JP2007519261A - 電子部品のスズ表面における半田付け性の保存及びウイスカ成長の阻止 - Google Patents

電子部品のスズ表面における半田付け性の保存及びウイスカ成長の阻止 Download PDF

Info

Publication number
JP2007519261A
JP2007519261A JP2006551316A JP2006551316A JP2007519261A JP 2007519261 A JP2007519261 A JP 2007519261A JP 2006551316 A JP2006551316 A JP 2006551316A JP 2006551316 A JP2006551316 A JP 2006551316A JP 2007519261 A JP2007519261 A JP 2007519261A
Authority
JP
Japan
Prior art keywords
tin
metal layer
based coating
metal
depositing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006551316A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007519261A5 (https=
Inventor
スー，チェン
チャン，ユン
ファン，チョンルン
カーセレブ，オスカー
アビス，ジョセフ，エー．
ワルシュ，エリック
クラインフェルド，マルリース
エッカート，ハンス，ウルリッヒ
Original Assignee
エントン インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/838,571 external-priority patent/US20050249968A1/en
Priority claimed from US10/968,500 external-priority patent/US20050249969A1/en
Application filed by エントン インコーポレイテッド filed Critical エントン インコーポレイテッド
Publication of JP2007519261A publication Critical patent/JP2007519261A/ja
Publication of JP2007519261A5 publication Critical patent/JP2007519261A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H10W70/457—Materials of metallic layers on leadframes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10909—Materials of terminal, e.g. of leads or electrodes of components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y10T428/12722—Next to Group VIII metal-base component

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Chemically Coating (AREA)
  • Details Of Resistors (AREA)
JP2006551316A 2004-01-21 2005-01-21 電子部品のスズ表面における半田付け性の保存及びウイスカ成長の阻止 Pending JP2007519261A (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102004002982 2004-01-21
US10/838,571 US20050249968A1 (en) 2004-05-04 2004-05-04 Whisker inhibition in tin surfaces of electronic components
US10/968,500 US20050249969A1 (en) 2004-05-04 2004-10-19 Preserving solderability and inhibiting whisker growth in tin surfaces of electronic components
PCT/US2005/001999 WO2005074026A2 (en) 2004-01-21 2005-01-21 Tin-based coating of electronic component

Publications (2)

Publication Number Publication Date
JP2007519261A true JP2007519261A (ja) 2007-07-12
JP2007519261A5 JP2007519261A5 (https=) 2008-03-21

Family

ID=34830753

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006551316A Pending JP2007519261A (ja) 2004-01-21 2005-01-21 電子部品のスズ表面における半田付け性の保存及びウイスカ成長の阻止

Country Status (6)

Country Link
US (1) US20080261071A1 (https=)
EP (1) EP1716732A2 (https=)
JP (1) JP2007519261A (https=)
KR (1) KR20070006747A (https=)
TW (1) TW200530433A (https=)
WO (1) WO2005074026A2 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016069659A (ja) * 2014-09-26 2016-05-09 株式会社オートネットワーク技術研究所 コネクタ用電気接点材料及びその製造方法
JP7061247B1 (ja) 2020-12-28 2022-04-28 松田産業株式会社 ニッケル電解めっき皮膜及びめっき構造体

