JP2007526601A - 拡散バリア層および拡散バリア層の製造方法 - Google Patents

拡散バリア層および拡散バリア層の製造方法 Download PDF

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Publication number
JP2007526601A
JP2007526601A JP2006553410A JP2006553410A JP2007526601A JP 2007526601 A JP2007526601 A JP 2007526601A JP 2006553410 A JP2006553410 A JP 2006553410A JP 2006553410 A JP2006553410 A JP 2006553410A JP 2007526601 A JP2007526601 A JP 2007526601A
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Japan
Prior art keywords
diffusion barrier
layer
barrier system
substrate
process chamber
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JP2006553410A
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English (en)
Japanese (ja)
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JP2007526601A5 (enExample
Inventor
カラッツィ・オルソン，マリアム
トラン・クオック，ハイ
ガリッシアン，アリス
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OC Oerlikon Balzers AG
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OC Oerlikon Balzers AG
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Application filed by OC Oerlikon Balzers AG filed Critical OC Oerlikon Balzers AG
Publication of JP2007526601A publication Critical patent/JP2007526601A/ja
Publication of JP2007526601A5 publication Critical patent/JP2007526601A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/917—Electroluminescent
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/32—Composite [nonstructural laminate] of inorganic material having metal-compound-containing layer and having defined magnetic layer
    • Y10T428/325—Magnetic layer next to second metal compound-containing layer

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  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Laminated Bodies (AREA)
  • Chemical Vapour Deposition (AREA)
JP2006553410A 2004-02-20 2005-02-16 拡散バリア層および拡散バリア層の製造方法 Pending JP2007526601A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US54627404P 2004-02-20 2004-02-20
PCT/CH2005/000088 WO2005081333A2 (en) 2004-02-20 2005-02-16 Diffusion barrier layer and method for manufacturing a diffusion barrier layer

Publications (2)

Publication Number Publication Date
JP2007526601A true JP2007526601A (ja) 2007-09-13
JP2007526601A5 JP2007526601A5 (enExample) 2008-02-28

Family

ID=34886254

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006553410A Pending JP2007526601A (ja) 2004-02-20 2005-02-16 拡散バリア層および拡散バリア層の製造方法

Country Status (6)

Country Link
US (2) US7492091B2 (enExample)
EP (1) EP1719192A2 (enExample)
JP (1) JP2007526601A (enExample)
CN (1) CN1977404B (enExample)
TW (1) TWI384583B (enExample)
WO (1) WO2005081333A2 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008231570A (ja) * 2007-02-23 2008-10-02 Tohcello Co Ltd 薄膜、及びその製造方法
JP2013036078A (ja) * 2011-08-05 2013-02-21 Ulvac Japan Ltd 成膜方法
JP2014515864A (ja) * 2011-03-30 2014-07-03 ▲海▼洋王照明科技股▲ふん▼有限公司 基板及びその製造方法、ならびに当該基板を使用する有機電界発光デバイス
JP2016523442A (ja) * 2013-06-29 2016-08-08 アイクストロン、エスイー 高性能コーティングの堆積方法及びカプセル化電子デバイス

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WO2006033233A1 (ja) * 2004-09-21 2006-03-30 Konica Minolta Holdings, Inc. 透明ガスバリア性フィルム
US7868903B2 (en) * 2004-10-14 2011-01-11 Daktronics, Inc. Flexible pixel element fabrication and sealing method
US8344410B2 (en) 2004-10-14 2013-01-01 Daktronics, Inc. Flexible pixel element and signal distribution means
US7893948B1 (en) 2004-10-14 2011-02-22 Daktronics, Inc. Flexible pixel hardware and method
JP4869348B2 (ja) * 2006-08-29 2012-02-08 パイオニア株式会社 ガスバリアフィルム及びその製造方法
JP5164465B2 (ja) * 2007-07-27 2013-03-21 株式会社アルバック 樹脂基板
JP5164464B2 (ja) * 2007-07-27 2013-03-21 株式会社アルバック 樹脂基板
JP4729759B2 (ja) * 2009-06-29 2011-07-20 富士電機株式会社 有機ｅｌ素子用封止膜、有機ｅｌ素子および有機ｅｌディスプレイ
WO2011006018A2 (en) 2009-07-08 2011-01-13 Plasmasi, Inc. Apparatus and method for plasma processing
FR2949775B1 (fr) 2009-09-10 2013-08-09 Saint Gobain Performance Plast Substrat de protection pour dispositif collecteur ou emetteur de rayonnement
FR2949776B1 (fr) 2009-09-10 2013-05-17 Saint Gobain Performance Plast Element en couches pour l'encapsulation d'un element sensible
US8765232B2 (en) 2011-01-10 2014-07-01 Plasmasi, Inc. Apparatus and method for dielectric deposition
KR101761834B1 (ko) 2011-01-28 2017-07-27 서울바이오시스 주식회사 웨이퍼 레벨 발광 다이오드 패키지 및 그것을 제조하는 방법
FR2973939A1 (fr) * 2011-04-08 2012-10-12 Saint Gobain Element en couches pour l’encapsulation d’un element sensible
TWI450650B (zh) 2011-05-16 2014-08-21 Ind Tech Res Inst 可撓式基材及可撓式電子裝置
CN102842683A (zh) * 2011-06-21 2012-12-26 海洋王照明科技股份有限公司 有机电致发光器件及其制作方法
TWI447955B (zh) 2011-11-23 2014-08-01 Ind Tech Res Inst 發光二極體元件、其導光結構的形成方法與形成設備
US9761830B1 (en) * 2012-05-14 2017-09-12 Eclipse Energy Systems, Inc. Environmental protection film for thin film devices
US9299956B2 (en) 2012-06-13 2016-03-29 Aixtron, Inc. Method for deposition of high-performance coatings and encapsulated electronic devices
US10526708B2 (en) 2012-06-19 2020-01-07 Aixtron Se Methods for forming thin protective and optical layers on substrates
TWI477642B (zh) * 2012-07-25 2015-03-21 E Ink Holdings Inc 阻氣基板
KR101892433B1 (ko) * 2012-12-31 2018-08-30 생-고뱅 퍼포먼스 플라스틱스 코포레이션 유연성 기재 상의 박막 규소질화물 장벽 층들
TWI514563B (zh) * 2013-09-09 2015-12-21 Innolux Corp 電子裝置與軟性基板的製造方法
CN104425735A (zh) * 2013-09-09 2015-03-18 群创光电股份有限公司 电子装置
US9373817B2 (en) 2014-07-11 2016-06-21 Industrial Technology Research Institute Substrate structure and device employing the same
CN105449123B (zh) * 2015-11-18 2018-03-06 上海大学 水氧阻隔层的制备方法

