JP2007516112A - 硬化されたシリコーン樹脂基材のエンボス加工方法 - Google Patents
硬化されたシリコーン樹脂基材のエンボス加工方法 Download PDFInfo
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- JP2007516112A JP2007516112A JP2006541178A JP2006541178A JP2007516112A JP 2007516112 A JP2007516112 A JP 2007516112A JP 2006541178 A JP2006541178 A JP 2006541178A JP 2006541178 A JP2006541178 A JP 2006541178A JP 2007516112 A JP2007516112 A JP 2007516112A
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- silicone resin
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- 239000000758 substrate Substances 0.000 title claims abstract description 49
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- 238000001816 cooling Methods 0.000 claims abstract description 4
- 239000000203 mixture Substances 0.000 claims description 56
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 17
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 15
- 150000002430 hydrocarbons Chemical class 0.000 claims description 15
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- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 10
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- 125000001931 aliphatic group Chemical group 0.000 claims description 8
- 125000003118 aryl group Chemical group 0.000 claims description 8
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- 239000002243 precursor Substances 0.000 claims description 8
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- UHXCHUWSQRLZJS-UHFFFAOYSA-N (4-dimethylsilylidenecyclohexa-2,5-dien-1-ylidene)-dimethylsilane Chemical compound C[Si](C)C1=CC=C([Si](C)C)C=C1 UHXCHUWSQRLZJS-UHFFFAOYSA-N 0.000 claims description 4
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 2
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- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
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- 239000005046 Chlorosilane Substances 0.000 description 3
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- 238000006243 chemical reaction Methods 0.000 description 3
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical compound Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 3
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- FENFUOGYJVOCRY-UHFFFAOYSA-N 1-propoxypropan-2-ol Chemical compound CCCOCC(C)O FENFUOGYJVOCRY-UHFFFAOYSA-N 0.000 description 2
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- ORVMIVQULIKXCP-UHFFFAOYSA-N trichloro(phenyl)silane Chemical compound Cl[Si](Cl)(Cl)C1=CC=CC=C1 ORVMIVQULIKXCP-UHFFFAOYSA-N 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 1
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- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 1
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- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
- B29C2059/023—Microembossing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29K2083/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
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- Y10T428/00—Stock material or miscellaneous articles
