JP2002096261A5

JP2002096261A5 -

Info

Publication number: JP2002096261A5
Application number: JP2000280216A
Authority: JP
Filing date: 2000-09-14
Publication date: 2004-12-24
Anticipated expiration: 2020-09-14

Description

【００１５】
【課題を解決するための手段】
上述した目的を達成するため、本発明の基板保持装置の１態様は、ポリッシング対象物である基板を保持して研磨テーブル上の研磨面に押圧する基板保持装置において、前記基板を保持するトップリング本体と、前記トップリング本体に固定されるか又は一体に設けられ基板の外周縁を保持するリテーナリングと、開口部を有した弾性膜で覆われ流体が供給されるトップリング本体内に設けられた流体室と、前記弾性膜の開口部に設けられるとともに連通孔を有した吸着部とを備え、前記流体室内に加圧流体を供給することにより前記基板を前記研磨面に押圧し、前記トップリング本体に押圧力を加えることにより前記リテーナリングを前記研磨面に押圧し、前記吸着部の連通孔を真空源に連通させることにより該吸着部により前記基板を吸着するようにしたことを特徴とするものである。
本発明の好ましい態様によれば、前記流体室に供給する加圧流体の圧力を調整することにより基板に加わる研磨圧力を調整する。
本発明の好ましい態様によれば、前記弾性膜は支持部材によって前記トップリング本体内で上下動可能に支持され、前記支持部材の前記トップリング本体に対する上下方向位置は規制部材により規制される。
本発明の好ましい態様によれば、前記弾性膜は複数の開口部を有し、該複数の開口部に前記吸着部が設けられている。
本発明の好ましい態様によれば、前記吸着部は前記支持部材に設けられている。
本発明の好ましい態様によれば、前記トップリング本体に押圧力を加える手段は、トップリング本体を上下動させる機構からなる。
本発明の基板保持装置の他の態様は、ポリッシング対象物である基板を保持して研磨テーブル上の研磨面に押圧する基板保持装置において、前記基板を保持するトップリング本体と、前記トップリング本体内に画成された空間内に設けられた開口部を有する弾性膜と、前記弾性膜を保持する弾性膜支持部材と、前記弾性膜の開口部に露出するように設けられた吸着部とを有し、前記吸着部は、真空源に接続されている連通孔を有し、さらに該吸着部の下端面には弾性シートが貼着されていることを特徴とするものである。 [0015]
[Means for Solving the Problems]
In order to achieve the above-described object, one aspect of the substrate holding device of the present invention is a substrate holding device for holding a substrate which is a polishing object and pressing the substrate against a polishing surface on a polishing table, the top ring holding the substrate Provided in a top ring main body covered with an elastic film having an opening and supplied with a fluid, the main body, a retainer ring fixed to or integrally provided on the top ring main body and holding an outer peripheral edge of the substrate; Fluid chamber and a suction unit provided at the opening of the elastic film and having a communication hole, and pressing the substrate against the polishing surface by supplying pressurized fluid into the fluid chamber, and The retainer ring is pressed against the polishing surface by applying a pressing force to the ring body, and the communication hole of the suction unit is communicated with a vacuum source to suck the substrate by the suction unit. It is characterized in that it has to be.
According to a preferred aspect of the present invention, the polishing pressure applied to the substrate is adjusted by adjusting the pressure of the pressurized fluid supplied to the fluid chamber.
According to a preferred aspect of the present invention, the elastic film is vertically movably supported in the top ring main body by a support member, and the vertical position of the support member with respect to the top ring main body is regulated by a regulation member.
According to a preferred aspect of the present invention, the elastic film has a plurality of openings, and the suction portion is provided in the plurality of openings.
According to a preferred aspect of the present invention, the suction unit is provided on the support member.
According to a preferred aspect of the present invention, the means for applying a pressing force to the top ring body comprises a mechanism for moving the top ring body up and down.
Another aspect of the substrate holding apparatus according to the present invention is a substrate holding apparatus for holding a substrate as a polishing object and pressing the substrate against a polishing surface on a polishing table, comprising: a top ring body for holding the substrate; An elastic film having an opening provided in a space defined inside, an elastic film supporting member for holding the elastic film, and a suction unit provided to be exposed at the opening of the elastic film The suction unit has a communicating hole connected to a vacuum source, and an elastic sheet is attached to a lower end surface of the suction unit.

