JP2007149810A - 発光素子用配線基板および発光装置 - Google Patents

発光素子用配線基板および発光装置 Download PDF

Info

Publication number
JP2007149810A
JP2007149810A JP2005339877A JP2005339877A JP2007149810A JP 2007149810 A JP2007149810 A JP 2007149810A JP 2005339877 A JP2005339877 A JP 2005339877A JP 2005339877 A JP2005339877 A JP 2005339877A JP 2007149810 A JP2007149810 A JP 2007149810A
Authority
JP
Japan
Prior art keywords
emitting element
light emitting
light
insulating
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005339877A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007149810A5 (enExample
Inventor
Minako Izumi
美奈子 泉
Tomohide Hasegawa
智英 長谷川
Yasuhiro Sasaki
康博 佐々木
Noriaki Hamada
紀彰 浜田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP2005339877A priority Critical patent/JP2007149810A/ja
Publication of JP2007149810A publication Critical patent/JP2007149810A/ja
Publication of JP2007149810A5 publication Critical patent/JP2007149810A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Led Device Packages (AREA)
JP2005339877A 2005-11-25 2005-11-25 発光素子用配線基板および発光装置 Pending JP2007149810A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005339877A JP2007149810A (ja) 2005-11-25 2005-11-25 発光素子用配線基板および発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005339877A JP2007149810A (ja) 2005-11-25 2005-11-25 発光素子用配線基板および発光装置

Publications (2)

Publication Number Publication Date
JP2007149810A true JP2007149810A (ja) 2007-06-14
JP2007149810A5 JP2007149810A5 (enExample) 2008-05-22

Family

ID=38210882

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005339877A Pending JP2007149810A (ja) 2005-11-25 2005-11-25 発光素子用配線基板および発光装置

Country Status (1)

Country Link
JP (1) JP2007149810A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2017897A1 (en) * 2007-07-16 2009-01-21 ILED Photoelectronics Inc. Package structure for a high-luminance light source
JP2009021426A (ja) * 2007-07-12 2009-01-29 Sharp Corp チップ部品型ｌｅｄ及びその製造方法
JP2011060960A (ja) * 2009-09-09 2011-03-24 Toshiba Lighting & Technology Corp 発光モジュール
WO2011002208A3 (ko) * 2009-07-03 2011-04-07 서울반도체 주식회사 발광 다이오드 패키지
JP2013046072A (ja) * 2011-08-22 2013-03-04 Lg Innotek Co Ltd 発光素子パッケージ、光源モジュール及びこれを含む照明システム
JP2018186284A (ja) * 2011-08-22 2018-11-22 エルジー イノテック カンパニー リミテッド 紫外線発光素子パッケージ
JP2019040956A (ja) * 2017-08-23 2019-03-14 スタンレー電気株式会社 半導体発光装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004235204A (ja) * 2003-01-28 2004-08-19 Kyocera Corp 発光素子収納用パッケージおよび発光装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004235204A (ja) * 2003-01-28 2004-08-19 Kyocera Corp 発光素子収納用パッケージおよび発光装置

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009021426A (ja) * 2007-07-12 2009-01-29 Sharp Corp チップ部品型ｌｅｄ及びその製造方法
EP2017897A1 (en) * 2007-07-16 2009-01-21 ILED Photoelectronics Inc. Package structure for a high-luminance light source
US9048391B2 (en) 2009-07-03 2015-06-02 Seoul Semiconductor Co., Ltd. Light emitting diode package
WO2011002208A3 (ko) * 2009-07-03 2011-04-07 서울반도체 주식회사 발광 다이오드 패키지
US8796706B2 (en) 2009-07-03 2014-08-05 Seoul Semiconductor Co., Ltd. Light emitting diode package
US9257624B2 (en) 2009-07-03 2016-02-09 Seoul Semiconductor Co., Ltd. Light emitting diode package
US9472743B2 (en) 2009-07-03 2016-10-18 Seoul Semiconductor Co., Ltd. Light emitting diode package
US9786827B2 (en) 2009-07-03 2017-10-10 Seoul Semiconductor Co., Ltd. Light emitting diode package
JP2011060960A (ja) * 2009-09-09 2011-03-24 Toshiba Lighting & Technology Corp 発光モジュール
JP2013046072A (ja) * 2011-08-22 2013-03-04 Lg Innotek Co Ltd 発光素子パッケージ、光源モジュール及びこれを含む照明システム
JP2018186284A (ja) * 2011-08-22 2018-11-22 エルジー イノテック カンパニー リミテッド 紫外線発光素子パッケージ
USRE48858E1 (en) 2011-08-22 2021-12-21 Suzhou Lekin Semiconductor Co., Ltd. Light emitting device package and light unit
JP2019040956A (ja) * 2017-08-23 2019-03-14 スタンレー電気株式会社 半導体発光装置
JP7048228B2 (ja) 2017-08-23 2022-04-05 スタンレー電気株式会社 半導体発光装置

Similar Documents

Publication Publication Date Title
EP2398072B1 (en) Semiconductor light-emitting device
US8314346B2 (en) Wiring board for light-emitting element
JP4858032B2 (ja) 発光装置
JP2008109079A (ja) 表面実装型発光素子用配線基板および発光装置
US9076714B2 (en) Substrate for mounting light-emitting element and light-emitting device
JP4804109B2 (ja) 発光素子用配線基板および発光装置並びに発光素子用配線基板の製造方法
JP2006093565A (ja) 発光素子用配線基板ならびに発光装置およびその製造方法
JP4780939B2 (ja) 発光装置
JP2006147999A (ja) 発光素子用配線基板並びに発光装置
JP2006339559A (ja) Ｌｅｄ部品およびその製造方法
JP2006156447A (ja) 発光素子用配線基板ならびに発光装置およびその製造方法
JP2007149810A (ja) 発光素子用配線基板および発光装置
JP2005191111A (ja) 発光素子収納用パッケージおよび発光装置
JP2011205009A (ja) 表面実装型発光素子用配線基板および発光装置
TW201824593A (zh) 發光元件搭載用基板及其製造方法、以及搭載有發光元件之封裝體
JP2006066409A (ja) 発光素子用配線基板および発光装置ならびに発光素子用配線基板の製造方法
JP2007250899A (ja) 発光モジュールとこれを用いた表示装置及び照明装置
JP4129169B2 (ja) 発光素子収納用パッケージおよび発光装置
JP2008270325A (ja) 静電気対策部品およびこれを用いた発光ダイオードモジュール
JP2006100364A (ja) 発光素子用配線基板および発光装置ならびに発光素子用配線基板の製造方法
JP6476703B2 (ja) セラミックスパッケージ、発光装置及びそれらの製造方法
JP2006066631A (ja) 配線基板および電気装置並びに発光装置
JP2006066630A (ja) 配線基板および電気装置並びに発光装置
JP2015159245A (ja) 発光素子搭載用パッケージおよび発光装置
JP4895777B2 (ja) 発光素子用配線基板ならびに発光装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080407

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080617

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20101019

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20101026

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20101221

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20110802