JP2007535129A - 光起電装置用の多重帯域半導体組成物 - Google Patents
光起電装置用の多重帯域半導体組成物 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims description 64
- 239000000203 mixture Substances 0.000 title claims description 44
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 34
- 239000000956 alloy Substances 0.000 claims abstract description 34
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 17
- 239000001301 oxygen Substances 0.000 claims abstract description 10
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 9
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 claims description 8
- 229910002059 quaternary alloy Inorganic materials 0.000 claims description 6
- 229910052711 selenium Inorganic materials 0.000 claims description 6
- 229910052717 sulfur Inorganic materials 0.000 claims description 6
- 229910002058 ternary alloy Inorganic materials 0.000 claims description 6
- 229910021476 group 6 element Inorganic materials 0.000 claims description 5
- 229910052749 magnesium Inorganic materials 0.000 claims description 3
- 229910052748 manganese Inorganic materials 0.000 claims description 3
- 229910052714 tellurium Inorganic materials 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 23
- 238000001228 spectrum Methods 0.000 abstract description 12
- 230000008018 melting Effects 0.000 abstract description 11
- 238000002844 melting Methods 0.000 abstract description 11
- 238000006243 chemical reaction Methods 0.000 abstract description 10
- 238000002347 injection Methods 0.000 abstract description 5
- 239000007924 injection Substances 0.000 abstract description 5
- 238000005468 ion implantation Methods 0.000 abstract description 3
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- 239000013078 crystal Substances 0.000 description 8
- 239000000523 sample Substances 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 6
- 229910052757 nitrogen Inorganic materials 0.000 description 6
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 5
- 238000000137 annealing Methods 0.000 description 5
- 125000004429 atom Chemical group 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 238000013461 design Methods 0.000 description 5
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- 238000002513 implantation Methods 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 125000004430 oxygen atom Chemical group O* 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 229910052785 arsenic Inorganic materials 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
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- 238000001451 molecular beam epitaxy Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 229910004613 CdTe Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 150000001450 anions Chemical class 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
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- 239000002019 doping agent Substances 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000005224 laser annealing Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
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- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 241000183024 Populus tremula Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000756 V alloy Inorganic materials 0.000 description 1
- 229910007709 ZnTe Inorganic materials 0.000 description 1
