JP4620072B2 - ポリッシング装置 - Google Patents

ポリッシング装置 Download PDF

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Publication number
JP4620072B2
JP4620072B2 JP2007071591A JP2007071591A JP4620072B2 JP 4620072 B2 JP4620072 B2 JP 4620072B2 JP 2007071591 A JP2007071591 A JP 2007071591A JP 2007071591 A JP2007071591 A JP 2007071591A JP 4620072 B2 JP4620072 B2 JP 4620072B2
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JP
Japan
Prior art keywords
polishing
semiconductor wafer
pressure
pressure chamber
top ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2007071591A
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English (en)
Japanese (ja)
Other versions
JP2007208282A5 (enExample
JP2007208282A (ja
Inventor
哲二 戸川
郁太郎 野路
計介 並木
穂積 安田
俊市朗 兒嶋
邦彦 桜井
暢行 高田
治 鍋谷
誠 福島
秀樹 高柳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2007071591A priority Critical patent/JP4620072B2/ja
Publication of JP2007208282A publication Critical patent/JP2007208282A/ja
Publication of JP2007208282A5 publication Critical patent/JP2007208282A5/ja
Application granted granted Critical
Publication of JP4620072B2 publication Critical patent/JP4620072B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2007071591A 2000-10-11 2007-03-19 ポリッシング装置 Expired - Lifetime JP4620072B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007071591A JP4620072B2 (ja) 2000-10-11 2007-03-19 ポリッシング装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000311071 2000-10-11
JP2007071591A JP4620072B2 (ja) 2000-10-11 2007-03-19 ポリッシング装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2001013899A Division JP2002187060A (ja) 2000-10-11 2001-01-22 基板保持装置、ポリッシング装置、及び研磨方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2009266388A Division JP2010045408A (ja) 2000-10-11 2009-11-24 研磨方法及び装置

Publications (3)

Publication Number Publication Date
JP2007208282A JP2007208282A (ja) 2007-08-16
JP2007208282A5 JP2007208282A5 (enExample) 2009-08-06
JP4620072B2 true JP4620072B2 (ja) 2011-01-26

Family

ID=38487412

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007071591A Expired - Lifetime JP4620072B2 (ja) 2000-10-11 2007-03-19 ポリッシング装置

Country Status (1)

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JP (1) JP4620072B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102307563B1 (ko) * 2015-05-06 2021-10-05 주식회사 케이씨텍 기판 캐리어 및 이를 구비하는 화학 기계적 기판 연마장치
JP6850636B2 (ja) * 2017-03-03 2021-03-31 東京エレクトロン株式会社 プラズマ処理装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3311116B2 (ja) * 1993-10-28 2002-08-05 株式会社東芝 半導体製造装置
US5559428A (en) * 1995-04-10 1996-09-24 International Business Machines Corporation In-situ monitoring of the change in thickness of films
US6183354B1 (en) * 1996-11-08 2001-02-06 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
JP3303963B2 (ja) * 1997-01-20 2002-07-22 株式会社東京精密 ウェーハの厚み加工量測定装置
JPH11226865A (ja) * 1997-12-11 1999-08-24 Speedfam Co Ltd キャリア及びｃｍｐ装置
JPH11262857A (ja) * 1998-03-18 1999-09-28 Rohm Co Ltd 半導体ウェハの研磨装置
US6368189B1 (en) * 1999-03-03 2002-04-09 Mitsubishi Materials Corporation Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
JP2000263421A (ja) * 1999-03-11 2000-09-26 Toshiba Mach Co Ltd ポリシング装置

Also Published As

Publication number Publication date
JP2007208282A (ja) 2007-08-16

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