JP2007501431A - 基板にパターン形成するための改善された方法 - Google Patents
基板にパターン形成するための改善された方法 Download PDFInfo
- Publication number
- JP2007501431A JP2007501431A JP2006522529A JP2006522529A JP2007501431A JP 2007501431 A JP2007501431 A JP 2007501431A JP 2006522529 A JP2006522529 A JP 2006522529A JP 2006522529 A JP2006522529 A JP 2006522529A JP 2007501431 A JP2007501431 A JP 2007501431A
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- JP
- Japan
- Prior art keywords
- exposure
- pass
- dose
- workpiece
- resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
- G03F7/70558—Dose control, i.e. achievement of a desired dose
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
- G03C5/00—Photographic processes or agents therefor; Regeneration of such processing agents
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70283—Mask effects on the imaging process
- G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/634,152 US7186486B2 (en) | 2003-08-04 | 2003-08-04 | Method to pattern a substrate |
| US55387404P | 2004-03-17 | 2004-03-17 | |
| PCT/SE2004/001161 WO2005013007A1 (en) | 2003-08-04 | 2004-08-04 | Further method to pattern a substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007501431A true JP2007501431A (ja) | 2007-01-25 |
| JP2007501431A5 JP2007501431A5 (enExample) | 2007-07-19 |
Family
ID=34119184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006522529A Pending JP2007501431A (ja) | 2003-08-04 | 2004-08-04 | 基板にパターン形成するための改善された方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US7186486B2 (enExample) |
| EP (1) | EP1652007B1 (enExample) |
| JP (1) | JP2007501431A (enExample) |
| KR (1) | KR20060129155A (enExample) |
| DE (1) | DE602004021392D1 (enExample) |
| WO (1) | WO2005013007A1 (enExample) |
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006285243A (ja) * | 2005-03-30 | 2006-10-19 | Asml Netherlands Bv | データフィルタ処理を利用したリソグラフィ装置及びデバイス製造法 |
| WO2010064730A1 (en) * | 2008-12-05 | 2010-06-10 | Fujifilm Corporation | Multi-beam exposure scanning method and apparatus, and method for manufacturing printing plate |
| WO2011122703A1 (en) * | 2010-03-31 | 2011-10-06 | Fujifilm Corporation | Multibeam exposure scanning method and apparatus, and method of manufacturing printing plate |
| JP2011215275A (ja) * | 2010-03-31 | 2011-10-27 | Fujifilm Corp | マルチビーム露光走査方法及び装置並びに印刷版の製造方法 |
| JP2011215274A (ja) * | 2010-03-31 | 2011-10-27 | Fujifilm Corp | マルチビーム露光走査方法及び装置並びに印刷版の製造方法 |
| JP2013191901A (ja) * | 2007-07-13 | 2013-09-26 | Nikon Corp | パターン形成方法及びパターン形成装置、並びにデバイス製造方法 |
| WO2015112802A1 (en) * | 2014-01-27 | 2015-07-30 | Tokyo Electron Limited | System and method for shifting critical dimensions of patterned films |
| WO2015127348A1 (en) * | 2014-02-24 | 2015-08-27 | Tokyo Electron Limited | Mitigation of euv shot noise replicating into acid shot noise in photo-sensitized chemically-amplified resist |
| US9291902B2 (en) | 2010-03-05 | 2016-03-22 | Mycronic AB | Method and apparatus for merging multiple geometrical pixel images and generating a single modulator pixel image |
| US9519227B2 (en) | 2014-02-24 | 2016-12-13 | Tokyo Electron Limited | Metrology for measurement of photosensitizer concentration within photo-sensitized chemically-amplified resist (PS-CAR) |
| US9618848B2 (en) | 2014-02-24 | 2017-04-11 | Tokyo Electron Limited | Methods and techniques to use with photosensitized chemically amplified resist chemicals and processes |
