JP2007243536A - Piezoelectric device and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a piezoelectric device and its manufacturing method which can reduce a height. <P>SOLUTION: The piezoelectric device electrically connects an electric component 20 and a piezoelectric vibrator 30 containing a piezoelectric vibrating reed 35 in a package 32 through a wiring pattern 27 of a substrate 40. The electric component 20 is arranged on the top plane 40a of the substrate 40, the piezoelectric vibrator 30 is arranged in parallel to the substrate 40, and resin 62 adheres to the top plane 40a side of the substrate 40 at least in a junction region between the piezoelectric vibrator 30 and the substrate 40. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a piezoelectric device that uses a substrate to connect a piezoelectric vibrator and an electronic component, and a manufacturing method thereof.

Piezoelectric devices are widely used in small information devices such as HDDs (hard disk drives), mobile computers, and IC cards, and mobile communication devices such as mobile phones, car phones, and paging systems.
FIG. 10 shows a schematic perspective view of a conventional piezoelectric device 1 (see Patent Document 1). In the figure, the piezoelectric device 1 has a substrate 2, a piezoelectric vibrator 3, and a semiconductor chip 4. .

That is, the piezoelectric vibrator 3 and the semiconductor chip 4 are mounted side by side on the upper surface of the substrate 2, and the piezoelectric vibrator 3 and the semiconductor chip 4 are electrically connected via a wiring pattern (not shown) on the substrate 2. To connect to. Thereby, compared with the case where the piezoelectric vibrator 3 and the semiconductor chip 4 are arranged in the height direction, the piezoelectric device 1 can be made thinner.
In the piezoelectric device 1, a bonding wire 5 for electrically connecting the semiconductor chip 4 and the wiring pattern is coated with a resin 6 so as to prevent a short circuit with other electronic devices.

Japanese Utility Model 1-82507 microfilm

  However, in recent years, electronic devices such as information devices are rapidly becoming thinner, and piezoelectric devices used in the electronic devices are also required to be thinner. For this reason, even with the piezoelectric device 1 as shown in FIG. 10, there has been a case where the request for thinning cannot be met.

  It is an object of the present invention to provide a piezoelectric device that can be reduced in height and a method for manufacturing the same.

  According to the first aspect of the present invention, there is provided a piezoelectric device in which an electronic component and a piezoelectric vibrator in which a piezoelectric vibrating piece is housed in a package are electrically connected via a wiring pattern on a substrate. The electronic component is disposed on an upper surface of the substrate, and the piezoelectric vibrator is disposed in parallel with the substrate, and is on the upper surface side of the substrate, and includes at least the piezoelectric vibrator and the substrate. This is achieved by a piezoelectric device in which a resin is attached to the bonding region.

According to the configuration of the first invention, the electronic component is arranged on the upper surface of the substrate, but the piezoelectric vibrator is arranged in parallel with the substrate. Therefore, since the piezoelectric vibrator is not disposed on the upper surface of the substrate, the height of the piezoelectric device can be reduced by the thickness of the substrate. Even if the piezoelectric vibrator and the substrate are arranged in parallel in this way, the resin adheres to at least the bonding region between the piezoelectric vibrator and the substrate on the upper surface side of the substrate. The piezoelectric vibrator and the substrate can be joined.
Thus, according to the present invention, it is possible to provide a piezoelectric device capable of reducing the height.

According to a second aspect of the invention, in the configuration of the first aspect of the invention, the upper surface of the piezoelectric vibrator is exposed to the outside, the side face of the piezoelectric vibrator on the substrate side, and the upper side of the substrate including the electronic component The whole is covered with resin.
According to the structure of 2nd invention, since the whole upper side of the board | substrate containing an electronic component is covered with resin, the electronic component on a board | substrate can be protected by resin sealing. In addition, since the side surface of the piezoelectric vibrator on the substrate side is also covered with resin, the bonding strength between the piezoelectric vibrator and the substrate can be increased. In addition, since the upper surface of the piezoelectric vibrator is exposed to the outside, no resin adheres to the upper surface of the piezoelectric vibrator, and the height is lower than when the resin covers the piezoelectric vibrator. Can be

According to a third invention, in the configuration of the first or second invention, the package of the piezoelectric vibrator has a conductive pattern electrically connected to the piezoelectric vibrating piece in the vicinity of the substrate, The wiring pattern of the board is arranged so as to be adjacent to the conductive pattern.
According to the configuration of the third invention, the package of the piezoelectric vibrator has a conductive pattern electrically connected to the piezoelectric vibrating piece in the vicinity of the substrate, and the wiring pattern of the substrate is adjacent to the conductive pattern. Are arranged to be. Therefore, for example, soldering is performed so that the conductive pattern on the adjacent piezoelectric vibrator side and the wiring pattern on the board side are bridged, and the electromechanical joining between the piezoelectric vibrator and the substrate can be achieved.

