TWI384583B - 擴散阻障層及製造擴散阻障層之方法 - Google Patents

擴散阻障層及製造擴散阻障層之方法 Download PDF

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Publication number
TWI384583B
TWI384583B TW094104751A TW94104751A TWI384583B TW I384583 B TWI384583 B TW I384583B TW 094104751 A TW094104751 A TW 094104751A TW 94104751 A TW94104751 A TW 94104751A TW I384583 B TWI384583 B TW I384583B
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TW
Taiwan
Prior art keywords
diffusion barrier
barrier layer
substrate
layers
layer
Prior art date
Application number
TW094104751A
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English (en)
Chinese (zh)
Other versions
TW200532846A (en
Inventor
瑪麗安卡雷吉奧士森
海特蘭庫爾克
愛麗絲高立西恩
Original Assignee
歐瑞康太陽能特魯貝屈股份有限公司
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Publication of TW200532846A publication Critical patent/TW200532846A/zh
Application granted granted Critical
Publication of TWI384583B publication Critical patent/TWI384583B/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/917—Electroluminescent
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/32—Composite [nonstructural laminate] of inorganic material having metal-compound-containing layer and having defined magnetic layer
    • Y10T428/325—Magnetic layer next to second metal compound-containing layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Chemical Vapour Deposition (AREA)
  • Laminated Bodies (AREA)
TW094104751A 2004-02-20 2005-02-18 擴散阻障層及製造擴散阻障層之方法 TWI384583B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US54627404P 2004-02-20 2004-02-20

Publications (2)

Publication Number Publication Date
TW200532846A TW200532846A (en) 2005-10-01
TWI384583B true TWI384583B (zh) 2013-02-01

Family

ID=34886254

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094104751A TWI384583B (zh) 2004-02-20 2005-02-18 擴散阻障層及製造擴散阻障層之方法

Country Status (6)

Country Link
US (2) US7492091B2 (enExample)
EP (1) EP1719192A2 (enExample)
JP (1) JP2007526601A (enExample)
CN (1) CN1977404B (enExample)
TW (1) TWI384583B (enExample)
WO (1) WO2005081333A2 (enExample)

Cited By (1)

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US9373817B2 (en) 2014-07-11 2016-06-21 Industrial Technology Research Institute Substrate structure and device employing the same