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JP2001284042A (ja) * 2000-03-31 2001-10-12 Denso Corp 有機ｅｌ素子
WO2003050894A2 (en) * 2001-12-13 2003-06-19 Koninklijke Philips Electronics N.V. Sealing structure for display devices
JP2003297556A (ja) * 2002-04-02 2003-10-17 Dainippon Printing Co Ltd 表示素子用基材、表示パネル、表示装置及び表示素子用基材の製造方法

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US6110544A (en) * 1997-06-26 2000-08-29 General Electric Company Protective coating by high rate arc plasma deposition
US6458512B1 (en) * 1998-10-13 2002-10-01 3M Innovative Properties Company Oxynitride encapsulated electroluminescent phosphor particles
US6268695B1 (en) 1998-12-16 2001-07-31 Battelle Memorial Institute Environmental barrier material for organic light emitting device and method of making
US6573652B1 (en) * 1999-10-25 2003-06-03 Battelle Memorial Institute Encapsulated display devices
US6576351B2 (en) 2001-02-16 2003-06-10 Universal Display Corporation Barrier region for optoelectronic devices
JP4147008B2 (ja) 2001-03-05 2008-09-10 株式会社日立製作所 有機ｅｌ素子に用いるフィルム及び有機ｅｌ素子
US6597111B2 (en) 2001-11-27 2003-07-22 Universal Display Corporation Protected organic optoelectronic devices
JP4101511B2 (ja) * 2001-12-27 2008-06-18 株式会社半導体エネルギー研究所 発光装置及びその作製方法
US7098069B2 (en) * 2002-01-24 2006-08-29 Semiconductor Energy Laboratory Co., Ltd. Light emitting device, method of preparing the same and device for fabricating the same
US7268486B2 (en) * 2002-04-15 2007-09-11 Schott Ag Hermetic encapsulation of organic, electro-optical elements
US7015640B2 (en) * 2002-09-11 2006-03-21 General Electric Company Diffusion barrier coatings having graded compositions and devices incorporating the same

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
JP2001284042A (ja) * 2000-03-31 2001-10-12 Denso Corp 有機ｅｌ素子
WO2003050894A2 (en) * 2001-12-13 2003-06-19 Koninklijke Philips Electronics N.V. Sealing structure for display devices
JP2005512299A (ja) * 2001-12-13 2005-04-28 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ ディスプレイ装置のための密封構造
JP2003297556A (ja) * 2002-04-02 2003-10-17 Dainippon Printing Co Ltd 表示素子用基材、表示パネル、表示装置及び表示素子用基材の製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008231570A (ja) * 2007-02-23 2008-10-02 Tohcello Co Ltd 薄膜、及びその製造方法
JP2014515864A (ja) * 2011-03-30 2014-07-03 ▲海▼洋王照明科技股▲ふん▼有限公司 基板及びその製造方法、ならびに当該基板を使用する有機電界発光デバイス
US9059416B2 (en) 2011-03-30 2015-06-16 Ocean's King Lighting Science & Technology Co., Ltd. Substrate, manufacturing method thereof, and organo-electroluminescent device using the same
JP2013036078A (ja) * 2011-08-05 2013-02-21 Ulvac Japan Ltd 成膜方法
JP2016523442A (ja) * 2013-06-29 2016-08-08 アイクストロン、エスイー 高性能コーティングの堆積方法及びカプセル化電子デバイス

Also Published As

Publication number Publication date
US7492091B2 (en) 2009-02-17
WO2005081333A3 (en) 2006-01-05
CN1977404B (zh) 2010-05-12
EP1719192A2 (en) 2006-11-08
TWI384583B (zh) 2013-02-01
WO2005081333A2 (en) 2005-09-01
CN1977404A (zh) 2007-06-06
TW200532846A (en) 2005-10-01
US20090087998A1 (en) 2009-04-02
US20050194898A1 (en) 2005-09-08

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