JP2007169105A - NiCuZn系フェライトおよびそれを用いた電子部品 - Google Patents
NiCuZn系フェライトおよびそれを用いた電子部品 Download PDFInfo
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- 229910000859 α-Fe Inorganic materials 0.000 title claims abstract description 38
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims abstract description 28
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims abstract description 16
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000011787 zinc oxide Substances 0.000 claims abstract description 13
- 229910000416 bismuth oxide Inorganic materials 0.000 claims abstract description 10
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 claims abstract description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 9
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910001887 tin oxide Inorganic materials 0.000 claims abstract description 9
- 239000005751 Copper oxide Substances 0.000 claims abstract description 7
- 229910000431 copper oxide Inorganic materials 0.000 claims abstract description 7
- 229910006404 SnO 2 Inorganic materials 0.000 claims description 13
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 5
- 229910000480 nickel oxide Inorganic materials 0.000 claims description 5
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 claims description 5
- 239000002131 composite material Substances 0.000 claims description 3
- 239000011162 core material Substances 0.000 description 18
- 239000000203 mixture Substances 0.000 description 18
- 230000035699 permeability Effects 0.000 description 13
- 239000000463 material Substances 0.000 description 11
- 238000010304 firing Methods 0.000 description 10
- 230000007423 decrease Effects 0.000 description 8
- 239000000843 powder Substances 0.000 description 6
- 239000002994 raw material Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 238000001354 calcination Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000696 magnetic material Substances 0.000 description 4
- 238000004804 winding Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 3
- 229910017518 Cu Zn Inorganic materials 0.000 description 2
- 229910017752 Cu-Zn Inorganic materials 0.000 description 2
- 229910017943 Cu—Zn Inorganic materials 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 238000010298 pulverizing process Methods 0.000 description 2
- 229910020599 Co 3 O 4 Inorganic materials 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000037237 body shape Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- -1 dipping Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
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- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/34—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
- H01F1/342—Oxides
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Abstract
【解決手段】 主成分として酸化鉄がFe2O3換算で45.0〜49.0モル%、酸化銅がCuO換算で5.0〜14.0モル%、酸化亜鉛がZnO換算で1.0〜32.0モル%、酸化ニッケルがNiO換算で残部モル%含有されて構成されるNiCuZn系フェライトであって、
前記主成分に対して、酸化ビスマスがBi2O3換算で0.25〜0.40重量%(ただし、0.25重量%を含まない)、酸化錫がSnO2換算で1.00〜2.50重量%含有されてなるように構成される。
【選択図】 なし
Description
本発明のNiCuZn系フェライトにおける実質的な主成分は、酸化鉄がFe2O3換算で45.0〜49.0モル%(特に好ましくは、47.0〜48.8モル%)、酸化銅がCuO換算で5.0〜14.0モル%(特に好ましくは、7.0〜12モル%)、酸化亜鉛がZnO換算で1.0〜32.0モル%(特に好ましくは、14.0〜28.0モル%)、酸化ニッケルがNiO換算で残部モル%含有されて構成される。
(1)100kHzにおける初透磁率μi
900℃、および920℃の各焼成温度で製造した各トロイダルコアサンプルにワイヤを20回巻回した後、LCRメータにてインダクタンス値等を測定し、100kHz、25℃における初透磁率μi900、およびμi920(下付きの添字は焼成温度を示している)を求めた。
ワイヤを20回ほど巻回した各トロイダルコアサンプルについて直流電流を流した時のμの変化を測定し、μと直流電流の関係をグラフにする。次いで、このグラフを用いて直流電流0mA時の初期の透磁率μiが10%低下するときの電流値を計算するという手法によって、初透磁率μiの10%低下の電流値Idc10%down(mA)を求めた。
Claims (3)
- 主成分として酸化鉄がFe2O3換算で45.0〜49.0モル%、酸化銅がCuO換算で5.0〜14.0モル%、酸化亜鉛がZnO換算で1.0〜32.0モル%、酸化ニッケルがNiO換算で残部モル%含有されて構成されるNiCuZn系フェライトであって、
前記主成分に対して、酸化ビスマスがBi2O3換算で0.25〜0.40重量%(ただし、0.25重量%を含まない)、酸化錫がSnO2換算で1.00〜2.50重量%含有されてなることを特徴とするNiCuZn系フェライト。 - NiCuZn系フェライトを有してなる電子部品であって、
前記フェライトは、主成分として酸化鉄がFe2O3換算で45.0〜49.0モル%、酸化銅がCuO換算で5.0〜14.0モル%、酸化亜鉛がZnO換算で1.0〜32.0モル%、酸化ニッケルがNiO換算で残部モル%含有され、
