JP2008027937A5 - - Google Patents

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Publication number
JP2008027937A5
JP2008027937A5 JP2006195066A JP2006195066A JP2008027937A5 JP 2008027937 A5 JP2008027937 A5 JP 2008027937A5 JP 2006195066 A JP2006195066 A JP 2006195066A JP 2006195066 A JP2006195066 A JP 2006195066A JP 2008027937 A5 JP2008027937 A5 JP 2008027937A5
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JP
Japan
Prior art keywords
cassette
wafer
vacuum processing
processing
processing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006195066A
Other languages
English (en)
Japanese (ja)
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JP2008027937A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006195066A priority Critical patent/JP2008027937A/ja
Priority claimed from JP2006195066A external-priority patent/JP2008027937A/ja
Publication of JP2008027937A publication Critical patent/JP2008027937A/ja
Publication of JP2008027937A5 publication Critical patent/JP2008027937A5/ja
Pending legal-status Critical Current

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JP2006195066A 2006-07-18 2006-07-18 真空処理装置 Pending JP2008027937A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006195066A JP2008027937A (ja) 2006-07-18 2006-07-18 真空処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006195066A JP2008027937A (ja) 2006-07-18 2006-07-18 真空処理装置

Publications (2)

Publication Number Publication Date
JP2008027937A JP2008027937A (ja) 2008-02-07
JP2008027937A5 true JP2008027937A5 (zh) 2009-07-23

Family

ID=39118304

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006195066A Pending JP2008027937A (ja) 2006-07-18 2006-07-18 真空処理装置

Country Status (1)

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JP (1) JP2008027937A (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010123733A (ja) * 2008-11-19 2010-06-03 Tokyo Electron Ltd 基板処理装置及びその処理方法、並びに記憶媒体
JP5463066B2 (ja) * 2009-04-30 2014-04-09 東京エレクトロン株式会社 ロット処理開始判定方法及び制御装置
JP6213079B2 (ja) * 2013-09-09 2017-10-18 シンフォニアテクノロジー株式会社 Ｅｆｅｍ
JP7215412B2 (ja) * 2019-12-26 2023-01-31 株式会社Sumco 半導体ウェーハ用研磨布の使用開始時期の判定方法及びそれを用いた半導体ウェーハの研磨方法、並びに半導体ウェーハ研磨システム

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2881228B2 (ja) * 1988-11-07 1999-04-12 東京エレクトロン株式会社 移し換え装置及び被処理体の処理方法
JP2644912B2 (ja) * 1990-08-29 1997-08-25 株式会社日立製作所 真空処理装置及びその運転方法
JP2001127044A (ja) * 1999-10-29 2001-05-11 Hitachi Ltd 真空処理装置および真空処理システム
JP2004153185A (ja) * 2002-10-31 2004-05-27 Applied Materials Inc 基板処理方法
JP2004172395A (ja) * 2002-11-20 2004-06-17 Tokyo Seimitsu Co Ltd 半導体製造装置
JP2004304116A (ja) * 2003-04-01 2004-10-28 Hitachi Kokusai Electric Inc 基板処理装置
JP4246654B2 (ja) * 2004-03-08 2009-04-02 株式会社日立ハイテクノロジーズ 真空処理装置
JP2005286102A (ja) * 2004-03-30 2005-10-13 Hitachi High-Technologies Corp 真空処理装置および真空処理方法
JP4749690B2 (ja) * 2004-09-10 2011-08-17 株式会社日立ハイテクノロジーズ 真空処理装置
JP2006120799A (ja) * 2004-10-20 2006-05-11 Tokyo Electron Ltd 基板処理装置、基板載置台交換方法、及びプログラム

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