The mother substrate 1 and the lattice-like body 2 are made of an electrically insulating material such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, and the like. In the case of a ligation, a suitable organic solvent and solvent are added to and mixed with raw material powders such as alumina (Al ₂ O ₃ ), silica (SiO ₂ ), calcia (CaO), magnesia (MgO), etc. At the same time, using a conventionally known doctor blade method, calendar roll method, etc., and forming into a sheet shape, a ceramic green sheet (ceramic green sheet) is obtained, and then the ceramic green sheet is appropriately punched. If necessary, a plurality of sheets are laminated and fired at a high temperature (about 1500 to 1800 ° C.).

  In addition, a plurality of penetrating portions to be the concave portions 5 are formed in a predetermined region of the ceramic green sheet for the lattice-like body 2 by a punching method using a die or a punching machine, or a processing method such as laser processing. A plurality of recesses 5 are formed by stacking and mounting the ceramic green sheet for use on one main surface of the ceramic green sheet for the mother substrate 1. Then, by firing the ceramic green sheet for the mother substrate 1 and the ceramic green sheet for the lattice body 2 at a high temperature, the mother substrate 1 and the lattice body 2 are sintered and integrated.

  A plurality of electronic component storage package regions 6 are formed in the central portion of the mother board 1 and the lattice-like body 2, and a concave portion 5 and a wiring conductor 7 are formed in each electronic component storage package region 6. Yes. In the plan view of FIG. 1A, the planned dividing line 8 formed along the outer edge of each electronic component storage package region is indicated by a one-dot chain line. By dividing the multi-component electronic component storage package into the electronic component storage package regions 6 along the planned dividing line 8, a large number of electronic component storage packages can be formed. As a method of dividing into individual electronic component storage packages, a method of dividing a plurality of electronic component storage packages by dividing them into split dividing lines 8 and flexing and dividing along the division grooves, Alternatively, there is a method of cutting each electronic component storage package region 8 by a slicing method or the like.

  In addition, the wiring conductor 7 functions as a conductive path for electrically connecting an electronic component housed in each recess 5 of each electronic component housing package region 6 to an external electric circuit board. The wiring conductor 7 is made of metal powder metallization such as tungsten, molybdenum, copper, and silver. The metallization for the wiring conductor 7 is formed on the ceramic green sheet for the mother substrate 1 or the ceramic green sheet for the lattice-like body 2 by screen printing or the like. The paste is printed and applied, and the metallized paste is fired together with the ceramic green sheet for the mother substrate 1 and the ceramic green sheet for the lattice-like body 2 to form a predetermined region.

  The metallized paste for the wiring conductor 7 is mixed and kneaded by kneading means such as a ball mill, a three-roll mill, a planetary mixer, etc. with an organic binder, an organic solvent, and a dispersant added as necessary to the main component metal powder. Will be produced. Glass or ceramic powder may be added to match the sintering behavior of the ceramic green sheet or to increase the bonding strength with the laminated substrate after sintering.

  Further, the wiring conductors 7 formed on the surface and inside of the mother board 1 or the grid-like body 2 are electrically connected by a through conductor penetrating the mother board 1 or the grid-like body 2 as necessary. Such penetrating conductors can be formed by punching a ceramic green sheet for the mother substrate 1 or a ceramic green sheet for the lattice-like body 2 by a die or punching prior to printing and application of the metallized paste for forming the wiring conductors 7. A through hole for the through conductor is formed by a processing method such as laser processing, and a metallized paste for the through conductor is filled in the through hole by a printing means such as a screen printing method. It forms in each area | region by baking with the ceramic green sheet for a sheet | seat and the grid | lattice-like body 2. FIG. The metallized paste for the through conductor is prepared in the same manner as the metallized paste for the wiring conductor 7, but is prepared to have a viscosity suitable for filling depending on the amount of the organic binder or the organic solvent.

  In addition, the portion of the wiring conductor 7 exposed on the outer surface of the mother substrate 1 and the lattice-like body 2 is coated with a metal having excellent corrosion resistance such as nickel (Ni) or gold (Au). Can be effectively prevented from being oxidized and corroded, and the wiring conductor 7 and the electronic component can be joined, and the wiring conductor 7 can be electrically connected to the Au wire and the solder bump, and the wiring conductor 7 can be joined to the external circuit board. Can be made strong. Therefore, a portion where the wiring conductor 7 is exposed on the outer surface of the mother substrate 1 and the lattice-like body 2 includes a Ni plating layer having a thickness of about 1 to 10 μm and a gold (Au) plating layer having a thickness of about 0.1 to 3 μm. It is sequentially deposited by electrolytic plating or electroless plating.

  The multiple wiring substrate of the present invention is electrically connected to the measurement metallization layer 3 embedded between the mother substrate 1 and the lattice-like body 2 and the measurement metallization layer 3. 1 and a pair of measurement terminals 4 led out to the outer surface of the lattice-like body 2.

  The measurement metallization layer 3 is formed around the plurality of recesses 5, that is, between the recesses 5 and the outer edges of the electronic component storage package regions 6 for each electronic component storage package region 6, and between the mother substrate 1 and the lattice 2. And function as one for confirming the airtightness of each recess 5 of each electronic component storage package region 6. The measurement metallization layer 3 is made of metal powder metallization such as tungsten, molybdenum, copper, silver, etc., and a predetermined region of the ceramic green sheet for the mother substrate 1 or the ceramic green sheet for the lattice-like body 2 (for the mother substrate 1). The metallized paste for the metallization layer 3 for measurement is printed and applied to a region where the ceramic green sheet and the ceramic green sheet for the grid-like body 2 are in contact with each other by lamination, and the ceramic green sheet for the mother substrate 1 After the ceramic green sheets for the lattice-like body 2 are laminated, the metallized paste is fired together with the ceramic green sheet for the mother substrate 1 and the ceramic green sheet for the lattice-like body 2 to thereby fire the mother substrate 1 and the lattice-like body 2. It is buried between and formed.

  The metallized paste for the measurement metallized layer 3 can be produced by the same method as the metallized paste for the wiring conductor 7, and the metallized paste is produced in the same manner as the metallized paste for the wiring conductor 7. Viscosity suitable for printing is adjusted by the amount of organic solvent.

  In addition, in order to be able to confirm the airtightness of the plurality of recesses 5 formed by stacking the mother substrate 1 and the lattice-like body 2 better, the outer edge of each electronic component storage package region 6 It is preferable that the length of the measurement metallization layer 3 formed between the recess 5 and the inner wall of the recess 5 is longer than the length of the side of each recess 5. Here, the length of the side of the measurement metallization layer 3 refers to the length of the measurement metallization layer 3 along this side.