According to a fourth aspect of the present invention, in the configuration of the third aspect, the electronic component is wire-bonded to a wiring pattern of the substrate, and a part of the package protrudes in the horizontal direction, and the protruding portion The conductive pattern is provided on the upper surface of the substrate.
According to the configuration of the fourth aspect of the invention, the package has a part of the substrate side protruding in the horizontal direction, and the conductive pattern is provided on the upper surface of the protruding part. Therefore, the conductive pattern provided on the upper surface of the protruding part. And the wiring pattern of the substrate can be wire-bonded. Therefore, when the electronic component and the wiring pattern of the substrate are wire-bonded, the conductive pattern of the piezoelectric vibrator and the wiring pattern of the substrate can be wire-bonded, so that the number of processes can be suppressed.

According to a fifth invention, in the configuration of the third invention, a part of the package side of the package protrudes in a horizontal direction, and the conductive pattern is provided on an upper surface of the protruding part. The package side has a crank shape and is placed on the upper surface of the protruding portion, and the wiring pattern is provided on the lower surface of the crank-shaped end portion.
According to the configuration of the fifth aspect of the invention, the substrate has a crank shape on the package side and is placed on the upper surface of the protruding portion, and the wiring pattern is provided on the lower surface of the crank-shaped end portion. Yes. For this reason, when joining a piezoelectric vibrator and a board | substrate, a piezoelectric vibrator and a board | substrate can be electrically connected only by mounting a crank-shaped edge part on the upper surface of a protrusion part.

A sixth invention is characterized in that, in the configurations of the third to fifth inventions, the conductive pattern is extended to an upward surface of the package.
According to the configuration of the sixth invention, the conductive pattern is extended to the upward surface of the package. Therefore, the inspection probe pin can be brought into contact with the conductive pattern extended to the upward surface of the package from above to easily inspect the characteristics of the piezoelectric vibrator.

  According to a seventh aspect of the present invention, there is provided a piezoelectric vibrator having a package for accommodating a piezoelectric vibrating piece, an electronic component electrically connected to the piezoelectric vibrator, the electronic component and the piezoelectric A preparation step of separately forming a substrate having a wiring pattern for electrically connecting a vibrator, a parallel placement step of placing the piezoelectric vibrator and the substrate in parallel, and the electronic component, A method for manufacturing a piezoelectric device, comprising: a component arranging step for arranging on a top surface of the substrate; and a resin coating step for adhering a resin to at least a bonding region between the piezoelectric vibrator and the substrate on the top surface side of the substrate. Is achieved.

According to the configuration of the seventh aspect of the invention, since the piezoelectric vibrator and the substrate are arranged in parallel in the parallel placement step, the piezoelectric device is reduced in height because the piezoelectric vibrator is not placed on the upper surface of the substrate. it can. And even if the piezoelectric vibrator and the substrate are arranged in parallel in this way, in the resin coating process, because the resin adheres to the upper surface side of the substrate and at least the bonding region between the piezoelectric vibrator and the substrate, The piezoelectric vibrator and the substrate can be joined by this resin.
Therefore, according to the present invention, it is possible to provide a method for manufacturing a piezoelectric device that enables a reduction in height.

1 to 4 show a piezoelectric oscillator as an example of a piezoelectric device 10 according to an embodiment of the present invention. FIG. 1 is a schematic plan view of the piezoelectric device 10, and FIG. 2 is a schematic cut along line AA in FIG. FIG. 3 is a schematic perspective view of a piezoelectric device seen through a resin described later, and FIG. 4 is a diagram showing only the bottom substrate of the piezoelectric vibrator 10 after removing the resin and electronic components described later of the piezoelectric device 10. FIG.
In these drawings, in the piezoelectric device 10, an electronic component 20 and a piezoelectric vibrator 30 in which a piezoelectric vibrating piece 35 is housed in a package 32 are electrically connected via a wiring pattern 27 of a substrate 40. The mounting terminals 42 to 45 are provided at the four corners of the bottom surface (lower surface).

The piezoelectric vibrator 30 is a so-called surface-mount type vibrator and has a substantially rectangular package 32.
That is, the package 32 is formed by, for example, laminating a plurality of substrates formed by molding an aluminum oxide ceramic green sheet as an insulating material and then sintering, as shown in FIG. In this embodiment, the first substrate 33 and the second substrate 34 are stacked from the bottom.