| US9645391B2 (en) | 2013-11-27 | 2017-05-09 | Tokyo Electron Limited | Substrate tuning system and method using optical projection |
| US10020195B2 (en) | 2014-02-25 | 2018-07-10 | Tokyo Electron Limited | Chemical amplification methods and techniques for developable bottom anti-reflective coatings and dyed implant resists |
| US10048594B2 (en) | 2016-02-19 | 2018-08-14 | Tokyo Electron Limited | Photo-sensitized chemically amplified resist (PS-CAR) model calibration |
| US10096528B2 (en) | 2016-05-13 | 2018-10-09 | Tokyo Electron Limited | Critical dimension control by use of a photo agent |
| US10429745B2 (en) | 2016-02-19 | 2019-10-01 | Osaka University | Photo-sensitized chemically amplified resist (PS-CAR) simulation |
| US10551743B2 (en) | 2016-05-13 | 2020-02-04 | Tokyo Electron Limited | Critical dimension control by use of photo-sensitized chemicals or photo-sensitized chemically amplified resist |
| US11163236B2 (en) | 2019-08-16 | 2021-11-02 | Tokyo Electron Limited | Method and process for stochastic driven detectivity healing |
| CN114077165A (zh) * | 2020-08-20 | 2022-02-22 | 株式会社Orc制作所 | 曝光装置和曝光方法 |
Families Citing this family (57)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE0104238D0 (sv) * | 2001-12-14 | 2001-12-14 | Micronic Laser Systems Ab | Method and apparatus for patterning a workpiece |
| US20030233630A1 (en) * | 2001-12-14 | 2003-12-18 | Torbjorn Sandstrom | Methods and systems for process control of corner feature embellishment |
| US7186486B2 (en) * | 2003-08-04 | 2007-03-06 | Micronic Laser Systems Ab | Method to pattern a substrate |
| US7101816B2 (en) * | 2003-12-29 | 2006-09-05 | Tokyo Electron Limited | Methods for adaptive real time control of a thermal processing system |
| WO2005079360A2 (en) * | 2004-02-12 | 2005-09-01 | Ionwerks, Inc. | Advanced optics for rapidly patterned lasser profiles in analytical spectrometry |
| EP1719018A1 (en) * | 2004-02-25 | 2006-11-08 | Micronic Laser Systems Ab | Methods for exposing patterns and emulating masks in optical maskless lithography |
| US20050214674A1 (en) * | 2004-03-25 | 2005-09-29 | Yu Sui | Positive-working photoimageable bottom antireflective coating |
| DE102004022329B3 (de) * | 2004-05-06 | 2005-12-29 | Infineon Technologies Ag | Verfahren zur dynamischen Dosisanpassung in einem lithographischen Projektionsapparat und Projektionsapparat |
| US7632625B2 (en) * | 2004-05-25 | 2009-12-15 | Roberts David H | Method of pre-exposing relief image printing plate |
| JP4908756B2 (ja) * | 2004-12-22 | 2012-04-04 | ラピスセミコンダクタ株式会社 | 半導体装置の製造方法 |
| US7718326B2 (en) * | 2005-06-17 | 2010-05-18 | Vincent E Stenger | Seamless stitching of patterns formed by interference lithography |
| US7927779B2 (en) | 2005-06-30 | 2011-04-19 | Taiwan Semiconductor Manufacturing Companym, Ltd. | Water mark defect prevention for immersion lithography |
| US8048589B2 (en) * | 2005-07-30 | 2011-11-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Phase shift photomask performance assurance method |
| US8383322B2 (en) * | 2005-08-05 | 2013-02-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Immersion lithography watermark reduction |
| US20070046954A1 (en) * | 2005-08-24 | 2007-03-01 | Asml Netherlands B.V. | Method of verifying consistent measurement between a plurality of CD metrology tools |
| US7993808B2 (en) | 2005-09-30 | 2011-08-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | TARC material for immersion watermark reduction |