  The width of the measurement metallization layer 3 is formed narrower than the distance between the outer edge of each electronic component storage package region 7 and the recess 5. The width of the measurement metallization layer 3 varies depending on the material and shape of the mother substrate 1 and the lattice-like body 2, but is preferably formed to be 0.05 mm or more. When it is less than 0.05 mm, when the metallized paste of the measurement metallized layer 3 is printed on the ceramic green sheet for the mother substrate 1 or the ceramic green sheet for the lattice-like body 2, it is better due to fading at the time of printing. There is a possibility that the metallization layer 3 for measurement may be disconnected because it cannot be formed.

  The measurement terminal 4 is formed as a pair electrically connected to the measurement metallization layer 3 and confirms the state of the measurement metallization layer 3 formed between the mother substrate 1 and the lattice-like body 2. Function as a conductive path. The measurement terminal 4 is made of metal powder metallization such as tungsten, molybdenum, copper, or silver, and is measured by a screen printing method or the like on a predetermined area of the ceramic green sheet for the mother substrate 1 or the ceramic green sheet for the lattice 2. After the metallized paste for the terminal 4 is printed and applied, and the ceramic green sheet for the mother substrate 1 and the ceramic green sheet for the lattice-like body 2 are laminated, the metallized paste is applied to the ceramic green sheet and the lattice for the mother substrate 1. By firing together with the ceramic green sheet for the body 2, it is led out from the measurement metallized layer 3 to the outer surface of the mother substrate 1 or the outer surface of the lattice 2. The metallized paste for the measurement terminal 4 can be produced by the same method as the metallized paste for the wiring conductor 7, and the metallized paste is produced in the same manner as the metallized paste for the wiring conductor 7. The viscosity is suitable for printing depending on the amount of the organic solvent.

  The measurement terminal 4 is led out to the outer surface such as the main surface or the side surface of the mother board 1 or the lattice-like body 2. When derived to the main surface of the mother substrate 1 or the lattice-like body 2, the measurement is performed from the measurement metallized layer 3 to the main surface of the mother substrate 1 or the lattice-like body 2 as a through conductor penetrating the mother substrate 1 or the lattice-like body 2. The lead terminal 4 may be formed by being led out. In the case of leading to the side surface, the lead terminal 4 for measurement may be led out from the measurement metallization layer 3 to the side surface of the mother substrate 1 or the lattice-like body 2. It ’s fine.

  When the formation region is restricted due to the formation of the wiring conductor 7 or the like on the main surface of the mother board 1 or the grid-like body 2, the measurement terminal 4 is led out to the side surface of the mother board 1 or the grid-like body 2. It is preferable to keep it. Moreover, it is preferable that the pair of measurement terminals 4 be led out to the outer surface in the same direction so that it can be efficiently performed when the electrical conduction state is confirmed.

  In addition, in order to prevent the measurement terminal 4 from being oxidatively corroded in the portion of the measurement terminal 4 exposed on the outer surface of the mother board 1 or the lattice-like body 2, the thickness 1 to It is preferable that a Ni plating layer having a thickness of about 10 μm and a gold (Au) plating layer having a thickness of about 0.1 to 3 μm are sequentially deposited by an electrolytic plating method or an electroless plating method.

  The metallization layer 3 for measurement is subject to coating formation failure during the printing process or separation during the laminating process due to the influence of the foreign object when the foreign material enters between the mother substrate 1 and the grid 2 during the manufacturing process. Occurs and breaks easily. That is, when the metallized paste for the measurement metallized layer 3 is printed on the ceramic green sheet for the mother substrate 1 or the ceramic green sheet for the lattice-like body 2, On the top, it is difficult to print the metallized paste satisfactorily, and the metallized paste of the measurement metallized layer 3 is easily divided. In addition, when the ceramic green sheet for the mother substrate 1 and the ceramic green sheet for the lattice-like body 2 are laminated, if a foreign substance adheres to the laminated surface, the metallized paste for the measurement metallized layer 3 is divided by the foreign substance. Is done. As a result, if a foreign material is baked between the ceramic green sheet for the mother substrate 1 and the lattice-like body 2, the foreign matter is burned out, so that the space between the mother substrate 1 and the lattice-like body 2 is reduced. At the same time as the gap for reducing the airtightness of the recess 5 is formed, the measurement metallized layer 3 between the mother substrate 1 and the lattice-like body 2 is formed in a disconnected state.

  For this reason, the state of the region between the mother substrate 1 on which the measurement metallized layer 3 is formed and the lattice-like body 2 is confirmed by confirming the electrical continuity between the pair of measurement terminals 4, that is, the presence or absence of disconnection. That is, the presence or absence of a gap can be confirmed, and an electronic component storage package region in which the airtightness of the recess 5 is ensured for each electronic component storage package region 6 can be easily selected.

  Further, since it is possible to confirm the airtightness of the recess 5 with respect to each electronic component storage package area and to perform the confirmation in the form of the electronic component storage package, the recess 5 Airtightness can be confirmed efficiently and satisfactorily.

  Further, as shown in FIG. 2, the lattice-like body 2 may be composed of a plurality of layers (in FIG. 2, the insulating layers 2a and 2b), and the measurement embedded in the interlayer of the lattice-like body 2 composed of a plurality of layers. The metallization layer 3 and the measurement metallization layer 3 that are electrically connected to the measurement metallization layer 3 and led to the outer surface of the mother substrate 1 or the outer surface of the lattice-like body 2 may be provided.

  Such a lattice-like body 2 has a predetermined region of the ceramic green sheet for the insulating layer 2a or the ceramic green sheet for the insulating layer 2b (the ceramic green sheet for the insulating layer 2a and the ceramic green sheet for the insulating layer 2b are separated from each other). The metallized paste for the measurement metallization layer 3 is printed and applied to the area abutted by lamination) by screen printing or the like, and the ceramic green sheet for the mother substrate 1 and the ceramic green for the grid 2 (insulating layers 2a, 2b) After the sheets are laminated, the metallized paste is fired together with the ceramic green sheet for the mother substrate 1 and the ceramic green sheet for the lattice-like body 2 so as to be embedded between the lattice-like bodies 2.

