JP2007165755A - Wiring board and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wiring board in which component land width is different from signal wiring width, or signal wiring whose wiring width is different is intermingled, and any impedance mismatching is not generated and a method for manufacturing the wiring board, and to achieve highly dense signal wiring and thin wiring board whose signal quality is stable. <P>SOLUTION: In a wiring board where signal wiring 9 whose width is thin and signal wiring 7 whose width is wide are formed on the surface of a dielectric layer 5A so as to be intermingled, a dielectric layer 8 whose dielectric rate is different from that of the dielectric layer 5A is arranged under the signal wiring 7 whose width is wide so that it is possible to increase the characteristic impedance of the signal wiring 7 whose width is wide, and to match the characteristic impedance with that of the signal wiring 9 whose signal line width is thin. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a wiring board capable of obtaining good signal wiring transmission quality in a wiring board having a layer structure composed of a conductor pattern such as a land or a signal wiring, a dielectric layer, and a conductor layer, and a method of manufacturing the same. .

  In a circuit using a high frequency band such as a microwave band or a millimeter wave band, it is important to match the input / output impedance of the circuit element itself and the characteristic impedance of the signal wiring in order to reduce transmission loss. 2. Description of the Related Art In recent years, research and development for communications that have a wide communication band and a large number of channels, such as a high-speed wireless LAN (Local Area Network), have been actively conducted. In a circuit using such a high frequency band, a high frequency wiring board corresponding to the microwave band or a transmission line substrate is used. These circuits require high-frequency characteristics of circuit elements, and high-frequency characteristics of signal wiring between circuit elements and their lands, or between one circuit element land and another circuit element land. A lot is happening.

  In a communication standard such as a high-speed wireless LAN equipped with a wireless circuit and a digital circuit as a controller, for example, a multilayer substrate as shown in FIG. 19 may be used. FIG. 19 is a plan view showing an example of a conventional wiring board. Although schematically shown on the multilayer circuit board 32, circuit elements 33, 34, 36 and 39, an antenna 38, a land 40, and signal wirings 35, 37, 41 and 42 are written. 20 is a view seen from the H direction in FIG. This is a multilayer substrate having four conductor layers 43 to 46 and three dielectric layers 47 to 49. As shown in FIG. 20, circuit elements and the like are placed on the substrate surface, and the conductor layers 44 and 45 are a GND (ground) layer or a power supply layer. The signal wirings 35, 37, 41, and 42 on the substrate surface and the conductor layer 45 have a so-called microstrip line configuration with the dielectric layer 47 interposed therebetween. The characteristic impedance of the land and signal wiring can be controlled by adjusting the area and line width with respect to the thickness of the dielectric layer having a certain dielectric constant and dielectric loss.

  The input / output impedance of the circuit element is predetermined such as 50Ω. A dedicated land (appropriate land) is determined at the terminal of the circuit element, and signal wiring is drawn from this land and connected to other circuit elements and the like. Most of the appropriate lands are sized from the viewpoint that the circuit elements can be properly soldered, and depending on the board configuration, the thickness of the dielectric layer varies, so what is the input / output impedance of the circuit elements? May cause inconsistencies. In addition, the signal wiring is drawn out from the land and connected to other circuit elements, but the signal wiring width is almost always determined to have a desired characteristic impedance with respect to the material characteristics and thickness of the dielectric layer immediately below. The land width and the signal wiring width may be different. Also, in a wiring board where digital circuits and wireless circuits (analog circuits) are mixed, the wiring width of the digital circuit and the wiring width of the wireless circuit are different in order to keep the signal quality stable while increasing the density as much as possible. In many cases, the wiring width of a digital circuit is narrower. Also, when the signal wiring is drawn out from a terminal (BGA (Ball Grid Array), etc.) of a circuit element such as an LSI (Large Scale Integration) mounted on a bare chip, the signal wiring width must be narrow because the pitch between the terminals is narrow. Therefore, the signal wiring width often differs when connecting to other circuit elements. Thus, if there is a point where the width of the land or the signal wiring on the same dielectric layer changes, the characteristic impedance changes at that point and mismatch may occur, leading to deterioration in signal transmission quality.

  In FIG. 19, the wiring width determined by the signal wiring 37 is connected to the land 40 of the circuit element 39, but the width changes in the land 40. Further, since the distance between the terminals of the circuit element 34 is narrow, the signal wiring 41 and the signal wiring 42 connected from the circuit element 39 to the circuit element 34 have different wiring widths. When the circuit elements 33, 34, and 39 are multi-port devices, the port (terminal) width may be narrowed, and the input / output terminals of the circuit elements may cause impedance mismatch with respect to the lands.

  If these impedance mismatches occur, there is a problem in that signal reflection increases at that location and transmission quality deteriorates.

  In the conventional technique of (Patent Document 1), the contents of narrowing the wiring width of the signal wiring drawn from the terminal of the LSI and matching the characteristic impedance are disclosed. According to this, a projecting portion is formed by plating on the opposing ground conductor layer below the thin signal wiring between the terminals of the LSI to reduce the thickness of the dielectric layer and adjust the characteristic impedance of the thin signal wiring to 50Ω. Is disclosed. According to this method, the optimum dielectric layer thickness can be set for each signal wiring having a different wiring width, and transmission quality can be easily maintained at low cost.

