JP2000024924A - Sandblast treating device and treating method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the cutting efficiency and to improve the abrasion resistance of a mask composed of a resist to the abrasive sand by mounting a heating part for sending a substrate to a sand blasting treating part in a heated state in the sand blasting process. SOLUTION: A substrate to be treated 180 is conveyed from a convey roller 272 side to a processing chamber 205 of a heating part 200. Then the infared ray 220 is irradiated to the front and rear surfaces of the substrate 180 by a panel heater 21 in the treatment chamber 204 while conveying the substrate 180 by a convey roller 271. The substrate 180 heated at a predetermined temperature is conveyed and sent into a treatment chamber 105 of a sand blasting part 100. Then a work piece is selectively cut through a mask by the blasting abrasive sand 118 jetted from a nozzle 110 by the high-pressure air while conveyed by a convey roller 171 at a predetermined speed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sandblasting apparatus for performing sandblasting by injecting abrasive sand powder such as glass beads using high-pressure air.

[0002]

2. Description of the Related Art In recent years, plasma display panels (hereinafter, also referred to as PDPs) have been used in various display devices because of their small depth, light weight, clear display, and wide viewing angle compared to liquid crystal panels. It is being used.
Generally, a plasma display panel (PDP) has two
A pair of regularly arranged electrodes are provided on a pair of opposed glass substrates, and a gas mainly containing neon, xenon, or the like is sealed between the pair of electrodes. Then, a voltage is applied between these electrodes, and a discharge is generated in minute cells around the electrodes, so that each cell emits light and display is performed. In particular, in order to display information, regularly arranged cells are selectively discharged to emit light.

Here, the configuration of the PDP is shown in FIG.
An example of the type PDP will be described. FIG. 7 is a perspective view of the PDP structure, but shows the front plate (glass substrate 710) and the rear plate (glass substrate 720) apart from the actual case for easy understanding. As shown in FIG. 7, two glass substrates 710 and 720 are disposed in parallel and opposed to each other, and both are provided on a glass substrate 720 serving as a back plate in parallel with each other (cell barrier). 730)
Are held at regular intervals. On the back side of the glass substrate 710 serving as a front plate, composite electrodes composed of a transparent electrode 740 serving as a discharge sustaining electrode and a metal electrode 750 serving as a bus electrode are formed in parallel with each other.
A dielectric layer 760 is formed, and a protective layer (MgO layer) 770 is further formed thereon. In addition, on the front side of a glass substrate 720 serving as a back plate, an address electrode 780 is positioned between barriers 730 so as to be orthogonal to the composite electrode.
Are formed in parallel with each other, and a phosphor 790 is provided so as to cover the wall surface of the barrier 730 and the cell bottom surface. The barrier 730 is for defining a discharge space, and each partitioned discharge space is called a cell or a unit light emitting region.
This AC type PDP is a surface discharge type, and has a structure in which an AC voltage is applied between composite electrodes on the front panel to discharge.
In this case, since the alternating current is applied, the direction of the electric field changes according to the frequency. Then, the phosphor 790 is caused to emit light by the ultraviolet light generated by the discharge, and the light transmitted through the front plate can be visually recognized by an observer. In addition, DC type PD
In the case of P, the electrode is different from the AC type in that the electrode has a structure not coated with the dielectric layer, but the discharge effect is the same. 7 has a structure in which a base layer 767 is provided on one surface of a glass substrate 720 and a dielectric layer 765 is provided thereon, but the base layer 767 and the dielectric layer
5 is not necessarily required.

[0004] Conventionally, as a method of forming a barrier of a back plate used in the above-mentioned PDP, a barrier forming material is repeatedly printed on a glass substrate in a barrier pattern shape by screen printing a plurality of times, and a required pattern is formed. The first method of stacking and drying at a height (called a screen printing method), or applying a barrier-forming material over the entire surface of a glass substrate and then patterning a resist having sandblast resistance on the applied surface into a predetermined shape A second method (called a sandblast method) of forming a barrier-forming material into a predetermined shape by sandblasting using the resist as a mask has been employed. However, in forming the barrier of the back plate used in the PDP by the first method, it is necessary to screen-print the paste several times to several tens times to obtain a predetermined thickness as the barrier, which is troublesome. In addition, it is necessary to control the printing accuracy, and it is difficult to obtain satisfactory printing quality. At present, the second method is mainly used.

