JP2007250283A - Method of manufacturing plasma display panel, and plasma display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a plasma display panel which provides stable quality by preventing charge of static electricity caused by ejection of a cutting material in cutting work. <P>SOLUTION: In an electrode forming process to form address electrodes 121 and extraction electrodes 310, the extraction parts 320 are formed at the location of the non-display region 132 of a work with the interval of a region 140 wider than the width dimension between adjacent address electrodes 121 in a display region 131 between, by collectively forming the extraction electrodes 310. The extraction electrodes 310 located in the region 140 of the adjacent extraction parts 320 are connected to one address electrode 121 in the display region 131, and formed with the extraction electrodes 310 branched form the address electrode 121. A potential difference becomes 0 V between the extraction parts 320 by the extraction electrodes 310 connected to the address electrode 121, inconvenience caused by charge of static electricity at the time of sand blasting can be prevented with a simple structure. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a plasma display panel manufacturing method and a plasma display panel in which a workpiece is sandblasted by jetting a cutting material.

Conventionally, in a plasma display panel (PDP), a pair of planar substrates are arranged to face each other via a discharge space, and a grid-like or striped partition is provided on the inner surface of one planar substrate. As a result, the PDP has a discharge space partitioned into a plurality of discharge cells. The PDP is an apparatus that displays an image by selectively discharging light in a plurality of discharge cells.
Such a PDP is often formed by a sandblasting method from the point of accuracy when the partition is formed. When a partition is formed by sandblasting, an address electrode is previously formed on a substrate, a glass paste or the like is applied on the substrate to form a partition material layer, and a resist mask corresponding to the partition pattern is formed thereon. Coating. A portion of the partition wall material layer not covered with the resist mask is removed by spraying dry air containing a cutting material from the spray nozzle onto the substrate on which the resist mask and the partition wall material layer are formed. A procedure for firing the substrate after removing the mask is employed.
And when forming a partition by the sandblasting method, the manufacturing method which makes the peeling operation | movement of a resist pattern easy and reliable, improving the shape precision of a partition is known (for example, refer patent document 1).
The one described in Patent Document 1 is provided with a wide gap in which the interval between the external connection terminal portions of the adjacent address electrodes is set wider than other intervals, and when the external connection terminal portion is covered with a resist pattern, In the resist pattern, a slit-shaped cutout is formed in a portion covering the wide gap. In addition, a gap for connecting the drive circuit is provided as a portion having a wider interval than other intervals between the external connection terminal portions.

JP 2003-281996 A

By the way, the sandblasting method has a problem that static electricity is generated during processing. In general, static electricity is more likely to be generated as the contact pressure between materials increases, the time from contact between the materials to separation becomes shorter, or the humidity in the environment decreases. When partition walls are formed by the sandblasting method, since the cutting material collides with the partition material layer at a high spray pressure, dry air is used to inject the cutting material. May be adversely affected.
A conventional PDP in which the interval between adjacent external connection terminal portions as described in Patent Document 1 is wider than the interval between adjacent address electrodes in the display region, that is, a drive circuit as shown in FIG. When there is a portion where the interval between the adjacent external connection terminals 512 is wider than the interval between the adjacent address electrodes 511 in the display area 514, such as the connection gap 501, the area 520 where the external connection terminals 512 are gathered is wide. There is a difference in the charged state from the gap 501 that is the region. As a result, charging due to static electricity is likely to occur due to the edge portions of the region 520 and the region (gap) 501. That is, electric charge is most likely to be generated in the external connection terminal 512 adjacent to the region 501 side in the region 520, that is, the external connection terminal 512 adjacent through the region (gap) 501. The address electrode 511 in the display area 514 is narrower than the width dimension of the area (gap) 501, so that the address electrode 511 is more susceptible to the generated charges.
That is, the charges generated at the edge portion of the external connection terminal 512 are transmitted to the address electrodes 511 and remain in the portions between the address electrodes 511 having a narrow gap, and the residue of the partition wall is generated in the portion where the charges remain due to sandblasting. In other words, defects such as barrier ribs or ribs may occur, such as a discharge between adjacent address electrodes 511 due to residual charges and a part of the barrier rib material layer being destroyed to cause pin holes and exposing the address electrodes 511. One possible problem is an example.