This is a method to control the characteristic impedance of the signal wiring by reducing the thickness of the dielectric layer just above the convexity by providing a convex part on the ground conductor layer. When the signal wiring width is narrow and the characteristic impedance is high It can cope with.
JP 2001-53507 A

  In general, when a substrate is produced, there are restrictions on the substrate configuration first, and the thickness of the dielectric layer is determined in most cases. In some cases, a portion where the wiring width is made as wide as possible to stabilize the signal quality against wiring variations and a portion where the wiring width is thin are mixed on the same layer. In this way, in order to ensure signal quality, it is desired to widen the wiring width. However, if there is a limit due to restrictions on the substrate configuration, a material having a low dielectric constant of the dielectric layer can only be selected. This increases the characteristic impedance of the thin wiring and increases the material cost. In such a case, there is a limit to making the characteristic impedances of both the thin wiring and the wide wiring approximately equal to each other because the material characteristics of the dielectric layer are single.

  The present invention eliminates the mismatch of characteristic impedance caused by the land and signal wiring formed on the dielectric layer and the line width of the signal wiring, even if the board configuration is limited. It is an object of the present invention to provide a wiring board and a method for manufacturing the same that can substantially match the characteristic impedance throughout.

  The present invention includes a first dielectric layer as a substrate of a wiring board, a conductor pattern formed on the surface of the first dielectric layer, and a GND pattern formed on the back surface of the first dielectric layer. A wiring board having a second dielectric layer having a dielectric constant different from that of the first dielectric layer in the first dielectric layer between the conductor pattern and the GND pattern, or a conductor The main feature is that at least one second dielectric layer is provided between the pattern and the first dielectric layer.

  The wiring board according to the present invention eliminates the characteristic impedance mismatch caused by the land or signal wiring formed on the first dielectric layer and the line width of the signal wiring is different. There is an advantage that the characteristic impedance can be substantially matched over the entire wiring board by eliminating the provision.

  The present invention eliminates the mismatch of characteristic impedance caused by the land and signal wiring formed on the dielectric layer and by the difference in the line width of the signal wiring, and substantially matches the characteristic impedance over the entire wiring board. The purpose is to have a first dielectric layer which is a substrate of the wiring board, a conductor pattern formed on the surface of the first dielectric layer, and a GND pattern formed on the back surface of the first dielectric layer. A wiring board, wherein a second dielectric layer having a dielectric constant different from that of the first dielectric layer is provided in the first dielectric layer between the conductor pattern and the GND pattern, or the conductor pattern This is realized by providing at least one second dielectric layer between the first dielectric layer and the first dielectric layer.

  A first invention made to solve the above problems includes a first dielectric layer as a substrate of a wiring board, a conductor pattern formed on the surface of the first dielectric layer, and a first dielectric. A wiring board having a GND pattern formed on the back surface of the layer, wherein the second dielectric layer has a dielectric constant different from that of the first dielectric layer in the first dielectric layer between the conductor pattern and the GND pattern. The dielectric layer is provided.

  In the first aspect of the present invention, for example, when there is a part having a high characteristic impedance and a part having a relatively low characteristic impedance, the first pattern between the conductor pattern at a part having a low characteristic impedance and the GND pattern below the conductor pattern By disposing the second dielectric layer having a dielectric constant smaller than that of the dielectric layer, the characteristic impedance can be increased. Alternatively, by disposing a second dielectric layer having a dielectric constant larger than that of the first dielectric layer between the conductor pattern at a location where the characteristic impedance is high and the GND pattern under the conductor pattern, the characteristic impedance is increased. can do.

  A second invention made to solve the above-described problems includes a first dielectric layer which is a substrate of a wiring board, a conductor pattern formed on the surface of the first dielectric layer, and a first dielectric A wiring board having a GND pattern formed on the back surface of the layer, wherein at least one second dielectric layer is provided between the conductor pattern and the first dielectric layer.

  In the second aspect of the invention, for example, when there is a part having a high characteristic impedance and a part having a relatively low characteristic impedance, there is a gap between the conductor pattern of the part having a low characteristic impedance and the first dielectric layer immediately below the conductor pattern. The characteristic impedance can be increased by disposing another second dielectric layer. At this time, if the dielectric constant of the second dielectric layer newly disposed is smaller than the dielectric constant of the first dielectric layer, the characteristic impedance can be increased with a thinner layer thickness, which is efficient.

  A third invention made to solve the above problems is the wiring board according to the first or second invention, wherein the conductor pattern is a land of a component.

  In the third aspect of the invention, for example, when the characteristic impedance of the component land is low with respect to the output impedance of the component, another second having a low value with respect to the dielectric constant of the first dielectric layer immediately below the component land. By arranging the dielectric layer between the component land and the conductor layer under the component land, it is possible to match the output impedance of the component. Alternatively, by arranging another second dielectric layer between the component land and the first dielectric layer immediately below the land, the output impedance of the component can be adjusted. At this time, if the dielectric constant of the second dielectric layer newly disposed is smaller than the dielectric constant of the first dielectric layer, the characteristic impedance can be increased with a smaller layer thickness, which is efficient.