Here, the second method (sand blast method)
FIG. 5 shows an example of the barrier formation by the sand blast method, and the barrier formation method by the sand blast method will be further described. FIG.
As shown in (a), after the electrode wiring 530 is formed on one surface of the glass substrate 510 via the undercoat layer 520, the electrode wiring 530 is formed on the surface of the glass substrate 510 so as to cover the surface of the glass substrate 510.
Further, a dielectric layer 550 is formed. Next, the dielectric layer 5
After applying a processing material 560 made of a low-melting glass paste for forming a barrier over the entire surface on the top 50 (FIG. 5B), a photosensitive resist 540 resistant to sandblasting is applied on the processing material 560. Then, only a predetermined region of the resist 540 is exposed using a photomask having a pattern of a predetermined shape corresponding to the shape of a barrier to be formed, and is developed to form a predetermined region. Pattern into shape. (FIG. 5D) Then, the resist 540 is used as a mask when the processing material 560 is subjected to sandblasting, and sandblasting is performed, and only the processing material 560 exposed from the mask is cut into a predetermined shape. I do. (FIG. 5E) Thereafter, the resist 540 is removed and a baking process is performed to form a barrier 560A on the dielectric layer 550. (FIG. 5
(F))

In forming a barrier on a glass substrate serving as a back plate used in a PDP by the second method, a barrier-forming material coated on the glass substrate is covered with a sandblast-resistant mask to form a plurality of barriers. Polishing sand such as glass beads was blown from a nozzle with high-pressure air, and a portion exposed from the mask was selectively cut to form a barrier. Normal,
As shown in FIG. 6, a blast nozzle 610 is inserted into the processing chamber 605 via a supporting shaft 611, and the blast nozzle 610 is moved along a slit 695 provided in a ceiling 691 of the processing chamber 605. A processing substrate of various sizes has been subjected to sandblasting using a sandblasting apparatus that moves the position. In such a sandblasting apparatus, it is important that the cutting efficiency is high. Conventionally, in order to avoid a decrease in the cutting efficiency due to agglomeration due to moisture (moisture) in the atmosphere of the polishing sand, the polishing sand is used in a heated state. Thus, a method for preventing a reduction in cutting efficiency has been adopted. However, from the viewpoint of mass productivity, a method with higher cutting efficiency has been demanded. On the other hand, there is also a problem with the abrasion resistance of the resist against polishing sand, and this measure has been demanded.

[0007]

As described above, the PDP
When forming a barrier of the back plate used for sandblasting by a sandblasting method, a sandblasting method with higher cutting efficiency is required from the viewpoint of mass productivity, and an improvement in the abrasion resistance of the resist against polishing sand is required. Was. The present invention
In response to this, a processing material is provided on the processing surface side,
Further, in a sand blasting method for a processing substrate provided with a mask made of a resist of a predetermined shape, a sand blasting method capable of improving the cutting efficiency and improving the abrasion resistance of the mask made of the resist against abrasive sand is provided. It is assumed that.

[0008]

According to the present invention, there is provided a sand blasting apparatus for processing a substrate having a processing material provided on a processing surface side and a mask having a resist having a predetermined shape, which is resistant to sand blasting. On the other hand, it is an apparatus for performing a sand blasting process, in which a blast nozzle position is moved in a processing chamber, and a processing substrate is polished by high-pressure air through the mask provided on a processing surface side of the processing substrate. Spray the sand from the blast nozzle,
A sand blast processing unit that selectively cuts and removes a processing material on a processing substrate, and a heating unit that sends the processing substrate in a heated state to the sand blast processing unit when performing sand blast processing, Is what you do. In the above, the processing substrate is a substrate for a plasma display, and the processing material is a low-melting glass paste for forming a barrier or the like.

