JP2007165776A5 - - Google Patents

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Publication number
JP2007165776A5
JP2007165776A5 JP2005363411A JP2005363411A JP2007165776A5 JP 2007165776 A5 JP2007165776 A5 JP 2007165776A5 JP 2005363411 A JP2005363411 A JP 2005363411A JP 2005363411 A JP2005363411 A JP 2005363411A JP 2007165776 A5 JP2007165776 A5 JP 2007165776A5
Authority
JP
Japan
Prior art keywords
mounting
support substrate
wiring portion
manufacturing
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005363411A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007165776A (ja
JP4668782B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005363411A priority Critical patent/JP4668782B2/ja
Priority claimed from JP2005363411A external-priority patent/JP4668782B2/ja
Priority to US11/610,244 priority patent/US7410837B2/en
Priority to TW095147046A priority patent/TW200730065A/zh
Publication of JP2007165776A publication Critical patent/JP2007165776A/ja
Publication of JP2007165776A5 publication Critical patent/JP2007165776A5/ja
Application granted granted Critical
Publication of JP4668782B2 publication Critical patent/JP4668782B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2005363411A 2005-12-16 2005-12-16 実装基板の製造方法 Expired - Fee Related JP4668782B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2005363411A JP4668782B2 (ja) 2005-12-16 2005-12-16 実装基板の製造方法
US11/610,244 US7410837B2 (en) 2005-12-16 2006-12-13 Method of manufacturing mounting substrate
TW095147046A TW200730065A (en) 2005-12-16 2006-12-15 Method of manufacturing mounting substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005363411A JP4668782B2 (ja) 2005-12-16 2005-12-16 実装基板の製造方法

Publications (3)

Publication Number Publication Date
JP2007165776A JP2007165776A (ja) 2007-06-28
JP2007165776A5 true JP2007165776A5 (enExample) 2008-11-13
JP4668782B2 JP4668782B2 (ja) 2011-04-13

Family

ID=38174163

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005363411A Expired - Fee Related JP4668782B2 (ja) 2005-12-16 2005-12-16 実装基板の製造方法

Country Status (3)

Country Link
US (1) US7410837B2 (enExample)
JP (1) JP4668782B2 (enExample)
TW (1) TW200730065A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201325338A (zh) * 2011-12-14 2013-06-16 Wistron Corp 避免金手指結構沾錫之電路板
US8889484B2 (en) * 2012-10-02 2014-11-18 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and method for a component package
US9642261B2 (en) * 2014-01-24 2017-05-02 Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. Composite electronic structure with partially exposed and protruding copper termination posts
US9508703B2 (en) * 2014-04-30 2016-11-29 Taiwan Semiconductor Manufacturing Company, Ltd. Stacked dies with wire bonds and method
KR102192569B1 (ko) * 2015-11-06 2020-12-17 삼성전자주식회사 전자 부품 패키지 및 그 제조방법

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11112152A (ja) 1997-10-03 1999-04-23 Matsushita Electric Ind Co Ltd フリップチップ実装の多層プリント基板
JP2001119131A (ja) * 1999-10-20 2001-04-27 Matsushita Electric Ind Co Ltd 電子部品実装体とそれを用いた電子機器と電子部品実装体の製造方法
JP2002261440A (ja) * 2001-03-01 2002-09-13 Sony Chem Corp フレキシブル配線基板の製造方法及びフレキシブル配線基板
US7474538B2 (en) * 2002-05-27 2009-01-06 Nec Corporation Semiconductor device mounting board, method of manufacturing the same, method of inspecting the same, and semiconductor package
JP4043872B2 (ja) * 2002-07-11 2008-02-06 大日本印刷株式会社 多層配線基板の製造方法および樹脂封止型半導体装置の製造方法
JP4137659B2 (ja) * 2003-02-13 2008-08-20 新光電気工業株式会社 電子部品実装構造及びその製造方法
JP4483247B2 (ja) * 2003-09-22 2010-06-16 凸版印刷株式会社 多層フレキシブル配線基板の製造方法及び多層フレキシブル配線基板
JP4298559B2 (ja) * 2004-03-29 2009-07-22 新光電気工業株式会社 電子部品実装構造及びその製造方法
JP2005315775A (ja) * 2004-04-30 2005-11-10 Fujitsu Autom Ltd 片面移動式プローブを用いた４端子検査方法及び４端子検査用治具
JP4108643B2 (ja) * 2004-05-12 2008-06-25 日本電気株式会社 配線基板及びそれを用いた半導体パッケージ

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