  In view of such circumstances, the present invention provides a method for manufacturing a plasma display panel and a plasma display panel that provide a stable quality by preventing electrostatic charging in cutting processing by ejecting cutting material. Objective.

  The invention according to claim 1 is an electrode forming step for forming a plurality of electrodes on a substrate, and an insulator layer for forming an insulator layer in a region corresponding to a display region on the surface of the substrate on which the electrodes are formed Forming a partition wall material layer on the insulator layer of the substrate, and sequentially forming a mask having openings corresponding to the partition wall pattern on the partition wall material layer, and cutting the mask openings by spraying a cutting material; A partition wall forming step of forming a partition wall by cutting the partition wall material layer, wherein the electrode forming step includes: A plurality of extraction electrodes that are externally connected to the electrodes are formed in a non-display area outside the display area at an interval wider than the distance between the electrodes in the display area to form an assembly of extraction electrode groups. Both a method of manufacturing a plasma display panel, characterized in that the lead electrodes are positioned in the gap side to form the electrode in a state of connecting with the display area between adjacent said extraction electrode group.

  According to a second aspect of the present invention, there is provided an electrode forming step of forming a plurality of electrodes on a substrate, and an insulator layer for forming an insulator layer in a region corresponding to a display region on the surface of the substrate on which the electrodes are formed Forming a partition wall material layer on the insulator layer of the substrate, and sequentially forming a mask having openings corresponding to the partition wall pattern on the partition wall material layer, and cutting the mask openings by spraying a cutting material; A partition wall forming step of forming a partition wall by cutting the partition wall material layer, wherein the electrode forming step includes: Any one of the extraction electrodes formed in a non-display area outside the display area and externally connected to the electrode is arranged at a position wider than the distance between the electrodes in the display area. It is formed by branching in pairs from a method of manufacturing a plasma display panel according to claim.

  According to a sixth aspect of the present invention, there are provided a plurality of electrodes formed on a substrate, an insulator layer formed in a region corresponding to a display region on a surface of the substrate where the electrodes are formed, and the substrate A plasma display panel comprising a partition wall formed on an insulator layer and defining a plurality of discharge cells in the display region, wherein the plasma display panel has a surface outside the display region on the surface on which the electrode is formed. In a state where the extraction electrodes formed in the non-display area and externally connected to the electrodes are gathered into a plurality of block-shaped extraction electrode groups at intervals wider than the distance between the electrodes in the display area, and a plurality of In the plasma display panel, the extraction electrodes positioned on the gap side between the adjacent extraction electrode groups among the electrodes are connected to each other in the display region.

  According to a seventh aspect of the present invention, there are provided a plurality of electrodes formed on a substrate, an insulator layer formed in a region corresponding to a display region on a surface of the substrate on which the electrodes are formed, and the substrate A plasma display panel comprising a partition wall formed on an insulator layer and defining a plurality of discharge cells in the display region, wherein the plasma display panel has a surface outside the display region on the surface on which the electrode is formed. Any one of the lead electrodes formed in the non-display area and externally connected to the electrodes branches in pairs from the position of the display area at an interval wider than the distance between the electrodes in the display area It is the plasma display panel characterized by being formed in this.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
FIG. 2 is an exploded perspective view with a part cut away showing the internal structure of the plasma display panel in the present exemplary embodiment. FIG. 3 is a schematic configuration diagram illustrating a sand blasting apparatus that performs sand blasting by injecting a cutting material when forming a partition wall of the manufacturing method for manufacturing the plasma display panel according to the present embodiment. FIG. 4 is a plan view in which a part of the work to be the back substrate to be sandblasted is omitted. FIG. 5 is a plan view schematically showing an electrode pattern in the vicinity of the non-display area of the workpiece. FIG. 6 is a perspective view with a part cut away showing a workpiece to be sandblasted to form a back substrate constituting the plasma display panel.