  As in the case of the measurement metallized layer 3 formed between the mother substrate 1 and the lattice-like body 2 described above, measurement is performed when foreign matter enters between the lattice-like bodies 2 composed of a plurality of layers during the manufacturing process. The metallization layer 3 for use is broken due to a coating formation defect during the printing process or a division during the lamination process due to the influence of foreign matter. For this reason, the airtightness of the recessed part 5 can be confirmed with respect to each package area 6 for electronic component accommodation by investigating the presence or absence of the disconnection of the measurement metallization layer 3 through the pair of measurement terminals 4. Become.

  Similarly to the above, since it is possible to confirm the airtightness of the recess 5 with respect to each electronic component storage package region 6 in the form of the electronic component storage package, each electronic component storage package region 6 has On the other hand, the airtightness of the recess 5 can be confirmed efficiently and satisfactorily.

  The lattice-like body 2 is not limited to being formed from two layers of insulating layers 2a and 2b, and may be formed from three or more layers. For example, as shown in FIG. 3, when the grid 2 is formed of three layers of insulating layers 2 a, 2 b, and 2 c, the measurement metallization layer 3 has all the thicknesses of the grid 2 in the thickness direction. It is preferably embedded in each of the layers. With this configuration, the measurement metallization layer 3 is formed between all the layers of the lattice-like body 2 in which the hermeticity of the recesses 5 may be lowered, and therefore, a plurality of layers are formed via the pair of measurement terminals 4. By confirming the electrical continuity of the measurement metallization layer 3 formed between the layers of the grid-like body 2, the airtightness between all the layers in the thickness direction of the recess 5 with respect to each electronic component storage package region 6 is confirmed. Can be confirmed efficiently.

  As shown in FIG. 4, a plurality of measurement metallization layers 3 are formed in each electronic component storage package region 6, and a pair of measurement terminals 4 are electrically connected to each of the plurality of measurement metallization layers 3. It is preferable that they are connected. In FIG. 4, FIG. 4 (a) is a plan view showing an example of a multi-piece electronic component storage package in which a measurement metallization layer 3 is formed between the mother substrate 1 and the lattice-like body 2. FIG. 4B is a plan view of the mother board 1 in FIG. In FIG. 4A, the region where each recess 5 of each electronic component storage package region 6 is formed is indicated by a broken line for each electronic component storage package region 6 on the mother board 1 in FIG. Is shown enclosed. Thereby, an airtight state can be confirmed for each region where the measurement metallization layer 3 of each electronic component storage package region 6 is formed.

  Further, when it is confirmed that there is no electrical continuity between the pair of measurement terminals 4, the state of each measurement metallization layer 3 is checked to thereby make a plurality of measurement purposes in each electronic component storage package region 6. It becomes easy to satisfactorily confirm in which region of the region where the metallized layer 3 is formed that the airtightness of the recess 5 may be lowered.

  Each of the measurement metallization layers 3 is preferably formed so as to surround the recess 5 of each electronic component storage package region 6 in plan view. With this configuration, by confirming the electrical connection state between the pair of measurement terminals 4 and confirming the state of the measurement metallization layer 3, the peripheral region of the recess 5 with respect to each electronic component storage package region 6 The airtightness in can be confirmed better.

  As shown in FIGS. 5 and 6, the measurement metallization layer 3 preferably forms a series circuit or a parallel circuit between the pair of measurement terminals 4. 5, FIG. 5 (a) is a plan view showing an example of a multi-package electronic component storage package in which the measurement metallization layer 3 forms a series circuit between the mother substrate 1 and the lattice-like body 2. FIG. FIG. 5B is a plan view of the mother board 1 shown in FIG. FIG. 5 shows that the pair of measurement terminals 4 is led out from the measurement metallization layer 3 forming a series circuit to the main surface of the lattice-like body 2. 6, FIG. 6A is a plan view showing an example of a multi-package electronic component storage package in which the measurement metallization layer 3 forms a parallel circuit between the mother substrate 1 and the lattice-like body 2. FIG. 6B is a plan view of the mother board 1 shown in FIG. FIG. 6 shows that a pair of measurement terminals 4 are led out from the measurement metallization layer 3 in which a parallel circuit is formed to the main surface of the lattice-like body 2. In FIG. 5B and FIG. 6B, the outer periphery of the region where the recess 5 is formed by mounting the lattice-like body 2 is indicated by a broken line. With this configuration, the electrical conduction state between the pair of measurement terminals 4 can be confirmed by the series circuit and the parallel circuit of the measurement metallization layer 3 surrounding the recess 5. On the other hand, the airtightness in the surrounding area of the recessed part 5 can be confirmed more favorably. That is, the state of the measurement metallization layer 3 can be confirmed by the presence or absence of electrical continuity between the pair of measurement terminals 4 in the case of a series circuit, and the pair of measurement terminals in the case of a parallel circuit. It can be confirmed by a difference in resistance value between 4 (a resistance value when there is a disconnection and a difference between resistance values when there is no disconnection). For example, the resistance values of the pair of measurement terminals 4 and the like are actually detected together, but the resistance value of the measurement metallization layer 3 forming the parallel circuit as shown in FIG. In the case of 2R (the resistance value of each measurement metallization layer 3 is R), when one measurement metallization layer 3 is disconnected, the resistance value of the measurement metallization layer 3 is calculated as a double R.

  In the case of a parallel circuit, as shown in FIG. 6B, by arranging the measurement metallization layer 3 so as to surround the entire circumference of the recess 5, each electronic component storage package region 6 is provided. On the other hand, the airtightness in the entire peripheral area of the concave portion 5 can be confirmed better.

  Further, the mother board 1 includes an outer dummy area outside the arrangement area of the electronic component storage package area 6, and the measurement terminal 4 is led out to one main surface of the mother board 1 in the outer dummy area. Preferably it is. With this configuration, since the measurement terminal 4 is led out to a region other than each electronic component storage package region 6, it is not necessary to form the measurement terminal 4 on the main surface of the electronic component storage package region 6. The influence on the arrangement region of the wiring conductor 7 in the component storage package region 6 is reduced, the measurement terminals 4 can be arranged, and a plurality of electronic component storage package regions can be formed as a small one. it can.

  The outer dummy area is formed as a non-product part on the outer peripheral portion of the mother board 1 and can be used as an area for facilitating the manufacture and transportation of the mother board 1. When the mother board 1 is processed or carried, Can be used for positioning and fixing. Further, in the outer dummy area, a plating conductive pattern for depositing a plating layer on the wiring conductor 7 and a wiring conductor 7 for connecting to an external circuit board on the side surface of the wiring board are formed as necessary. Through-holes are formed.