  If the characteristic impedance of the component land is higher than the output impedance of the component, another second dielectric layer having a high value relative to the dielectric constant of the first dielectric layer immediately below the component land is connected to the component land. And the conductor layer under the component land can be adjusted to the output impedance of the component.

  A fourth invention made to solve the above-mentioned problems is the wiring board according to the first or second invention, wherein the conductor pattern is a signal wiring having portions having different line widths.

  In the fourth aspect of the invention, for example, when a signal wiring having a wide line width and a signal wiring having a relatively narrow line width are continuous, the first dielectric layer directly below the signal wiring having a large line width is provided. By arranging another second dielectric layer having a low dielectric constant between the signal wiring and the conductor layer under the signal wiring, it is possible to match the characteristic impedance of the signal wiring with a narrow line width. it can. Alternatively, by arranging another second dielectric layer between the signal wiring with a wide line width and the first dielectric layer immediately below the signal wiring, it can be matched to the characteristic impedance of the signal wiring with a narrow line width. Can do. At this time, if the dielectric constant of the second dielectric layer newly disposed is smaller than the dielectric constant of the first dielectric layer, the characteristic impedance can be increased with a smaller layer thickness, which is efficient.

  Alternatively, another second dielectric layer having a high value relative to the dielectric constant of the first dielectric layer immediately below the signal wiring having a narrow line width is disposed between the signal wiring and the conductor layer under the signal wiring. Thus, it is possible to match the characteristic impedance of the signal wiring having a wide line width.

  A fifth invention made to solve the above problems is the wiring board of the first or second invention, wherein the conductor pattern includes a land of a component and a signal wiring.

  In the fifth aspect of the invention, for example, when the signal wiring width is wide and the characteristic impedance is low with respect to the signal wiring drawn from the component land, the same as the dielectric constant of the first dielectric layer immediately below the signal wiring. By disposing another second dielectric layer having a moderate or low value between the signal wiring and the conductor layer under the signal wiring, the characteristic impedance of the signal wiring can be adjusted higher. Alternatively, by disposing another second dielectric layer between the signal line having a wide line width and the first dielectric layer immediately below the signal line, the characteristic impedance of the component land can be matched. At this time, if the dielectric constant of the second dielectric layer newly disposed is smaller than the dielectric constant of the first dielectric layer, the characteristic impedance can be increased with a smaller layer thickness, which is efficient.

  In addition, when the signal wiring width is narrow and the characteristic impedance is high with respect to the component land, another second dielectric having the same or lower value than the dielectric constant of the first dielectric layer immediately below the component land. By disposing the body layer between the component land and the conductor layer below the component land, the characteristic impedance of the component land can be adjusted higher.

  Alternatively, by arranging another second dielectric layer between the component land and the first dielectric layer immediately below the component land, the characteristic impedance of the signal wiring can be adjusted. At this time, if the dielectric constant of the second dielectric layer newly disposed is smaller than the dielectric constant of the first dielectric layer, the characteristic impedance can be increased with a smaller layer thickness, which is efficient.

  A sixth invention made to solve the above-mentioned problems is the wiring board according to the first or second invention, wherein the conductor pattern includes signal wires having different lands and line widths of the components, It is characterized in that the characteristic impedances of the signal wirings having different widths are substantially matched.

  In the sixth aspect of the invention, the land or signal wiring is used for a wiring board including a case where the component land width is different from the line width of the signal wiring to be drawn out or the signal wiring changes in the middle. Impedance can be selectively adjusted by providing a plurality of second dielectric layers having a dielectric constant different from that of the first dielectric layer between the conductor pattern and the GND pattern under the conductor pattern. Alternatively, the impedance can be selectively adjusted by providing at least one second dielectric layer between the land and the conductor pattern of the signal wiring and the first dielectric layer. Therefore, in a wiring board composed of a conductor pattern including signal wirings with different parts lands and line widths, a first dielectric layer immediately below the conductor pattern, and a GND pattern immediately below the dielectric layer, with respect to locations having different impedances By selectively adjusting the impedance, the characteristic impedance can be substantially matched.

  A seventh invention made to solve the above problems is the wiring board according to the first or second invention, wherein the conductor pattern includes signal lands having different lands and line widths. For signal wirings with different line widths, a second dielectric layer having a lower dielectric constant than the first dielectric layer directly below the conductor pattern is provided on the side with lower characteristic impedance to The characteristic impedances of the signal wirings having different widths are substantially matched.

  In the seventh aspect of the present invention, for example, from a component land, for a wiring board including a case where the component land width differs from the line width of the signal wiring drawn out from this, or the line width of the signal wiring changes midway. If the signal wiring width is wide and the characteristic impedance is low with respect to the drawn signal wiring, another second dielectric layer having a low value relative to the dielectric constant of the first dielectric layer immediately below the signal wiring is used. By arranging between the signal wiring and the conductor layer under the signal wiring, the characteristic impedance of the signal wiring can be matched with the characteristic impedance of the component land. Alternatively, another second dielectric layer having a dielectric constant smaller than that of the first dielectric layer is disposed between the signal wiring having a wide line width and the first dielectric layer immediately below the signal wiring. Thus, the characteristic impedance of the component land can be matched.

