JP2008004971A5 - - Google Patents

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Publication number
JP2008004971A5
JP2008004971A5 JP2007249579A JP2007249579A JP2008004971A5 JP 2008004971 A5 JP2008004971 A5 JP 2008004971A5 JP 2007249579 A JP2007249579 A JP 2007249579A JP 2007249579 A JP2007249579 A JP 2007249579A JP 2008004971 A5 JP2008004971 A5 JP 2008004971A5
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JP
Japan
Prior art keywords
resin
resin sheet
mold
die pad
back surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007249579A
Other languages
English (en)
Japanese (ja)
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JP2008004971A (ja
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Publication date
Application filed filed Critical
Priority to JP2007249579A priority Critical patent/JP2008004971A/ja
Priority claimed from JP2007249579A external-priority patent/JP2008004971A/ja
Publication of JP2008004971A publication Critical patent/JP2008004971A/ja
Publication of JP2008004971A5 publication Critical patent/JP2008004971A5/ja
Pending legal-status Critical Current

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JP2007249579A 2007-09-26 2007-09-26 半導体装置およびその製造方法 Pending JP2008004971A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007249579A JP2008004971A (ja) 2007-09-26 2007-09-26 半導体装置およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007249579A JP2008004971A (ja) 2007-09-26 2007-09-26 半導体装置およびその製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2003339730A Division JP2005109100A (ja) 2003-09-30 2003-09-30 半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
JP2008004971A JP2008004971A (ja) 2008-01-10
JP2008004971A5 true JP2008004971A5 (enExample) 2009-10-15

Family

ID=39009047

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007249579A Pending JP2008004971A (ja) 2007-09-26 2007-09-26 半導体装置およびその製造方法

Country Status (1)

Country Link
JP (1) JP2008004971A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4947135B2 (ja) 2009-12-04 2012-06-06 株式会社デンソー 半導体パッケージおよびその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10125826A (ja) * 1996-10-24 1998-05-15 Hitachi Ltd 半導体装置及びその製法

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