The second substrate 34 is formed with a predetermined hole inside thereof, so that when the second substrate 34 is stacked on the first substrate 33, a predetermined internal space S is formed inside the package 32. This internal space S becomes a cavity for accommodating the piezoelectric vibrating piece 35.
In addition, the lid 38 is bonded to the opening end face at the upper end of the second substrate 34 through a brazing material (not shown) such as low-melting glass, for example, so that the internal space S Is sealed.
The lid 34 may be made of metal and grounded. However, in the case of this embodiment, the metal coating portion (not shown) of the piezoelectric vibrating piece 35 is irradiated from the outside to reduce the mass. In order to adjust the frequency according to the method, it is made of a material that transmits light, particularly thin glass.

The first substrate 33 is a substantially flat plate-like member for constituting the bottom substrate of the package 32, and is formed on the inner bottom surface (that is, the top surface of the bottom substrate) 33b exposed to the internal space S, for example, nickel on tungsten metallization. Electrode portions 31, 31 formed by plating and gold plating are provided. The electrode portions 31 and 31 have different polarities, and conductive adhesives 37 and 37 are used on the upper surfaces of the electrode portions 31 and 31 to bond and fix the piezoelectric vibrating piece 35.
Further, as shown in FIGS. 1 and 2, mounting terminals 42 and 43 are provided on the bottom surface (lower surface) 33a of the first substrate 33 at two outer corners (that is, the bottom surface of the entire piezoelectric device 10). 2 corners).

  In the present embodiment, the piezoelectric vibrating piece 35 is an AT-cut vibrating piece formed of a piezoelectric material such as quartz. However, the present invention is not limited to this, and for example, a lithium tantalate or the like is used. Of course, a piezoelectric material or a tuning-fork type piezoelectric vibrating piece may be used.

  In the case of the present embodiment, the electronic component 20 is an oscillation circuit element (hereinafter referred to as “IC chip”) formed of a semiconductor element or the like having at least a circuit structure that oscillates the piezoelectric vibrator 30, as shown in FIG. Further, the upper surface 20a has a plurality of terminals 41, 41,. Of course, the number and type of terminals 41 of the IC chip 20 may be larger or smaller than those shown in FIG. 3 depending on the type of the IC chip. It includes an electrically connected gate / drain (G / D) terminal, an input / output terminal of an oscillation circuit connected to the mounting terminal portion, a control terminal for writing data to the oscillation circuit, a ground terminal, and the like.

  The IC chip 20 is mounted side by side with the piezoelectric vibrator 30 on the upper surface 40a of the substrate 40, rather than being arranged in the vertical direction of the piezoelectric vibrator 30 in order to make the IC chip 20 thinner. Specifically, the IC chip 20 is formed smaller than the piezoelectric vibrator 30 in the horizontal direction, and is higher than the piezoelectric vibrator 30 in the height direction even if a thickness D2 of the substrate 40 described later is added. And is bonded to the vicinity of the center of the substrate 40 using an adhesive (not shown).

  The IC chip 20 is electrically bonded to the wiring patterns 21 to 28 on the substrate 40 by wire bonding. The IC chip 20 of the present embodiment is electrically connected to the wiring patterns 21 to 28 by wire bonding, but may be electrically and mechanically bonded by so-called flip chip bonding.

The substrate 40 is a member to which the piezoelectric vibrator 30 and the IC chip 20 are electrically and mechanically connected, and a rigid substrate or a flexible substrate can be used.
In the case of the present embodiment, the substrate 40 includes an insulating member formed of polyimide, glass epoxy, or the like in consideration of heat resistance, and a plurality of wiring patterns 21 to 28 formed on the upper surface of the insulating member. Yes.
The wiring patterns 21 to 28 are made of a conductive material such as copper foil, and are formed on the upper surface 40a of the substrate 40 by etching, printing, vapor deposition, plating, or the like.

Specifically, as shown in FIG. 3, the wiring patterns 21 and 27 are wire-bonded to the gate / drain terminals of the IC chip 20, and the electrode portion 31 is interposed via conductive patterns 54 and 56 described later of the piezoelectric vibrator 30. , 31 are electrically connected.
The wiring patterns 22, 23 and 26 serve as terminals for writing data to the IC chip 20.
The wiring patterns 24 and 25 are wire-bonded to the input / output terminals of the oscillation circuit of the IC chip 20, and are extended near the two corners of the piezoelectric device 10, respectively. Then, through the conductive members in the via holes 24a and 25a formed at the end portions, the mounting terminal portions 44 and 45 provided in the vicinity of two corners on the bottom surface (lower surface) of the piezoelectric device 10 are electrically connected. It is connected.
The wiring pattern 28 is wire-bonded to the ground terminal of the IC chip 20, and is electrically connected to the mounting terminal 43 via a pattern 52 of the piezoelectric vibrator 30 described later and a via hole 52 a formed at an end of the pattern 52. It is connected to the.