  When the signal wiring width is narrow and the characteristic impedance is high with respect to the component land, another second dielectric layer having a low value relative to the dielectric constant of the first dielectric layer immediately below the component land is provided. By arranging between the component land and the conductor layer below the component land, it is possible to match the characteristic impedance of the signal wiring.

  Alternatively, by arranging another second dielectric layer having a dielectric constant smaller than that of the first dielectric layer between the component land and the first dielectric layer immediately below the component land, the signal wiring Can be matched to the characteristic impedance.

  In this way, the second dielectric layer having a lower dielectric constant characteristic than the first dielectric layer immediately below the conductor pattern, on the low characteristic impedance side of the signal wiring having different component lands and line widths It is possible to substantially match the characteristic impedance of signal wirings having different lands and line widths.

  An eighth invention made to solve the above problems is the wiring board according to the first invention, wherein a tape-like substrate material is used as the second dielectric layer.

  In the eighth invention, a plurality of tape-like substrate materials having different dielectric constants from the first dielectric layer are provided between the conductor pattern and the GND pattern under the conductor pattern, thereby selectively and easily. A second dielectric layer having a different dielectric constant can be disposed on the substrate, and the characteristic impedance can be adjusted.

  A ninth invention made to solve the above problem is the wiring board according to the second invention, wherein a tape-like substrate material is used as at least one second dielectric layer. .

  In the ninth aspect of the invention, by providing at least one second dielectric layer made of a tape-like substrate material between the conductor pattern and the first dielectric layer immediately below the conductor pattern, The second dielectric layer having a different dielectric constant can be easily arranged, and the characteristic impedance can be adjusted.

  The tenth invention made to solve the above-mentioned problem is that a tape-like substrate material with an adhesive on one side is pasted on the conductor layer of the substrate with one-side copper foil, and another one-side copper foil is on it. The wiring board manufacturing method is characterized in that the dielectric layers of the substrates are arranged so as to be bonded surfaces, and are bonded by heat treatment.

  In the tenth aspect of the invention, by using a tape-like substrate material with an adhesive on one side, it can be easily attached to a desired area on the conductor layer of a substrate with a copper foil on one side, and then with a copper foil on one side By disposing the second dielectric layer of the substrate to be a bonding surface, and performing heat treatment and bonding, a wiring substrate that can partially include a different dielectric layer can be manufactured.

  In an eleventh aspect of the invention made to solve the above problems, a tape-like substrate material with an adhesive on one side is pasted on the first dielectric layer of the substrate with a copper foil on one side, and the other It arrange | positions so that the 2nd dielectric material layer of a board | substrate with a one side copper foil may become a bonding surface, It heat-processes and adheres, It is characterized by the above-mentioned.

  In this eleventh invention, by using a tape-like substrate material with an adhesive on one side, it can be easily attached to a desired area on the first dielectric layer of the substrate with copper foil on one side, A wiring board capable of partially including different dielectric layers is manufactured by arranging the second dielectric layer of the substrate with copper foil on one side to be a bonding surface, and performing heat treatment and bonding. Can do.

  In a twelfth aspect of the invention made to solve the above problems, a signal wiring is formed on a copper foil surface of one side of a substrate with copper foil on both sides by forming a signal wiring, and shape processing or drilling is performed by punching, laser, or ultrasonic waves. A tape-like substrate with a one-side adhesive is attached so as to cover the signal wiring, and the signal wiring is formed on the tape-like substrate by plating or the like.

  In the twelfth invention, the tape-like substrate with the adhesive on one side can be easily punched, shaped or drilled by laser or ultrasonic waves, and can be easily attached to a desired area on the signal wiring. . The tape substrate with the adhesive on one side is attached so as to cover the signal wiring, and through holes and signal wiring are formed using plating or the like. As described above, it is possible to manufacture a wiring board having partially different dielectric layer thicknesses.

  The wiring board manufacturing method according to the thirteenth aspect of the present invention, which has been made to solve the above problems, forms a signal wiring by performing a photolithography process on one side of the copper foil surface of the board with both side copper foils, and performs punching or laser or Formed or drilled with ultrasonic waves, photolithography processing, plating, etc. to form through holes and signal wiring, tape-shaped substrate with one side adhesive, signal wiring and one side adhesive on substrate with copper foil on both sides Both substrates are bonded so that the through holes of the attached tape-shaped substrate are joined.

  In the thirteenth invention, the tape-like substrate with the adhesive on one side can be easily punched, shaped or drilled by laser or ultrasonic waves, and subjected to photolithography treatment, through-holes or signal wiring by plating or the like. Can be easily attached to a desired area of the wiring substrate to be attached. The tape-like substrate with the adhesive on one side is attached so as to cover the signal wiring. As described above, it is possible to manufacture a wiring board having partially different dielectric layer thicknesses.

(Embodiment 1)
Embodiment 1 of the present invention will be described with reference to FIG. 1 and FIG.

  1 is a plan view of a wiring board of a component land portion according to Embodiment 1 of the present invention, and FIG. 2 is a cross-sectional view taken along line AA in FIG.