[Configuration of plasma display panel]
In FIG. 2, reference numeral 100 denotes a plasma display panel (PDP). In this PDP 100, a front substrate 110 and a rear substrate 120 are arranged to face each other with a discharge space 101 interposed therebetween.
On the inner surface side of the front substrate 110, a plurality of transparent electrodes 111, a plurality of bus electrodes 112, a plurality of black stripes 113, a dielectric layer 114, and a protective film 115 are provided.
A plurality of address electrodes 121 are provided in parallel on the rear substrate 120 on the inner surface side of the rear substrate 120, and address electrode protection that is an insulator layer on the inner surface side of the rear substrate 120 so as to cover the address electrodes 121. A layer 122 is provided, and stripe-shaped barrier ribs 123 are provided on the address electrode protective layer 122, and a plurality of discharge cells 124 are partitioned by these barrier ribs 123.
Inside the plurality of discharge cells 124, phosphor layers (125R, 125G, 125B) of three primary colors of red (R), green (G), and blue (B) are sequentially formed. The inside of the discharge space 101, that is, the inside of each discharge cell 124, is filled with a discharge gas such as neon gas and sealed with the outside air.

[Configuration of sandblasting equipment]
In FIG. 3, reference numeral 200 denotes a sand blasting device. The sand blasting device 200 injects a cutting material onto a workpiece W as a substrate to be processed for forming a back substrate 120 constituting the PDP 100, that is, sand blasting. It is an apparatus for performing processing.
This sandblasting device 200 is disposed in a sandblasting chamber 201. The sand blast chamber 201 is provided with a humidification adjusting means 202 inside, and the humidity inside the sandblast chamber 201 is maintained in a high state.
This humidification adjusting means 202 is a humidifier that humidifies the air in the sandblast chamber 201, for example, one that generates steam by heating water, one that generates steam with ultrasonic waves, or other means that generates steam. Any device that generates the above can be adopted. The humidification adjusting means 202 preferably adjusts the humidity to 50 to 60%, for example. That is, the humidification adjusting means 202 increases the amount of water adhering to the surface of the workpiece W during the sandblasting process to improve the electrical conductivity on the surface of the workpiece W, thereby releasing the accumulated static electricity into the atmosphere at a high humidity. The inside of the chamber 201 is held.

Here, the workpiece W subjected to sandblasting is one in which an address electrode, an address electrode protection layer, and a partition wall formation layer, which are electrodes, are generated in the previous step.
That is, the sand blasting apparatus 200 performs the work W on which the electrode forming process, the insulator layer forming process, the partition material layer forming process in the partition forming process, and the mask forming process in the partition forming process are performed in the partition forming process. This is an apparatus for sandblasting in the sandblasting process.
The electrode forming step is a step of forming address electrodes as a plurality of electrodes on the substrate.

In this electrode formation process, as shown in FIGS. 4 and 5, the address electrodes 121 are formed in a plurality of stripes at positions corresponding to the display areas 131 on the back substrate 120 of the PDP 100, and display A plurality of extraction electrodes 310 are formed in the non-display area 132 outside the area 131 and connected to each address electrode 121. 4 and 5 are diagrams schematically showing the address electrode 121 and the extraction electrode 310 in a rough state for convenience of explanation. FIG. 5 is a schematic diagram in which the extraction electrode 310 is exaggerated and a part thereof is omitted for convenience of explanation.
As shown in FIGS. 4 and 5, these lead electrodes 310 have an external connection terminal portion 311 for external connection and an address electrode lead portion 312 for connecting the address electrode 121 and the external connection terminal portion 311. . Then, the external connection terminal portions 311 are formed together at a predetermined interval as the extraction portion 320 as an extraction electrode group that is a block-like assembly.
4 and FIG. 5 defined by the lead-out portion 320 and the address electrode lead-out portion 312 is a width 140 between the adjacent address electrodes 121 in the display region 131 in the parallel direction of the external connection terminal portion 311. It is wider than the dimension, and is set to a width dimension necessary for connecting the lead-out portion 320 to each drive circuit (not shown), for example. That is, the lead-out portion 320 is configured by forming the external connection terminal portion 311 into a block-like aggregate together for each drive circuit. Note that the external connection terminal portions 311 in the lead-out portion 320 are formed at substantially equal intervals.
Further, in the electrode formation step, the two external connection terminal portions 311 located at the extreme end on the region 140 side in the extraction portion 320 and facing the region 140 are formed in a state of being connected to one address electrode 121 by the address electrode extraction portion 312. Is done. That is, the lead electrode 310 branches from the end portion of the address electrode 121 in the longitudinal direction to the address electrode lead portion 312 in a substantially V shape, and is connected to the adjacent external connection terminal portion 311 through the region 140. Formed into a state.