  Moreover, the mother board 1 is provided with an intermediate dummy area between adjacent electronic component storage package areas, and the measurement terminals 4 are preferably led out to one main surface of the mother board 1 in the intermediate dummy area. . With this configuration, since the measurement terminals 4 are led out to regions other than the electronic component storage package regions 6, it is not necessary to form the measurement terminals 4 on the main surface of the electronic component storage package. The influence on the arrangement area of the wiring conductor 7 in the package area 6 is reduced, the connection metallization layer 4 can be arranged, and a plurality of electronic component housing package areas can be formed as a small one. .

  The intermediate dummy area is formed as a non-product part between the electronic component storage package areas 6 of the mother board 1, and if necessary, a plating conduction pattern or a wiring for depositing a plating layer on the wiring conductor 7 A through hole for forming the wiring conductor 7 for connecting to the external circuit board is formed on the side surface of the board.

  Further, as shown in FIG. 7, it is preferable that the measurement metallization layers 3 formed in the respective layers having different height positions are electrically connected to each other by the connection conductor 9. With this configuration, by confirming the electrical continuity between the pair of measurement terminals 4, it is possible to simultaneously confirm the state of each region between the layers having different height positions of each electronic component storage package region 6. Therefore, the airtightness of the recess 5 can be confirmed efficiently and satisfactorily for each electronic component storage package region 6. When the measurement metallization layer 3 is formed between the mother substrate 1 and the lattice-like body 2 and between the lattice-like bodies 2, all these measurement metallization layers 3 are electrically connected in the same manner. It is preferable to keep it.

  The connection conductor 9 is made of metal powder metallization such as tungsten, molybdenum, copper, silver, and the like. Prior to printing and application of the metallization paste for forming the measurement metallization layer 3, a ceramic green sheet or a lattice shape for the mother substrate 1 is formed. A through hole for a through conductor is formed in a ceramic green sheet for the body 2 by a die or punching method by punching or a processing method such as laser processing, and a metallized paste for the connecting conductor 9 is screen printed using this through hole. These are filled in by the printing means and fired together with the ceramic green sheet for the mother substrate 1 and the ceramic green sheet for the lattice-like body 2 to form each region. The metallized paste for the connection conductor 9 is prepared in the same manner as the metallized paste for the wiring conductor 7, but is prepared to have a viscosity suitable for filling depending on the amount of the organic binder or organic solvent.

  Further, the measurement metallized layers 3 of the electronic component storage packages adjacent to each other in the electronic component storage package region 6 may be electrically connected by the connection conductor 9. For example, the measurement metallized layers 3 adjacent to each other in each column or row of the electronic component storage package regions 6 arranged on the mother board 1 and the grid 2 are electrically connected by the connection conductors 9. The measurement metallization layers 3 of the plurality of electronic component storage package regions 6 arranged in columns or rows may be electrically connected. Then, a pair of measurement terminals 4 electrically connected to these electrically connected measurement metallization layers 3 is led out to the outer surface of the mother board 1 or the outer surface of the lattice-like body 2, By confirming the electrical continuity state of these measurement metallization layers 3 collectively through the measurement terminals 4, recesses are formed in a plurality of electronic component storage package regions 6 arranged in columns or rows. 5 can be confirmed efficiently. Also, some of the surrounding metallization layers 3 for measurement among the electronic component storage package regions 6 may be electrically connected by the connection conductors 9, and all the electronic component storage package regions 6 may be connected. The measurement metallization layer 3 may be electrically connected by the connection conductor 9. Further, when it is confirmed that there is no electrical continuity of the measurement terminals 4 and the airtightness of the recesses 5 of the plurality of electronic component storage package regions 6 is lowered, the measurement terminals 4 are divided along the planned dividing line 8. Thereafter, the airtightness of the recess 5 may be confirmed with respect to the electronic component storage package whose electrical continuity has not been confirmed. In the above-described case, the connection conductor 9 is divided between the mother substrate 1 and the lattice-like body 2 or between the lattice-like bodies 2 which are the same layer as the layer on which the measurement metallized layer 3 is formed. The measurement metallization layers 3 adjacent to each other are electrically connected to each other.

  As shown in FIG. 8, the pair of measurement terminals 4 is preferably covered with a measurement pad 10 having a larger area than the measurement terminals 4. With this configuration, even when the electronic component storage package area 6 is small and the measurement terminal 4 is formed small, the measurement is formed larger on the outer surface of the mother board 1 or the outer surface of the lattice-like body 2. Since the measurement device or the like can be satisfactorily brought into contact with the pad 9, the electrical continuity between the pair of measurement terminals 4 can be confirmed, and the recesses 5 of the electronic component storage package regions 6 can be confirmed. Airtightness can be confirmed efficiently and satisfactorily.

  Note that such a measurement pad 10 is made of metal powder metallization such as tungsten, molybdenum, copper, silver, and the like, in a predetermined region of the ceramic green sheet for the mother substrate 1 or the ceramic green sheet for the lattice-like body 2. The metallized paste for the measurement pad 10 was printed and applied by a screen printing method or the like so as to cover the measurement terminal 4, and the ceramic green sheet for the mother substrate 1 and the ceramic green sheet for the lattice 2 were laminated. Thereafter, the metallized paste is deposited on the outer surface of the measurement terminal 4 by firing together with the ceramic green sheet for the mother substrate 1 and the ceramic green sheet for the lattice-like body 2. The metallized paste for the measurement pad 10 can be produced by the same method as the metallized paste for the wiring conductor 7, and the metallized paste is produced in the same manner as the metallized paste for the wiring conductor 7. The viscosity is suitable for printing depending on the amount of the organic solvent.

  In order to prevent the measurement pad 10 from being oxidatively corroded at the portion of the measurement pad 10 exposed on the outer surface of the mother substrate 1 or the grid-like body 2, the thickness 1 to It is preferable that a Ni plating layer having a thickness of about 10 μm and a gold (Au) plating layer having a thickness of about 0.1 to 3 μm are sequentially deposited by an electrolytic plating method or an electroless plating method.