| KR100843890B1 (ko) * | 2005-11-07 | 2008-07-03 | 주식회사 하이닉스반도체 | 리소그래피 공정의 시뮬레이션 방법 |
| US8518628B2 (en) | 2006-09-22 | 2013-08-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Surface switchable photoresist |
| US7917244B2 (en) * | 2007-03-14 | 2011-03-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and system for reducing critical dimension side-to-side tilting error |
| JP2009010079A (ja) * | 2007-06-27 | 2009-01-15 | Canon Inc | 露光装置 |
| US8088548B2 (en) | 2007-10-23 | 2012-01-03 | Az Electronic Materials Usa Corp. | Bottom antireflective coating compositions |
| US20090199152A1 (en) * | 2008-02-06 | 2009-08-06 | Micronic Laser Systems Ab | Methods and apparatuses for reducing mura effects in generated patterns |
| EP2269108B1 (en) * | 2008-04-24 | 2017-11-01 | Micronic Mydata AB | Spatial light modulator with structured mirror surfaces |
| US8492288B2 (en) * | 2008-06-10 | 2013-07-23 | Micron Technology, Inc. | Methods of treating semiconductor substrates, methods of forming openings during semiconductor fabrication, and methods of removing particles from over semiconductor substrates |
| US9341936B2 (en) | 2008-09-01 | 2016-05-17 | D2S, Inc. | Method and system for forming a pattern on a reticle using charged particle beam lithography |
| US8473875B2 (en) | 2010-10-13 | 2013-06-25 | D2S, Inc. | Method and system for forming high accuracy patterns using charged particle beam lithography |
| US8039176B2 (en) | 2009-08-26 | 2011-10-18 | D2S, Inc. | Method for fracturing and forming a pattern using curvilinear characters with charged particle beam lithography |
| US8057970B2 (en) | 2008-09-01 | 2011-11-15 | D2S, Inc. | Method and system for forming circular patterns on a surface |
| US20120219886A1 (en) | 2011-02-28 | 2012-08-30 | D2S, Inc. | Method and system for forming patterns using charged particle beam lithography with variable pattern dosage |
| US9323140B2 (en) | 2008-09-01 | 2016-04-26 | D2S, Inc. | Method and system for forming a pattern on a reticle using charged particle beam lithography |
| US7901850B2 (en) | 2008-09-01 | 2011-03-08 | D2S, Inc. | Method and system for design of a reticle to be manufactured using variable shaped beam lithography |
| US8455176B2 (en) * | 2008-11-12 | 2013-06-04 | Az Electronic Materials Usa Corp. | Coating composition |
| US20120278770A1 (en) | 2011-04-26 | 2012-11-01 | D2S, Inc. | Method and system for forming non-manhattan patterns using variable shaped beam lithography |
| US9448473B2 (en) | 2009-08-26 | 2016-09-20 | D2S, Inc. | Method for fracturing and forming a pattern using shaped beam charged particle beam lithography |
| US9164372B2 (en) | 2009-08-26 | 2015-10-20 | D2S, Inc. | Method and system for forming non-manhattan patterns using variable shaped beam lithography |
| US8632948B2 (en) * | 2009-09-30 | 2014-01-21 | Az Electronic Materials Usa Corp. | Positive-working photoimageable bottom antireflective coating |
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Also Published As
| Publication number | Publication date |
|---|---|
| US20050032002A1 (en) | 2005-02-10 |
| US20050053850A1 (en) | 2005-03-10 |
| WO2005013007A1 (en) | 2005-02-10 |
| EP1652007A1 (en) | 2006-05-03 |
| KR20060129155A (ko) | 2006-12-15 |
| US7186486B2 (en) | 2007-03-06 |
| US7150949B2 (en) | 2006-12-19 |
| DE602004021392D1 (de) | 2009-07-16 |
| EP1652007B1 (en) | 2009-06-03 |
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