JP2007165755A5 - - Google Patents

Claims (8)

A wiring having a first dielectric layer as a base of the wiring substrate, a conductor pattern formed on the surface of the first dielectric layer, and a GND pattern formed on the back surface of the first dielectric layer A second dielectric layer having a dielectric constant different from that of the first dielectric layer is provided in the first dielectric layer between the conductor pattern and the GND pattern. A characteristic wiring board. A wiring having a first dielectric layer as a base of the wiring substrate, a conductor pattern formed on the surface of the first dielectric layer, and a GND pattern formed on the back surface of the first dielectric layer A wiring board, wherein at least one second dielectric layer is provided between the conductor pattern and the first dielectric layer. 3. The conductor pattern according to claim 1, wherein the conductor pattern includes signal wirings having different lands and line widths, and characteristic impedances of the signal wirings having different land and line widths are substantially matched. Wiring board. The conductor pattern includes signal wirings having different lands and line widths of components, and the signal wiring having different land and line widths of the components has a lower characteristic impedance than the first dielectric layer. The wiring board according to claim 1, wherein a second dielectric layer having a dielectric constant characteristic is provided, and characteristic impedances of the signal wirings having different lands and line widths are substantially matched. A tape-like substrate material with an adhesive on one side is affixed on the conductor layer of a substrate with copper foil on one side, and the dielectric layer of the other substrate with copper foil on it is placed on the bonding surface. A method of manufacturing a wiring board, characterized by heat-bonding and bonding. A tape-like substrate material with adhesive on one side is pasted on the first dielectric layer of the substrate with copper foil on one side, and the second dielectric layer of the substrate with other copper foil is pasted on it. A method of manufacturing a wiring board, wherein the wiring board is disposed so as to be a surface, and is bonded by heat treatment. A signal wiring is formed on the copper foil surface of one side of the board with the copper foil on both sides by forming a signal wiring, and a tape-shaped substrate with a one-sided adhesive formed by punching or laser or ultrasonic wave is applied to the signal wiring. And a signal wiring is formed on the tape-shaped substrate by plating or the like. A signal wiring is formed on one side copper foil surface of a board with copper foil on both sides to form a signal wiring, shape processing or drilling by punching or laser or ultrasonic wave, photolithography processing, plating etc., through hole, signal Affixing both substrates so that the signal wiring of the board with the copper foil on both sides and the through hole of the tape-like board with the one-sided adhesive are joined to the tape-like board with the one-sided adhesive formed the wiring. A method for manufacturing a wiring board.