JP2002028870A - Sand blast device and rib forming method for plasma display panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent generation of a defect due to static electricity generated at the time of sand blast when a rib of a plasma display panel is patterned by a sand blast method. SOLUTION: In a rib forming method for the plasma display panel including a process for patterning a rib material layer into a rib shape by the sand blast for jetting mixed air including a grinding material from an upper side of a mask after at least the rib material layer is formed on a base material and a mask for sand blast resistance is formed into a pattern shape, an injection nozzle 22 for performing sand blast is provided with a discharging means 30 and the sand blast is performed, discharging static electricity generated on a base plate G. Since large discharge is not generated during the sand blast, the rib can be patterned without generating defects in an address electrode and the rib.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a process for manufacturing a plasma display panel (hereinafter referred to as "PDP"), and more particularly to a technical field of forming a rib constituting a discharge space of a PDP by a sandblasting method. .

[0002]

2. Description of the Related Art In general, a PDP has a structure in which a pair of regularly arranged electrodes are provided on two opposing glass substrates, and a gas mainly composed of Ne, Xe or the like is sealed between the electrodes. Then, a voltage is applied between these electrodes,
By generating a discharge in a minute cell around the electrode, each cell emits light to perform display. In order to display information, regularly arranged cells are selectively caused to emit light. There are two types of PDPs, a direct current type (DC type) in which the electrodes are exposed to the discharge space, and an alternating current type (AC type) in which the electrodes are covered with an insulating layer. And a refresh driving method and a memory driving method.

FIG. 1 shows a configuration example of an AC type PDP. This figure shows the front plate and the back plate separated from each other. As shown in the figure, two glass substrates 1 and 2 are arranged in parallel with each other and face each other. The ribs 3 are provided on the glass substrate 2 in parallel with each other so as to be held at regular intervals. On the back side of the glass substrate 1 serving as the front plate, composite electrodes composed of a sustain electrode 4 which is a transparent electrode and a bus electrode 5 which is a metal electrode are formed in parallel with each other. Is formed, and a protective layer 7 (MgO layer) is further formed thereon. On the front side of the glass base material 2 serving as a back plate, address electrodes 8 are formed parallel to each other and located between the ribs 3 so as to be orthogonal to the composite electrode. 9 are formed, and a phosphor layer 10 is provided so as to cover the wall surface of the rib 3 and the cell bottom surface. This AC type PDP is of a surface discharge type, and has a structure in which an AC voltage is applied between composite electrodes on the front panel to discharge. Then, the phosphor layer 10 emits light by the ultraviolet light generated by the discharge, and the light transmitted through the front plate is visually recognized by the observer.

Conventionally, the ribs on the back plate of such a PDP have been formed by overprinting by screen printing. However, recently, the ribs are often formed by a so-called sand blast method from the viewpoint of accuracy. When ribs are formed by this method, a low-melting point glass powder, an inorganic powder such as a refractory filler is used as a main component or a component, and a rib paste obtained by adding an appropriate binder resin and a solvent to the base material is applied to the base material. Forming a rib material layer by drying and then providing a photosensitive resin composition layer having sand blast resistance thereon, and then patterning the same into a cell defining mask by a photolithography method, and the upper part of the sand blasting mask In this method, unnecessary portions of the rib material layer are removed by injecting a mixed air containing abrasives from the injection nozzle, and then the sand blast resistant mask is removed before firing. And, as the abrasive, glass beads,
Inorganic powders such as SiC, SiO ₂ , Al ₂ O ₃ and ZrO ₂ are used.

[0005]

In the rib forming method by the sand blast method, the rib material layer is patterned by injecting air containing an abrasive from an injection nozzle. In this case, when the abrasive collides with the substrate, the rib material layer is patterned. Static electricity is generated on the substrate. The static electricity may affect the quality of the rib. In particular, when the charge amount on the substrate is large, if the substrate is too close to the sandblasting device, a large discharge occurs, which may cause defects in address electrodes and ribs.

The present invention has been made in view of such circumstances, and an object of the present invention is to provide a sand blasting apparatus which does not cause a defect due to static electricity generated during sand blasting. An object of the present invention is to provide a method for forming a rib of a used PDP.

[0007]

In order to achieve the above object, a sand blasting apparatus of the present invention is used for patterning a substrate having at least a rib material layer formed on a substrate by cutting the substrate with an abrasive. , At least, a substrate processing chamber, a substrate transport means for transporting the substrate so as to pass through the substrate processing chamber, an injection nozzle for injecting a grinding material onto the substrate in the substrate processing chamber, and a grinding for the injection nozzle. In a sand blasting apparatus provided with an abrasive supply means for supplying a material and an injection nozzle moving means for reciprocating the injection nozzle in a direction orthogonal to the substrate transport direction, a static elimination means for removing static electricity generated on the substrate is provided. It is characterized by being provided in the injection nozzle.

In the method for forming a rib of a PDP according to the present invention, a rib material layer is formed on a base material, a sandblast resistant mask is formed thereon in a pattern, and a grinding material is included from above the mask. In a method for forming a rib of a PDP including a step of patterning a rib material layer into a rib shape by sand blasting by injecting mixed air, a discharging nozzle for performing sand blasting is provided with a discharging device, and sand blasting is performed while discharging static electricity generated on a substrate. It is characterized by processing.

[0009]

Next, an embodiment of the present invention will be described with reference to the drawings.

FIG. 2 is a schematic configuration diagram showing a sand blasting apparatus according to the present invention.