  It should be noted that both end portions 21a, 21b, 27a, 27b, 28a, 28b of the wiring patterns 21, 27, and 28 around which the substrate 40 is routed and the bonded portions of the wiring patterns 22 to 26 are exposed upward. In this way, the entire upper surface 40a of the substrate 40 is covered with the insulating film. In the case of the present embodiment, the insulating film is formed of a resist film, which enables a thin film and improves the positional accuracy using a photolithography technique. This prevents a short circuit between the wiring patterns 21 to 28 due to solder or the like when the piezoelectric vibrator 30 and the substrate 40 are joined.

Here, the piezoelectric vibrator 30 is arranged in parallel with the substrate 40. That is, the piezoelectric vibrator 30 is arranged so that the side surface of the piezoelectric vibrator 30 and the side surface of the substrate 40 face each other without being superimposed on the substrate 40.
In the case of the present embodiment, as shown in FIGS. 2 and 3, the thickness D1 of the first substrate (bottom substrate) 33 and the thickness D2 of the substrate 40 among the plurality of substrates 33, 34 constituting the package 32. Are formed with substantially the same dimensions, and the side surface 33c of the first substrate (bottom substrate) 33 and the side surface 40c of the substrate 40 are in contact with each other. That is, the upper surface 40a of the substrate 40 and the upper surface 33b of the bottom substrate of the package 32 are substantially flush with each other.
Further, as shown in FIG. 4, the side surface 32 b along the direction perpendicular to the side surface 32 a facing the substrate 40 of the piezoelectric vibrator 30 and the side surface 40 b of the substrate 40 are substantially flush with each other.

The package 32 of the piezoelectric vibrator 30 has conductive patterns 54 and 56 electrically connected to the piezoelectric vibrating piece 35 in the vicinity of the substrate 40.
As shown in FIG. 4, the conductive patterns 54 and 56 of this embodiment are such that the electrode portions 31 and 31 pass through the upper surface 33 b of the first substrate 33 of the package 32 to the side surface 32 a on the substrate 40 side. In the same manner as the electrode portions 31, 31, nickel plating and gold plating are formed on the tungsten metallization.
Further, as shown in FIG. 3, the side surface 32a on the substrate 40 side of the package 32 and located on the upper side of the substrate 40 (that is, the side surface of the second substrate 34 of the package 32) 34c has a side surface 32a. The castellations 46, 46 are formed so as to face each other, and conductive patterns 54, 56 are provided up to the inner surfaces of the castellations 46, 46.

  Note that another castellation 46 is formed on the side surface 32 a of the piezoelectric vibrator 30, and a conductive pattern 52 is provided on the inner surface of the castellation 46 in the same manner as the conductive patterns 54 and 56. As shown in FIG. 4, the conductive pattern 52 is routed to the vicinity of the corner of the upper surface 33b of the first substrate (bottom substrate) 33 of the package 32, and the end located near the corner. It is electrically connected to the mounting terminal 43 through a conductive member in a via hole 52a formed in the part.

  On the other hand, the wiring patterns 21 and 27 of the substrate 40 wire bonded to the gate / drain terminals of the IC chip 20 are routed so as to be disposed adjacent to the conductive patterns 54 and 56 on the package side surface 32a. The wiring pattern 28 wire bonded to the ground terminal of the IC chip 20 is also routed so as to be disposed adjacent to the pattern 52 on the package side surface 32a.

  As shown in FIGS. 3 and 4, the conductive patterns 54 and 56 provided on the side surface 34c of the piezoelectric vibrator 30 and the end portions 21b and 27b of the wiring patterns 21 and 27 of the substrate 40 are soldered or the like. These are electrically and mechanically connected using the conductive materials 60 and 60. At this time, since the side surface 34c on which the conductive patterns 54 and 56 are provided is positioned above the upper surface 40a of the substrate 40, the conductive materials 60 and 60 adhere to both patterns so as to form fillets. . Similarly, a fillet is formed on the pattern 52 provided on the side surface 34c of the piezoelectric vibrator 30 and the end portion 28b of the wiring pattern 28 of the substrate 40 by using a conductive material 60 such as solder. Electrically and mechanically connected.

  As shown in FIG. 2, the piezoelectric device 10 is on the upper surface 40 a side of the substrate 40 and at least a bonding region between the piezoelectric vibrator 30 and the substrate 40 (that is, the side surface 32 a of the package 32 and the package 32 of the substrate 40. A thermosetting resin 62 such as an epoxy resin adheres to the side surface 40c opposite to the surface of the piezoelectric vibrator 30 and the substrate 40, for example.