As described above, the insulator layer forming step performed after the electrode forming step for forming the address electrode 121 and the extraction electrode 310 is the address electrode of the work W constituting the rear substrate 120 on which the address electrode 121 is formed by the electrode forming step. This is a step of generating an insulating layer (not shown) to be the address electrode protection layer 122 in a region corresponding to the display region 131 on the formation surface.
The partition wall material layer forming step is a step of forming a partition wall material layer 123A as shown in FIG. 6 on the upper surface of the insulator layer of the work W on which the insulator layer is formed by the insulator layer forming step. As the partition wall material for forming the partition wall material layer 123A, low melting point glass having a relatively small specific gravity is used.
The mask formation step is a step of covering and forming a resist mask (not shown) in which a partition wall pattern corresponding to the shape of the partition wall is formed on the upper surface of the partition wall material layer 123A formed in the partition wall material layer formation step.

As shown in FIG. 3, the sandblasting apparatus 200 includes a transport roller 203 that transports the workpiece W, a blast gun 210, a processing chamber 220, a blast cabinet 230, a material supply tank 240, a separation filter 250, a centrifuge 260, A dust collector 270, a cutting material tank 280, a quantitative supply device 290, and the like are provided.
The blast gun 210 sprays a cutting material onto the workpiece W together with dry air in a direction intersecting the plane of the workpiece W, and is provided inside the processing chamber 220. The blast gun 210 is provided so as to be swingable in conjunction with the movement of the workpiece W. The cutting material sprayed by the blast gun 210 cuts and removes the partition wall material layer that is not covered with a resist mask (not shown) on the workpiece W, and generates cutting scraps in which the partition wall material and the cutting material after cutting are mixed. To do. In addition, as a cutting material used for sandblasting by the sandblasting apparatus 200, glass beads, silicon carbide (SiC), silicon oxide (SiO ₂ ), aluminum oxide (Al ₂ O ₃ ), zirconium oxide having a relatively large specific gravity are used. Particles such as (ZrO ₂ ) are used.

The processing chamber 220 is a housing in which sandblasting is actually performed, and is configured so that cutting scraps such as a processed cutting material and a cut partition wall material are not scattered outside the processing chamber 220. ing. Specifically, the processing chamber 220 is maintained in a state where the internal pressure is lower than the external pressure.
In part of the processing chamber 220, a carry-in window 221 into which the work W is carried in and a carry-out window 222 through which the work W is carried out are formed so as to pass through the carry-in window 221 and the carry-out window 222. A transfer line is formed by 203. That is, a plurality of conveying rollers 203 are arranged in parallel on the horizontal plane substantially perpendicular to the moving direction of the workpiece W, and a conveying line that is substantially parallel to the moving direction of the workpiece W is formed by these conveying rollers 203.
Further, a discharge portion 223 is provided at the bottom of the processing chamber 220, and cutting waste can be discharged out of the processing chamber 220 through the discharge portion 223.
Further, a heater 224 is provided inside the processing chamber 220 to dry the cutting waste.

The blast cabinet 230 is a casing provided on the downstream side in the conveyance direction of the workpiece W with respect to the processing chamber 220 and the processing chamber 220, and collects cutting scraps scattered in the processing chamber 220. The blast cabinet 230 has an opening 231 for carrying the work W and an exit window 232 for carrying the work W open. The blast cabinet 230 is configured such that the conveyance line passes through the carry-in window 231 and the carry-out window 232 and the carry-in window 221 and the carry-out window 222 of the processing chamber 220.
The blast cabinet 230 is provided with an air cleaning means (not shown) for removing cutting waste adhering to the workpiece W by cleaning the workpiece W after sandblasting with air. The removed cutting waste is discharged out of the blast cabinet 230 through a discharge unit (not shown) similar to the discharge unit 223.