  As shown in FIGS. 1 and 2, the wiring board of the first embodiment has a dielectric layer 5A that is a main component of the board, lands 2 formed thereon, and a back surface of the dielectric layer 5A. A conductor layer 6 formed as a power supply pattern or a GND pattern and a dielectric layer 5B covering the conductor layer 6 are provided. On the land 2, the circuit element 1 is mounted on the dielectric layer 5A by solder bonding or the like with the electrode 3 thereof. A dielectric layer 4 having a dielectric constant smaller than that of the dielectric layers 5A and 5B is disposed in the dielectric layer 5A between the land 2 and its peripheral area and the conductor layer 6.

  The first embodiment is an example of a wiring board that adjusts the impedance when the output impedance of the circuit element 1 is 50Ω, for example, and the characteristic impedance of the land 2 is smaller than 50Ω. In order to adjust the impedance, as shown in FIGS. 1 and 2, in the dielectric layer 5A between the land 2 and the conductor layer 6, a dielectric layer 4 having a smaller dielectric constant than the dielectric layers 5A and 5B is provided. Deploy.

  By doing so, the characteristic impedance of the land 2 can be increased. For example, in order to adjust the characteristic impedance value to 50Ω, the dielectric constant is smaller than the glass epoxy of FR-4, which is a common material for the dielectric layer 5 (5A, 5B), for example, Teflon (registered trademark) (registered trademark). ) And the thickness of the dielectric layer 4 is set so that the characteristic impedance of the land 2 is 50Ω.

(Embodiment 2)
A second embodiment of the present invention will be described with reference to FIGS.

  3 is a plan view of the wiring board of the signal wiring portion according to the second embodiment, and FIG. 4 is a cross-sectional view taken along the line BB in FIG.

  As shown in FIGS. 3 and 4, the wiring board of the second embodiment includes a dielectric layer 5A that is a main component of the board, signal wiring 7 and signal wiring 9 formed thereon, and a dielectric. A conductor layer 6 formed as a power supply pattern or a GND pattern on the back surface of the layer 5A, and a dielectric layer 5B covering the conductor layer 6 are provided. A dielectric layer 8 having a dielectric constant smaller than that of the dielectric layers 5A and 5B is disposed in the dielectric layer 5A between the signal wiring 7 and its peripheral area and the conductor layer 6.

  The second embodiment is an example of a wiring board that adjusts the impedance when the board configuration is determined and the characteristic impedance of the signal wiring 9 is about 50Ω, for example, but the characteristic impedance of the signal wiring 7 is smaller than 50Ω. It is. For this impedance adjustment, as shown in FIGS. 3 and 4, a dielectric layer 8 having a dielectric constant smaller than that of the dielectric layer 5 is provided between the signal wiring 7 and the conductor layer 6 in the signal wiring 7 and its peripheral area. Deploy.

  By doing so, the characteristic impedance of the signal wiring 9 can be increased. For example, in order to match the characteristic impedance value to 50Ω, the dielectric layer 5 (5A, 5B) is made of a material having a dielectric constant smaller than that of a general FR-4 glass epoxy, for example, Teflon (registered trademark), and signal wiring. The thickness of the dielectric layer 8 is set so that the characteristic impedance of 7 is 50Ω.

(Embodiment 3)
A third embodiment of the present invention will be described with reference to FIGS.

  FIG. 5 is a plan view of the wiring board of the signal wiring portion according to the third embodiment, and FIG. 6 is a cross-sectional view taken along the line CC in FIG.

  As shown in FIGS. 5 and 6, the wiring board of the third embodiment includes a dielectric layer 5A that is a main component of the board, signal wiring 7 and signal wiring 9 formed thereon, and a dielectric. A conductor layer 6 formed as a power supply pattern or a GND pattern on the back surface of the layer 5A, and a dielectric layer 5B covering the conductor layer 6 are provided. A dielectric layer 50 having a dielectric constant larger than that of the dielectric layers 5A and 5B is disposed in the dielectric layer 5A between the signal wiring 9 and its peripheral area and the conductor layer 6.

  In the third embodiment, the substrate configuration is determined, and the characteristic impedance of the signal wiring 7 is about 50Ω, for example. However, when the characteristic impedance of the signal wiring 9 is larger than 50Ω, an example of a wiring substrate for adjusting the impedance It is. For this impedance adjustment, as shown in FIGS. 5 and 6, a dielectric layer 50 having a dielectric constant larger than that of the dielectric layer 5 is formed between the signal wiring 9 and the conductor layer 6 in the signal wiring 9 and its peripheral area. Deploy.

  By doing so, the characteristic impedance of the signal wiring 9 can be reduced. For example, in order to adjust the characteristic impedance value to 50Ω, for example, alumina is selected from ceramic materials among materials having a dielectric constant larger than that of a general glass epoxy substrate as the material of the dielectric layer 5, and the characteristic impedance of the signal wiring 9. The thickness of alumina may be set so that becomes 50Ω. Further, for example, by using a material obtained by processing this alumina material into a sheet shape, it can be easily arranged in a desired area.

(Embodiment 4)
A fourth embodiment of the present invention will be described with reference to FIGS.