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 229910002056 binary alloy Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
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- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910021478 group 5 element Inorganic materials 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000009396 hybridization Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000001907 polarising light microscopy Methods 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 238000004549 pulsed laser deposition Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
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Abstract
Description
本願に説明し特許請求される本発明は、米国エネルギー省とカリフォルニア州立大学間の契約番号第DE-AC03-76SF000-98の下に、米国エネルギー省によって提供された助成金を部分的に用いて行われた。政府は本発明に関して一定の権利を有する。
(II族)(x)(A)(1-x)(SまたはSe)(1-y-z)(Te)(y)(O)z、0<x≦1、0<z<0.04、0<y<0.2。材料は以下のように作製することができる。ZnSe1-yTey基板(0<y<0.2)に1〜4%のOを注入した。上部層をレーザー光の短いパルスで溶融した。上部層の4帯域層をn型にドープして、p型基板でp/n接合を形成することができる。
本願に説明する半導体材料を用いる太陽電池の調製。Zn1-yMnyTe(または類似材料)のp型基板は1〜4原子%のOおよび0〜1原子%のClを注入することができる。次いで、上部の注入層は短いレーザーパルスで溶融される。電子濃度1017〜1019cm-3の再成長したn型層はp基板でp/n接合を形成する。金属オーミック接触は基板の裏面に形成される。n型層への前面の接触はZnOまたはInSnO合金などの透明導体を用いて形成される。
(II族)(1-y)(A)(y)Ox(VI族)(1-x)、0≦y<1、0<x<0.1の調製、“A”はMgを含む。90keVおよび30keVのO+を用いる多重エネルギー注入をZn1-yMnyTe(y=0および0.12)単結晶に行って、0.0165〜0.044のOモル比に対応する比較的一定のO濃度を有する厚さ〜0.2μmの層を形成した。その全てを参照して本願に援用しているK.M.Yu, W.Walukiewicz, M.A.Scarpulla, O.D.Dubin, J.Jasinski, Z.Liliental-Weber, J.Wu, J.W.Beeman, M.R.Pillai, and M.J.Aziz, J.Appli.Phys. 94,1043(2003)に述べられたように、FWHMパルス期間〜38nsのKrFレーザー(λ=248nm)を用いてO+注入サンプルを空気中でパルスレーザー溶融した。多重プリズムホモジェナイザーを通過させた後、サンプルでのフルエンスは0.020〜0.3J/cm2の範囲であった。いくつかのサンプルは、PLMの後、300〜700℃で10秒間N2流中でRTAを行った。
GaNxAs1-x-yPyの調製、式中、0.3≦y<0.5、0<x<0.05である。GaAs1-yPy(0.3≦y≦0.5)単結晶中へNを多重エネルギー注入し、0<x<0.05のNモル比に対応する比較的一定のN濃度の薄膜を形成する。N+注入サンプルを、光子フルエンスを変化させてパルスレーザー溶融する。また、分子ビームエピタキシャルおよび金属有機化学蒸着を含む適切な薄膜成長エピタキシャル技術を用いて、0.3≦y<0.5、0<x<0.05のGaNxAs1-x-yPyを成長させることができる。図7は、GaNxAs1-x-yPy中の伝導帯域エネルギー最小値EгおよびExに関する窒素エネルギーENレベルの位置を示す。中間の窒素誘導帯域は、ENがEг以下に降下し、EгがまだExの最小値以下であるとき、最も良く形成される。図7に見られるように、これは0.4≦y<0.6で起きる。
Ga1-yInyNxP1-xの調製、式中、0.4≦y<0.6、0<x<0.05である。Ga1-yInyP(0.4≦y≦0.6)単結晶中へNを多重エネルギー注入し、0<x<0.05のNモル比に対応する比較的一定のN濃度の薄膜を形成する。N+注入サンプルを、変動する光子フルエンスでパルスレーザー溶融する。また、分子ビームエピタキシャルおよび金属有機化学蒸着を含む適切な薄膜成長エピタキシャル技術を用いて、0.3≦y<0.5、0<x<0.05のGa1-yInyNxP1-xを成長することができる。
明瞭な理解のため、前述の発明をいくらか詳細に説明したが、当業者であれば、本発明の範囲と精神から逸脱することなく、上述の好ましい実施形態の様々な翻案と修正が可能である。したがって、説明した実施形態は例示であって制限するものではなく、本発明は
本明細書に与えられた詳細に制限されず、以下の請求項およびその等価の全範囲によって定義されるべきである。
Claims (25)
- 三元または四元合金を含む半導体組成物であって、
前記合金が、II族元素、VI族元素、酸素、および任意選択的に第3の元素“A”を含み、
前記合金が、(II族)(1-y)(A)yOx(VI族)(1-x)、0≦y<1、0<x<1、のモル比組成物を有し、“A”がMgを含む半導体組成物。 - 前記合金が、Zn0.88A0.12OxTe1-x、0<x<0.05を含む請求項1に記載の半導体組成物。
- xが約0.01〜0.05である請求項2に記載の半導体組成物。
- xが約0.02〜0.04である請求項3に記載の半導体組成物。
- 前記合金が、Cd1-yMgyOxTe1-x、0<y<1、0<x<0.05を含む請求項1に記載の半導体組成物。
- xが約0.01〜0.05である請求項5に記載の半導体組成物。
- xが約0.02〜0.04である請求項3に記載の半導体組成物。
- 三元または四元合金を含む半導体組成物であって、
前記合金が、II族元素、VI族元素、酸素、および任意選択的に第3の元素“A”を含み、
前記合金が、(II族)(1-y)(A)yOx(VI族)(1-x)、0≦y<1、0<x<0.05のモル比組成物を有し、“A”がMnまたはMgを含み、II族元素がCdを含まない半導体組成物。 - 前記合金が、Zn0.88A0.12OxTe1-x、0<x<0.05である請求項8に記載の半導体組成物。
- xが約0.01〜0.05である請求項9に記載の半導体組成物。
- xが約0.02〜0.04である請求項10に記載の半導体組成物。
- II族元素、任意選択的に他のII族元素“A”を含み、さらにSまたはSeを含み、さらに酸素およびテルリウムを含む半導体組成物であって、