In FIG. 2, reference numeral 20 denotes a substrate processing chamber. A substrate G, which is a workpiece, is carried in from outside the substrate processing chamber 20 through an entrance 20a by a substrate transport means 21 such as a transport roller. After being processed while being transported indoors, it is carried out through the outlet 20b.
Reference numeral 22 denotes an injection nozzle for injecting the abrasive toward the substrate G in the substrate processing chamber 20, which is configured so that the abrasive is supplied together with air from an abrasive supply means (not shown) through a supply pipe 23. I have.

The injection nozzle 22 is connected to the substrate processing chamber 20.
It is arranged so as to reciprocate in a direction orthogonal to the direction of transport of the substrate G by an ejection nozzle moving means provided on the upper part of the substrate. In the example shown in FIG. 2, slit-like openings 20 c and 20 d through which the supply pipe 23 of the injection nozzle 22 passes are provided on the upper surface of the substrate processing chamber 20.
The trolley 24 attached to the opening is provided with a slit-shaped opening 20c,
It moves on rails 25 installed on both sides of 20d.

As shown in the perspective view of FIG. 3, the injection nozzle 22 has a structure in which a static elimination brush 30 is attached to a side surface thereof. In this case, the injection nozzle 22 is attached in a state of being parallel to the direction in which the nozzle holes are arranged. The neutralization brush 30 is made of conductive resin bristles 31.
Is preferably used, and commercially available ones can be used. Needless to say, the neutralizing brush 30 needs to be grounded. It is desirable that the distance between the neutralizing brush 30 and the substrate G can be adjusted. For example, in a case where the discharging brush 30 is fixed to the injection nozzle 22 with a screw, the mounting position may be moved.

When the rib forming layer on the substrate G is patterned by the sand blasting apparatus having the above structure, even if the abrasive sprayed from the injection nozzle 22 hits the substrate G to generate static electricity, the charge on the substrate G is removed by the charge removing brush 30. Is always removed. Therefore, a large discharge phenomenon does not occur. In this case, the charge on the substrate G can be removed by adjusting the distance from the substrate G without contacting the charge removal brush 30 with the substrate G. Conversely, if the charge removing brush 30 is in contact with the substrate G, there is a high possibility that a defect such as a rib defect will occur. The distance between the charge removing means and the substrate is preferably adjusted within a range of 20 mm or less so that they do not contact each other. If it exceeds 20 mm, the static elimination action is not performed. Practically, it is preferable to adjust within the range of about 5 to 10 mm.

[0015]

As described above, the sand blasting device of the present invention has a structure in which the discharging nozzle for removing static electricity generated on the substrate is provided in the injection nozzle, so that the rib forming layer on the substrate can be patterned. , Eliminates the discharge phenomenon caused by static electricity generated during sandblasting,
The ribs can be processed while maintaining the quality of the address electrodes and the ribs.

According to the rib forming method of the PDP of the present invention, the discharging nozzle for performing the sand blast processing is provided with the discharging means, and the sand blast processing is performed while discharging the static electricity generated on the substrate. Since a large discharge does not occur during the processing, the ribs can be patterned without causing defects in the address electrodes and the ribs.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an example of a plasma display panel in which a front plate and a back plate are separated from each other.

FIG. 2 is a schematic configuration diagram showing a sand blast device according to the present invention.

FIG. 3 is an enlarged perspective view of an injection nozzle in the sandblasting device of FIG.

[Explanation of symbols]

 1, glass substrate 3 rib 4 sustain electrode 5 bus electrode 6 dielectric layer 7 protective layer 8 address electrode 9 dielectric layer 10 phosphor layer 20 substrate processing chamber 20a entrance 20b exit 20c, 20d slit opening 21 substrate transport Means 22 Injection nozzle 23 Supply pipe 24 Dolly 25 Rail 30 Static elimination brush 31 Bristle G Substrate

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01J 11/02 H01J 11/02 B

Claims (8)

[Claims] 1. A substrate, on which at least a rib material layer is formed on a base material, is used for cutting and patterning with a grinding material, so that at least a substrate processing chamber and a substrate passing through the substrate processing chamber. Substrate transport means for transporting the substrate, an injection nozzle for injecting the abrasive into the substrate in the substrate processing chamber, abrasive supply means for supplying the abrasive to the injection nozzle, and the injection nozzle in the substrate transport direction What is claimed is: 1. A sand blasting apparatus comprising: a spray nozzle moving means for reciprocating in a direction perpendicular to the sand blast apparatus, wherein a static elimination means for removing static electricity generated on the substrate is provided in the spray nozzle. 2. The sand blasting device according to claim 1, wherein the discharging means is a discharging brush. 3. The sandblasting device according to claim 1, wherein the distance between the charge removing means and the substrate is adjustable. 4. The sandblasting apparatus according to claim 1, wherein the distance between the charge removing means and the substrate is set to 20 mm or less so that they do not contact each other. 5. After forming a rib material layer on a substrate and forming a sand blast resistant mask thereon in a pattern,
In a method of forming a rib of a plasma display panel including a step of patterning a rib material layer into a rib shape by sandblasting in which mixed air containing abrasives is sprayed from above a mask, a discharge nozzle for performing sandblasting is provided with a discharger, A method for forming a rib of a plasma display panel, comprising: performing sandblasting while removing static electricity generated on the upper surface. 6. The method according to claim 5, wherein the discharging means is a discharging brush. 7. The method according to claim 5, wherein the distance between the charge removing means and the substrate is adjustable. 8. The method for forming a rib of a plasma display panel according to claim 5, wherein the distance between the charge removing means and the substrate is set to 20 μm or less so that they are not in contact with each other. .