  The electrical continuity state of the measurement terminals 4 of the multi-component electronic component storage package according to the present invention is matched with the position of the pair of measurement terminals 4 led out to the outer surface of the mother board 1 or the grid 2. It can be satisfactorily confirmed by using a measuring instrument provided with an arranged measuring pin. In addition, when a plurality of pairs of measurement terminals 4 are led out to the outer surface, by using a measurement instrument including a plurality of measurement pins arranged in accordance with the positions of each pair of measurement terminals 4, The electrical continuity states of the plurality of pairs of measurement terminals 4 can be measured at the same time, and the plurality of electronic component storage package regions 6 can be efficiently confirmed.

  The present invention is not limited to the multi-package electronic component storage package as described above, but can also be applied to individual electronic component storage packages. Next, an embodiment of an electronic component storage package of the present invention will be described with reference to the accompanying drawings. FIG. 9A is a plan view showing an example of an embodiment of the electronic component storage package of the present invention, FIG. 9B is a cross-sectional view taken along the line EE ′ of FIG. (C) is sectional drawing in the FF 'line | wire of Fig.9 (a). In FIG. 9, 11 is an insulating substrate, 12 is a frame, 13 is a metallization layer for package measurement, 14 is a package measurement terminal, 5 is a recess, and 7 is a wiring conductor.

  The electronic component storage package of the present invention is an electronic component storage package having an insulating base 11 and a frame 12 mounted on at least one main surface of the insulating base 11. A pair of package measurement metallization layers 13 embedded in between and a package measurement metallization layer 13 electrically connected to the package measurement metallization layer 13 and led to the outer surface of the insulating substrate 11 or the outer surface of the frame 12. Terminal 14 is provided.

The insulating base body 11 and the frame body 12 are made of an electrically insulating material such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, for example, an aluminum oxide sintered body. In the case of a body, an appropriate organic solvent or solvent is added to and mixed with raw material powders such as alumina (Al ₂ O ₃ ), silica (SiO ₂ ), calcia (CaO), magnesia (MgO), etc. to form a slurry. At the same time, a ceramic green sheet is obtained by forming the sheet into a sheet shape by adopting a conventionally known doctor blade method, calendar roll method, etc., and then subjecting the ceramic green sheet to an appropriate punching process and a plurality of sheets as necessary. It is manufactured by laminating and baking at a high temperature (about 1500-1800 ° C.).

  In addition, a through-hole serving as the recess 5 is formed in a predetermined region of the ceramic green sheet for the frame 12 by a punching method using a die or a punching machine, or a processing method such as laser processing, so that the ceramic for the frame 12 is formed. The recess 5 is formed by stacking and mounting the green sheet on one main surface of the ceramic green sheet for the insulating substrate 11. Then, both the ceramic green sheet for the insulating base 11 and the ceramic green sheet for the frame 12 are fired at a high temperature, whereby the insulating base 11 and the frame 12 are sintered and integrated.

  A wiring conductor 7 is formed on the insulating base 11 or the frame 12. The wiring conductor 7 functions as a conductive path for electrically connecting the electronic component housed in the recess 5 to the external electric circuit board. Moreover, the wiring conductor 7 formed on the surface of the insulating base 11 or the frame 12 and inside thereof is electrically connected by a through conductor penetrating the insulating base 11 or the frame 12 as necessary. Such a through conductor is formed by a punching method using a die or punching or laser processing on a ceramic green sheet for the insulating substrate 11 or a ceramic green sheet for the frame body 12 prior to printing and application of the metallized paste for forming the wiring conductor. A through hole for the through conductor is formed by a processing method such as the above, and a metallized paste for the through conductor is filled in the through hole for the through conductor by a printing means such as a screen printing method. It is formed in each region by firing together with the ceramic green sheet and the ceramic green sheet for the frame 12. The metallized paste for the wiring conductor 7 and the metallized paste for the through conductor are prepared to have a viscosity suitable for filling depending on the amount of the organic binder and the organic solvent.

  In addition, the portions exposed to the outer surface of the insulating base 11 and the frame body 12 of the wiring conductor 7 are coated with a metal having excellent corrosion resistance such as nickel (Ni), gold (Au), etc. Oxidative corrosion can be effectively prevented, and the connection between the wiring conductor 7 and an electronic component, the electrical connection of the wiring conductor 7 with an Au wire, a solder bump, and the like, and the connection between the wiring conductor 7 and an external circuit board are possible. It can be strong. Therefore, in a portion where the wiring conductor 7 is exposed on the outer surface of the insulating base 11 and the frame body 12, a Ni plating layer having a thickness of about 1 to 10 μm and a gold (Au) plating layer having a thickness of about 0.1 to 3 μm are electrolyzed. It is sequentially deposited by plating or electroless plating.

  The electronic component storage package of the present invention is electrically connected to the package measurement metallization layer 13 embedded between the insulating substrate 11 and the frame 12 and the package measurement metallization layer 13, and is insulated. A pair of package measuring terminals 14 led out to the outer surface of the base 11 or the outer surface of the frame 12 are provided.

  The package measuring metallization layer 13 is embedded around the recess 5, that is, between the recess 5 and the outer edge of the electronic component storage package, and between the insulating base 11 and the frame body 12, and is formed in the recess of the electronic component storage package. 5 functions to confirm the state of airtightness. The package measurement metallization layer 13 is made of metal powder metallization such as tungsten, molybdenum, copper, silver, and the like, and a predetermined region of the ceramic green sheet for the insulating substrate 11 or the ceramic green sheet for the frame 12 (for the insulating substrate 11). The metallized paste for the package measuring metallization layer 13 is printed and applied to the ceramic green sheet and the ceramic green sheet for the frame 12 by a screen printing method or the like, and the ceramic green sheet and the frame for the insulating substrate 11 are coated. After laminating the ceramic green sheet for the body 12, the metallized paste is fired together with the ceramic green sheet for the insulating base 11 and the ceramic green sheet for the frame 12, so that the insulating base 11 and the frame 12 are sandwiched. Embedded and formedThe metallized paste for the measurement metallized layer 3 can be produced by the same method as the metallized paste for the wiring conductor 7, and the metallized paste is produced in the same manner as the metallized paste for the wiring conductor 7. The viscosity is suitable for printing depending on the amount of the organic solvent.

  And in order to be able to confirm the airtightness of the recessed part 5 formed by laminating | stacking the insulation base | substrate 11 and the frame 12 more favorably, the metallization layer 13 for package measurement is the side of the recessed part 5 It is preferable to form it longer than the length. Here, the length of the side of the package measurement metallization layer 13 refers to the length of the package measurement metallization layer 13 along this side.