The material supply tank 240 is a tank that supplies new cutting material, and is in communication with the separation filter 250.
This material supply tank 240 is provided with a heater 241 inside, and dries the inside.

The separation filter 250 is a filter that collects cutting waste discharged from the discharge portion 223 of the processing chamber 220 and the discharge portion of the blast cabinet 230 and removes foreign matters mixed in the recovered cutting waste. Then, the cutting waste collected by the separation filter 250 is transferred to the centrifugal separator 260, and is separated into a partition material after cutting with a small weight and a cutting material with a large weight by the centrifugal separator 260. .
The dust collector 270 collects the partition wall material after cutting separated by the centrifuge 260. The dust collector 270 is provided with an intake fan 271 and a partition material storage (not shown) inside.
Then, the intake fan 271 sucks the cut partition wall material separated by the centrifugal separator 260 and transfers it to the partition wall material storage unit. Further, the intake fan 271 adjusts the internal pressure of the processing chamber 220 to be lower than the external pressure by the intake air. In addition, the partition wall material after cutting stored in the partition wall material storage unit is reused from the viewpoint of resource saving.

The cutting material tank 280 collects the cutting material separated by the centrifuge 260. The collected cutting material is transferred to a quantitative supply device 290 connected to the cutting material tank 280. Further, the cutting material tank 280 is provided with a heater 281 inside, and the inside thereof is dried.
The quantitative supply device 290 quantitatively adjusts the cutting material collected in the cutting material tank 280 and supplies the blast gun 210 with pressure. This fixed quantity supply device 290 is provided with a heater 291 inside, and the inside is dried. In addition, the heaters 224, 241, 281 and 291 provided inside the processing chamber 220, the material supply tank 240, the cutting material tank 280, and the fixed amount supply device 290 are dried to form fine particles. It is provided in order to prevent cutting materials from adhering to each other due to humidity and preventing uniform sandblasting.

[Operation of sandblasting device]
Next, the operation of the above-described sandblast apparatus 200 will be described. As an operation of the sandblasting apparatus 200, an operation of forming a partition wall on the workpiece W for forming the rear substrate 120 of the PDP 100 in the partition forming process by the above-described sandblasting apparatus 200 will be described.

First, a work W is formed by performing a pre-process of a partition forming process for performing sandblasting, that is, as described above, an electrode forming process, an insulator layer forming process, a partition material layer forming process, and a mask forming process. deep.
Further, the humidity inside the sandblast chamber 201 is appropriately adjusted by the humidification adjusting means 202, and each component device of the sandblasting apparatus 200 is operated. During this operation, the internal pressure of the processing chamber 220 is adjusted to be lower than the external pressure by the rotation of the intake fan 271 of the dust collector 270. Thus, humidified air is introduced into the interior from the carry-in window 221 and the carry-out window 222 of the processing chamber 220, the carry-in window 231 and the carry-out window 232 of the blast cabinet 230, and the like.

In this state, the work W is placed on the transport roller 203, and the work W is carried into the processing chamber 220 through the loading window 231 of the blast cabinet 230 and the loading window 221 of the processing chamber 220.
Since the internal pressure of the processing chamber 220 is negative with respect to the external pressure, the surface of the work W that is carried in is the carry-in window 221 and the carry-out window 222 of the machining chamber 220 or the carry-in window of the blast cabinet 230. 231 and the humidified air flowing in from the carry-out window 232 are in contact with each other.

Then, the sand blasting apparatus 200 injects a cutting material from the blast gun 210 onto a surface to be processed of the workpiece W carried into the processing chamber 220, that is, a surface provided with a resist mask.
During the injection of the cutting material, the workpiece W is connected to the ground potential. That is, in the non-display area 132, each external connection terminal portion 311 in the lead-out portion 320 is brought into contact with, for example, a discharging means such as a conductive brush and grounded. The blast gun 210 swings so as to reciprocate in the width direction of the workpiece W in conjunction with the movement of the workpiece W, and injects the cutting material from one end to the other end of the surface to be processed of the workpiece W without leakage. Then, the partition wall material layer 123A not covered with the resist mask of the workpiece W is cut and removed.
Note that cutting waste generated during the sandblasting process is instantaneously dried by the heater 224 and sucked into the discharge unit 223 of the processing chamber 220 by the rotation of the intake fan 271.