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100451171C (zh) * 2005-09-27 2009-01-14 北京东方新材科技有限公司 提高金属焊接性能的表面处理方法及用该方法处理的工件
US20070287022A1 (en) * 2006-06-07 2007-12-13 Honeywell International, Inc. Intumescent paint coatings for inhibiting tin whisker growth and methods of making and using the same
ES2404104T3 (es) * 2008-05-19 2013-05-23 Phoenix Contact Gmbh & Co. Kg Unidad de contacto y procedimiento para la producción de una unidad de contacto
WO2010051341A1 (en) * 2008-10-31 2010-05-06 Sundew Technologies, Llc Coatings for suppressing metallic whiskers
ES2623604T3 (es) * 2008-10-31 2017-07-11 Sundwiger Messingwerk Gmbh & Co. Kg Aleación de cobre-estaño, material compuesto y empleo
US8610156B2 (en) 2009-03-10 2013-12-17 Lg Innotek Co., Ltd. Light emitting device package
KR101047603B1 (ko) 2009-03-10 2011-07-07 엘지이노텍 주식회사 발광 소자 패키지 및 그 제조방법
TWI405876B (zh) * 2010-04-13 2013-08-21 Univ Nat Taiwan Science Tech 抑制錫鬚晶生長的方法
CN103367325A (zh) * 2012-04-03 2013-10-23 鸿富锦精密工业（深圳）有限公司 具触觉效果的电子元件
EP2799595A1 (de) * 2013-05-03 2014-11-05 Delphi Technologies, Inc. Elektrisches Kontaktelement
DE102018109059B4 (de) * 2018-01-15 2020-07-23 Doduco Solutions Gmbh Elektrischer Einpress-Kontaktstift

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000144482A (ja) * 1998-09-11 2000-05-26 Nippon Mining & Metals Co Ltd 金属材料
JP2002302790A (ja) * 2001-04-06 2002-10-18 Ishihara Chem Co Ltd スズ−銅合金メッキ方法
JP2003049293A (ja) * 2001-03-16 2003-02-21 Shipley Co Llc 錫メッキ

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4504427A (en) * 1983-06-17 1985-03-12 At&T Bell Laboratories Solder preform stabilization for lead frames
US4511631A (en) * 1984-04-13 1985-04-16 Toyo Kohan Co., Ltd. Metallic chromium-nickel-hydrated chromium oxide-coated tin free steel and process for the production thereof
US4749626A (en) * 1985-08-05 1988-06-07 Olin Corporation Whisker resistant tin coatings and baths and methods for making such coatings
US4786324A (en) * 1986-01-10 1988-11-22 Rieger Franz Metallveredelung Nickel-plating bath
US4959278A (en) * 1988-06-16 1990-09-25 Nippon Mining Co., Ltd. Tin whisker-free tin or tin alloy plated article and coating technique thereof
US5393573A (en) * 1991-07-16 1995-02-28 Microelectronics And Computer Technology Corporation Method of inhibiting tin whisker growth
US5675177A (en) * 1995-06-26 1997-10-07 Lucent Technologies Inc. Ultra-thin noble metal coatings for electronic packaging
US5916696A (en) * 1996-06-06 1999-06-29 Lucent Technologies Inc. Conformable nickel coating and process for coating an article with a conformable nickel coating
US5750017A (en) * 1996-08-21 1998-05-12 Lucent Technologies Inc. Tin electroplating process
US6136460A (en) * 1998-04-03 2000-10-24 Olin Corporation Tin coatings incorporating selected elemental additions to reduce discoloration
WO2000015876A1 (en) * 1998-09-11 2000-03-23 Nippon Mining & Metals Co., Ltd. Metal material
US6248455B1 (en) * 1998-12-22 2001-06-19 International Business Machines Corporation Alloy-plated sheet steel cured with a thin layer of insulating polymer material forming an electrically nonconductive breachable metal substrate
JP4489232B2 (ja) * 1999-06-14 2010-06-23 日鉱金属株式会社 コネクタ用めっき材料
US6361823B1 (en) * 1999-12-03 2002-03-26 Atotech Deutschland Gmbh Process for whisker-free aqueous electroless tin plating
US6452258B1 (en) * 2000-11-06 2002-09-17 Lucent Technologies Inc. Ultra-thin composite surface finish for electronic packaging
US20020192492A1 (en) * 2001-05-11 2002-12-19 Abys Joseph Anthony Metal article coated with near-surface doped tin or tin alloy
US20020185716A1 (en) * 2001-05-11 2002-12-12 Abys Joseph Anthony Metal article coated with multilayer finish inhibiting whisker growth
US20030025182A1 (en) * 2001-06-22 2003-02-06 Abys Joseph A. Metal article coated with tin or tin alloy under tensile stress to inhibit whisker growth
DE10159890B4 (de) * 2001-12-06 2006-02-16 Federal-Mogul Burscheid Gmbh Verfahren für das Beschichten von Aluminiumwerkstoffen mit Funktionsschichten aus Eisen
EP1342816A3 (en) * 2002-03-05 2006-05-24 Shipley Co. L.L.C. Tin plating method
US6860981B2 (en) * 2002-04-30 2005-03-01 Technic, Inc. Minimizing whisker growth in tin electrodeposits
US6982030B2 (en) * 2002-11-27 2006-01-03 Technic, Inc. Reduction of surface oxidation during electroplating

