JP2002245930A - Method of manufacturing gas discharge panel and barrier rib manufacturing equipment used for the manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a gas discharge panel for forming a barrier rib while preventing the electrification of electrodes at the time of sand blasting, and barrier rib manufacturing equipment for forming a barrier rib while preventing the electrification of the electrodes. SOLUTION: A conductive tape 222 is disposed so as to cover the entire surface of an extraction electrode part 122 positioned at the outer edge part of a rear substrate 201 and in the state of being exposed at both end parts of the electrode 22 and to be brought into contact with the extraction electrode part 122, and an earth cable is connected to one end of the conductive tape 222. The extraction electrode part 122 is present out of an area of sand blasting. Since the electrode 22 is diselectrified by the conductive tape 22 by adopting such a diselectrifing method and performing the sand blasting, the barrier rib 24 can be formed by the sand blasting while preventing the electrification of the electrode 22.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a gas discharge panel used for a display device and the like and an apparatus for manufacturing a partition used for the same.

[0002]

2. Description of the Related Art In a gas discharge panel, for the purpose of equalizing the volume of a discharge space and ensuring display stability of each pixel by preventing crosstalk, it is necessary to form a partition partitioning a gap between opposed panels. Done. The method of manufacturing the partition wall includes a sand blasting method, a printing method, a method of using a film-like rib material, an additive method, and the like. Among these, the sand blasting method facilitates formation of a fine pattern and applies the partition material. It is currently mainstream due to the merit that can be achieved in a few times as few as.

In a general method of manufacturing a partition wall by the sand blast method, first, a partition wall material layer is formed on a surface on which the dielectric glass layer is formed, with respect to a back substrate on which a striped electrode and a dielectric glass layer are formed. A resist mask corresponding to the pattern of the partition is formed thereon. Then, the material of the partition wall where the resist mask is not formed is peeled off and removed by sandblasting. Thereafter, the resist mask is removed to form a partition. For the method and apparatus for manufacturing a gas discharge panel including the method for manufacturing this partition,
It is described in "Latest Plasma Display Panel Manufacturing Technology" (Press Journal).

[0004]

However, when the partition walls are formed by sandblasting as described above, the electrodes and the dielectric layer may be damaged. this is,
At the time of sand blasting, static electricity is generated due to friction between the abrasive and the resist mask and the partition wall material, and each part of the panel is charged. In some cases, a lightning strike may occur to damage electrodes and the like. As described above, in the conventional partition wall forming method using sandblasting, there is a problem that the yield is deteriorated due to damage to the base material caused by charging. In recent years, attempts have been made to improve the composition by modifying the composition of the resist mask and adding an antistatic agent. However, there is a demand for a simpler and more reliable method of removing the electric charge on an electrode or the like during sandblasting.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and it is an object of the present invention to provide a method of manufacturing a gas discharge panel for forming a partition wall while preventing charging of electrodes during sandblasting. It is another object of the present invention to provide a partition manufacturing apparatus for forming a partition while preventing electrification of an electrode.

[0006]

In order to achieve the above-mentioned object, the present invention is directed to a first aspect, wherein a first electrode is provided on one of the main surfaces, and a partition material layer is formed so as to cover the first electrode. A method for manufacturing a gas discharge panel, comprising a step of forming a partition by subjecting the first substrate to sandblasting, wherein the step of forming the partition includes performing sandblasting with the first electrode grounded. It is characterized by.

In such a method of manufacturing a gas discharge panel, since the static electricity generated by friction between the abrasive and the resist mask and the first panel during sandblasting is removed by the conductive material, a large amount of the static electricity is applied to the first electrode. Can be prevented from being charged. Then, in the first substrate used in the partition wall forming step, the first substrate
At the end of the electrode, an extraction electrode portion on which a partition wall material layer is not formed is provided, and at the time of sandblasting, the extraction electrode portion is set outside the region of sandblasting, and a grounded tape-shaped conductive material is formed. Alternatively, any of the paste-like conductive materials is brought into contact with the lead-out electrode portion, or is applied to the first conductive material.
Preferably, the electrodes are grounded.