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- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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Abstract
Description
を開示している。該加水分解前駆体は(iii)二有機ジハロシランおよび二有機ジアルコキシシランから選択される二官能性シランをさらに含み得る。
によって例示されている。
(E)実験式(R5 (3−p)R1 pSiO1/2)(R5 2SiO2/2)z((R5 (2−q)R1 qSiO2/2)(R5 2SiO2/2)z)y(R5 (3−p)R1 pSiO1/2)
を有する第一のシリコーンゴム(式中、各R1は上記の通りであり、各々およびR5は独立して、非官能性のR2基から選択され、pは1、2または3であり、qは1または2であり、xは6以上の整数であり、そしてyは0または10までの整数である)、
(F)実験式 R5 2R2SiO(R5 2SiO)m(R5R2SiO)nSiR2R5 2
を有する第二のシリコーンゴム(式中、R2は上記のようなR1またはR2であり、そして各R5は上記の通りであり、ただし1分子あたり少なくとも2つのR2基がR1でなければならず、mが150〜1,000、nが0〜10である)、および
(G)溶媒、
ここで一以上の構成要素(E)、(F)および(G)がステップ(1)の後でステップ(2)の前に、硬化性シルセスキオキサン樹脂組成物に添加される。
(A’)実験式R1 aR2 bR3 cSiO(4−a−b−c)/2(式中、aが0または正数であり、bが0または正数であり、cが0または正数であり、ただし、0.8≦(a+b+c)≦3.0、そして構成要素(A’)が平均して1分子あたり少なくとも2つのR1基を有し、各R1は独立して不飽和脂肪族を有する一価の炭化水素基と水素原子とから成る群から選択される官能基であり、各R2は非官能基とR1とから選択される一価の炭化水素基であり、各R3は非官能基とR1とから選択される一価の炭化水素基である)
を有することを条件とする構成単位を含むシルセスキオキサンコポリマー;
(B’)一般式
および(C’)ヒドロシリル化反応触媒:
を含むヒドロシリル化反応硬化性組成物を開示している。
(D’)ヒドロシリル化反応触媒抑制剤、
(E’)実験式(R5 (3−p)R1 pSiO1/2)(R5 2SiO2/2)z((R5 (2−q)R1 qSiO2/2)(R5 2SiO2/2)z)y(R5 (3−p)R1 pSiO1/2)
(式中、各R1が上記の通りであり、構成要素(E’)の各R5基が、独立して、R2に関する非官能基から選択され、pが1、2、または3であり、qが1または2であり、zが6以上の整数であり、そしてyが0または10までの整数である)を有する第一のシリコーンゴム、
(F’)実験式R5 2R6SiO(R5 2SiO)m(R5R6SiO)nSiR6R5 2
(式中、各R5は上記の通りであり、各R6はR1とR5とから成る群から選択され、ただし1分子あたり少なくとも2つのR6基がR1でなければならず、mが150〜1,000であり、そしてnが1〜10である)を有する第二のシリコーンゴムの0〜15重量%、そして
(G’)溶媒、
から選択される1以上の構成要素をさらに含み得る。
(R5 (3−P)R1 pSiO1/2)(R5 2SiO2/2)z((R5 (2−q)R1 qSiO2/2)(R5 2SiO2/2)z)y(R5 (3−p)R1 pSiO1/2)
(式中、各R1は上記の通りであり、pが1、2、または3であり、qが1または2であり、zは6以上の整数であり、yは0または10までの整数である)を有する。各R1は官能基であり、それは上記で議論されたような本発明の硬化されたシルセスキオキサンを形成するための硬化反応に加わる。構成要素(E’)内の各R5は、独立して、上記のR2に関する非官能基から選択される。
実験式R5 2R6SiO(R5 2SiO)m(R5R6SiO)nSiR6R5 2
(式中、各R5は上記の通りであり、各R6はR1およびR5から成る群から選択され、ただし1分子あたり少なくとも2つのR6基がR1でなければならず、mは150〜1,000、好ましくは246〜586であり、nが1〜10である)のポリ二有機シロキサンである。該硬化性組成物内での構成要素(F’)の量は、一般的に0〜15重量%、好ましくは2〜8重量%である。
構成要素(A’’)は典型的に構成単位
(R1 3SiO2/2)a(i)
(R2 2SiO2/2)b(ii)
(R3SiO3/2)c(iii)および
(SiO4/2)d(iv)
(式中、R1およびR2は、各々独立して、不飽和脂肪族炭化水素基および1〜10の炭素原子を有する一価の炭化水素基から選択され、R3はアリール基または1〜8の炭素原子を有するアルキル基であり、aが0以上の値を有し、bが0以上の値を有し、cが0以上の値を有し、dが0以上の値を有し、ただしc+dの値が0より大きく、a+b+c+dの値が1であり、それはシリコーン樹脂中で少なくとも2つのケイ素結合不飽和脂肪族炭化水素原子が存在する)を含むシリコーン樹脂である。構成要素(A’’)は、構成単位(ViMe2SiO1/2)0.25および(PhSiO3/2)0.75(Viがビニル基を表し、Phがフェニル基であり、およびMeがメチル基を表す)を含むシリコーン樹脂によって例示される。
攪拌棒、添加漏斗、温度計およびDean Stark trapを備えた丸底三口フラスコ内を、17gの(ViMe2Si)2O、107gのPhSi(OMe)3、1gのH2O、および0.1gのトリフルオロメタンスルホン酸で満たした。該混合物を60℃で2時間熱した。22.2g以上のH2Oおよび27.2gのトルエンを加え、そして該混合物を50℃で2時間攪拌した。その後、温度を上げて、還流を維持して、メタノールを冷却器(コンデンサー)の底から取り出した。該温度が80℃に到達した時、該フラスコを40℃に冷却した。0.23gのCaCO3を加え、加熱なしに24時間攪拌した。この後18gのトルエンと0.1gのKOHを加えた。該温度を還流するまで上昇させ、水が出てこなくなるまで凝結水を冷却器の底から取り出した。主要部分の樹脂を室温に冷やし、0.18gのViMe2SiClを攪拌して入れた。該樹脂溶液を最終的にろ過し、追加のトルエンを固体含有量75重量%まで調節して加えうる。該結果生成物は構成単位(PhSiO3/2)0.75および(ViMe2SiO1/2)0.25を含むシリコーン樹脂であった。
100mm×80mmの寸法にカットした実施例1の硬化されたシロキサンフィルムを、パターン化された直径2インチのシリコンウェハに置き、その後2つのステンレス鋼プレート(230mm×230mm)の間に挟んだ。その系を加熱プレスに置き、5メートルトンの一定の力で2時間100℃で加熱した。動的機械分析により、実験条件によって該フィルムは80〜95℃の間のTgを有する。それ故、該フィルムはエンボス加工している間そのTg以上にした。その系は加圧下で冷却してもよい。光学顕微鏡は、ウェハのパターンが図2に見られるようなシリコーン樹脂フィルムにエンボス加工されたことを示した。