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000144482A (ja) * 1998-09-11 2000-05-26 Nippon Mining & Metals Co Ltd 金属材料
JP2003049293A (ja) * 2001-03-16 2003-02-21 Shipley Co Llc 錫メッキ
JP2002302790A (ja) * 2001-04-06 2002-10-18 Ishihara Chem Co Ltd スズ−銅合金メッキ方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016069659A (ja) * 2014-09-26 2016-05-09 株式会社オートネットワーク技術研究所 コネクタ用電気接点材料及びその製造方法
JP7061247B1 (ja) 2020-12-28 2022-04-28 松田産業株式会社 ニッケル電解めっき皮膜及びめっき構造体
JP2022103538A (ja) * 2020-12-28 2022-07-08 松田産業株式会社 ニッケル電解めっき皮膜及びめっき構造体

Also Published As

Publication number Publication date
US20080261071A1 (en) 2008-10-23
KR20070006747A (ko) 2007-01-11
WO2005074026A3 (en) 2005-10-06
TW200530433A (en) 2005-09-16
WO2005074026A2 (en) 2005-08-11
EP1716732A2 (en) 2006-11-02

Similar Documents

Publication Publication Date Title
US7391116B2 (en) Fretting and whisker resistant coating system and method
JP5667152B2 (ja) 表面処理めっき材およびその製造方法、並びに電子部品
US20050249969A1 (en) Preserving solderability and inhibiting whisker growth in tin surfaces of electronic components
CA2118758C (en) Lead frame for integrated circuits
JP2002339097A (ja) 近表面をドープしたスズまたはスズ合金で被覆された金属製品
JP2003293187A (ja) めっきを施した銅または銅合金およびその製造方法
JPH11350188A (ja) 電気・電子部品用材料とその製造方法、およびその材料を用いた電気・電子部品
US5916696A (en) Conformable nickel coating and process for coating an article with a conformable nickel coating
JP2726434B2 (ja) ＳｎまたはＳｎ合金被覆材料
JP2007519261A (ja) 電子部品のスズ表面における半田付け性の保存及びウイスカ成長の阻止
JPH11350189A (ja) 電気・電子部品用材料とその製造方法、その材料を用いた電気・電子部品
US20050249968A1 (en) Whisker inhibition in tin surfaces of electronic components
KR20070026832A (ko) 주석계 도금 피막 및 그 형성 방법
KR20190117596A (ko) 전자 부품용 금속 재료 및 그 제조 방법, 그것을 사용한 커넥터 단자, 커넥터 및 전자 부품
JP2010084228A (ja) リードフレーム材、それを用いた半導体装置
US7233072B2 (en) Electronic part and surface treatment method of the same
CN100548090C (zh) 在电子部件的锡表面中保持可焊性及抑制晶须生长的方法
JPH043041B2 (https=)
JPH0711477A (ja) 貴金属めっき品
JP2004238689A (ja) めっき材及び電子部品用端子、コネクタ、リード部材及び半導体装置
Schetty Lead-free finishes for printed circuit boards and components
JPH03188253A (ja) Ｓｎめっき銅合金材
US20060240276A1 (en) Underlayer for reducing surface oxidation of plated deposits
JPH0397888A (ja) 銅合金用錫めっき品
KR930005262B1 (ko) 동합금용 땜납도금품 및 동합금용 주석도금품

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080121

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080121

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20100818

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100824

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20110201