[0008] The present invention also provides a method of forming a partition by sandblasting a first substrate on which a first electrode is provided on one of the main surfaces and a partition material layer is formed so as to cover the first electrode. A substrate transport mechanism for holding and transporting the first substrate, an abrasive injection mechanism for injecting an abrasive into the partition material layer, and the abrasive injection mechanism comprising the partition material layer And a charge elimination mechanism that removes electric charges charged to the first electrode in a region where the abrasive is injected and in the vicinity thereof.

The partition manufacturing apparatus having such a charge removing mechanism can prevent a large amount of electric charges from being charged on the first electrode during sandblasting, so that the first electrode is not damaged. Can be formed. It is preferable that the static elimination mechanism is a grounded static elimination brush or a substrate fixing bracket, and is arranged so as to be in conductive contact with the extraction electrode portion.

Further, it is preferable that the static elimination mechanism is a static elimination blow device that blows a static elimination blow to at least two portions of the first electrode. The present invention also provides a partition in which a first electrode is provided on one of the main surfaces and a partition material layer is formed so as to cover the first electrode. A method for manufacturing a gas discharge panel including a forming step, wherein in the partition wall forming step, sandblasting is performed while removing charges charged on the first electrode using the charge eliminating mechanism.

[0011] According to such a method of manufacturing a gas discharge panel, it is also possible to form a partition by sandblasting while preventing charging of the first electrode.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for manufacturing a gas discharge panel and an apparatus for manufacturing a partition will be described below. First, the structure of a gas discharge panel common to the following embodiments is shown in FIG. Figure 1
1 is a perspective view of a main part of a plasma display panel (hereinafter, referred to as “PDP”) as an example of a gas discharge panel.

As shown in FIG. 1, the PDP is manufactured by arranging a front panel 10 and a rear panel 20 to face each other with a partition wall 24 interposed therebetween. The back panel 20
Is manufactured by arranging address electrodes 22 in a stripe shape on a back substrate 21, forming a dielectric glass layer 23, and further forming a partition 24 between the address electrodes 22 thereon. Here, the address electrode 22 is provided at the outer edge of the back substrate 21 with the extraction electrode portion 12.
2 is set. This is a portion for connecting the address electrode 22 and a drive circuit (not shown). Therefore, the dielectric glass layer 23 and the partition 2
4 is not formed.

A method of manufacturing a PDP is described in a document such as "Latest Plasma Display Panel Manufacturing Technology" (Press Journal) or Japanese Patent Application Laid-Open No. H11-34556.
The method of forming the partition wall 24, which is a feature of the present embodiment, will be described here. (Embodiment 1) The formation of the partition wall 24 on the rear panel 20 will be described with reference to FIG.

FIG. 2 is a schematic view showing a partition forming step. In FIG. 2, (a) to (c) show the photosensitive coating layer 2
03 shows the process of formation, (d) shows the process of arranging the conductive tape, and (e) to (f) show the process of sandblasting. First, as shown in FIG. 2A, a partition wall material layer 202 is formed on a rear substrate 201 on which an address electrode 22 and a dielectric glass layer 23 are formed. On this occasion,
The partition material layer 20 is formed on the extraction electrode portion 122.
2 is not formed. As a specific example of the formation of the partition wall material layer 202, a paste (for example, product number 3100, manufactured by ES L Corporation) containing low-melting glass mixed with a metal oxide such as alumina as a main component is used. There is a method of applying using a screen printing method. Alternatively, it may be performed by adding a resin to the above-mentioned paste to form a film, and affixing the paste on the dielectric glass layer 23. Then, on the partition wall material layer 202 thus formed, a photosensitive layer having a photosensitive thickness of 5
A dry film resist (hereinafter, referred to as “DFR”) 203 having a thickness of 0 μm is laminated, and a photomask 204 is formed thereon. And the rear substrate 2
The surface on which the DFR 203 was formed was exposed to ultraviolet light, exposed to light, developed with a 1% aqueous solution of sodium carbonate, and washed with water to form a surface on the rear substrate 201 as shown in FIG. A DFR 203 having a desired pattern is formed.