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WO2006033233A1 (ja) * 2004-09-21 2006-03-30 Konica Minolta Holdings, Inc. 透明ガスバリア性フィルム
US7868903B2 (en) * 2004-10-14 2011-01-11 Daktronics, Inc. Flexible pixel element fabrication and sealing method
US8344410B2 (en) 2004-10-14 2013-01-01 Daktronics, Inc. Flexible pixel element and signal distribution means
US7893948B1 (en) 2004-10-14 2011-02-22 Daktronics, Inc. Flexible pixel hardware and method
US20100255263A1 (en) * 2006-08-29 2010-10-07 Pioneer Corporation Gas barrier film and process for preparation of the same
JP5253838B2 (ja) * 2007-02-23 2013-07-31 三井化学東セロ株式会社 薄膜製造方法
JP5164464B2 (ja) * 2007-07-27 2013-03-21 株式会社アルバック 樹脂基板
JP5164465B2 (ja) * 2007-07-27 2013-03-21 株式会社アルバック 樹脂基板
US8319428B2 (en) * 2009-06-29 2012-11-27 Sharp Kabushiki Kaisha Sealing film for organic EL element, organic EL element, and organic EL display
CN103597119B (zh) 2009-07-08 2017-03-08 艾克斯特朗欧洲公司 用于等离子体处理的装置和方法
FR2949775B1 (fr) 2009-09-10 2013-08-09 Saint Gobain Performance Plast Substrat de protection pour dispositif collecteur ou emetteur de rayonnement
FR2949776B1 (fr) 2009-09-10 2013-05-17 Saint Gobain Performance Plast Element en couches pour l'encapsulation d'un element sensible
US8765232B2 (en) 2011-01-10 2014-07-01 Plasmasi, Inc. Apparatus and method for dielectric deposition
KR101761834B1 (ko) 2011-01-28 2017-07-27 서울바이오시스 주식회사 웨이퍼 레벨 발광 다이오드 패키지 및 그것을 제조하는 방법
JP5688183B2 (ja) * 2011-03-30 2015-03-25 ▲海▼洋王照明科技股▲ふん▼有限公司 基板及びその製造方法、ならびに当該基板を使用する有機電界発光デバイス
FR2973939A1 (fr) * 2011-04-08 2012-10-12 Saint Gobain Element en couches pour l’encapsulation d’un element sensible
TWI450650B (zh) 2011-05-16 2014-08-21 Ind Tech Res Inst 可撓式基材及可撓式電子裝置
CN102842683A (zh) * 2011-06-21 2012-12-26 海洋王照明科技股份有限公司 有机电致发光器件及其制作方法
JP5781393B2 (ja) * 2011-08-05 2015-09-24 株式会社アルバック 成膜方法
TWI447955B (zh) 2011-11-23 2014-08-01 Ind Tech Res Inst 發光二極體元件、其導光結構的形成方法與形成設備
US9761830B1 (en) * 2012-05-14 2017-09-12 Eclipse Energy Systems, Inc. Environmental protection film for thin film devices
US9299956B2 (en) 2012-06-13 2016-03-29 Aixtron, Inc. Method for deposition of high-performance coatings and encapsulated electronic devices
US10526708B2 (en) 2012-06-19 2020-01-07 Aixtron Se Methods for forming thin protective and optical layers on substrates
TWI477642B (zh) * 2012-07-25 2015-03-21 E Ink Holdings Inc 阻氣基板
KR101892433B1 (ko) * 2012-12-31 2018-08-30 생-고뱅 퍼포먼스 플라스틱스 코포레이션 유연성 기재 상의 박막 규소질화물 장벽 층들
CN105720207B (zh) * 2013-06-29 2017-09-15 艾克斯特朗欧洲公司 用于高性能涂层的沉积的方法以及封装的电子器件
TWI514563B (zh) * 2013-09-09 2015-12-21 Innolux Corp 電子裝置與軟性基板的製造方法
CN104425735A (zh) * 2013-09-09 2015-03-18 群创光电股份有限公司 电子装置
CN105449123B (zh) * 2015-11-18 2018-03-06 上海大学 水氧阻隔层的制备方法
EP4433625A4 (en) * 2021-11-15 2025-10-01 Versum Mat Us Llc MULTILAYER SILICON NITRIDE FILM

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US20030104753A1 (en) * 1999-10-25 2003-06-05 Graff Gordon Lee Method of making encapsulated display devices
WO2003050894A2 (en) * 2001-12-13 2003-06-19 Koninklijke Philips Electronics N.V. Sealing structure for display devices
US20030129298A1 (en) * 2000-03-31 2003-07-10 Ryonosuke Tera Method for manufacturing organic EL device with protective layer
US20030127651A1 (en) * 2001-12-27 2003-07-10 Satoshi Murakami Light emitting device and method of manufacturing the same
US20030183830A1 (en) * 2002-01-24 2003-10-02 Semiconductor Energy Laboratory Co., Ltd. Light emitting device, method of preparing the same and device for fabricating the same
US20030193286A1 (en) * 2002-04-15 2003-10-16 Clemens Ottermann Hermetic encapsulation of organic, electro-optical elements

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US20030104753A1 (en) * 1999-10-25 2003-06-05 Graff Gordon Lee Method of making encapsulated display devices
US20030129298A1 (en) * 2000-03-31 2003-07-10 Ryonosuke Tera Method for manufacturing organic EL device with protective layer
CN1426605A (zh) * 2000-04-20 2003-06-25 巴特勒记忆研究所 封装的显示装置
WO2003050894A2 (en) * 2001-12-13 2003-06-19 Koninklijke Philips Electronics N.V. Sealing structure for display devices
US20030127651A1 (en) * 2001-12-27 2003-07-10 Satoshi Murakami Light emitting device and method of manufacturing the same
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US9373817B2 (en) 2014-07-11 2016-06-21 Industrial Technology Research Institute Substrate structure and device employing the same

Also Published As

Publication number Publication date
WO2005081333A2 (en) 2005-09-01
JP2007526601A (ja) 2007-09-13
US20090087998A1 (en) 2009-04-02
CN1977404A (zh) 2007-06-06
TW200532846A (en) 2005-10-01
CN1977404B (zh) 2010-05-12
US7492091B2 (en) 2009-02-17
EP1719192A2 (en) 2006-11-08
WO2005081333A3 (en) 2006-01-05
US20050194898A1 (en) 2005-09-08

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