Also, by the time the workpiece W is transported and reaches the carry-out window 222, sandblasting is performed on substantially the entire surface to be processed of the workpiece W. After machining, the workpiece W is transferred from the carry-out window 222 to the buffer in the blast cabinet 230. Conveyed to the room. In this buffer chamber, the workpiece W after sandblasting is cleaned by an air cleaning means (not shown), and the cutting waste adhering to the workpiece W is removed. After air cleaning of the workpiece W, the workpiece W is unloaded from the unloading window 232 to the outside of the blast cabinet 230, and a series of sandblasting processes is completed.
Thereafter, the resist mask is transferred from the workpiece W to the step of peeling.

[Effects of Embodiment]
As described above, in the above-described embodiment, the work in which the address electrodes 121 and the extraction electrodes 310 are formed in the electrode forming step of forming the plurality of address electrodes 121 and the extraction electrodes 310 on the work W constituting the back substrate 120. Located in the non-display area 132 outside the display area 131 on the surface of W, the extraction electrode 310 is provided in a block shape with an interval of the area 140 wider than the width dimension between the adjacent address electrodes 121 in the display area 131. The lead electrodes 320 of the lead parts 320 located in the region 140 of the lead parts 320 adjacent to each other are formed so as to be connected to the address electrodes 121 in the display region 131. Yes.
That is, the extraction electrode 310 is formed in a state where it branches from the display area 131 in a pair with respect to one address electrode 121 and faces through the area 140.
As a result, the lead electrode 310 connected to the address electrode 121 at a position facing the region 140 of the lead portion 320 where the electrostatic charge easily occurs due to the difference in charge state between the lead portion 320 and the region 140 between the lead portion 320 during sandblasting. The potential difference between the extraction units 320 becomes 0V.
Therefore, inconvenience due to electrostatic charging during sandblasting can be prevented with a simple configuration, and a stable and good quality PDP 100 can be provided.
Since the extraction electrode 310 that makes a pair with respect to one address electrode 121 is in a branched state, for example, the extraction electrode 310 that makes a pair in the front stage portion of the address pulse driving means that is an externally connected drive circuit. It is only necessary to provide one conductor connected across the two. With this configuration, even when the extraction electrode 310 is branched into two, an address pulse can be supplied to the address electrode 121 by one drive pulse supply unit. The address pulse can be supplied by any method or configuration, not limited to such a configuration.

Even if the cutting scraps adhere to the non-display area 132, the work W is connected to the ground potential, that is, the lead-out portion 320 is grounded by the charge removing means to remove electricity.
For this reason, there is no or no strong adsorption force of cutting waste due to static electricity.
For this reason, it is sufficiently removed by the air cleaning means in the buffer chamber in the blast cabinet 230, and the above-described inconveniences such as poor connection can be reliably prevented with a simple configuration such as air cleaning.

A sandblasting device 200 is disposed in a sandblasting chamber 201 provided with a humidification adjusting means 202.
For this reason, since the humidified air flows into the processing chamber 220 where the sandblasting is performed and comes into contact with the workpiece W, the workpiece W is less likely to be charged with static electricity, and the non-display area 132 of the cutting waste is better. Can be prevented.

[Modification of Embodiment]
In addition, this invention is not limited to one Embodiment mentioned above, The deformation | transformation shown below is included in the range which can achieve the objective of this invention.

That is, the sandblasting process is not limited to the configuration of the sandblasting apparatus 200 described above, and any apparatus that can form a partition wall by spraying a cutting material can be used.
For example, the configuration is not limited to the configuration in which the sandblasting device 200 is disposed in the sandblasting chamber 201 provided with the humidification adjusting means 202, and the humidified air is blown to the workpiece W, such as the humidification adjusting means 202 being provided in the processing chamber 220. It is also possible to use a configuration that does not provide a humidifying configuration.
Further, the cutting waste is recovered and the cutting material is recovered and no reusable configuration is provided, or any other reusable configuration is used, or the heater 224 is not provided. May be.