  The width of the package measuring metallization layer 13 is narrower than the width of the frame 12. The width of the package measurement metallization layer 13 is preferably 0.05 mm or more, although it varies depending on the material and shape of the insulating substrate 11 and the frame 12. When the thickness is less than 0.05 mm, when the metallized paste of the package measurement metallized layer 13 is applied to the ceramic green sheet for the insulating substrate 11 or the ceramic green sheet for the frame 12 by printing, it is better due to blurring during printing. There is a possibility that the metallization layer 13 for package measurement may be disconnected because it cannot be formed.

  The package measurement terminals 14 are formed as a pair electrically connected to the package measurement metallization layer 13 and lead out from the package measurement metallization layer 13 to the outer surface of the insulating base 11 or the outer surface of the frame 12. Function as a conductive path. The package measuring terminal 14 is made of metal powder metallization such as tungsten, molybdenum, copper, or silver, and is packaged in a predetermined region of the ceramic green sheet for the insulating base 11 or the ceramic green sheet for the frame 12 by screen printing or the like. A metallized paste for measurement terminals is printed and applied, and a ceramic green sheet for the insulating substrate 11 and a ceramic green sheet for the frame 12 are laminated. Then, the metallized paste is applied to the ceramic green sheet and the frame for the insulating substrate 11. By firing together with the ceramic green sheet for 12, the lead is formed from the packaged metallization layer 13 to the outer surface of the insulating substrate 11 or the outer surface of the frame 12. The metallized paste for the package measuring terminal 14 can be manufactured by the same method as the metallized paste for the wiring conductor 7, and the metallized paste is manufactured in the same manner as the metallized paste for the wiring conductor 7. The viscosity is suitable for printing depending on the amount of organic solvent.

  The package measurement terminal 14 is led out to the outer surface such as the main surface of the insulating base 11 or the frame 12 or the side surface of the insulating base 11 or the frame 12. When leading out to the main surface of the insulating base 11 or the frame 12, the package measuring metallization layer 13 is used as a through conductor penetrating the insulating base 11 or the frame 12 to the main surface of the insulating base 11 or the frame 12 for package measurement. The terminal 14 may be formed by being led out. When the terminal 14 is led out, the package measuring terminal 14 may be led out from the package measuring metallization layer 13 to the side surface of the insulating substrate 11 or the frame 12. It ’s fine.

  If the formation region is restricted due to the formation of the wiring conductor 7 or the like on the main surface of the insulating base 11 or the frame body 12, the package measuring terminals 14 are led out to the side surfaces of the insulating base body 11 or the frame body 12. It is preferable to keep it. Further, the pair of package measuring terminals 14 are preferably led out to the same direction surface of the insulating substrate 11 or the frame body 12 so as to be able to be efficiently performed when confirming the electrical conduction state.

  In addition, in order to prevent the package measurement terminal 14 from being oxidatively corroded at the portion exposed to the outer surface of the insulating base 11 or the frame 12 of the package measurement terminal 14, the thickness 1 is the same as the wiring conductor 7. It is preferable that a Ni plating layer having a thickness of about 10 μm and a gold (Au) plating layer having a thickness of about 0.1 to 3 μm are sequentially deposited by an electrolytic plating method or an electroless plating method.

  The metallization layer 13 for measuring the package is the same as in the case of the multi-component electronic component storage package described above when a foreign object enters between the insulating substrate 11 and the frame 12 during the manufacturing process. A disconnection occurs due to a defect in coating formation or cutting during the lamination process. Thus, by confirming the electrical conduction state of the package measurement metallization layer 13 via the pair of package measurement terminals 14, the airtightness of the recess 5 can be satisfactorily confirmed with respect to the electronic component storage package. Can do.

  The confirmation of the electrical continuity between the package measuring terminals 14 is performed in the same inspection process as the process of confirming the electrical continuity of various wiring conductors formed in the electronic component storage package. The airtightness of the recess 5 can be efficiently confirmed with respect to the electronic component storage package.

  Further, as shown in FIG. 10, the frame 12 may be composed of a plurality of layers (insulating layers 12a and 12b in FIG. 10), and a package embedded between the layers of the frame 12 composed of a plurality of layers. The measurement metallization layer 13 and a pair of package measurement terminals 14 that are electrically connected to the package measurement metallization layer 13 and led out to the outer surface of the insulating substrate 11 or the frame 12 may be provided. . Such a frame 12 has a predetermined region of a ceramic green sheet for the insulating layer 12a or a ceramic green sheet for the insulating layer 12b (a ceramic green sheet for the insulating layer 12a and a ceramic green sheet for the insulating layer 12b are laminated). The metallized paste for the package measuring metallized layer 13 is printed and applied by screen printing or the like to the ceramic green sheet for the insulating substrate 11 and the ceramic green sheet for the frame 12 (insulating layers 12a, 12b) After being laminated, the metallized paste is baked together with the ceramic green sheet for the insulating base 11 and the ceramic green sheet for the frame 12 so as to be embedded between the frames 12. When a foreign object enters between the frame bodies 12 composed of a plurality of layers during the manufacturing process of the electronic component storage package, as in the case of the multi-component electronic component storage package, the package measurement metallization layer 13 is: Due to the influence of foreign matter, a defect in coating formation during the printing process or cutting during the laminating process occurs, resulting in disconnection. For this reason, by confirming the state of the package measurement metallization layer 13 formed between the frame bodies 2 composed of a plurality of layers via the pair of package measurement terminals 14, the recess 5 is formed in the electronic component storage package. The airtightness of can be confirmed.

  The frame 12 is not limited to being formed from two layers of insulating layers 12a and 12b, and may be formed from three or more layers. For example, as shown in FIG. 11, when the frame 12 is formed of three layers of insulating layers 12 a, 12 b, and 12 c, the package measurement metallization layer 13 is an interlayer with different height positions of the frame 2. It is preferable that each is embedded. With this configuration, by confirming the electrical continuity between the pair of package measuring terminals 14, it is possible to simultaneously confirm the state of each region between layers at different height positions. On the other hand, the airtightness of the recess can be confirmed efficiently and satisfactorily.

  Further, as shown in FIG. 12, the package measurement metallization layers 13 formed in the respective layers may be electrically connected by the connection conductor 9. Thereby, the electrical continuity state of the metallization layer 13 for package measurement of each layer can be measured at the same time, and the airtightness of the recess 5 can be efficiently and satisfactorily confirmed with respect to the electronic component storage package. When the package measurement metallization layer 13 is formed between the insulating substrate 11 and the frame body 12 and between the frame bodies 12, all these package measurement metallization layers 13 are electrically connected in the same manner. It is preferable to keep.

