JP2007297712A - プラズマを利用して堆積された薄いシード層を介してのメタライゼーション - Google Patents

プラズマを利用して堆積された薄いシード層を介してのメタライゼーション Download PDF

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Publication number
JP2007297712A
JP2007297712A JP2007118362A JP2007118362A JP2007297712A JP 2007297712 A JP2007297712 A JP 2007297712A JP 2007118362 A JP2007118362 A JP 2007118362A JP 2007118362 A JP2007118362 A JP 2007118362A JP 2007297712 A JP2007297712 A JP 2007297712A
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JP
Japan
Prior art keywords
layer
seed layer
deposition
process according
plasma
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007118362A
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English (en)
Japanese (ja)
Inventor
Peter Olbrich
オルブリヒ ペーター
Gerd Hoffmann
ホフマン ゲルト
Guenter Klemm
クレンム ギュンター
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2007297712A publication Critical patent/JP2007297712A/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
    • C23C14/025—Metallic sublayers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/20—Metallic material, boron or silicon on organic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/32—Wound capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/015—Special provisions for self-healing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physical Vapour Deposition (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Laminated Bodies (AREA)
JP2007118362A 2006-04-28 2007-04-27 プラズマを利用して堆積された薄いシード層を介してのメタライゼーション Pending JP2007297712A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP06113329A EP1849885A1 (de) 2006-04-28 2006-04-28 Metallisierung mittels dünner, mit Plasmaunterstützung abgeschiedener Impfschicht

Publications (1)

Publication Number Publication Date
JP2007297712A true JP2007297712A (ja) 2007-11-15

Family

ID=36999788

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007118362A Pending JP2007297712A (ja) 2006-04-28 2007-04-27 プラズマを利用して堆積された薄いシード層を介してのメタライゼーション

Country Status (5)

Country Link
EP (1) EP1849885A1 (de)
JP (1) JP2007297712A (de)
KR (1) KR20070106462A (de)
CN (1) CN101067195A (de)
RU (1) RU2007115638A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101370769B1 (ko) * 2012-07-09 2014-03-06 성문전자주식회사 필름 커패시터용 진공 증착기의 증발기 이송 장치

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106409507B (zh) * 2016-10-20 2019-03-01 无锡宸瑞新能源科技有限公司 一种耐高温高湿应用的薄膜电容器及其加工方法
DE102018000272A1 (de) * 2018-01-16 2019-07-18 Elfolion Gmbh Folienartiges Funktionsmaterial und Verfahren zu dessen Herstellung
RU187908U1 (ru) * 2018-12-25 2019-03-21 Закрытое акционерное общество "ГРУППА КРЕМНИЙ ЭЛ" Затравочный слой медной металлизации интегральных схем
DE102019135296A1 (de) * 2019-07-18 2021-01-21 Tdk Electronics Ag Metallisierte Folie, Vorrichtung für die Herstellung einer metallisierten Folie, Verfahren zur Herstellung einer metallisierten Folie und Folienkondensator, der die metallisierte Folie enthält

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08267645A (ja) * 1995-03-31 1996-10-15 Toyo Metaraijingu Kk グロー処理蒸着プラスチックフィルム
JPH093630A (ja) * 1995-06-21 1997-01-07 Toyo Metaraijingu Kk 金属蒸着プラスチック基材およびその製造方法
JP2003011273A (ja) * 2001-07-02 2003-01-15 Mitsubishi Shindoh Co Ltd 金属化ポリイミドフィルム

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5928569A (ja) * 1982-08-09 1984-02-15 Sumitomo Electric Ind Ltd 乾式メツキ法
JPH04165063A (ja) * 1990-10-25 1992-06-10 Shin Etsu Chem Co Ltd コンデンサ―用金属化ポリプロピレンフィルムの製造方法
JP3759266B2 (ja) * 1996-12-20 2006-03-22 三菱伸銅株式会社 亜鉛蒸着フィルムおよび金属化フィルムコンデンサ
DE19943379A1 (de) * 1999-09-10 2001-03-15 Fraunhofer Ges Forschung Verfahren zur Herstellung metallisierter Kunststoffolie für Kondensatoren

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08267645A (ja) * 1995-03-31 1996-10-15 Toyo Metaraijingu Kk グロー処理蒸着プラスチックフィルム
JPH093630A (ja) * 1995-06-21 1997-01-07 Toyo Metaraijingu Kk 金属蒸着プラスチック基材およびその製造方法
JP2003011273A (ja) * 2001-07-02 2003-01-15 Mitsubishi Shindoh Co Ltd 金属化ポリイミドフィルム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101370769B1 (ko) * 2012-07-09 2014-03-06 성문전자주식회사 필름 커패시터용 진공 증착기의 증발기 이송 장치

Also Published As

Publication number Publication date
KR20070106462A (ko) 2007-11-01
RU2007115638A (ru) 2008-11-10
EP1849885A1 (de) 2007-10-31
CN101067195A (zh) 2007-11-07

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