In the case of the present embodiment, the entire upper side of the substrate 40 including the IC chip 20 is covered with the resin 62, thereby improving the strength of the substrate 40 and protecting the IC chip 20 and the wire by resin sealing. is doing. Further, the side surface 32 a on the substrate 40 side of the piezoelectric vibrator 30 is also covered with the resin 62, and the bonding strength between the piezoelectric vibrator 30 and the substrate 40 including the IC chip 20 is increased.
In this way, even if the entire upper side of the substrate 40 is covered with the resin 62, the upper surface of the piezoelectric vibrator 30 (ie, the upper surface of the lid 38) is exposed to the outside. That is, the height of the piezoelectric device 10 is reduced by forming the upper surface of the piezoelectric vibrator 30 and the upper surface of the resin 62 so as to have the same position in the height direction. Further, when the lid 38 is made transparent by exposing the upper surface of the piezoelectric vibrator 30 to the outside, for example, even after resin molding, the laser beam is applied to the metal coating portion on the surface of the piezoelectric vibrating piece 35. Irradiate and frequency can be adjusted by mass reduction method.

Next, an embodiment of the manufacturing method of the piezoelectric device 10 will be outlined with reference to FIGS. 1 to 4 described above and FIG. 5 which is a flowchart showing an example of the manufacturing method of the piezoelectric device 10.
As shown in FIG. 5, the piezoelectric device 10 has a substrate, a piezoelectric vibrator, and an IC chip (electronic component) separately prepared. That is, as shown in FIG. 2 and FIG. 3, the piezoelectric vibrator 30 having the package 32 that houses the piezoelectric vibrating piece 35, the IC chip 20 electrically connected to the piezoelectric vibrator 30, and the IC chip 20 And a substrate 40 having wiring patterns 21 and 27 for electrically connecting the piezoelectric vibrator 30 and the piezoelectric vibrator 30 are separately prepared (ST1-1, ST1-2, ST1-3 in FIG. 5). .

Next, as shown in FIGS. 2 and 3, the piezoelectric vibrator 30 and the substrate 40 are placed on a jig in parallel so that the side face 32 a of the piezoelectric vibrator 30 and the side face 40 c of the substrate 40 are in contact with each other. (ST2 in FIG. 5: parallel arrangement step).
Next, as shown in FIGS. 2 and 3, the conductive patterns 54 and 56 provided on the side surface 32a of the piezoelectric vibrator 30, and the conductive pattern 52, and the wiring pattern 21 on the substrate upper surface 40a adjacent to these patterns are provided. , 27, 28 are soldered to the end portions 21b, 27b, 28b (ST3 in FIG. 5).

Next, as shown in FIGS. 2 and 3, the IC chip 20 formed in the preparation step is bonded to the upper surface 40a of the substrate 40 using an adhesive or the like (ST4 in FIG. 5: component placement step), and then the substrate. The wiring patterns 21 to 28 on the upper surface 40a and the terminals 41 of the IC chip 20 are wire-bonded (ST5 in FIG. 5).
Next, for example, when it is necessary to inspect the temperature characteristics of the piezoelectric device and correct the frequency characteristics, probe pins or the like are brought into contact with the wiring patterns 22, 23, and 26 (see FIG. 3) of the substrate 40 and the IC. Data is written to the chip 20 (ST6 in FIG. 5: inspection and / or adjustment).

Next, as shown in FIG. 2, the resin 62 is adhered to at least the bonding region between the piezoelectric vibrator 30 and the substrate 40 on the upper surface 40a side of the substrate 30 (ST7 in FIG. 5: resin application step).
The resin 62 may be injection molded with an insulating member such as an epoxy resin using a mold, or may be applied by screen printing.
In the present embodiment, the resin 62 covers the entire upper side of the substrate 40 so that the upper surface of the piezoelectric vibrator 30 is exposed to the outside. In addition, when resin adheres to the upper surface of the piezoelectric vibrator 30, the adhered resin may be removed by sandblasting or brushing.

  Next, when predetermined vibration characteristics cannot be obtained from the piezoelectric device 10, the laser light is transmitted through the transparent lid 38 shown in FIG. 2, and the metal covering portion (not shown) of the piezoelectric vibrating piece 35 in the package 32 is shown. To adjust the frequency by the mass reduction method (ST8 in FIG. 5) to complete the piezoelectric device.

  The embodiment of the present invention is configured as described above. Since the piezoelectric vibrator 30 is arranged in parallel with the substrate 40, the height of the piezoelectric device 10 can be reduced by the thickness of the substrate 40. Even if the piezoelectric vibrator 30 and the substrate 40 are arranged in parallel as described above, the resin 62 adheres to at least the bonding area between the piezoelectric vibrator 30 and the substrate 40 on the upper surface 40a side of the substrate 40. Therefore, the piezoelectric vibrator 30 and the substrate 40 can be joined by the resin 62.