  Further, as shown in FIG. 13, a plurality of package measurement metallization layers 13 are formed, and a pair of package measurement terminals 14 are electrically connected to each of the plurality of package measurement metallization layers 13. preferable. 13A is a plan view showing an example of an electronic component storage package in which a package measurement metallized layer 13 is formed between the insulating substrate 11 and the frame body 12, and FIG. FIG. 13B is a plan view of the insulating base 11 in FIG. In FIG. 13B, the outer periphery of the region where the recess 5 is formed by mounting the frame body 12 is indicated by a broken line.

With this configuration, it is possible to better check the airtightness of the recess 5 through the pair of package measurement terminals 14 for a plurality of regions where the package measurement metallization layer 13 of the electronic component storage package is formed. it can.

  When it is confirmed that there is no electrical continuity between the pair of package measurement terminals 14, the state of each package measurement metallization layer 13 is checked to thereby measure a plurality of packages in the electronic component storage package. It becomes easy to satisfactorily confirm in which region of the region where the metallized layer 13 is formed the airtightness of the recess 5 may be lowered.

  Moreover, it is preferable that the metallization layer 13 for package measurement is formed so that it may circulate around the frame 2 by planar view. Since the package measurement metallization layer 13 surrounds the recess 5 of the electronic component storage package, by confirming the electrical connection state between the pair of package measurement terminals 14, the package measurement metallization layer 13 is recessed with respect to the electronic component storage package. The airtightness in the surrounding area of 5 can be confirmed better.

  Further, it is preferable that the packaged metallization layer 13 for package measurement forms a series circuit or a parallel circuit between the pair of package measurement terminals 14. 14, FIG. 14A is a plan view of the insulating substrate 1 when the package measuring metallization layer 13 forms a series circuit between the insulating substrate 11 and the frame 12, and FIG. FIG. 6B is a plan view of the insulating substrate 1 when the package measuring metallization layer 13 forms a parallel circuit between the insulating substrate 11 and the frame body 12. FIG. 14 shows that a pair of package measurement terminals 14 are led out from the package measurement metallization layer 13 to the side surface of the insulating substrate 1. With this configuration, the electrical continuity between the pair of package measurement terminals 14 can be confirmed by the series circuit and the parallel circuit of the package measurement metallization layer 14 surrounding the recess 5. The airtightness in the surrounding area of the recess 5 can be confirmed more favorably. That is, the confirmation of the state of the package measurement metallization layer 13 can be confirmed by the presence or absence of electrical continuity between the pair of package measurement terminals 14 in the case of a series circuit, and in the case of a parallel circuit, It can be confirmed by the difference in resistance value between the package measuring terminals 14 (resistance value when there is a disconnection and difference between resistance values when there is no disconnection).

  In the case of a parallel circuit, as shown in FIG. 14B, the package measurement metallization layer 13 is arranged so as to surround the entire circumference of the recess 5, so that The airtightness in the entire peripheral region of the recess 5 can be confirmed more favorably.

  Further, as shown in FIG. 15, the package measurement terminal 14 may be covered with a measurement pad 10 having an area larger than that of the package measurement terminal 14 on the outer surface. With this configuration, the measurement pad 10 formed on the outer surface of the insulating substrate 11 or the outer surface of the frame body 12 is provided even when the electronic component storage package is small and the package measurement terminal 14 is formed small. Since it can be confirmed by using a measurement instrument or the like in good contact with each other, the electrical continuity between the pair of package measurement terminals 14 can be confirmed, and the airtightness of the recess 5 with respect to the electronic component storage package can be confirmed. It can be confirmed efficiently and well.

  An electronic device according to the present invention includes the electronic component storage package described above and an electronic component mounted on the electronic component storage package. With this configuration, an electronic component is mounted on a highly reliable electronic component storage package that has been confirmed to have good airtightness in the recess 5, and a highly reliable electronic device is obtained.

  An electronic device is provided by mounting a semiconductor element such as an IC chip or an LSI chip, a piezoelectric element such as a crystal oscillator or a piezoelectric vibrator, or various electronic parts such as various sensors in the recess 5 of the above-described electronic component storage package. It becomes. In the multi-component electronic component storage package, an electronic component may be mounted on the electronic component storage package obtained by dividing the multi-component electronic component storage package along the planned dividing line 8, or a plurality of electronic component storage packages may be mounted. A plurality of electronic devices may be formed by mounting a plurality of electronic components on each electronic component storage package area 6 of the wiring board to obtain a plurality of electronic devices, and then dividing the electronic device. In addition, when a plurality of electronic components are mounted on each electronic component storage package region 6 of the multi-piece wiring board and then divided, the electronic component storage package region 6 confirmed to have good airtightness of the recess 5. It is only necessary to mount electronic components on the electronic component storage package area 6, and after mounting the electronic components on the electronic component storage package area 6, the electronic component storage package area 6 is divided into each of the electronic component storage package areas 6 so that a plurality of highly reliable electronic devices can be efficiently obtained. Can be produced.

  When the electronic component is a flip-chip type semiconductor element, the electrode of the semiconductor element and the wiring conductor are connected via a solder bump, a gold bump, or a conductive resin (anisotropic conductive resin, etc.). In the case where the electronic component is a wire bonding type semiconductor element, it is fixed by a bonding material such as glass, resin, brazing material, etc. This is performed by electrically connecting the electrode of the semiconductor element and the wiring conductor 7. When the electronic component is a piezoelectric element such as a crystal resonator, the piezoelectric element is fixed and the electrode of the piezoelectric element and the wiring conductor 7 are electrically connected by a conductive resin.

  The electronic component is sealed by covering the electronic component with a sealing resin such as an epoxy resin, or a lid made of resin, metal, ceramics or the like placed so as to cover the electronic component is made of glass, resin. It is sealed by being attached to an electronic component storage package with an adhesive such as a brazing material.

  Note that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention. For example, in a multi-package electronic component storage package, the lattice-like body 2 may be mounted on both main surfaces of the mother board 1 and the recesses 5 may be formed on both main surfaces. Further, one or more recesses 5, that is, a plurality of recesses 5 may be formed in each electronic component storage package region 6. In the case as described above, the measurement metallization layer 3 may be formed around each recess 5 and a pair of measurement terminals 4 electrically connected to the measurement metallization layer 3 may be formed. Note that the above-described example is not limited to the multi-component electronic component storage package, but can be applied to the electronic component storage package.

