JP2007208282A5 - - Google Patents
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- Publication number
- JP2007208282A5 JP2007208282A5 JP2007071591A JP2007071591A JP2007208282A5 JP 2007208282 A5 JP2007208282 A5 JP 2007208282A5 JP 2007071591 A JP2007071591 A JP 2007071591A JP 2007071591 A JP2007071591 A JP 2007071591A JP 2007208282 A5 JP2007208282 A5 JP 2007208282A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- top ring
- elastic pad
- ring body
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims 13
- 239000000758 substrate Substances 0.000 claims 13
- 239000012530 fluid Substances 0.000 claims 5
- 230000002093 peripheral effect Effects 0.000 claims 3
- 239000000463 material Substances 0.000 claims 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 239000010408 film Substances 0.000 claims 1
- 229910052731 fluorine Inorganic materials 0.000 claims 1
- 239000011737 fluorine Substances 0.000 claims 1
- 239000011810 insulating material Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000010409 thin film Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007071591A JP4620072B2 (ja) | 2000-10-11 | 2007-03-19 | ポリッシング装置 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000311071 | 2000-10-11 | ||
| JP2007071591A JP4620072B2 (ja) | 2000-10-11 | 2007-03-19 | ポリッシング装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001013899A Division JP2002187060A (ja) | 2000-10-11 | 2001-01-22 | 基板保持装置、ポリッシング装置、及び研磨方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009266388A Division JP2010045408A (ja) | 2000-10-11 | 2009-11-24 | 研磨方法及び装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007208282A JP2007208282A (ja) | 2007-08-16 |
| JP2007208282A5 true JP2007208282A5 (enExample) | 2009-08-06 |
| JP4620072B2 JP4620072B2 (ja) | 2011-01-26 |
Family
ID=38487412
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007071591A Expired - Lifetime JP4620072B2 (ja) | 2000-10-11 | 2007-03-19 | ポリッシング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4620072B2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102307563B1 (ko) * | 2015-05-06 | 2021-10-05 | 주식회사 케이씨텍 | 기판 캐리어 및 이를 구비하는 화학 기계적 기판 연마장치 |
| JP6850636B2 (ja) * | 2017-03-03 | 2021-03-31 | 東京エレクトロン株式会社 | プラズマ処理装置 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3311116B2 (ja) * | 1993-10-28 | 2002-08-05 | 株式会社東芝 | 半導体製造装置 |
| US5559428A (en) * | 1995-04-10 | 1996-09-24 | International Business Machines Corporation | In-situ monitoring of the change in thickness of films |
| US6183354B1 (en) * | 1996-11-08 | 2001-02-06 | Applied Materials, Inc. | Carrier head with a flexible membrane for a chemical mechanical polishing system |
| JP3303963B2 (ja) * | 1997-01-20 | 2002-07-22 | 株式会社東京精密 | ウェーハの厚み加工量測定装置 |
| JPH11226865A (ja) * | 1997-12-11 | 1999-08-24 | Speedfam Co Ltd | キャリア及びｃｍｐ装置 |
| JPH11262857A (ja) * | 1998-03-18 | 1999-09-28 | Rohm Co Ltd | 半導体ウェハの研磨装置 |
| US6368189B1 (en) * | 1999-03-03 | 2002-04-09 | Mitsubishi Materials Corporation | Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure |
| JP2000263421A (ja) * | 1999-03-11 | 2000-09-26 | Toshiba Mach Co Ltd | ポリシング装置 |
-
2007
- 2007-03-19 JP JP2007071591A patent/JP4620072B2/ja not_active Expired - Lifetime
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