【００１９】
また本発明のポリッシング装置の１態様は、研磨面を有する研磨テーブルと、ポリッシング対象物である基板を保持して研磨テーブル上の研磨面に押圧するトップリングとを備え、前記トップリング内に開口部を有した弾性膜により形成された流体室を設け、かつ前記弾性膜の開口部に連通孔を有した吸着部を設け、前記流体室内に加圧流体を供給することにより前記基板を前記研磨面に押圧し、前記吸着部の連通孔を真空源に連通させることにより該吸着部により前記基板を吸着するようにしたことを特徴とするものである。
本発明の好ましい態様によれば、前記トップリングはトップリング本体に固定されるか又は一体に設けられ基板の外周縁を保持するリテーナリングを備え、前記トップリング本体に押圧力を加えることにより前記リテーナリングを前記研磨面に押圧する。 [0019]
The one aspect of the polishing apparatus of the present invention includes a polishing table having a polishing surface, a top ring for pressing the polishing surface on the holding substrate and the polishing table is polished object, before Symbol top in the ring A fluid chamber formed of an elastic film having an opening is provided, and an adsorption portion having a communicating hole is provided at the opening of the elastic film, and the substrate is fronted by supplying a pressurized fluid into the fluid chamber. pressing the serial Labs Migakumen, it is characterized in that so as to adsorb the substrate by adsorption unit by communicating the communication hole of the suction unit to a vacuum source.
According to a preferred aspect of the present invention, the top ring is provided with a retainer ring fixed to or integrally provided on the top ring main body and holding the outer peripheral edge of the substrate, the pressing force being applied to the top ring main body The retainer ring is pressed against the polishing surface.

【００２１】
本発明の好ましい態様によれば、前記硬質の研磨部材は、砥粒をバインダ中に固定し板状に形成した固定砥粒により構成される。
本発明の好ましい態様によれば、研磨面を有する研磨テーブルと、ポリッシング対象物である基板を保持して研磨テーブル上の研磨面に押圧する前記基板保持装置とを備えている。
また本発明のポリッシング方法は、研磨面を有する研磨テーブルとトップリングとを有し、トップリングによりポリッシング対象物である基板を保持して研磨テーブル上の研磨面に押圧することによって基板を研磨するポリッシング方法において、前記トップリング内に弾性膜により形成された流体室に加圧流体を供給することにより、前記基板を流体圧により研磨面に押圧して研磨し、前記基板を前記研磨テーブルに搬出入する際に、前記弾性膜の開口部に設けられた吸着部の連通孔を真空源に連通させ該吸着部により前記基板を吸着することを特徴とするものである。[0021]
According to a preferred aspect of the present invention, the hard abrasive member is constituted by a fixed abrasive in which abrasive grains are fixed in a binder and formed into a plate shape.
According to a preferred aspect of the present invention, a polishing table having a polishing surface, and the substrate holding device for holding a substrate as a polishing target and pressing the substrate against the polishing surface on the polishing table are provided.
Further, the polishing method of the present invention has a polishing table having a polishing surface and a top ring, and holds the substrate as a polishing object by the top ring and presses the substrate against the polishing surface on the polishing table to polish the substrate. in polishing method, by supplying pressurized fluid to the fluid chamber formed by an elastic film on the top in the ring, the substrate is polished by pressing the O Ri Labs Migakumen the fluid pressure, the polishing said substrate At the time of carrying in and out of the table, the communication hole of the adsorption unit provided at the opening of the elastic film is communicated with a vacuum source, and the adsorption unit adsorbs the substrate.