Further, the extraction electrode 310 in the drive circuit connection region 140 has been described as being connected to one address electrode 121 in the display region 131. However, for example, the connection is not limited to the address electrode 121. Instead of being connected to 121, the display area 131 may be simply connected to each other.
Further, not only the extraction electrode 310 facing the region 140 for connecting the drive circuit, but a gap is formed in which the space between the extraction electrodes 310 is wider than the interval between the address electrodes 121 for reasons of formation of the extraction electrode 310, for example. In such a configuration, the extraction electrode 310 facing the gap may be connected in the display region 131.

  In addition to the configuration in which a conductive brush or the like is brought into contact as a configuration for eliminating static electricity, a configuration in which the work W is connected to the ground potential by any method such as using a columnar member with a conductive member coated on the surface of a soft member is applied. it can.

  In addition, the specific structure and procedure for carrying out the present invention can be appropriately changed to other structures and the like within a range in which the object of the present invention can be achieved.

[Effect of the embodiment]
As described above, the display area on the surface of the work W on which the address electrodes 121 and the extraction electrodes 310 are formed in the electrode forming step of forming the plurality of address electrodes 121 and the extraction electrodes 310 on the work W constituting the back substrate 120. Positioned in the non-display area 132 outside the area 131, the extraction electrodes 310 are grouped into a block-shaped extraction section 320 with an interval of the area 140 wider than the width dimension between adjacent address electrodes 121 in the display area 131. In addition, the lead electrodes 310 at the extreme ends of the lead portions 320 located in the region 140 of the lead portions 320 adjacent to each other are formed so as to be connected in the display region 131.
For this reason, the extraction electrode 310 at a position facing the area 140 of the extraction section 320 that is likely to be charged with static electricity due to a difference in charging state between the extraction section 320 and the area 140 between the extraction sections 320 during sandblasting is connected to the display area 131. Therefore, the potential difference between the extraction parts 320 becomes 0 V, and inconveniences due to electrostatic charging during sandblasting, such as inconveniences in the configuration in which the residue and the extraction electrode 310 are connected to the address electrodes 121, for example, can be prevented with a simple configuration, and stable and good Can provide a high quality PDP 100.

Further, in the electrode forming step of forming the plurality of address electrodes 121 and the extraction electrodes 310 on the work W constituting the back substrate 120, the display area 131 outside the display area 131 on the surface of the work W on which the address electrodes 121 and the extraction electrodes 310 are formed. In the non-display area 132, the extraction electrode 310 is branched in pairs from the position of the display area 131 at intervals of the area 140 wider than the width dimension between the adjacent address electrodes 121 in the display area 131. Is formed.
For this reason, the potential difference between the extraction electrodes 310 becomes 0 V due to the extraction electrode 310 facing the region 140 where electrostatic charging is likely to occur due to the difference in charge state between the extraction electrode 310 and the region 140 during sandblasting. Inconvenience due to electrostatic charging during sandblasting, such as inconvenience in the configuration connected to the address electrode 121, can be prevented with a simple configuration, and a stable and good quality PDP 100 can be provided.

It is the top view which notched a part which shows notionally the pattern of the extraction electrode vicinity in the non-display area | region of the workpiece | work which comprises the conventional general plasma display panel. It is the disassembled perspective view which notched the part which shows the internal structure of the plasma display panel which concerns on one Embodiment in this invention. It is a schematic block diagram which shows the sandblasting apparatus utilized at the sandblasting process in the said embodiment. It is the top view which abbreviate | omitted one part which shows the workpiece | work used as the back substrate which carries out the sandblasting in the said embodiment. It is a top view which shows roughly the electrode pattern of the non-display area | region vicinity of the workpiece | work in the said embodiment. It is the perspective view which notched a part which shows the workpiece | work which carries out the sandblasting process in the said embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 ... Plasma display panel 200 ... Sand blast apparatus 131 ... Display area 132 ... Non-display area 120 ... Back substrate which is a substrate 121 ... Address electrode which is an electrode 123A ... Partition material layer 140 ... Area which is a gap 310... Extraction electrode that is an electrode 320... Extraction part that is a group of extraction electrodes
W: Workpiece that is a substrate