FIG. 6 is an enlarged perspective view of the piezoelectric device 12 according to the first modification of the embodiment of the present invention, in the vicinity of the bonding region between the piezoelectric vibrator 30 and the substrate 40. In this figure, the resin is not shown for convenience of understanding.
In this figure, the portions denoted by the same reference numerals as those used in the description of FIGS. 1 to 5 have a common configuration, and therefore, a duplicate description will be omitted, and hereinafter, differences will be mainly described.
The piezoelectric device 12 is different from the above-described piezoelectric device 10 in the connection structure between the package 32 of the piezoelectric vibrator 30 and the substrate 40.

That is, part of the package 32 of the piezoelectric device 12 on the side of the substrate 40 protrudes in the horizontal direction, and the conductive patterns 54 and 56 and the pattern 52 are provided on the upper surface 70 a of the protrusion 70.
Specifically, the end portion of the lowermost substrate 64 constituting the package 32 is disposed on the substrate 40 side as compared with the second-layer substrate 65 on the package 32, and the end portion is used as the projecting portion 70. The conductive patterns 54 and 56 are formed so as to route an electrode portion (not shown) connected to the piezoelectric vibrating piece to the upper surface 70a which is an upward stepped portion of the protruding portion 70. For this reason, the conductive patterns 54 and 56 are directed upward to facilitate wire bonding with the upward wiring patterns 21, 27 and 28 of the substrate 40.

  The conductive patterns 54 and 56 are extended to the upward surface 65 a of the package 32. In the case of the first modification, the second layer substrate 65 of the package 32 is arranged on the substrate 40 side as compared to the third layer substrate 66 thereabove, and an upward stepped portion is formed. This upward stepped portion becomes an upward surface 65a. Thus, the inspection probe pin K is brought into contact with the conductive patterns 54 and 56 extending to the upward surface 65a from above, and the characteristics of the piezoelectric vibrator 30 can be easily inspected.

  Since the package 32 is formed with a plurality of upward stepped portions or upper surfaces 70a and 65a as described above, a larger number of laminated substrates 64, 65 and 66 are used than the piezoelectric device 10 of FIG. It has a layered structure. In order not to increase the overall height of the piezoelectric device 12, the thickness of part or all of the substrates 64, 65, 66 is reduced. In the first modification, the thickness of the lowermost substrate 64 is made smaller than that of the piezoelectric device 10 of FIG.

  In the case of the first modified example, the thickness D3 of the lowermost substrate 64 and the thickness D4 of the substrate 40 provided with the wiring pattern 21 and the like are substantially the same size, and the thickness D4 of the substrate 40 is flexible. It is formed to be thin enough to have properties. Specifically, the substrate 40 is provided with a conductive material such as copper foil on the top surface of an insulating film containing polyimide or the like, and is insulated with a resist or the like so that a part of the conductive material is exposed. A film is formed, and the film-like material is cut into a predetermined size.

  The first modification of the embodiment of the present invention is configured as described above. A part of the package 32 on the side of the substrate 40 protrudes in the horizontal direction, and the conductive pattern 54, Since 56 is provided, the conductive patterns 54 and 56 provided on the upper surface 70a of the protrusion 70 and the wiring patterns 21 and 27 of the substrate 40 can be wire-bonded. Therefore, wire bonding for electrically connecting the conductive patterns 54 and 56 of the piezoelectric vibrator 30 and the wiring patterns 21 and 27 of the substrate 40, and the wiring patterns 21 to 28 of the IC chip 20 and the substrate 40 (FIG. 3). And wire bonding for electrically connecting to each other can be performed in the same process (ST5 in FIG. 5). That is, compared with the manufacturing process of the piezoelectric device 10 of FIG. 5, the soldering process of ST3 of FIG. 5 becomes unnecessary, and the number of manufacturing processes can be reduced.

  In the first modification, as described above, the lowermost substrate 64 and the substrate 40 are formed thin enough to be flexible. Therefore, as shown by the alternate long and short dash line in FIG. 6, when wire bonding is performed, the lowermost substrate 64 and the substrate 40 are fixed by sandwiching an adhesive supporting tape 72 between the fixing base 74. It is better not to move from the stand 74.

  In the first modification, the conductive patterns 54 and 56 and the wiring patterns 21 and 27 are wire-bonded as described above, but the IC chip 20 and the wiring patterns 21 to 28 (see FIG. 3) are used. For example, when performing flip-chip bonding, as shown in FIG. 7 which is a further modification of the piezoelectric device 12 of FIG. 6, the conductive patterns 54 and 56 and the wiring patterns 21 and 27 are electrically machined with a conductive material 76 such as solder. May be connected to each other.

