JP2002096261A5 - - Google Patents

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Publication number
JP2002096261A5
JP2002096261A5 JP2000280216A JP2000280216A JP2002096261A5 JP 2002096261 A5 JP2002096261 A5 JP 2002096261A5 JP 2000280216 A JP2000280216 A JP 2000280216A JP 2000280216 A JP2000280216 A JP 2000280216A JP 2002096261 A5 JP2002096261 A5 JP 2002096261A5
Authority
JP
Japan
Prior art keywords
substrate
polishing
top ring
holding
elastic film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000280216A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002096261A (ja
JP3856634B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2000280216A external-priority patent/JP3856634B2/ja
Priority to JP2000280216A priority Critical patent/JP3856634B2/ja
Priority to DE60138343T priority patent/DE60138343D1/de
Priority to EP01117745A priority patent/EP1177859B1/en
Priority to EP09005308A priority patent/EP2085181A1/en
Priority to SG200804145-1A priority patent/SG157258A1/en
Priority to SG200501205A priority patent/SG125152A1/en
Priority to US09/917,732 priority patent/US6890402B2/en
Priority to KR1020010046378A priority patent/KR100876381B1/ko
Priority to TW090118572A priority patent/TW516991B/zh
Priority to SG200104611-9A priority patent/SG129989A1/en
Publication of JP2002096261A publication Critical patent/JP2002096261A/ja
Priority to US10/972,579 priority patent/US20050072527A1/en
Publication of JP2002096261A5 publication Critical patent/JP2002096261A5/ja
Publication of JP3856634B2 publication Critical patent/JP3856634B2/ja
Application granted granted Critical
Priority to US11/907,590 priority patent/US20080047667A1/en
Priority to US11/979,019 priority patent/US20080066862A1/en
Priority to US12/136,424 priority patent/US7897007B2/en
Priority to SG10201706765QA priority patent/SG10201706765QA/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2000280216A 2000-07-31 2000-09-14 基板保持装置及び該基板保持装置を備えたポリッシング装置 Expired - Lifetime JP3856634B2 (ja)

Priority Applications (15)

Application Number Priority Date Filing Date Title
JP2000280216A JP3856634B2 (ja) 2000-09-14 2000-09-14 基板保持装置及び該基板保持装置を備えたポリッシング装置
DE60138343T DE60138343D1 (de) 2000-07-31 2001-07-30 Substrathalter und Poliervorrichtung
EP01117745A EP1177859B1 (en) 2000-07-31 2001-07-30 Substrate holding apparatus and substrate polishing apparatus
EP09005308A EP2085181A1 (en) 2000-07-31 2001-07-30 Substrate holding apparatus and substrate polishing apparatus
KR1020010046378A KR100876381B1 (ko) 2000-07-31 2001-07-31 기판 고정 장치 및 기판 폴리싱 장치
SG200104611-9A SG129989A1 (en) 2000-07-31 2001-07-31 Substrate holding apparatus and substrate polishing apparatus
SG200501205A SG125152A1 (en) 2000-07-31 2001-07-31 Substrate holding apparatus and substrate polishing apparatus
US09/917,732 US6890402B2 (en) 2000-07-31 2001-07-31 Substrate holding apparatus and substrate polishing apparatus
SG200804145-1A SG157258A1 (en) 2000-07-31 2001-07-31 Substrate holding apparatus and substrate polishing apparatus
TW090118572A TW516991B (en) 2000-07-31 2001-07-31 Substrate holding apparatus and substrate polishing apparatus
US10/972,579 US20050072527A1 (en) 2000-07-31 2004-10-26 Substrate holding apparatus and substrate polishing apparatus
US11/907,590 US20080047667A1 (en) 2000-07-31 2007-10-15 Substrate holding apparatus and substrate polishing apparatus
US11/979,019 US20080066862A1 (en) 2000-07-31 2007-10-30 Substrate holding apparatus and substrate polishing apparatus
US12/136,424 US7897007B2 (en) 2000-07-31 2008-06-10 Substrate holding apparatus and substrate polishing apparatus
SG10201706765QA SG10201706765QA (en) 2000-07-31 2014-07-31 Substrate holding apparatus and substrate polishing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000280216A JP3856634B2 (ja) 2000-09-14 2000-09-14 基板保持装置及び該基板保持装置を備えたポリッシング装置

Publications (3)

Publication Number Publication Date
JP2002096261A JP2002096261A (ja) 2002-04-02
JP2002096261A5 true JP2002096261A5 (enExample) 2004-12-24
JP3856634B2 JP3856634B2 (ja) 2006-12-13

Family

ID=18765099

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000280216A Expired - Lifetime JP3856634B2 (ja) 2000-07-31 2000-09-14 基板保持装置及び該基板保持装置を備えたポリッシング装置

Country Status (1)

Country Link
JP (1) JP3856634B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1593148B1 (en) 2003-02-10 2015-04-29 Ebara Corporation Substrate holding apparatus and polishing apparatus
JP5464820B2 (ja) 2007-10-29 2014-04-09 株式会社荏原製作所 研磨装置
US10702972B2 (en) 2012-05-31 2020-07-07 Ebara Corporation Polishing apparatus
JP5976522B2 (ja) 2012-05-31 2016-08-23 株式会社荏原製作所 研磨装置および研磨方法
KR102160111B1 (ko) * 2013-12-11 2020-09-25 주식회사 케이씨텍 화학 기계적 연마 장치의 캐리어 헤드용 멤브레인 및 이를 구비한 캐리어 헤드
JP7372107B2 (ja) * 2019-10-15 2023-10-31 株式会社岡本工作機械製作所 ウェーハ研磨用ヘッド
KR102783310B1 (ko) * 2019-11-19 2025-03-19 가부시키가이샤 에바라 세이사꾸쇼 기판을 보유 지지하기 위한 톱링 및 기판 처리 장치
CN119217254B (zh) * 2024-10-31 2025-12-02 华海清科股份有限公司 用于晶圆加工的承载头、化学机械抛光设备

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