Claims (7)

An electrode forming step of forming a plurality of electrodes on the substrate; an insulator layer forming step of forming an insulator layer in a region corresponding to a display region on the surface of the substrate on which the electrodes are formed; and an insulator of the substrate A partition wall material layer is formed on the layer, and a mask having openings corresponding to the partition wall pattern is sequentially formed on the partition wall material layer, and the partition wall material layer is cut through the opening of the mask by spraying a cutting material. And a partition wall forming step of forming a partition wall, and a method of manufacturing a plasma display panel,
In the electrode formation step, the electrodes are externally connected to a non-display area outside the display area on the surface of the substrate on which the electrode is formed, with an interval wider than the distance between the electrodes in the display area. A plurality of extraction electrodes are formed to form an assembly of extraction electrode groups, and the electrodes are formed in a state in which the extraction electrodes positioned on the gap side between the adjacent extraction electrode groups are connected in the display area. A method of manufacturing a plasma display panel. An electrode forming step of forming a plurality of electrodes on the substrate; an insulator layer forming step of forming an insulator layer in a region corresponding to a display region on the surface of the substrate on which the electrodes are formed; and an insulator of the substrate A partition wall material layer is formed on the layer, and a mask having openings corresponding to the partition wall pattern is sequentially formed on the partition wall material layer, and the partition wall material layer is cut through the opening of the mask by spraying a cutting material. And a partition wall forming step of forming a partition wall, and a method of manufacturing a plasma display panel,
In the electrode formation step, any one of the extraction electrodes formed in a non-display area outside the display area on the surface of the substrate on which the electrode is formed and externally connected to the electrode is connected to the display area. A method of manufacturing a plasma display panel, wherein the plasma display panel is formed by branching from the position of the display region at intervals wider than the distance between the electrodes. A method of manufacturing a plasma display panel according to claim 2,
The method of manufacturing a plasma display panel, wherein in the electrode forming step, the extraction electrodes are formed by gathering into a plurality of block-shaped extraction electrode groups at intervals between the extraction electrodes formed by branching. A method for manufacturing a plasma display panel according to any one of claims 1 to 3,
In the partition forming step, the substrate is connected to a ground potential during cutting by spraying the cutting material. A method of manufacturing a plasma display panel, comprising: It is a manufacturing method of the plasma display panel of Claim 4, Comprising:
The method for manufacturing a plasma display panel, wherein the extraction electrode is connected to a ground potential as a connection to the ground potential of the substrate in the partition forming step. A plurality of electrodes formed on a substrate; an insulator layer formed in a region corresponding to a display region on a surface of the substrate on which the electrode is formed; and the display formed on the insulator layer of the substrate A plasma display panel comprising a partition wall that partitions and forms a plurality of discharge cells in a region,
A plurality of extraction electrodes formed on a non-display area outside the display area on the surface of the substrate on which the electrodes are formed and connected to the outside of the electrodes are wider than the distance between the electrodes in the display area. In a state of being assembled into a block-shaped extraction electrode group, and the extraction electrodes located on the gap side between adjacent extraction electrode groups among the plurality of electrodes are connected to each other in the display region. A plasma display panel characterized by this. A plurality of electrodes formed on a substrate; an insulator layer formed in a region corresponding to a display region on a surface of the substrate on which the electrode is formed; and the display formed on the insulator layer of the substrate A plasma display panel comprising a partition wall that partitions and forms a plurality of discharge cells in a region,
Any one of lead electrodes formed in a non-display area outside the display area on the surface of the substrate on which the electrode is formed and externally connected to the electrode is based on a distance between the electrodes in the display area. A plasma display panel, wherein the plasma display panel is formed in a state of being branched from the position of the display region in pairs at a wide interval.

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