The sand blasting method of the present invention is a sand blasting method for a processing substrate provided with a processing material on a processing surface side and further provided with a mask made of a resist having a predetermined shape and resistant to sand blasting. When performing the sand blasting process, the processing substrate is fed into the sand blasting processing section in a heated state. In the above, the processing substrate is a substrate for a plasma display, and the processing material is a low-melting glass paste for forming a barrier or the like. Here, the heating is a heating treatment in which the water content of the working material (cutting layer) is reduced and cutting efficiency can be increased as compared with the case where no heating is performed.
This is a heat treatment for softening the resist and improving the wear resistance of the resist mask.

[0010]

According to the sand blasting apparatus of the present invention having such a structure, a processing material is provided on the processing surface side, and a sand blast processing is performed on a processing substrate on which a mask made of a resist having a predetermined shape is further provided. According to the method, it is possible to provide a sand blasting apparatus capable of improving the cutting efficiency and improving the abrasion resistance of a mask made of a resist against abrasive sand. Specifically, in the processing chamber, the position of the blast nozzle is moved, and the processing substrate is blown with abrasive sand from the blast nozzle by high-pressure air through the mask provided on the processing surface side of the processing substrate. By providing a sand blast processing unit that selectively cuts and removes the processing material on the processing substrate, and a heating unit that sends the processing substrate in a heated state to the sand blast processing unit when performing the sand blast processing, This has been achieved. A blast nozzle is inserted into a processing chamber via a supporting shaft used for forming a barrier of a PDP substrate, etc., and a sand blasting apparatus in which the shaft is moved along a slit provided on a ceiling of the processing chamber is also easy. Applicable to In particular, when the processing substrate is a substrate for a plasma display and the processing material is made of a low-melting glass paste for forming a barrier or the like, it is effective.
Mass production and quality improvement of sandblasting of PDP substrates can be expected.

The sand blasting method of the present invention having such a structure makes it possible to provide a sand blasting method which has a high cutting efficiency and can improve the abrasion resistance of a mask made of a resist against abrasive sand. .
This is particularly effective when the processing substrate is a substrate for a plasma display and the processing material is a low-melting glass paste for forming a barrier or the like.

The first reason for performing the heat treatment is that by heating the processing substrate, the water content of the processing material (cutting layer) to be sandblasted is reduced, and the cutting efficiency is improved as compared with the case where no heating is performed. . Usually, the paste for forming the barrier of the substrate (back plate) for PDP is a low melting glass frit, a filler (alumina, zirconia, etc.), a pigment,
It is made of resin and solvent, applied on a processing substrate, dried, and then contains water, which may reduce the cutting efficiency in sandblasting. The second reason is that the softening of the resist improves the wear resistance as a mask. In the production of a substrate (back plate) for PDP, a resist used for forming a barrier thereof is a negative type alkali-soluble commercially available dry film resist (for example, BF-603 manufactured by Tokyo Ohka Kogyo Co., Ltd.). Is used. Incidentally, the dry film resist is usually a commercially available form in which a resist is formed on a base film and covered with a cover film.The cover film is peeled off, and the resist portion is put together with the base film on the paste side of the processing substrate. Laminates are used, but resist formation on the processing substrate is advantageously employed from the viewpoint of workability. The development is performed with the base film removed. In this case, the resist softens,
The temperature at which the wear resistance is improved is, in particular, 80 ° C to 1 ° C.
00 ° C is preferred. The effect can be obtained even at 60 ° C to 180 ° C.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a sandblasting apparatus according to the present invention will be described with reference to the drawings. FIG. 1 is a simplified structural view of a sandblasting apparatus of the present invention, FIG. 2 is a schematic sectional view of a sandblasting section, FIG. 3 is a schematic view of a heating section, and FIG. FIG. 2B is a diagram viewed from the B1-B2 side in FIG. 2A, FIG. 3A is a perspective view of a part viewed from the A0 side in FIG. 1, and FIG. FIG. 3A is a partial perspective view seen from the C0 side. 1 to 3, reference numeral 100 denotes a sand blast processing unit, 105 denotes a processing chamber, 110 denotes a blast nozzle, 111 denotes a shaft (also a polishing sand pipe), 113 denotes a shaft fixing unit, 115 denotes a shaft transporting unit, and 117 denotes an outlet. Part, 118 is abrasive sand, 120 is a transport plate, 121 is a bearing part, 1
Reference numeral 30 denotes a slideway, 170 denotes a transport roll, 180 denotes a substrate, 190 denotes a processing chamber wall, 191 denotes a ceiling, 195 denotes a slit, 200 denotes a heating section, 205 denotes a processing chamber, 210 denotes a panel heater, and 211 denotes a panel heater holding section. , 220 is an infrared ray, 230 is a motor, 271 and 272 are transport rolls, and 290 is a processing chamber wall. The sand blast processing apparatus of the present invention is a sand blast processing apparatus used when manufacturing a substrate for a plasma display, in which a processing material is formed of a low-melting glass paste for forming a barrier, etc., on a processing material on a processing surface side. Dry film resist of predetermined shape (for example, BF-60 manufactured by Tokyo Ohka Kogyo Co., Ltd.)
This is an apparatus for performing sandblasting on a processing substrate provided with the sandblasting mask according to 3).
Then, a sand blast processing unit 100 that selectively cuts a processing material through the mask provided on the processing surface side of the processing substrate, and a sand blast processing unit 100 that performs sand blast processing on the processing substrate. And a heating unit 200 for feeding the processing substrate 180 in a heated state.