(A) is a top view which shows an example of embodiment of the package for taking multiple electronic components of this invention, (b) is sectional drawing in the AA 'line of (a), (c). These are sectional drawings in the BB 'line of (a). (A) is a top view which shows an example of embodiment of the package for multiple picking of electronic components of this invention, (b) is sectional drawing in CC 'line of (a), (c) These are sectional drawings in the DD 'line of (a). It is sectional drawing which shows an example of embodiment of the package for taking multiple electronic components of this invention. (A) is a top view which shows an example of embodiment of the package for picking up multiple electronic components of this invention, (b) is a top view which shows the motherboard in (a). (A) is a top view which shows an example of embodiment of the package for picking up multiple electronic components of this invention, (b) is a top view which shows the motherboard in (a). (A) is a top view which shows an example of embodiment of the package for picking up multiple electronic components of this invention, (b) is a top view which shows the motherboard in (a). It is sectional drawing which shows an example of embodiment of the package for taking multiple electronic components of this invention. It is sectional drawing which shows an example of embodiment of the package for taking multiple electronic components of this invention. (A) is a top view which shows an example of embodiment of the electronic component storage package of this invention, (b) is sectional drawing in the EE 'line of (a), (c) is ( It is sectional drawing in the FF 'line of a). (A) is a top view which shows an example of embodiment of the electronic component storage package of this invention, (b) is sectional drawing in the GG 'line | wire of (a), (c) is ( It is sectional drawing in the HH 'line of a). It is sectional drawing which shows an example of embodiment of the electronic component storage package of this invention. It is sectional drawing which shows an example of embodiment of the electronic component storage package of this invention. (A) is a top view which shows an example of embodiment of the electronic component storage package of this invention, (b) is a top view which shows the insulation base | substrate in (a). BRIEF DESCRIPTION OF THE DRAWINGS It is an example of embodiment of the electronic component storage package of this invention, (a) is a top view of the insulated base in which the metallization layer for package measurement shows a series circuit, (b) is the metallization layer for package measurement FIG. 3 is a plan view of an insulating substrate showing a parallel circuit. (A) is a top view which shows an example of embodiment of the electronic component storage package of this invention, (b) is sectional drawing in the II 'line of (a), (c) is ( It is sectional drawing in the JJ 'line of a).

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Mother board 2 ... Lattice-like body 3 ... Measurement metallization layer 4 ... Measurement terminal 5 ... Recess 6 ... Package area 7 for electronic component accommodation ... Wiring conductor 8 ... Division line 9 ... Connection conductor 10 ... Measurement pad 11 ... Insulating substrate 12 ... Frame body 13 ... Package measurement metallization layer 14 ... Package measurement terminal

Claims (17)

An electronic component storage package having an insulating base and a frame mounted on at least one main surface of the insulating base,
A metallization layer for package measurement embedded between the insulating base and the frame, and electrically connected to the metallization layer for package measurement, to the outer surface of the insulating base or the outer surface of the frame An electronic component storage package comprising: a pair of derived package measurement terminals. An electronic component storage package having an insulating base and a frame body composed of a plurality of layers mounted on at least one main surface of the insulating base,
A metallization layer for package measurement embedded between the layers of the frame, and a pair of package measurement terminals that are electrically connected to the metallization layer for package measurement and led to the outer surface of the insulating base or frame And a package for storing electronic components.   The electronic component storage package according to claim 2, wherein the metallization layer for measuring the package is embedded in each of the layers having different height positions of the frame.   3. The package measurement metallization layer is formed in plural, and a pair of package measurement terminals are electrically connected to each of the plurality of package measurement metallization layers. 3. An electronic component storage package according to 3.   The electronic component storage package according to any one of claims 2 to 4, wherein the package measurement metallization layer is formed so as to circulate in the frame body in a plan view. 6. The electronic component storage package according to claim 5, wherein the package measuring metallization layer forms a series circuit or a parallel circuit between a pair of package measuring terminals. A plurality of electronic component storage packages having a grid-like body disposed on at least one main surface of a mother board, and having a plurality of recesses and a plurality of electronic component storage package regions corresponding to the recesses,
A metallization layer for measurement embedded between the mother board and the lattice-like body of each electronic component storage package region;
A plurality of electronic component housings, characterized by comprising a pair of measurement terminals that are electrically connected to the measurement metallization layer and led to the outer surface of the mother board or the outer surface of the grid-like body For package. A multi-package electronic component storage package having a plurality of layers and a plurality of recesses and a plurality of electronic component storage package regions corresponding to the recesses on at least one main surface of the mother board. Because
A metallization layer for measurement embedded between the layers of the plurality of layers of the electronic component storage package region, and electrically connected to the metallization layer for measurement, and an outer surface of the mother board or A package for storing multiple electronic components, comprising a pair of measuring terminals led to the outer surface of the grid-like body.   9. The multi-component electronic component storage package according to claim 8, wherein the measurement metallization layer is embedded in each of the layers having different height positions of the lattice-like body.   A plurality of the measurement metallization layers are formed in each of the electronic component storage package regions, and a pair of measurement terminals are electrically connected to each of the plurality of measurement metallization layers. A package for storing a plurality of electronic components according to any one of claims 7 to 9.   8. Each of the measurement metallization layers in each electronic component storage package region is formed so as to surround the concave portion of each electronic component storage package region in a plan view. A package for storing a plurality of electronic components according to claim 10.   12. The multi-component electronic component storage package according to claim 11, wherein the measurement metallization layer forms a series circuit or a parallel circuit between a pair of measurement terminals.   The mother board includes an outer dummy area outside the arrangement area of the electronic component storage package area, and the measurement terminal is led out to one main surface of the mother board in the outer dummy area. A package for storing a plurality of electronic components according to any one of claims 7 to 12.   The mother board includes an intermediate dummy area between adjacent electronic component storage package areas, and the measurement terminal is led out to one main surface of the mother board in the intermediate dummy area. A package for storing multiple electronic components according to any one of claims 7 to 12.   The multi-component electronic component storage package according to claim 9, wherein the measurement metallized layers formed between layers having different height positions are electrically connected by a connection conductor.   An electronic device comprising the electronic component storage package according to any one of claims 1 to 6 and an electronic component mounted on the electronic component storage package. The multi-component electronic component storage package according to claim 7, and an electronic component mounted in the electronic component storage package region of the multi-component electronic component storage package. An electronic device obtained by dividing a plurality of electronic devices into electronic component storage package areas.

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