FIG. 8 is an enlarged cross-sectional view of the piezoelectric device 14 according to the second modified example of the embodiment of the present invention, in the vicinity of the bonding region between the piezoelectric vibrator 30 and the substrate 40. In this figure, the resin is not shown for convenience of understanding.
In this figure, the portions denoted by the same reference numerals as those used in the description of FIGS. 1 to 7 have a common configuration, and therefore, a duplicate description will be omitted, and hereinafter, differences will be mainly described.
The piezoelectric device 14 differs from the above-described piezoelectric devices 10 and 12 in the connection structure between the package 32 of the piezoelectric vibrator 30 and the substrate 40.

That is, the package 32 of the piezoelectric device 14 is located above the upper surface 40 a of the substrate 40, and a part of the side surface located on the substrate 40 side protrudes in the horizontal direction. Conductive patterns 54 and 56 are provided.
Specifically, the package 32 includes three layers of laminated substrates 64, 65, and 66 as in the piezoelectric device 12 according to the first modified example of FIG. However, the protruding portion 78 is formed so as to protrude from the lowermost substrate 64 toward the substrate 40.
The conductive patterns 54 and 56 are routed around the lower surface 78a of the protrusion 78. In the case of the second modification, the conductive patterns 54 and 56 are not only the lower surface 78a of the protrusion 78 but also the protrusion. The side surface 78b in the protruding direction of 78 and the side surface 64a of the lowermost substrate 64 on the substrate 40 side are also formed integrally.

Further, the thickness D5 of the lowermost substrate 64 of the package 32 is slightly larger than the thickness D6 of the substrate 40 on which the IC chip 20 is placed, and the upper surface 40a of the substrate 40 is the protrusion 78. It arrange | positions so that it may oppose the lower surface 78a, and it will sink into a ridge.
Then, the conductive patterns 54 and 56 provided on the projecting portion 78 and the lowermost substrate 64 and the wiring patterns 21 and 27 of the substrate 40 on which the IC chip 20 is placed are formed using a conductive material 76 such as solder. Electrically and mechanically connected.

  The second modification of the embodiment of the present invention is configured as described above, and the package 32 is positioned above the substrate 40, and a part of the side surface positioned on the substrate 40 side is in the horizontal direction. The substrate 40 is disposed so that the upper surface 40 a thereof faces the lower surface 78 a of the projecting portion 78. Therefore, the bonding area between the package 32 and the substrate 40 can be increased, and the bonding strength between the piezoelectric vibrator 30 and the substrate 40 can be improved.

FIG. 9 is an enlarged cross-sectional view of the piezoelectric device 16 according to the third modification of the embodiment of the present invention, in the vicinity of the bonding region between the piezoelectric vibrator 30 and the substrate 40. In this figure, the resin is not shown for convenience of understanding.
In this figure, the portions denoted by the same reference numerals as those used in the description of FIGS. 1 to 8 have a common configuration, and therefore, a duplicate description will be omitted, and the following description will focus on differences.
The piezoelectric device 16 is different from the above-described piezoelectric devices 10, 12, and 14 in the connection structure between the package 32 of the piezoelectric vibrator 30 and the substrate 40.

  First, the piezoelectric device 16 has substantially the same configuration as the piezoelectric vibrator 30 of the piezoelectric device 12 according to the first modification example of FIG. Specifically, in the package 32, a part on the substrate 40 side (the bottom substrate 64 in this modification) protrudes in the horizontal direction, and conductive patterns 54 and 56 are provided on the upper surface 70 a of the protrusion 70. The thickness of the bottom substrate 64 of the package 32 in FIG. 9 is formed larger than the thickness of the substrate 40, unlike the first modification example in FIG.

  On the other hand, unlike the piezoelectric device 12 according to the first modification example of FIG. 6, the substrate 40 has a crank shape on the package 32 side and is placed on the upper surface 70 a of the protruding portion 70. The wiring patterns 21 and 27 are provided on the lower surface 80a of the crank-shaped end portion 80. Further, the resin 62 covers the crank-shaped end 80. The wiring patterns 21 and 27 on the lower surface 80a are routed around the upper surface 40a of the substrate 40 by using via holes (not shown) and are wire-bonded to the IC chip 20.

In the case of the third modified example, a flexible member such as a flexible substrate is used for the substrate 40, and the substrate 40 is bent into a crank shape using the flexibility.
Further, since the substrate 40 is flexible as described above, the supporting tape 72 having adhesive force is used until the substrate 40 is fixed by a resin mold or the like as in the first modification shown in FIG. Is preferably sandwiched between the fixed base 74 and the substrate 40 so as not to move from the fixed base 74.