The pattern of the DFR 203 is a stripe having a hole width of 80 μm and a pitch of 360 μm.
In the process of disposing the conductive tape shown in FIG. 2C, a conductive tape 222 in which a conductive material such as carbon powder is dispersed in an adhesive is closely attached so as to be connected to the extraction electrode portion 122. I do. Then, the conductive tape 22
2 is connected to the ground wire. As a result, the address electrode 22 is connected to the ground.

Next, in the course of the sand blasting process shown in FIG.
While scanning along the address electrodes 22, and slowly moving the rear substrate 201 in a direction orthogonal to the address electrodes 22. The scanning range of the blast nozzle 206 depends on the partition material layer 202 on the back substrate 201.
Are formed only so that the abrasive is not applied to the extraction electrode portion 122.
As described above, the partition wall 24 is formed on the rear substrate 201. Sandblasting is performed under the following conditions.

(Processing conditions) Air flow rate: 1.5 m ³ / min. (Nor) Abrasive supply amount: 1.5 kg / min. Then, the back substrate 201 that has been subjected to the sandblasting process as described above is immersed in a 5% sodium hydroxide aqueous solution, so that the DFR 203 and the conductive tape 222 are removed. Thereafter, the rear substrate 201
Is fired to complete the rear panel 20 on which the partition walls 24 are formed as shown in FIG.

As described above, by applying the conductive tape 222 to the extraction electrode portion 122 in close contact with it and performing sandblasting, the partition wall 24 can be formed while preventing the address electrode 22 from being charged. . here,
Since the conductive tape 222 is located at the extraction electrode portion 122 outside the region of the sandblasting, the conductive tape 222 is not separated and removed by the sandblasting. Therefore, static elimination of the address electrodes 22 is performed throughout the sandblasting.

It is preferable that the conductive tape 222 is adhered to the extraction electrode portions 122 on both sides set at both ends of the address electrode 22, but may be attached to one side. In the above-described method, the conductive tape 222 is attached to the extraction electrode portion 122 as a method for removing the electric charge of the address electrode 22. However, a conductive paste is applied to the extraction electrode portion 122 and a ground wire is connected to the paste. By doing so, the charge of the address electrode 22 can be eliminated.

(Embodiment 2) A feature of the partition forming method according to Embodiment 2 is that charging of the address electrode 22 is prevented by using a charge eliminating brush 322 during sandblasting. FIG. 3 is a diagram showing a partition manufacturing apparatus provided with the charge removing brush 322. As shown in FIG. 3, the charge removing brush 322 is provided in the substrate transport unit 300. The brush 322 for static elimination is arranged at a position on the extension line where the blast nozzle 206 scans along the address electrode 22 and outside the scanning area so as to be in contact with the extraction electrode portion 122 and have conductivity. And grounded.

By performing sandblasting using such a partition manufacturing apparatus, the partition 24 can be formed while the charge of the address electrode 22 is being removed. Therefore, such a manufacturing method makes it possible to form a partition wall while preventing a large amount of charge from being charged on the address electrode 22, as in the case of the first embodiment.

In the above description, the address electrodes 22
Was performed by bringing the brush 322 for static elimination into contact with the extraction electrode section 122. However, as shown in FIG. 4, the substrate fixture 422 provided in the substrate transfer section 300 was brought into contact with the extraction electrode section 122, It is also possible to remove static electricity by connecting to ground. In addition, as shown in FIG. 5, a static elimination blow device 500 is provided in the sand blast nozzle 206, and the static elimination can also be performed by blowing ion air to the back panel 20 immediately after the sand blast processing. As an example of the static elimination blow device, an air / self-jet type ionizer (IMP Co., Ltd.) that eliminates static electricity by injecting ion air
REX). When this apparatus is used for sandblasting, it is possible to remove electricity from the panel surface by blowing ion air onto the panel surface immediately after sandblasting.

Furthermore, in the above description, the manufacturing method and the partition wall manufacturing apparatus have been described by taking an AC surface discharge type PDP as an example, but a gas discharge panel having a manufacturing process of forming a partition wall on a substrate provided with electrodes is described. If so, it is possible to use the manufacturing method and the partition wall manufacturing apparatus of the present invention.