  FIG. 7 is a plan view of the wiring board of the signal wiring portion according to the fourth embodiment, and FIG. 8 is a sectional view taken along the line DD in FIG.

  As shown in FIGS. 7 and 8, the wiring board of the fourth embodiment includes a dielectric layer 5 that is a main component of the board, a signal wiring 16 that is locally formed thereon, and a dielectric layer. 5, a dielectric layer 13 formed so as to partially overlap the signal wiring 16, a land 11 and a signal wiring 14 formed on the dielectric layer 13, and the back surface of the dielectric layer 5 And a conductor layer 6 formed as a power supply pattern or a GND pattern. On the land 11, the circuit element 10 is mounted on the electrode 12 by solder bonding or the like. Further, the signal wiring 16 on the dielectric layer 5 and the signal wiring 14 on the dielectric layer 13 are electrically connected through a through hole 15.

  In the fourth embodiment, the substrate configuration is determined and the characteristic impedance of the signal wiring 16 is about 50Ω, for example, but the characteristic impedance of the land 11 of the circuit element 10 and the signal wiring 14 drawn from the land is smaller than 50Ω. This is an example of a wiring board that adjusts the impedance. In order to adjust the impedance, as shown in FIGS. 7 and 8, the dielectric layer 13 is disposed between the signal wiring 14 and the dielectric layer 5 in the circuit element 10, the land 11, the signal wiring 14 and the peripheral area thereof. .

  By doing so, the characteristic impedance of the land 11 and the signal wiring 14 can be increased. If the dielectric layer 13 has the same material characteristics as the dielectric layer 5, the characteristic impedance can be set to 50Ω by adjusting the thickness. Further, when a material having a dielectric constant smaller than that of the dielectric layer 5 is used, for example, a material having a dielectric constant smaller than that of general glass epoxy is used as a material of the dielectric layer 5 (registered). When the trademark is selected, the thickness can be adjusted to 50Ω with a smaller thickness than the dielectric layer 13 having the same material characteristics as the dielectric layer 5.

(Embodiment 5)
A fifth embodiment of the present invention will be described with reference to FIG. 9 and FIG.

  FIG. 9 is a plan view of the wiring board of the signal wiring portion according to the fifth embodiment, and FIG. 10 is a cross-sectional view taken along line EE in FIG.

  As shown in FIGS. 9 and 10, the wiring board of the fifth embodiment includes a dielectric layer 5 that is a main component of the board, a signal wiring 19 locally formed thereon, and a dielectric layer. 5, a dielectric layer 18 formed so as to partially overlap the signal wiring 19, a signal wiring 17 formed on the dielectric layer 18, and a power supply pattern on the back surface of the dielectric layer 5. And a conductor layer 6 formed as a GND pattern. The signal wiring 19 on the dielectric layer 5 and the signal wiring 17 on the dielectric layer 18 are electrically connected through a through hole 20.

  The fifth embodiment is an example of a wiring board for adjusting the impedance when the board configuration is determined and the characteristic impedance of the signal wiring 19 is about 50Ω, for example, but the characteristic impedance of the signal wiring 17 is larger than 50Ω. is there. In order to adjust the impedance, a dielectric layer 18 is disposed between the signal wiring 17 and the dielectric layer 5 in the signal wiring 17 and its peripheral area as shown in FIGS.

  By doing so, the characteristic impedance of the signal wiring 17 can be reduced. If the dielectric layer 18 has the same material characteristics as the dielectric layer 5, the characteristic impedance can be set to 50Ω by adjusting the thickness. Further, when a material having a dielectric constant of the dielectric layer 18 smaller than that of the dielectric layer 5 is used, for example, when Teflon (registered trademark) is selected among materials having a larger dielectric constant than glass epoxy, the dielectric The thickness can be adjusted to 50 Ω with a smaller thickness than the dielectric layer 18 having the same material characteristics as the layer 5.

(Embodiment 6)
A sixth embodiment of the present invention will be described with reference to FIG. 11 and FIG.

  FIG. 11 is a plan view of the wiring board of the signal wiring portion according to the sixth embodiment, and FIG. 12 is a sectional view taken along line FF in FIG.

  As shown in FIGS. 11 and 12, the wiring board of the sixth embodiment includes a dielectric layer 5 that is a main component of the board, a signal wiring 17 that is locally formed thereon, and a dielectric layer. 5, a dielectric layer 51 formed so as to partially overlap the signal wiring 17, a signal wiring 19 formed on the dielectric layer 51, and a power supply pattern on the back surface of the dielectric layer 5. And a conductor layer 6 formed as a GND pattern. The signal wiring 17 on the dielectric layer 5 and the signal wiring 19 on the dielectric layer 51 are electrically connected through the through hole 20.

  The sixth embodiment is an example of a wiring board that adjusts the impedance when the board configuration is determined and the characteristic impedance of the signal wiring 17 is about 50Ω, but the characteristic impedance of the signal wiring 19 is smaller than 50Ω. . In order to adjust the impedance, as shown in FIGS. 11 and 12, the dielectric having a material characteristic having a dielectric constant greater than that of the dielectric layer 5 between the signal wiring 19 and the dielectric layer 5 in the signal wiring 19 and its peripheral area. The body layer 51 is disposed.