The heating section 200 places the processing substrate 180 on the transport roll 271 with the processing material of the processing substrate 180 and the mask side facing upward, and irradiates infrared rays 220 to the front and back of the processing substrate 180 with the upper and lower panel heaters 210. , And a heat treatment, and has a structure as shown in FIG. The transport roll 271 is driven and rotated by the motor 230. FIG. 3 shows the whole in an easy-to-understand manner, and shows only the main part on the upper side. More specifically, FIG.
As shown in FIG.
In this example, seven 200 W panel heaters 210 are arranged in a substrate traveling direction and eleven in a width direction of the substrate (a total of 77) are arranged in a grid pattern at an interval of 20 mm. It matches the size of the substrate. It is preferable to select the number of panel heaters to be used and the output of the panel heaters / sheet according to the transfer speed of the processing substrate and the size of the processing substrate.

The sandblasting section 100 is provided in the processing chamber 10.
5, the position of the blast nozzle 110 is moved, and polishing sand is blown from the blast nozzle with high-pressure air to the processing substrate through the mask provided on the processing surface side of the processing substrate. This is for selectively cutting and removing the above processing material. As shown in FIG. 2A, the sand blast unit 100
By supporting the ten parts on a shaft 111 fixed to the shaft transport unit 115, suspending the ten parts in the processing chamber 105, and moving the shaft 111 along a slit 195 provided in a ceiling 191 of the processing chamber 105, The blast nozzle 110 is reciprocated. As shown in FIG. 2B, a blowout port 117 is provided below the blast nozzle 110, and abrasive sand 118 is blown out by high-pressure air, and is applied to a processing substrate 180 to selectively cut a processing material. . The shaft 111 is indicated by an arrow B3 (FIG. 2B).
Reciprocate in the direction of. In FIG. 2A, the transport plate 1
Reference numeral 20 denotes an integral part of the precision polished bearing 121, which integrally supports the shaft transporting part 115. The shaft 111 supported by the shaft transporting part 115 is moved along the slideway 130 to form a slit 19.
It moves along 5. Further, the slideway 130 is fixed to the ceiling 191, but is not particularly limited thereto, and may be fixed to another.

The transport speed of each of the transport rollers 271 and 171 is independently controlled so that the transport can be performed at a speed suitable for each process.