前記主成分に対して、酸化ビスマスがBi2O3換算で0.25〜0.40重量%(ただし、0.25重量%を含まない)、酸化錫がSnO2換算で1.00〜2.50重量%含有されてなることを特徴とする電子部品。 - 前記電子部品はコイル導体を備えるとともに、前記フェライトからなるコア部を備え、コア部が閉磁路を形成する積層インダクタまたはLC複合部品である請求項2に記載の電子部品。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005368381A JP4532401B2 (ja) | 2005-12-21 | 2005-12-21 | NiCuZn系フェライトおよびそれを用いた電子部品 |
US11/468,599 US7527744B2 (en) | 2005-12-21 | 2006-08-30 | NiCuZn-base ferrites and electronic parts using the same |
TW095133302A TW200733151A (en) | 2005-12-21 | 2006-09-08 | Nickel copper zinc based ferromagnet and electric component using the same |
KR1020060094832A KR100757903B1 (ko) | 2005-12-21 | 2006-09-28 | NiCuZn계 페라이트 및 그것을 사용한 전자부품 |
EP06020928A EP1801820B1 (en) | 2005-12-21 | 2006-10-05 | NiCuZn-base ferrites and electronic parts using the same |
DE602006001928T DE602006001928D1 (de) | 2005-12-21 | 2006-10-05 | NiCuZn-Ferrite und Elektronikteile die diese verwenden |
CNB2006101493054A CN100543886C (zh) | 2005-12-21 | 2006-11-21 | NiCuZn系铁氧体及使用其制造的电子部件 |
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Application Number | Priority Date | Filing Date | Title |
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JP2005368381A JP4532401B2 (ja) | 2005-12-21 | 2005-12-21 | NiCuZn系フェライトおよびそれを用いた電子部品 |
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Publication Number | Publication Date |
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JP2007169105A true JP2007169105A (ja) | 2007-07-05 |
JP4532401B2 JP4532401B2 (ja) | 2010-08-25 |
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JP2005368381A Active JP4532401B2 (ja) | 2005-12-21 | 2005-12-21 | NiCuZn系フェライトおよびそれを用いた電子部品 |
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Country | Link |
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US (1) | US7527744B2 (ja) |
EP (1) | EP1801820B1 (ja) |
JP (1) | JP4532401B2 (ja) |
KR (1) | KR100757903B1 (ja) |
CN (1) | CN100543886C (ja) |
DE (1) | DE602006001928D1 (ja) |
TW (1) | TW200733151A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009263196A (ja) * | 2008-04-30 | 2009-11-12 | Tdk Corp | NiCuZn系フェライトおよびそれを用いた電子部品 |
JP2013236050A (ja) * | 2012-04-13 | 2013-11-21 | Toko Inc | 積層型電子部品 |
JP2017510996A (ja) * | 2014-04-08 | 2017-04-13 | ローゼンベルガー ホーフフレクベンツテクニーク ゲーエムベーハー ウント ツェーオー カーゲー | サプレッサチョーク |
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JP5880517B2 (ja) * | 2013-10-16 | 2016-03-09 | Tdk株式会社 | フェライト組成物および電子部品 |
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JP2022148515A (ja) * | 2021-03-24 | 2022-10-06 | Tdk株式会社 | フェライト組成物および電子部品 |
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JP3147496B2 (ja) * | 1992-05-25 | 2001-03-19 | 株式会社村田製作所 | フェライト材料 |
JPH10223424A (ja) | 1997-02-07 | 1998-08-21 | Tdk Corp | 積層型インダクタ |
JP4384346B2 (ja) | 2000-10-13 | 2009-12-16 | 東光株式会社 | Ni−Cu−Zn系フェライト磁性材料 |
JP2002141215A (ja) | 2000-11-07 | 2002-05-17 | Sumitomo Metal Ind Ltd | 酸化物磁性材料とその製造方法および積層チップインダクタ |
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JP2003272912A (ja) | 2002-03-15 | 2003-09-26 | Murata Mfg Co Ltd | 酸化物磁性材料、及びそれを用いた積層型電子部品 |
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JP2009263196A (ja) * | 2008-04-30 | 2009-11-12 | Tdk Corp | NiCuZn系フェライトおよびそれを用いた電子部品 |
JP2013236050A (ja) * | 2012-04-13 | 2013-11-21 | Toko Inc | 積層型電子部品 |
JP2017510996A (ja) * | 2014-04-08 | 2017-04-13 | ローゼンベルガー ホーフフレクベンツテクニーク ゲーエムベーハー ウント ツェーオー カーゲー | サプレッサチョーク |
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CN1988067A (zh) | 2007-06-27 |
CN100543886C (zh) | 2009-09-23 |
EP1801820B1 (en) | 2008-07-23 |
JP4532401B2 (ja) | 2010-08-25 |
TWI317955B (ja) | 2009-12-01 |
US7527744B2 (en) | 2009-05-05 |
EP1801820A1 (en) | 2007-06-27 |
TW200733151A (en) | 2007-09-01 |
KR20070066848A (ko) | 2007-06-27 |
KR100757903B1 (ko) | 2007-09-11 |
US20070138431A1 (en) | 2007-06-21 |
DE602006001928D1 (de) | 2008-09-04 |
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