Claims

A substrate holding apparatus for holding a substrate as a polishing object and pressing the substrate against a polishing surface on a polishing table,
A top ring body for holding the substrate, a retainer ring fixed to or integrally provided on the top ring body for holding the outer peripheral edge of the substrate, covered with an elastic film having an opening and supplied with a fluid The substrate includes the fluid chamber provided in the top ring body, and the suction unit provided at the opening of the elastic film and having a communicating hole, and supplying the pressurized fluid into the fluid chamber. The retainer ring is pressed against the polishing surface by pressing on the surface and applying a pressing force to the top ring main body, and the communication hole of the suction portion is communicated with a vacuum source to suck the substrate by the suction portion A substrate holding device characterized in that.

The substrate holding apparatus according to claim 1, wherein the polishing pressure applied to the substrate is adjusted by adjusting the pressure of the pressurized fluid supplied to the fluid chamber.

The elastic membrane is supported by the support member so as to be vertically movable in the top ring main body, and the vertical position of the support member with respect to the top ring main body is restricted by the restriction member. The board | substrate holding | maintenance apparatus of description.

The substrate holding device according to any one of claims 1 to 3, wherein the elastic film has a plurality of openings, and the suction portion is provided in the plurality of openings.

The substrate holding apparatus according to claim 3, wherein the suction unit is provided on the support member.

The substrate holding device according to any one of claims 1 to 5, wherein the means for applying a pressing force to the top ring body comprises a mechanism for moving the top ring body up and down.

A substrate holding apparatus for holding a substrate as a polishing object and pressing the substrate against a polishing surface on a polishing table,
  A top ring body for holding the substrate;
  An elastic membrane having an opening provided in a space defined in the top ring body;
  An elastic film supporting member for holding the elastic film;
  And a suction portion provided to be exposed at the opening of the elastic film,
  The substrate holding apparatus, wherein the suction unit has a communication hole connected to a vacuum source, and an elastic sheet is attached to a lower end surface of the suction unit.

Comprises a polishing table having a polishing surface, a top ring for pressing the polishing surface on the holding substrate and the polishing table is polishing object,
Before SL fluid chamber formed by an elastic film having an opening provided in the top ring, and provided with a suction unit having a communication hole in the opening of the elastic membrane, supplies pressurized fluid to the fluid chamber polishing apparatus in which the substrate is pressed before SL Research Migakumen a, characterized in that the communicating hole of the suction unit so as to adsorb the substrate by adsorption unit by communicating to a vacuum source by.

The top ring includes a retainer ring fixed to or integrally provided on the top ring body and holding an outer peripheral edge of the substrate, and pressing the retainer ring against the polishing surface by applying a pressing force to the top ring body The polishing apparatus according to claim 8 , characterized in that:

The pre-Symbol Migaku Ken surface, 19.6MPa (200kg / cm ²⁾ or more can be formed in the polishing member rigid with a compressive modulus of elasticity, characterized in claims 8 polishing apparatus according.

9. The polishing apparatus according to claim 8, wherein the hard polishing member is constituted by fixed abrasives formed by fixing abrasives in a binder and forming a plate shape.

A polishing table having a polishing surface, and a substrate holding device according to any one of claims 1 to 7 , which holds a substrate as a polishing object and presses the substrate against the polishing surface on the polishing table. Polishing equipment.

A polishing method comprising a polishing table having a polishing surface and a top ring, and holding the substrate to be polished by the top ring and pressing the substrate against the polishing surface on the polishing table to polish the substrate,
By supplying pressurized fluid to the fluid chamber formed by an elastic film on the top in the ring, the substrate is polished by pressing the O Ri Labs Migakumen the fluid pressure, carrying in and carrying out the substrate to the polishing table In the polishing method, the communication hole of the suction unit provided in the opening of the elastic film is communicated with a vacuum source, and the suction unit suctions the substrate.