JP2007243536A - 圧電デバイス及びその製造方法 - Google Patents
圧電デバイス及びその製造方法 Download PDFInfo
- Publication number
- JP2007243536A JP2007243536A JP2006062368A JP2006062368A JP2007243536A JP 2007243536 A JP2007243536 A JP 2007243536A JP 2006062368 A JP2006062368 A JP 2006062368A JP 2006062368 A JP2006062368 A JP 2006062368A JP 2007243536 A JP2007243536 A JP 2007243536A
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- Prior art keywords
- substrate
- piezoelectric
- piezoelectric vibrator
- package
- piezoelectric device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 211
- 229920005989 resin Polymers 0.000 claims abstract description 44
- 239000011347 resin Substances 0.000 claims abstract description 44
- 238000000034 method Methods 0.000 claims abstract description 13
- 238000000576 coating method Methods 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000002360 preparation method Methods 0.000 claims description 3
- 238000005304 joining Methods 0.000 abstract description 5
- 230000004048 modification Effects 0.000 description 20
- 238000012986 modification Methods 0.000 description 20
- 239000004020 conductor Substances 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000010355 oscillation Effects 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Landscapes
- Oscillators With Electromechanical Resonators (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006062368A JP2007243536A (ja) | 2006-03-08 | 2006-03-08 | 圧電デバイス及びその製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006062368A JP2007243536A (ja) | 2006-03-08 | 2006-03-08 | 圧電デバイス及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007243536A true JP2007243536A (ja) | 2007-09-20 |
JP2007243536A5 JP2007243536A5 (enrdf_load_stackoverflow) | 2009-04-23 |
Family
ID=38588632
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006062368A Withdrawn JP2007243536A (ja) | 2006-03-08 | 2006-03-08 | 圧電デバイス及びその製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2007243536A (enrdf_load_stackoverflow) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010154177A (ja) * | 2008-12-25 | 2010-07-08 | Nippon Dempa Kogyo Co Ltd | 表面実装用の水晶発振器 |
JP2010177981A (ja) * | 2009-01-29 | 2010-08-12 | Nippon Dempa Kogyo Co Ltd | 水晶発振器を備えた電子カード |
JP2010283650A (ja) * | 2009-06-05 | 2010-12-16 | Daishinku Corp | 圧電発振器 |
JP5861460B2 (ja) * | 2010-06-11 | 2016-02-16 | 株式会社大真空 | 発振器 |
JP2020112613A (ja) * | 2019-01-09 | 2020-07-27 | 日本ルメンタム株式会社 | 光モジュール及び光モジュールの製造方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04247679A (ja) * | 1991-02-01 | 1992-09-03 | Tdk Corp | 電気回路の接続部およびその製造方法 |
JP2003204222A (ja) * | 2001-10-31 | 2003-07-18 | Seiko Epson Corp | 圧電振動デバイスの製造方法、圧電振動デバイスおよびセラミックパッケージ、並びにリアルタイムクロック |
JP2004007469A (ja) * | 2002-03-25 | 2004-01-08 | Seiko Epson Corp | 制御端子付き電子部品とこの電子部品を利用した携帯電話装置 |
JP2004312285A (ja) * | 2003-04-04 | 2004-11-04 | Toyo Commun Equip Co Ltd | 表面実装型圧電発振器 |
JP2005110017A (ja) * | 2003-09-30 | 2005-04-21 | Toshiba Corp | 高周波フィルタモジュール及びその製造方法 |
JP2005244639A (ja) * | 2004-02-26 | 2005-09-08 | Kyocera Corp | 温度補償型水晶発振器 |
-
2006
- 2006-03-08 JP JP2006062368A patent/JP2007243536A/ja not_active Withdrawn
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04247679A (ja) * | 1991-02-01 | 1992-09-03 | Tdk Corp | 電気回路の接続部およびその製造方法 |
JP2003204222A (ja) * | 2001-10-31 | 2003-07-18 | Seiko Epson Corp | 圧電振動デバイスの製造方法、圧電振動デバイスおよびセラミックパッケージ、並びにリアルタイムクロック |
JP2004007469A (ja) * | 2002-03-25 | 2004-01-08 | Seiko Epson Corp | 制御端子付き電子部品とこの電子部品を利用した携帯電話装置 |
JP2004312285A (ja) * | 2003-04-04 | 2004-11-04 | Toyo Commun Equip Co Ltd | 表面実装型圧電発振器 |
JP2005110017A (ja) * | 2003-09-30 | 2005-04-21 | Toshiba Corp | 高周波フィルタモジュール及びその製造方法 |
JP2005244639A (ja) * | 2004-02-26 | 2005-09-08 | Kyocera Corp | 温度補償型水晶発振器 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010154177A (ja) * | 2008-12-25 | 2010-07-08 | Nippon Dempa Kogyo Co Ltd | 表面実装用の水晶発振器 |
JP2010177981A (ja) * | 2009-01-29 | 2010-08-12 | Nippon Dempa Kogyo Co Ltd | 水晶発振器を備えた電子カード |
JP2010283650A (ja) * | 2009-06-05 | 2010-12-16 | Daishinku Corp | 圧電発振器 |
JP5861460B2 (ja) * | 2010-06-11 | 2016-02-16 | 株式会社大真空 | 発振器 |
JP2020112613A (ja) * | 2019-01-09 | 2020-07-27 | 日本ルメンタム株式会社 | 光モジュール及び光モジュールの製造方法 |
JP7224921B2 (ja) | 2019-01-09 | 2023-02-20 | 日本ルメンタム株式会社 | 光モジュール及び光モジュールの製造方法 |
US11653442B2 (en) | 2019-01-09 | 2023-05-16 | Lumentum Japan, Inc. | Optical module and method for manufacturing the same |
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