JPS6249275U - - Google Patents
Info
- Publication number
- JPS6249275U JPS6249275U JP14013785U JP14013785U JPS6249275U JP S6249275 U JPS6249275 U JP S6249275U JP 14013785 U JP14013785 U JP 14013785U JP 14013785 U JP14013785 U JP 14013785U JP S6249275 U JPS6249275 U JP S6249275U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- printed wiring
- dielectric constant
- multilayer printed
- inner layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
Landscapes
- Waveguides (AREA)
Description
第１図は本考案の多層印刷配線板を示す縦断面
図である。
１，４……ガラス―エポキシ樹脂の積層板、２
，３……信号パターン、５，６……地気層、７…
…（ガラス―エポキシ樹脂の）プリプレグ層、８
……ガラス―四フツ化エチレン樹脂の積層板、９
……スルホール。
FIG. 1 is a longitudinal sectional view showing a multilayer printed wiring board of the present invention. 1, 4...Glass-epoxy resin laminate, 2
, 3...Signal pattern, 5, 6...Geological layer, 7...
... (glass-epoxy resin) prepreg layer, 8
...Glass-tetrafluoroethylene resin laminate, 9
... Thruhole.
Claims (1)
層とを対向配設する内層導体層を有し、かつ絶縁
基板表裏面を導通するスルホールを有する多層印
刷配線板において、前記内層信号パターンと内層
磁気層との間の絶縁層内に誘電率２．０〜３．０
の低誘電率の基材層をスルホール壁と離間させて
配置したことを特徴とする多層印刷配線板。 (2) 前記低誘電率の基材層としてガラス―四フ
ツ化エチレン樹脂積層板を用いることを特徴とす
る実用新案登録請求の範囲第１項記載の多層印刷
配線板。[Scope of Claim for Utility Model Registration] (1) Multilayer printed wiring having an inner conductor layer in which an inner layer signal pattern and an inner layer ground layer are disposed facing each other in an insulating substrate, and a through hole that conducts between the front and back surfaces of the insulating substrate. In the plate, the insulating layer between the inner layer signal pattern and the inner layer magnetic layer has a dielectric constant of 2.0 to 3.0.
A multilayer printed wiring board characterized in that a base material layer having a low dielectric constant is arranged at a distance from a through-hole wall. (2) The multilayer printed wiring board according to claim 1, wherein a glass-tetrafluoroethylene resin laminate is used as the low dielectric constant base material layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14013785U JPS6249275U (en) | 1985-09-12 | 1985-09-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14013785U JPS6249275U (en) | 1985-09-12 | 1985-09-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6249275U true JPS6249275U (en) | 1987-03-26 |
Family
ID=31046702
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14013785U Pending JPS6249275U (en) | 1985-09-12 | 1985-09-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6249275U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6249277U (en) * | 1985-09-13 | 1987-03-26 | ||
| JPS6265879U (en) * | 1985-10-16 | 1987-04-23 | ||
| JP2007165755A (en) * | 2005-12-16 | 2007-06-28 | Matsushita Electric Ind Co Ltd | Wiring board and method for manufacturing the same |
-
1985
- 1985-09-12 JP JP14013785U patent/JPS6249275U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6249277U (en) * | 1985-09-13 | 1987-03-26 | ||
| JPS6265879U (en) * | 1985-10-16 | 1987-04-23 | ||
| JP2007165755A (en) * | 2005-12-16 | 2007-06-28 | Matsushita Electric Ind Co Ltd | Wiring board and method for manufacturing the same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6249275U (en) | ||
| JPS6424874U (en) | ||
| JPS61190180U (en) | ||
| JPS6228479U (en) | ||
| JPS6380881U (en) | ||
| JPH0348263U (en) | ||
| JPS58166068U (en) | multilayer printed wiring board | |
| JPH01104058U (en) | ||
| JPS59146999U (en) | Shield structure of printed circuit board | |
| JPS64399U (en) | ||
| JPH0279075U (en) | ||
| JPH0390503U (en) | ||
| JPS63165877U (en) | ||
| JPS631383U (en) | ||
| JPH01163370U (en) | ||
| JPS63182584U (en) | ||
| JPH0160578U (en) | ||
| JPS62199980U (en) | ||
| JPH03126077U (en) | ||
| JPH0236066U (en) | ||
| JPS6248089U (en) | ||
| JPS6280376U (en) | ||
| JPH03122572U (en) | ||
| JPH01115267U (en) | ||
| JPS593564U (en) | Laminated structure of multilayer ceramic substrate |