  The third modification of the embodiment of the present invention is configured as described above. Conductive patterns 54 and 56 are provided on the upper surface 70a of the projecting portion 70 of the package 32, and the package 32 side of the substrate 40 projects. It is in a crank shape so as to be placed on the upper surface 70 a of the portion 70, and the wiring patterns 21 and 27 are provided on the lower surface 80 a of the crank-shaped end portion 80. For this reason, when the piezoelectric vibrator 30 and the substrate 40 are placed on the jig in the parallel placement step of ST2 in FIG. 5, the piezoelectric end portion 80 is simply placed on the upper surface 70a of the projecting portion 70. Conduction between the vibrator 30 and the substrate 40 can be achieved. In addition, the contact area between the piezoelectric vibrator 30 and the substrate 40 can be increased to increase the bonding strength.

  The present invention is not limited to the above-described embodiment. Each configuration of the embodiment and each modified example can be appropriately combined or omitted, and can be combined with other configurations not shown.

1 is a schematic plan view of a piezoelectric device according to an embodiment of the present invention. FIG. 2 is a schematic sectional view taken along line AA in FIG. 1. The schematic perspective view which permeate | transmitted resin of the piezoelectric device which concerns on embodiment of this invention. FIG. 3 is a schematic plan view illustrating only the bottom substrate of the piezoelectric vibrator by removing the resin and the electronic component of the piezoelectric device according to the embodiment of the present invention. Process drawing which showed an example of the manufacturing method of the piezoelectric device which concerns on embodiment of this invention. FIG. 6 is an enlarged perspective view of the vicinity of a bonding region of a piezoelectric device according to a first modification of the embodiment of the present invention. 7 is a further modification of the piezoelectric device of FIG. The expanded sectional view of the joining area vicinity of the piezoelectric device which concerns on the 2nd modification of embodiment of this invention. The expanded sectional view of the joining area | region vicinity of the piezoelectric device which concerns on the 3rd modification of embodiment of this invention. The schematic perspective view of the conventional piezoelectric device.

Explanation of symbols

  10, 12, 14, 16 ... piezoelectric devices, 20 ... electronic components (IC chips), 21, 22, 23, 24, 25, 26, 27, 28 ... wiring patterns, 30 ... piezoelectrics Vibrator, 32 ... package, 40 ... substrate, 54, 56 ... conductive pattern, 62 ... resin

Claims (7)

A piezoelectric device in which an electronic component and a piezoelectric vibrator in which a piezoelectric vibrating piece is housed in a package are electrically connected via a wiring pattern on a substrate,
The electronic component is disposed on the upper surface of the substrate,
The piezoelectric vibrator is arranged in parallel with the substrate,
Resin is adhered to at least a bonding region between the piezoelectric vibrator and the substrate on the upper surface side of the substrate.   The upper surface of the piezoelectric vibrator is exposed to the outside, and the side surface of the piezoelectric vibrator on the substrate side and the entire upper side of the substrate including the electronic component are covered with resin. Item 2. The piezoelectric device according to Item 1. The package of the piezoelectric vibrator has a conductive pattern electrically connected to the piezoelectric vibrating piece in the vicinity of the substrate,
The piezoelectric device according to claim 1, wherein the wiring pattern of the substrate is disposed adjacent to the conductive pattern. The electronic component is wire bonded to the wiring pattern of the substrate,
4. The piezoelectric device according to claim 3, wherein a part of the package on the side of the substrate protrudes in a horizontal direction, and the conductive pattern is provided on an upper surface of the protrusion. In the package, a part of the substrate side protrudes in the horizontal direction, and the conductive pattern is provided on the upper surface of the protrusion.
The substrate has a crank shape on the package side and is placed on the upper surface of the protruding portion, and the wiring pattern is provided on the lower surface of the crank-shaped end portion. The piezoelectric device according to claim 3.   6. The piezoelectric device according to claim 3, wherein the conductive pattern is extended to an upward surface of the package. A piezoelectric vibrator having a package for accommodating a piezoelectric vibrating piece, an electronic component electrically connected to the piezoelectric vibrator, and a wiring pattern for electrically connecting the electronic component and the piezoelectric vibrator A preparation step of separately forming the substrate;
A parallel arrangement step of arranging the piezoelectric vibrator and the substrate in parallel;
A component placement step of placing the electronic component on the top surface of the substrate;
A method for manufacturing a piezoelectric device, comprising: a resin coating step of adhering a resin to at least a bonding region between the piezoelectric vibrator and the substrate on the upper surface side of the substrate.

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