Next, an example of an embodiment of the sandblasting method of the present invention will be described. In this example, a substrate for a plasma display made of a low-melting glass paste for forming a barrier or the like is used as a processing substrate, and the processing is performed using the apparatus shown in FIG. Hereinafter, this example will be described with reference to FIGS. At the same time, the description of the operation of the apparatus shown in FIG. Next, as an example of the sand blasting method of the present invention, an example of implementing the method using the apparatus shown in FIG. 1 will be described. First, the processing substrate 180 is transported from the transport roll 272 side into the processing chamber 205 of the heating unit 200. Subsequently, the front and back surfaces of the processing substrate 205 are irradiated with infrared rays 220 by the panel heater 210 and heated while the processing substrate 180 is being transported by the transfer roll 271. The processing substrate 180 is placed in the processing chamber 1205 of the heating unit 200 and heads toward the sandblasting unit 100 while being transported by the transport roll 271.
In the processing chamber 205 of the heating unit 200, the panel heaters 210 irradiating infrared rays 220 provided above and below receive heat from the front and back surfaces and are heated. Then
The processing substrate 180 heated to a predetermined temperature is transported and sent to the processing chamber 105 of the sandblast processing unit 100. Then, while being transported at a predetermined speed by the transport rolls 171, the processing material is selectively cut through a mask by abrasive sand 118 blown out from nozzles 110 by high-pressure air. In the case of this example, the processing substrate is a substrate for PDP, the processing material is a low melting point glass paste for forming a barrier or the like, and BF-603 manufactured by Tokyo Ohka Kogyo Co., Ltd. is used as a mask for sandblasting.
Since a dry film resist is used, the processing substrate 180 is required in view of sandblasting efficiency and abrasion resistance of the mask.
The heating temperature is reduced to 80 to 100 ° C., but the heating temperature is lower than that in the case where no heating is performed. The effect can be expected if the temperature is within the range where improvement is expected.

[0018]

As described above, the present invention provides a sandblasting method for a processing substrate provided with a processing material on the processing surface side and further provided with a mask made of a resist having a predetermined shape. It is possible to provide a sandblasting method capable of improving the abrasion resistance of a mask made of a resist against polishing sand. At the same time, it has become possible to provide a sandblasting apparatus capable of performing such processing. In particular, it is particularly effective when the present invention is applied to a sandblasting apparatus when forming a barrier or the like of a back plate used for a PDP by a sandblasting method. As a result, it is possible to cope with mass production and quality of PDP substrates.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of an example of an embodiment of a sandblasting apparatus of the present invention.

FIG. 2 is a schematic diagram of a sand blast processing unit.

FIG. 3 is a partial perspective view of a heating unit.

FIG. 4 is a diagram for explaining a panel heater;

FIG. 5 is a diagram for explaining formation of a barrier by sandblasting.

FIG. 6 is a view for explaining a conventional sandblasting apparatus.

FIG. 7 is a diagram illustrating a PDP substrate.

[Explanation of symbols]

REFERENCE SIGNS LIST 100 Sand blasting device 105 Processing chamber 110 Blast nozzle 111 Shaft (also a polishing sand pipe) 113 Shaft fixing part 115 Shaft conveying part 117 Blow-out part 118 Polishing sand 120 Transfer plate 121 Bearing 130 Slideway 170 Transfer roll 180 Substrate 190 Processing chamber wall Unit 191 Ceiling 195 Slit 200 Heating unit 205 Processing room 210 Panel heater 211 Panel heater holding unit 220 Infrared ray 230 Motor 271, 272 Conveyance roll 290 Processing room wall 605 Processing room 610 Nozzle 611 Shaft 613 Shaft fixing unit 615 Shaft conveying unit 620 Shielding Member 670 Conveyance roll 680 Glass substrate (back plate) 690 Sandblast processing chamber wall 691 Ceiling 695 Slit

Claims (4)

[Claims] 1. An apparatus for performing a sandblasting process on a processing substrate provided with a processing material on a processing surface side and further provided with a mask made of a resist having a predetermined shape and resistant to sandblasting, In the processing chamber, the position of the blast nozzle is moved, and
Through the mask provided on the processing surface side of the processing substrate,
A high-pressure air blows abrasive sand from a blast nozzle to selectively cut and remove the processing material on the processing substrate.When performing the sand blasting process, the sand blast processing unit heats the processing substrate. A sand blasting apparatus, comprising: a heating unit for feeding in. 2. The sandblasting apparatus according to claim 1, wherein the processing substrate is a substrate for a plasma display, and the processing material is a low-melting glass paste for forming a barrier or the like. 3. A sandblasting method for a processing substrate provided with a processing material on a processing surface side and further provided with a mask made of a resist having a predetermined shape and resistant to sandblasting, wherein the sandblasting is performed. In this case, a sandblast processing method is characterized in that the processing substrate is fed into the sandblast processing section in a heated state. 4. The sandblasting method according to claim 3, wherein the processing substrate is a substrate for a plasma display, and the processing material is a low-melting glass paste for forming a barrier or the like.