JP2007300088A5 - - Google Patents

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Publication number
JP2007300088A5
JP2007300088A5 JP2007104458A JP2007104458A JP2007300088A5 JP 2007300088 A5 JP2007300088 A5 JP 2007300088A5 JP 2007104458 A JP2007104458 A JP 2007104458A JP 2007104458 A JP2007104458 A JP 2007104458A JP 2007300088 A5 JP2007300088 A5 JP 2007300088A5
Authority
JP
Japan
Prior art keywords
metal layer
lead frame
planar
raised features
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007104458A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007300088A (ja
Filing date
Publication date
Priority claimed from US11/416,994 external-priority patent/US20070130759A1/en
Application filed filed Critical
Publication of JP2007300088A publication Critical patent/JP2007300088A/ja
Publication of JP2007300088A5 publication Critical patent/JP2007300088A5/ja
Pending legal-status Critical Current

Links

JP2007104458A 2006-05-02 2007-04-12 複数の金属層から形成される半導体素子パッケージリードフレーム Pending JP2007300088A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/416,994 US20070130759A1 (en) 2005-06-15 2006-05-02 Semiconductor device package leadframe formed from multiple metal layers

Publications (2)

Publication Number Publication Date
JP2007300088A JP2007300088A (ja) 2007-11-15
JP2007300088A5 true JP2007300088A5 (enExample) 2011-06-23

Family

ID=38769289

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007104458A Pending JP2007300088A (ja) 2006-05-02 2007-04-12 複数の金属層から形成される半導体素子パッケージリードフレーム

Country Status (2)

Country Link
JP (1) JP2007300088A (enExample)
CN (1) CN101068005B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101521164B (zh) * 2008-02-26 2011-01-05 上海凯虹科技电子有限公司 引线键合芯片级封装方法
US8309400B2 (en) * 2010-10-15 2012-11-13 Advanced Semiconductor Engineering, Inc. Leadframe package structure and manufacturing method thereof
CN102915988A (zh) * 2012-10-31 2013-02-06 矽力杰半导体技术(杭州)有限公司 一种引线框架以及应用其的倒装封装装置
CN103928431B (zh) * 2012-10-31 2017-03-01 矽力杰半导体技术(杭州)有限公司 一种倒装封装装置
CN103594448A (zh) * 2013-11-15 2014-02-19 杰群电子科技（东莞）有限公司 一种引线框架
CN110524891A (zh) * 2018-05-24 2019-12-03 本田技研工业株式会社 连续超声波增材制造
US11298775B2 (en) 2018-05-24 2022-04-12 Honda Motor Co., Ltd. Continuous ultrasonic additive manufacturing
JP7071631B2 (ja) 2018-06-25 2022-05-19 日亜化学工業株式会社 パッケージ、発光装置及びそれぞれの製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2582013B2 (ja) * 1991-02-08 1997-02-19 株式会社東芝 樹脂封止型半導体装置及びその製造方法
US6983537B2 (en) * 2000-07-25 2006-01-10 Mediana Electronic Co., Ltd. Method of making a plastic package with an air cavity
JP2004281887A (ja) * 2003-03-18 2004-10-07 Himeji Toshiba Ep Corp リードフレーム及びそれを用いた電子部品

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