Claims (10)
- (i)形状を含有する種型の表面がシリコーン樹脂基材に面するように、種型と該シリコーン樹脂熱硬化性基材とを重ねること;
(ii)該種型の軟化点よりは低いが該シリコーン樹脂のTgよりもわずかに高い温度での加圧下で(i)の生成物に圧力をかけること;
(iii)(ii)の生成物を冷却して、かつ該型への圧力を維持すること;および
(iv)該基材を剥離して、それゆえ該形状が該シリコーン樹脂基材上に刻まれること;
を含む、硬化されたシリコーン樹脂熱硬化性基材をエンボス加工して種型から該基材上にパターンを刻む方法。 - 前記基材がフィルム、プラック、またはコーティングの形態である、請求項1に記載の方法。
- 前記硬質シリコーン樹脂熱硬化性基材が50℃〜120℃のガラス転移温度を有する、請求項1または2に記載の方法。
- 前記圧力が1メートルトン以上である、請求項1、2、または3のいずれか1項に記載の方法。
- 前記種型が、シリコンウェハ、シリコンカーバイド、窒化ケイ素、アルミニウム、ステンレス鋼、ニッケル、合金および金属酸化物から選択される、請求項1、2、3、または4のいずれか1項に記載の方法。
- 前記硬化されたシリコーン樹脂熱硬化性基材が、(1)構成要素(A)および(B)を含む組み合わせを共重合することを含む方法によって得られる組成物であって、構成要素(A)が加水分解前駆体の加水分解物であり、該加水分解前駆体は、(i)有機トリアルコキシシランまたは有機トリハロシランと(ii)トリ有機モノアルコキシシラン、トリ有機モノハロシラン、ジシロキサン、およびジシラザンから選択されたモノ官能性シランとを含み、そして構成要素(B)は式:
- 前記硬化されたシリコーン樹脂熱硬化性基材が、
(A’)実験式R1 aR2 bR3 cSiO(4−a−b−c)/2
(式中、aが0または正数であり、bが0または正数であり、cが0または正数であり、ただし、0.8≦(a+b+c)≦3.0であり、そして構成要素(A’)が平均して1分子あたり少なくとも2つのR1基を有し、各R1は独立して不飽和脂肪族を有する一価の炭化水素基と水素原子とからなる群から選択される官能基であり、各R2は非官能基とR1とから選択される一価の炭化水素基であり、各R3は非官能基とR1とから選択される一価の炭化水素基であることを条件とする)
を有する構成単位を含むシルセスキオキサンコポリマー;
(B’)一般式
を有するシリル末端炭化水素;
および(C’)ヒドロシリル化反応触媒;
を含む組成物である、請求項1、2、3、4、または5のいずれか1項に記載の方法。 - 前記硬化されたシリコーン樹脂熱硬化性基材が、(C’’)白金触媒の存在下で、(A’’)平均式R1 aSiO(4−a)/2によって表されるシリコーン樹脂(式中、R1が独立して1〜10の炭素原子を有する一価の炭化水素基であり、aが0〜2の整数(双方排他的)であり、その分子内に少なくとも2つの不飽和脂肪族炭化水素基を有する)と、(B’’)その分子内に少なくとも2つのケイ素結合水素原子を有する有機ケイ素化合物とを反応させることを含む方法によって得られるシリコーン樹脂を含むポリシロキサンフィルムである、請求項1、2、3、4、または5のいずれか1項に記載の方法。
- 構成要素(A’’)が、構成単位
(R1 3SiO1/2)a(i)
(R2 2SiO2/2)b(ii)
(R3SiO3/2)c(iii)および
(SiO4/2)d(iv)
(式中、R1およびR2が、各々独立して、不飽和脂肪族炭化水素基および1〜10の炭素原子を有する一価の炭化水素基から選択され、R3がアリール基または1〜8の炭素原子を有するアルキル基であり、aが0以上の値を有し、bが0以上の値を有し、cが0以上の値を有し、dが0以上の値を有し、ただし、c+dの値が0より大きく、a+b+c+dの値が1であり、そのシリコーン樹脂内に少なくとも2つのケイ素結合不飽和脂肪族炭化水素原子が存在する)
を含むシリコーン樹脂である、請求項8に記載の方法。 - 構成要素(B’’)がp−ビス(ジメチルシリル)ベンゼンである、請求項8または9に記載の方法。
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- 2004-10-22 CN CN200480033743.3A patent/CN100540275C/zh not_active Expired - Fee Related
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JP2000135744A (ja) * | 1998-10-30 | 2000-05-16 | Nissei Denki Kk | 塑性変形加工品及びその製造方法 |
JP2001026717A (ja) * | 1999-07-01 | 2001-01-30 | Dow Corning Corp | 高い強度及び耐破壊性を有するシルセスキオキサン樹脂並びにそれらの調製方法 |
JP2002184719A (ja) * | 2000-12-19 | 2002-06-28 | Matsushita Electric Ind Co Ltd | パターン形成方法 |
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JP2008168480A (ja) * | 2007-01-10 | 2008-07-24 | Chisso Corp | ナノインプリント用組成物 |
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US20070098958A1 (en) | 2007-05-03 |
US7682545B2 (en) | 2010-03-23 |
JP4654200B2 (ja) | 2011-03-16 |
KR101154209B1 (ko) | 2012-06-18 |
KR20070009974A (ko) | 2007-01-19 |
DE602004010427T2 (de) | 2008-10-02 |
CN100540275C (zh) | 2009-09-16 |
WO2005051636A1 (en) | 2005-06-09 |
DE602004010427D1 (de) | 2008-01-10 |
EP1687130A1 (en) | 2006-08-09 |
EP1687130B1 (en) | 2007-11-28 |
CN1882432A (zh) | 2006-12-20 |
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