[0025]

As described above, according to the gas discharge panel manufacturing method of the present invention, in the partition wall forming step, the grounded conductive material is closely attached to the electrode provided on the rear substrate. Thereby, it is possible to prevent the electrodes from being charged during sandblasting. This allows
Even if the partition is formed by sandblasting,
It is possible to prevent the electrode from being damaged due to the lightning strike.

Further, by forming the partition walls using the partition wall manufacturing apparatus of the present invention, the charge of the electrodes during the sandblasting process is reduced as compared with the case where a conductive material is formed on the extraction electrode portion and the charge is removed. This can be prevented.

[Brief description of the drawings]

FIG. 1 is a perspective view of a plasma display panel according to an embodiment.

FIG. 2 is a schematic view showing a partition forming step according to the first embodiment.

FIG. 3 is a diagram illustrating a partition manufacturing apparatus including a charge removing brush according to a second embodiment.

FIG. 4 is a view showing a partition manufacturing apparatus provided with a substrate fixing bracket.

FIG. 5 is a view showing a partition manufacturing apparatus provided with a blowing device for static elimination.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Front panel 20 Back panel 21 Back glass substrate 24 Partition 122 Leader electrode 202 Partition material layer 203 Dry film resist (DFR) 206 Blast nozzle 207 Abrasive 222 Conductive tape 300 Substrate conveying part 322 Static removal brush 422 Substrate fixing bracket 500 Blow device for static elimination

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Shigeo Suzuki 1006 Kazuma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. 72) Inventor Nobuyuki Tai 1006 Kadoma, Kazuma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. 1006 Kadoma, Kadoma City Matsushita Electric Industrial Co., Ltd. F-term (reference) 5C027 AA09 5C040 FA01 FA04 GB06 GF19 JA17 JA23 LA17 MA23

Claims (8)

[Claims] 1. A partition wall, wherein a first electrode is provided on one of the main surfaces and a partition wall material layer is formed so as to cover the first electrode. A method of manufacturing a gas discharge panel, comprising: performing a sandblasting process in a state where the first electrode is grounded in the partition wall forming step. 2. In the first substrate used in the partition wall forming step, an extraction electrode section on which a partition material layer is not formed is provided at an end of the first electrode, and the extraction electrode section during sandblasting. 2. The gas discharge according to claim 1, wherein the first electrode is grounded by setting a grounded tape-shaped conductive material to the extraction electrode portion, while setting the outside of the region of sandblasting. 3. Panel manufacturing method. 3. The partition wall forming step includes applying a paste-like conductive material to the extraction electrode portion and grounding the first electrode by grounding the paste-like conductive material. The method for manufacturing a gas discharge panel according to claim 1, wherein: 4. A partition in which a first electrode is disposed on one of the main surfaces and a partition is formed by subjecting a first substrate having a partition material layer formed to cover the first electrode to sandblasting. A forming apparatus, comprising: a substrate transport mechanism that holds and transports the first substrate; an abrasive injection mechanism that injects an abrasive into the partition material; and an abrasive injection mechanism that injects an abrasive into the partition material layer. And a charge elimination mechanism that removes electric charges charged to the first electrode in a region where the first electrode is formed and in the vicinity thereof. 5. The static elimination mechanism according to claim 4, wherein the static elimination mechanism is a grounded static elimination brush, and is disposed so as to be conductively in contact with the extraction electrode portion. Partition wall manufacturing equipment. 6. The static elimination mechanism is a grounded metal fixture, and is disposed on the substrate transport mechanism so as to be conductively in contact with the extraction electrode portion. The partition manufacturing apparatus according to claim 4. 7. The bulkhead manufacturing apparatus according to claim 4, wherein the static elimination mechanism is a static elimination blow device that blows a static elimination blow to at least two places of the first electrode. 8. A partition wall for forming a partition wall by performing sandblasting on a first substrate on which a first electrode is disposed on one of the main surfaces and a partition wall material layer is formed so as to cover the first electrode. A method of manufacturing a gas discharge panel, comprising: performing a sandblasting process while removing a charge charged on the first electrode using the charge eliminating mechanism in the partition wall forming step. Production method.