前記組成物が、(II族)(x)(A)(1-x)(SまたはSe)(1-y-z)(Te)(y)(O)z、0<x≦1、0<z<0.04、0<y<0.2のモル比組成物を有する半導体組成物。 - 前記組成物が、ZnxMn1-xSe(1-y-z)TeyOz、0<x≦1、0<z<0.04、0<y<0.2を含む請求項12に記載の半導体組成物。
- zが約0.01〜0.04である請求項13に記載の半導体組成物。
- zが約0.02〜0.04である請求項14に記載の半導体組成物。
- GaNxAs1-x-yPy、0.3≦y<0.5、0<x<0.05を含む合金を含む半導体組成物。
- 0.01≦x≦0.04である請求項16に記載の半導体組成物。
- 0.02≦x≦0.03である請求項17に記載の半導体組成物。
- Ga1-yInyNxP1-x、0.4≦y<0.6、0<x<0.05を含む合金を含む半導体組成物。
- 0.01≦x≦0.04である請求項19に記載の半導体組成物。
- 0.02≦x≦0.03である請求項20に記載の半導体組成物。
- 請求項1に記載の組成物を含む光起電装置。
- 請求項8に記載の組成物を含む光起電装置。
- 請求項12に記載の組成物を含む光起電装置。
- 請求項19に記載の組成物を含む光起電装置。
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US52621003P | 2003-12-01 | 2003-12-01 | |
PCT/US2004/039900 WO2005055285A2 (en) | 2003-12-01 | 2004-11-29 | Multiband semiconductor compositions for photovoltaic devices |
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EP (1) | EP1695388A2 (ja) |
JP (1) | JP2007535129A (ja) |
CN (3) | CN101416321A (ja) |
HK (1) | HK1149366A1 (ja) |
WO (1) | WO2005055285A2 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2009512181A (ja) * | 2005-10-06 | 2009-03-19 | ビーエーエスエフ ソシエタス・ヨーロピア | 光起電活性の半導体材料を含む光電池 |
WO2010095681A1 (ja) | 2009-02-20 | 2010-08-26 | 国立大学法人京都工芸繊維大学 | 光吸収材料及びそれを用いた光電変換素子 |
WO2011115171A1 (ja) | 2010-03-18 | 2011-09-22 | 国立大学法人京都工芸繊維大学 | 光吸収材料およびそれを用いた光電変換素子 |
KR101407805B1 (ko) | 2006-01-03 | 2014-06-17 | 바스프 에스이 | 광전 활성 반도체 재료 및 광전지 |
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JP4868855B2 (ja) * | 2006-01-12 | 2012-02-01 | シャープ株式会社 | 多接合型太陽電池セル |
ES2293862B2 (es) | 2007-10-17 | 2009-02-16 | Universidad Politecnica De Madrid | Celula solar de banda intermedia de puntos cuanticos con acoplamiento optimo de la luz por difraccion. |
CA2745269A1 (en) * | 2008-01-28 | 2009-08-06 | Amit Goyal | [100] or [110] aligned, semiconductor-based, large-area, flexible, electronic devices |
CN102339893A (zh) * | 2010-07-23 | 2012-02-01 | 上海凯世通半导体有限公司 | 太阳能晶片的制备方法 |
CN102339894A (zh) * | 2010-07-23 | 2012-02-01 | 上海凯世通半导体有限公司 | 太阳能电池的制备方法 |
CN104200000B (zh) * | 2014-07-23 | 2017-09-26 | 江苏大学 | 基于Al‑N共掺的ZnO金属陶瓷薄膜P型转化设计方法 |
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- 2004-11-29 CN CN2012102265879A patent/CN102738259A/zh active Pending
- 2004-11-29 CN CN 201010129583 patent/CN101853889B/zh not_active Expired - Fee Related
- 2004-11-29 WO PCT/US2004/039900 patent/WO2005055285A2/en active Application Filing
- 2004-11-29 JP JP2006541490A patent/JP2007535129A/ja active Pending
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Cited By (6)
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JP2009512181A (ja) * | 2005-10-06 | 2009-03-19 | ビーエーエスエフ ソシエタス・ヨーロピア | 光起電活性の半導体材料を含む光電池 |
KR101407805B1 (ko) | 2006-01-03 | 2014-06-17 | 바스프 에스이 | 광전 활성 반도체 재료 및 광전지 |
WO2010095681A1 (ja) | 2009-02-20 | 2010-08-26 | 国立大学法人京都工芸繊維大学 | 光吸収材料及びそれを用いた光電変換素子 |
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JP5328887B2 (ja) * | 2009-02-20 | 2013-10-30 | 国立大学法人京都工芸繊維大学 | 光吸収材料及びそれを用いた光電変換素子 |
WO2011115171A1 (ja) | 2010-03-18 | 2011-09-22 | 国立大学法人京都工芸繊維大学 | 光吸収材料およびそれを用いた光電変換素子 |
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WO2005055285A2 (en) | 2005-06-16 |
WO2005055285A3 (en) | 2013-01-10 |
EP1695388A2 (en) | 2006-08-30 |
CN102738259A (zh) | 2012-10-17 |
CN101853889B (zh) | 2012-07-04 |
HK1149366A1 (en) | 2011-09-30 |
CN101416321A (zh) | 2009-04-22 |
CN101853889A (zh) | 2010-10-06 |
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