  By doing so, the characteristic impedance of the signal wiring 19 can be increased. For example, in order to adjust the characteristic impedance value to 50Ω, for example, alumina is selected from ceramic materials among materials having a larger dielectric constant than glass epoxy, and the thickness of the alumina is set so that the characteristic impedance of the signal wiring 17 is 50Ω. That's fine. Further, for example, by using a material obtained by processing this alumina material into a sheet shape, it can be easily arranged in a desired area.

(Embodiment 7)
A seventh embodiment of the present invention will be described with reference to FIG. 13 and FIG.

  13 is a plan view of the wiring board of the signal wiring portion according to the seventh embodiment, and FIG. 14 is a cross-sectional view taken along the line GG in FIG.

  As shown in FIGS. 13 and 14, the wiring board of the seventh embodiment includes a dielectric layer 5 that is a main component of the board, a signal wiring 19 locally formed thereon, and a dielectric layer. 5 and the signal wiring 19 formed on the dielectric layer 18, the signal wiring 17 formed on a predetermined portion of the dielectric layer 18, and a power supply pattern or a GND pattern on the back surface of the dielectric layer 5. A conductor layer 6. The signal wiring 19 on the dielectric layer 5 and the signal wiring 17 on the dielectric layer 18 are electrically connected through a through hole 20. In the present embodiment, the dielectric layer 18 has the same material characteristics as the dielectric layer 5 constituting the substrate, and has a dielectric constant ε of 4.25 (at 2.4 GHz).

  The seventh embodiment is an example of a wiring board that adjusts the impedance when the board configuration is determined and the characteristic impedance of the signal wiring 19 is about 50Ω, but the characteristic impedance of the signal wiring 17 is smaller than 50Ω. . In order to adjust the impedance, a dielectric layer 18 is disposed between the signal wiring 17 and the dielectric layer 5 in the signal wiring 17 and its peripheral area as shown in FIGS.

  By doing so, the characteristic impedance of the signal wiring 17 can be increased. The dimensions and material characteristics of each part were simulated using a circuit simulator (system name “ADS (Advanced Design System)”) of Agilent Technologies, and the result was that the characteristic impedance of the signal wiring as viewed from the input / output terminals was 50Ω. Yes.

(Embodiment 8)
As an eighth embodiment of the present invention, FIG. 15 is a process diagram showing a method of manufacturing a wiring board according to the eighth embodiment of the present invention in the second and third embodiments. In FIG. 15, step 10 shows a general FR-4 glass epoxy substrate with a copper foil on one side. In step 20, a tape-like substrate 28 is formed on the conductor layer 6 of this substrate. The substrate 28 has a tape shape and can be easily attached to a desired location. In step 30, a substrate with a copper foil on one side is placed on the tape-like substrate 28 so that the conductor layer 6 and the dielectric layer 22 are opposite to each other and heat-treated to adhere. Further, in step 40, the uppermost copper foil is subjected to a photolithography process to form the signal wiring 21, thereby forming the wiring board of the present invention.

(Embodiment 9)
FIG. 16 is a process diagram showing a method for manufacturing a wiring board according to Embodiment 9 of the present invention. In FIG. 16, step 10 is a general FR-4 glass epoxy substrate with a copper foil on one side. In step 20, a tape-like substrate 28 is formed on the dielectric layer 5 of this substrate. This substrate is tape-like and can be easily attached to a desired location. In step 30, a substrate with a copper foil on one side is placed on the tape-like substrate so that the dielectric layer 5 and the dielectric layer 22 face each other and are heat-treated and bonded. Further, in step 40, the uppermost copper foil is subjected to a photolithography process to form the signal wiring 21, whereby the wiring board of the present invention can be formed.

(Embodiment 10)
As a tenth embodiment of the present invention, FIG. 17 shows a process diagram showing a method for manufacturing a wiring board according to the tenth embodiment of the present invention in the fifth embodiment. In FIG. 17, Step 10 is a general FR-4 glass epoxy substrate with a copper foil on both sides. In step 20, a photolithography process is performed on the conductor layer 6 of the substrate to form a signal wiring 23. In step 30, the tape-like substrate 28 is attached so as to cover the signal wiring 23. This substrate is tape-like and can be easily attached to a desired location. The tape-shaped substrate 28 includes a dielectric layer 24, an adhesive 25, and a through hole 26. In step 40, the signal wiring 27 is formed on the tape-like substrate 28 to obtain the wiring substrate of the fifth embodiment (see FIG. 10).

  FIG. 18 is a process chart of the method for manufacturing the tape-shaped substrate 28. In FIG. 18, a tape-like substrate 28 is composed of a dielectric layer 29 and an adhesive 30 attached to the back surface thereof as in step 10. Even in this state, it can be easily attached to a desired location. In step 20, the outer shape is cut using a cutter or the like, and the through hole 31 is opened using punching, laser, ultrasonic waves, or the like. Since this substrate is in the form of a tape, processing as in step 20 can be easily performed. In the state up to step 20, it can be used as shown in step 30 of FIG. 17, but other than that, for example, as shown in step 30 of FIG. 18, through-hole plating formation, signal wiring formation by photolithography processing, etc. It is also possible to use it for the final process 40 of FIG.

  The present invention can easily match the characteristic impedances of lands and signal wirings regardless of the board configuration and various line widths, and does not cause impedance mismatch. As a wiring board and a method for manufacturing the wiring board that can be satisfactorily transmitted without deteriorating transmission quality, it can be suitably used for a circuit using a high frequency band such as a microwave band or a millimeter wave band. .

The top view of the wiring board of the component land part which concerns on Embodiment 1 of this invention AA sectional view in FIG. The top view of the wiring board of the signal wiring part which concerns on Embodiment 2 of this invention BB sectional view in FIG. The top view of the wiring board of the signal wiring part which concerns on Embodiment 3 of this invention CC sectional view in FIG. The top view of the wiring board of the signal wiring part which concerns on Embodiment 4 of this invention DD sectional view in FIG. The top view of the wiring board of the signal wiring part which concerns on Embodiment 5 of this invention EE sectional view in FIG. The top view of the wiring board of the signal wiring part which concerns on Embodiment 6 of this invention FF sectional drawing in FIG. The top view of the wiring board of the signal wiring part which concerns on Embodiment 7 of this invention GG sectional drawing in FIG. Process drawing which shows the manufacturing method of the wiring board which concerns on Embodiment 8 of this invention. Process drawing which shows the manufacturing method of the wiring board which concerns on Embodiment 9 of this invention. Process drawing which shows the manufacturing method of the wiring board which concerns on Embodiment 10 of this invention. Process drawing which shows the manufacturing method of the tape-shaped board | substrate which concerns on embodiment of this invention Plan view showing an example of a conventional wiring board The figure seen from the H direction in FIG.

Explanation of symbols

1,10 Circuit element 2,11 Land 3,12 Electrode 5 (5A, 5B) Dielectric layer (first dielectric layer)
4, 8, 13, 18, 22, 24, 29, 50, 51 Dielectric layer 6 Conductor layer 7, 9, 14, 16, 17, 19, 21, 23, 27 Signal wiring 15, 20, 26, 31 Through Hole 25, 30 Adhesive 28 Tape substrate ε Dielectric constant

Claims (13)

A wiring having a first dielectric layer as a base of the wiring substrate, a conductor pattern formed on the surface of the first dielectric layer, and a GND pattern formed on the back surface of the first dielectric layer A second dielectric layer having a dielectric constant different from that of the first dielectric layer is provided in the first dielectric layer between the conductor pattern and the GND pattern. A characteristic wiring board. A wiring having a first dielectric layer as a base of the wiring substrate, a conductor pattern formed on the surface of the first dielectric layer, and a GND pattern formed on the back surface of the first dielectric layer A wiring board, wherein at least one second dielectric layer is provided between the conductor pattern and the first dielectric layer. The wiring board according to claim 1, wherein the conductor pattern is a land of a component. The wiring board according to claim 1, wherein the conductor pattern is a signal wiring having portions having different line widths. The wiring board according to claim 1, wherein the conductor pattern includes a land of a component and a signal wiring. 3. The conductor pattern according to claim 1, wherein the conductor pattern includes signal wirings having different lands and line widths, and characteristic impedances of the signal wirings having different land and line widths are substantially matched. Wiring board. The conductor pattern includes signal wirings having different lands and line widths of components, and the signal wiring having different land and line widths of the components has a lower characteristic impedance than the first dielectric layer. The wiring board according to claim 1, wherein a second dielectric layer having a dielectric constant characteristic is provided, and characteristic impedances of the signal wirings having different lands and line widths are substantially matched. 2. The wiring board according to claim 1, wherein a tape-like substrate material is used as the second dielectric layer. 3. The wiring board according to claim 2, wherein a tape-shaped substrate material is used as the at least one second dielectric layer. A tape-like substrate material with an adhesive on one side is affixed on the conductor layer of a substrate with copper foil on one side, and the dielectric layer of the other substrate with copper foil on it is placed on the bonding surface. A method of manufacturing a wiring board, characterized by heat-bonding and bonding. A tape-like substrate material with adhesive on one side is pasted on the first dielectric layer of the substrate with copper foil on one side, and the second dielectric layer of the substrate with other copper foil is pasted on it. A method of manufacturing a wiring board, wherein the wiring board is disposed so as to be a surface, and is bonded by heat treatment. A signal wiring is formed on the copper foil surface of one side of the board with the copper foil on both sides by forming a signal wiring, and a tape-shaped substrate with a one-sided adhesive formed by punching or laser or ultrasonic wave is applied to the signal wiring. And a signal wiring is formed on the tape-shaped substrate by plating or the like. A signal wiring is formed on one side copper foil surface of a board with copper foil on both sides to form a signal wiring, shape processing or drilling by punching or laser or ultrasonic wave, photolithography processing, plating etc., through hole, signal Affixing both substrates so that the signal wiring of the board with the copper foil on both sides and the through hole of the tape-like board with the one-sided adhesive are joined to the tape-like board with the one-sided adhesive formed the wiring. A method for manufacturing a wiring board.

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